JPH05160440A - Light emitting diode array - Google Patents
Light emitting diode arrayInfo
- Publication number
- JPH05160440A JPH05160440A JP40818390A JP40818390A JPH05160440A JP H05160440 A JPH05160440 A JP H05160440A JP 40818390 A JP40818390 A JP 40818390A JP 40818390 A JP40818390 A JP 40818390A JP H05160440 A JPH05160440 A JP H05160440A
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- pattern
- substrate
- recognition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、複写機やファクシミ
リの光源などに用いられる発光ダイオ−ドアレイに関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode array used as a light source for a copying machine or a facsimile.
【０００２】[0002]
【従来の技術】このような利用分野の発光ダイオ−ドア
レイ（以下、ＬＥＤアレイと称す）には、図３に示され
るように印刷法（あるいは写真法）により配線パタ−ン
（図示しない）が形成された帯板状の基板１の側面に、
発光ダイオ−ド素子２（以下、ＬＥＤペレット２と称
す）を所定間隔で複数個、直列に搭載し、このＬＥＤペ
レット２がある基板１の側面に、ＬＥＤペレット２から
放射される光を集光させるための棒状のレンズ３を配置
した構造が用いられている。2. Description of the Related Art A light emitting diode array (hereinafter referred to as an LED array) in such a field of application is provided with a wiring pattern (not shown) by a printing method (or a photographic method) as shown in FIG. On the side surface of the formed strip-shaped substrate 1,
A plurality of light emitting diode elements 2 (hereinafter referred to as LED pellets 2) are mounted in series at predetermined intervals, and the light emitted from the LED pellets 2 is collected on the side surface of the substrate 1 on which the LED pellets 2 are located. The structure in which the rod-shaped lens 3 for arranging is arranged is used.
【０００３】なお、４はレンズ３の幅方向両側の脚部３
ａ，３ａの下面に突設された複数個のピン、５はこれら
ピン４の位置と対応する基板部分に設けられ上記ピン４
との嵌挿ならびにピン先端のかしめによりレンズ３を固
定するための孔部である。ところで、ＬＥＤアレイは、
イメ−ジセンサを用いたボンディング機械を用いて、基
板１にＬＥＤペレット２ボンディングしている。Reference numeral 4 denotes leg portions 3 on both sides of the lens 3 in the width direction.
A plurality of pins 5 projecting from the lower surface of a, 3a are provided on the substrate portion corresponding to the positions of these pins 4,
It is a hole for fixing the lens 3 by inserting and inserting and with the tip of the pin being caulked. By the way, the LED array
The LED pellets 2 are bonded to the substrate 1 by using a bonding machine using an image sensor.
【０００４】このようなボンディングでは、基板１の長
手方向両端部に、イメ−ジセンサによって認識可能な認
識マ−ク（認識部）Ａを設け、これら２つの認識マ−ク
Ａを基準位置として、同認識マ−ク間をむすぶ線上を基
準線とし所定位置に複数個のＬＥＤペレット２をボンデ
ィングすることが行われている。In such bonding, a recognition mark (recognition portion) A which can be recognized by an image sensor is provided at both ends of the substrate 1 in the longitudinal direction, and these two recognition marks A are used as reference positions. A plurality of LED pellets 2 are bonded to predetermined positions with a line passing through the recognition marks as a reference line.
【０００５】具体的には、従来より、認識マ−クＡは、
印刷法（あるいは写真法）を用いて、基板２をつくる
際、配線パタ−ンの一部として印刷されていて、その形
状には図３の（ａ）で示すようなリング状のマ−ク６や
図４の（ｂ）で示すような十字形状のマ−ク７などの形
状が採用されている。なお、ボンディング機械では、金
色は「白」、それ以外は「黒」と認識するため、認識マ
−クＡは配線パタ−ンと同色にしてある。Specifically, conventionally, the recognition mark A is
When the substrate 2 is formed by the printing method (or the photographic method), it is printed as a part of the wiring pattern, and its shape is a ring-shaped mark as shown in FIG. 6 and a cross-shaped mark 7 as shown in FIG. 4 (b) are used. Since the bonding machine recognizes that the gold color is "white" and the other colors are "black", the recognition mark A has the same color as the wiring pattern.
