JPH05152386A - Tab pasting method and device thereof - Google Patents
Tab pasting method and device thereofInfo
- Publication number
- JPH05152386A JPH05152386A JP34245391A JP34245391A JPH05152386A JP H05152386 A JPH05152386 A JP H05152386A JP 34245391 A JP34245391 A JP 34245391A JP 34245391 A JP34245391 A JP 34245391A JP H05152386 A JPH05152386 A JP H05152386A
- Authority
- JP
- Japan
- Prior art keywords
- tab
- metal substrate
- metal board
- temporary
- temporarily
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Die Bonding (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は半導体などに使用される
リードフレームのような肉薄の金属基板表面上に、裏面
に接着剤を付与したＴＡＢを高精度に貼着する方法に関
し、特に金属基板とＴＡＢとの貼着面に気泡の巻込みを
生ずることなくＴＡＢを金属基板に貼着する方法および
これに使用する装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for accurately adhering a TAB having an adhesive on the back surface onto a thin metal substrate surface such as a lead frame used for semiconductors, and more particularly to a metal substrate. The present invention relates to a method for sticking TAB to a metal substrate without causing air bubbles to be entrapped on the sticking surface between the TAB and the TAB, and an apparatus used therefor.
【０００２】[0002]
【従来の技術】ＴＡＢ（テープ・オートメーテッド・ボ
ンディング）はポリイミド樹脂などの絶縁性樹脂フィル
ム上に金属を蒸着またはラミネートしたものを所定のパ
ターニング処理してエッチングすることによって所定の
形状の配線パターンを形成したものであって、従来のリ
ードフレームよりも極めて薄く且つ多ピン化を可能にし
たものであり、これを肉薄の金属基板に貼着して使用す
る。2. Description of the Related Art TAB (Tape Automated Bonding) is a method for forming a wiring pattern of a predetermined shape by subjecting an insulating resin film such as a polyimide resin on which a metal is vapor-deposited or laminated to a predetermined patterning process and etching. The lead frame is formed so as to be extremely thinner than the conventional lead frame and has a large number of pins, and is used by being attached to a thin metal substrate.
【０００３】金属基板上にＴＡＢを貼着するには、従来
一般にはＴＡＢを金属基板上の所定位置に載置しておい
て、該ＴＡＢと金属基板を上下より加熱した平板にて押
圧して加熱圧着していた。To attach a TAB onto a metal substrate, conventionally, the TAB is generally placed at a predetermined position on the metal substrate, and the TAB and the metal substrate are pressed from above and below by a heated flat plate. It was hot pressed.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、この方
法によるときは、ＴＡＢの金属基板上への載置を正確に
行なったとしても、両者の貼着面積が大きいために圧着
に際して両材料間にずれを生ずることがあり位置精度の
高い貼着物が得られない恐れがある上に、圧着に際して
ＴＡＢと金属基板との間に気泡が包含されてしまい、気
泡を完全に除去することは至難であった。そして、これ
を解決する方法として、金属基板に微細な脱気孔を多数
設けることによって脱泡することが提案されているが、
この方法によるときは脱気孔から接着剤が洩出する等の
問題が生ずるほか、貼着ずれの問題は根本的に解決され
なかった。However, according to this method, even if the TAB is accurately placed on the metal substrate, since the bonding area of both is large, there is a gap between the two materials during pressure bonding. In addition, there is a possibility that an adherend with high positional accuracy may not be obtained, and bubbles are included between the TAB and the metal substrate during pressure bonding, and it is extremely difficult to completely remove the bubbles. .. Then, as a method of solving this, it is proposed to defoam by providing a large number of fine degassing holes in the metal substrate,
When this method is used, problems such as the adhesive leaking out from the deaeration holes occur, and the problem of sticking misalignment has not been fundamentally solved.
【０００５】本発明はＴＡＢの金属基板への貼着に際し
ての上記の問題点を克服し、ＴＡＢを気泡を巻き込みな
く、且つ正確な位置精度をもって貼着する方法およびこ
の方法を行なうための装置を提供することを目的とする
ものである。The present invention overcomes the above problems in attaching TAB to a metal substrate, and provides a method of attaching TAB with accurate positional accuracy without entraining bubbles, and an apparatus for performing this method. It is intended to be provided.
【０００６】[0006]
【課題を解決するための手段】本発明は上記の目的を達
成するために創案されたものであって、肉薄の金属基板
上に、１パターン毎に切り離して裏面に接着剤を付与し
たＴＡＢを貼着するに際して行なわれる一連の工程であ
って、ａ）：ＴＡＢを仮付け用加熱ステージ上に搭載さ
れた金属基板上の所定位置に正確に載置する工程、
ｂ）：該ＴＡＢの端部をヒートブロックにて押圧して金
属基板とＴＡＢの一部を仮付けする工程、およびｃ）：
前記ｂ）工程においてＴＡＢを仮付けした金属基板を、
ＴＡＢを仮付けした側から上下二個の加熱した回転ロー
ル間を通過させることによって加熱圧着する工程とより
なることを特徴とするものであり、またこの方法を実施
する装置として、移送用レールによって連結された仮付
けステージおよびＴＡＢ加熱圧着ロール、仮付けステー
ジ上に金属基板を搭載するための金属基板移送機構、１
パターン毎に切り離して裏面に接着剤を付与したＴＡＢ
を仮付けステージに搭載した金属基板上に載置するため
のＴＡＢ移送機構、ＴＡＢを正確に金属基板上に載置す
るための位置決め機構および仮付けステージ上において
ＴＡＢと金属基板とを部分的に仮付けるためのヒートブ
ロックとよりなるＴＡＢ貼着装置を提案するものであ
る。SUMMARY OF THE INVENTION The present invention was devised to achieve the above-mentioned object, and is a TAB in which an adhesive is applied to the back surface of a thin metal substrate which is separated for each pattern. A series of steps carried out when attaching, a): a step of accurately placing the TAB at a predetermined position on the metal substrate mounted on the temporary heating stage,
b): a step of pressing the end portion of the TAB with a heat block to temporarily attach a part of the TAB to the metal substrate, and c):
In the step b), the metal substrate to which the TAB is temporarily attached is
It is characterized in that it comprises a step of performing thermocompression bonding by passing between the two temporarily heated heating rolls from the side where the TAB is temporarily attached, and as a device for carrying out this method, a transfer rail is used. Connected temporary mounting stage and TAB heating and pressure bonding roll, metal substrate transfer mechanism for mounting the metallic substrate on the temporary mounting stage, 1
TAB which is separated into each pattern and adhesive is applied to the back surface
TAB transfer mechanism for mounting the TAB on the metal substrate mounted on the temporary mounting stage, a positioning mechanism for accurately mounting the TAB on the metal substrate, and the TAB and the metal substrate partially on the temporary mounting stage. The present invention proposes a TAB attaching device including a heat block for temporary attachment.
【０００７】[0007]
【作用】本発明は上記したように、裏面に接着剤を付与
したＴＡＢを金属基板上に正確に位置決めして載置した
後、ＴＡＢの一部を部分的に金属基板に仮付けしておい