【０００６】[0006]
【発明が解決しようとする課題】ところで、基板２をつ
くる際、すなわち配線パタ−ン、認識マ−クＡといった
パタ−ンを印刷する際、公差の範囲で、斜めに印刷され
ることがある。By the way, when the substrate 2 is made, that is, when the patterns such as the wiring pattern and the recognition mark A are printed, they may be printed obliquely within the tolerance range. ..
【０００７】ところが、このような斜めパタ−ンの基板
２でＬＥＤペレット２のボンディングが行われると、そ
のまま斜めに配置されている認識マ−クの２点間にＬＥ
Ｄペレット２がボンディングされてしまう。つまり、基
板２の所定位置から、ずれた部位にＬＥＤペレット２が
ボンディングされてしまうことがある。However, when the LED pellets 2 are bonded on the substrate 2 having such an oblique pattern, the LE is placed between the two points of the recognition marks which are obliquely arranged as they are.
The D pellet 2 is bonded. That is, the LED pellets 2 may be bonded to a portion deviated from the predetermined position of the substrate 2.
【０００８】これでは、ＬＥＤアレイを組立てたとき、
基板２上の所定位置にしたがって配光特性を定めたレン
ズ３と、実装したＬＥＤペレット２との差異から、配光
不良の製品ができるおそれが多大であった。With this, when the LED array is assembled,
Due to the difference between the mounted LED pellet 2 and the lens 3 whose light distribution characteristic is determined according to the predetermined position on the substrate 2, there is a great possibility that a product with poor light distribution is produced.
【０００９】この発明はこのような事情に着目してなさ
れたもので、その目的とするところは、パタ−ンのずれ
に関わらず、所定の配光特性を確保することができる発
光ダイオ−ドアレイを提供することにある。The present invention has been made in view of the above circumstances, and an object thereof is to provide a light emitting diode array capable of ensuring a predetermined light distribution characteristic regardless of a pattern deviation. To provide.
【００１０】[0010]
【課題を解決するための手段】上記目的を達成するため
にこの発明の発光ダイオ−ドアレイは、細長状の基板の
長手方向両端部の認識部を、基板の端縁に形成された切
込部と、この切込部の縁部の縁にならって設けられイメ
−ジセンサにより識別可能な識別パタ−ンとから構成し
たことにある。In order to achieve the above object, a light emitting diode array according to the present invention is provided with a notch portion formed at an edge of a substrate for recognizing an end portion of the elongated substrate in the longitudinal direction. And an identification pattern which is provided following the edge of the cut portion and which can be identified by the image sensor.
【００１１】[0011]
【作用】この発明の発光ダイオ−ドアレイによると、ボ
ンディング機械で発光ダイオ−ド素子をボンディングす
るときは、画像表示の差異となって現れる識別パタ−ン
と切込部先端との境界部分が認識場所として認識され
る。つまり、認識場所が基板の形状であるので、たとえ
公差の範囲でパタ−ンがずれを生じたとしても、認識場
所は常に一定である。According to the light emitting diode array of the present invention, when the light emitting diode element is bonded by the bonding machine, the boundary portion between the identification pattern and the tip of the notch which appears as a difference in image display is recognized. Recognized as a place. In other words, since the recognition location is the shape of the substrate, the recognition location is always constant even if the pattern shifts within the tolerance range.
【００１２】これにより、２つの切込先端を基準位置と
して、切込先端間をむすぶ線上を基準線とすると、同線
上に複数個の発光ダイオ−ド素子がボンディングされる
ことになり、発光ダイオ−ドのボンディング位置は基板
に対して常に一定となる。Thus, when the two cutting tips are used as reference positions and a line joining the cutting tips is set as a reference line, a plurality of light emitting diode elements are bonded on the same line, and the light emitting diode is bonded. The bonding position of the board is always constant with respect to the substrate.
【００１３】したがって、たとえ配線パタ−ンが傾斜し
て印刷（写真）されることがあっても、所定の配光特性
を確保することができる。つまり、配光不良を発生する
ようなことはなくなり、常に品質のよい発光ダイオ−ド
アレイを製品として提供できる。Therefore, even if the wiring pattern is printed (photographed) with an inclination, a predetermined light distribution characteristic can be secured. That is, a light distribution defect does not occur, and a high quality light emitting diode array can always be provided as a product.
【００１４】[0014]
【実施例】以下、この発明を図１および図２に示す一実
施例にもとづいて説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on an embodiment shown in FIGS.
【００１５】但し、図面において、先の「従来の技術」
の項で述べた構成部分と同じ部分は同一符号を付してそ
の説明を省略し、この項では異なる部分について説明す
ることにする。本実施例は、認識マ−クＡ（認識部）の
構造と、ピン４および孔部５による固定構造の点で、先
の「従来の技術」で述べたＬＥＤアレイとは異なる。However, in the drawings, the above-mentioned "prior art" is used.
The same parts as the constituent parts described in the above section are denoted by the same reference numerals, and the description thereof will be omitted. In this section, different parts will be described. This embodiment differs from the LED array described in the above-mentioned "prior art" in the structure of the recognition mark A (recognition part) and the fixing structure by the pin 4 and the hole 5.
【００１６】認識マ−クＡの構造は、図１および図２の
（ａ）で示されるように基板１の長手方向両側の端縁
に、先端が鋭角な一対の切込部、たとえばＶ字状の切込
部１０，１０を形成し、これら切込部１０，１０の縁部
およびこの縁部に連続する並行な一対の端縁にならって
帯状の識別パタ−ン１１を設けている。識別パタ−ン１
１は、ボンディング機械のイメ−ジセンサ（図示しな
い）が識別可能な材質、例えば金を金メッキ処理によっ
て縁部に帯状に被膜してなる。As shown in FIG. 1 and FIG. 2 (a), the structure of the recognition mark A has a pair of notched portions, for example, V-shaped, with sharp edges at the edges on both sides in the longitudinal direction of the substrate 1. The cut-out portions 10 and 10 are formed, and a strip-shaped identification pattern 11 is provided along with the edges of the cut-out portions 10 and 10 and a pair of parallel edges continuous with the edge portions. Identification pattern 1
Reference numeral 1 is a band-shaped coating of a material, such as gold, which can be identified by an image sensor (not shown) of a bonding machine, by gold plating.
【００１７】これにより、識別パタ−ン１１と切込部先
端Ｂとの境界部分を、イメ−ジセンサを用いたボンディ
ング機械で認識できる場所としている（金色は「白」、
それ以外は「黒」と認識するため）。つまり、基板１の
両端の鋭角な部分を認識場所として、ボンディング機械
は画像処理し、同２点間をむすぶ線上の所定位置にＬＥ
Ｄペレット２をボンディングするようにしている。As a result, the boundary portion between the identification pattern 11 and the tip B of the cut portion is set as a location which can be recognized by a bonding machine using an image sensor (gold is "white",
Others are recognized as "black"). In other words, the bonding machine performs image processing using the acute-angled portions at both ends of the substrate 1 as the recognition locations, and the LE is placed at a predetermined position on the line joining the two points.
The D pellet 2 is bonded.
【００１８】一方、ピン４と孔部５との嵌挿による固定
構造について説明すれば、通常、ピン４，孔部５の両方
とも、公差を設けているので、ピン４を孔部５に嵌挿し
てかしめて基板１とレンズ３とを固定しても、公差分、
組立てたＬＥＤアレイががたつきを起こす不具合があ
る。On the other hand, the fixing structure by fitting and inserting the pin 4 and the hole portion 5 will be described. Usually, since both the pin 4 and the hole portion 5 have tolerances, the pin 4 is fitted into the hole portion 5. Even if the substrate 1 and the lens 3 are fixed by inserting and caulking,
There is a problem that the assembled LED array causes rattling.
【００１９】そこで、図２の（ｂ）で示されるようにピ
ン４の根元部に公差よりは大ききな最大径をもつ円錐部
１２を設けて、ピン４を孔部５に嵌挿したとき、必ず円
錐部１２が孔部５の開口縁と当接するようにしたもの
で、組付け時ならびにびかしめ固定時（ピン先端をつぶ
して固定するもの）におけるがたつきの発生を抑制でき
るようになっている。Therefore, as shown in FIG. 2B, when a conical portion 12 having a maximum diameter larger than the tolerance is provided at the root of the pin 4 and the pin 4 is fitted into the hole 5. The cone 12 is always brought into contact with the opening edge of the hole 5, so that it is possible to suppress rattling at the time of assembling and caulking (fixing the pin tip by fixing). ing.
【００２０】しかして、ボンディング機械で、切込部１
０による認識部Ａを採用した基板１にＬＥＤペレット２
をボンディングすると、それぞれ識別パタ−ン１１と切
込部先端Ｂとの境界部分が認識場所として認識される。
なお、認識は同部分が画像処理上の差異となって現れ
る。Then, in the bonding machine, the notch 1
LED pellets 2 on the substrate 1 that uses the recognition unit A by 0
After bonding, the boundary between the identification pattern 11 and the tip B of the cut portion is recognized as a recognition place.
In the recognition, the same portion appears as a difference in image processing.
【００２１】このとき、認識場所は基板１の形状である
ので、たとえ公差の範囲でパタ−ンが多少斜めに印刷さ
れたり、ロットの出来上りによって差（ずれ）があって
も、認識場所は常に一定である。At this time, since the recognition place is the shape of the substrate 1, the recognition place is always recognized even if the pattern is printed slightly obliquely within the tolerance range or there is a difference (deviation) due to the completion of the lot. It is constant.
【００２２】そして、ボンディング機械は、これら各認
識した基板１の長手方向両側の切込部先端Ｂ，Ｂを基準
位置とし、同切込部先端Ｂ，Ｂ間をむすぶ線上を基準と
して所定位置にＬＥＤペレット２をボンディングしてい
く。すなわち、ＬＥＤペレット２のボンディング位置は
基板１に対して常に一定の位置となる。Then, the bonding machine uses these recognized cut-out ends B and B on both sides in the longitudinal direction of the substrate 1 as reference positions, and sets the predetermined positions with reference to the line between the cut-out ends B and B as a reference. The LED pellets 2 are bonded. That is, the bonding position of the LED pellet 2 is always a fixed position with respect to the substrate 1.
【００２３】そして、このＬＥＤペレット２が搭載され
た基板１の孔部５にピン４を嵌挿した後、ピン先端をか
しめて、レンズ３を固定することにより、ＬＥＤアレイ
が組立てられていく。After the pin 4 is inserted into the hole 5 of the substrate 1 on which the LED pellet 2 is mounted, the pin tip is caulked and the lens 3 is fixed, whereby the LED array is assembled.
【００２４】したがって、たとえ配線パタ−ン傾斜して
印刷（写真）されることがあっても、ＬＥＤペレット２
とレンズ３の配光性能とは一致することになる。つま
り、パタ−ンが多少公差の範囲でずれることを原因とし
た配光不良はなくなる。したがって、常に所定の配光特
性を確保することができ、常に品質のよいＬＥＤアレイ
を提供できる。なお、一実施例ではＶ字形の切込部を用
いたが、これに限らず、先端が鋭角な切込部であればよ
い。Therefore, even if the wiring pattern may be printed (photographed) with an inclination, the LED pellet 2
And the light distribution performance of the lens 3 agree with each other. That is, the light distribution defect caused by the deviation of the pattern within the tolerance range is eliminated. Therefore, it is possible to always ensure a predetermined light distribution characteristic and always provide a high quality LED array. In addition, although the V-shaped notch is used in the embodiment, the present invention is not limited to this, and a notch having a sharp tip may be used.
【００２５】[0025]
【発明の効果】以上説明したようにこの発明によれば、
パタ−ンのずれに関わらず、所定の配光特性を確保する
ことができる。したがって、パタ−ンが多少公差の範囲
でずれることを原因とした配光不良のない、品質のよい
発光ダイオ−ドアレイを提供することができる。As described above, according to the present invention,
It is possible to ensure a predetermined light distribution characteristic regardless of the deviation of the pattern. Therefore, it is possible to provide a high-quality light emitting diode array which is free from defective light distribution caused by the pattern being slightly displaced within the tolerance range.
【図１】この発明の一実施例の発光ダイオ−ドアレイを
示す分解斜視図。FIG. 1 is an exploded perspective view showing a light emitting diode array according to an embodiment of the present invention.
【図２】（ａ）は同実施例の基板両端の認識部を示す平
面図。（ｂ）は同実施例の基板とレンズとを固定する、
ピンおよび孔部回りの構造を拡大して示す断面図。FIG. 2A is a plan view showing recognition portions at both ends of the substrate of the embodiment. (B) fixes the substrate and the lens of the embodiment,
Sectional drawing which expands and shows the structure around a pin and a hole.
【図３】従来の発光ダイオ−ドアレイの全体の構成を示
す分解斜視図。FIG. 3 is an exploded perspective view showing the overall structure of a conventional light emitting diode array.
【図４】（ａ）は同発光ダイオ−ドアレイの発光ダイオ
−ド素子をボンディグするときの基準位置となる認識部
を示す平面図。（ｂ）はその異なる認識部を示す平面
図。FIG. 4A is a plan view showing a recognition unit which is a reference position when a light emitting diode element of the same light emitting diode array is bonded. FIG. 6B is a plan view showing the different recognition unit.
１…基板、２…ＬＥＤペレット、３…レンズ、３ａ…脚
部、４…ピン、１０…切込部、１１…識別パタ−ン、Ａ
…識別部、Ｂ…切込部先端。DESCRIPTION OF SYMBOLS 1 ... Substrate, 2 ... LED pellet, 3 ... Lens, 3a ... Leg part, 4 ... Pin, 10 ... Notch part, 11 ... Identification pattern, A
... identification part, B ... cut end.
Claims (1)
−ジセンサによって認識可能な認識部をそれぞれ設け、
これら認識部を基準とした２点間の基板部分に複数個の
発光ダイオ−ド素子を所定の間隔で配列させた発光ダイ
オ−ドアレイにおいて、 前記認識部は、 基板の端縁に形成された切込部と、 この切込部の縁部の縁にならって設けられた、前記イメ
−ジセンサで識別可能な識別パタ−ンとから構成したこ
とを特徴とする発光ダイオ−ドアレイ。1. A recognition unit, which can be recognized by an image sensor, is provided at each end of the elongated substrate in the longitudinal direction,
In a light emitting diode array in which a plurality of light emitting diode elements are arranged at a predetermined interval on a substrate portion between two points based on these recognition portions, the recognition portion is a cutout formed on an edge of the substrate. A light emitting diode array comprising a notch portion and an identification pattern which is provided along the edge of the notch portion and which can be discriminated by the image sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40818390A JPH05160440A (en) | 1990-12-27 | 1990-12-27 | Light emitting diode array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40818390A JPH05160440A (en) | 1990-12-27 | 1990-12-27 | Light emitting diode array |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05160440A true JPH05160440A (en) | 1993-06-25 |
Family
ID=18517675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP40818390A Pending JPH05160440A (en) | 1990-12-27 | 1990-12-27 | Light emitting diode array |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05160440A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006310653A (en) * | 2005-04-28 | 2006-11-09 | Toyoda Gosei Co Ltd | Led lamp and method of mounting substrate mounted component |
| WO2010146902A1 (en) * | 2009-06-15 | 2010-12-23 | シャープ株式会社 | Light emitting module, illuminating device, display device, and television receiving device |
-
1990
- 1990-12-27 JP JP40818390A patent/JPH05160440A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006310653A (en) * | 2005-04-28 | 2006-11-09 | Toyoda Gosei Co Ltd | Led lamp and method of mounting substrate mounted component |
| WO2010146902A1 (en) * | 2009-06-15 | 2010-12-23 | シャープ株式会社 | Light emitting module, illuminating device, display device, and television receiving device |
| CN102460752A (en) * | 2009-06-15 | 2012-05-16 | 夏普株式会社 | Light emitting module, illuminating device, display device, and television receiving device |
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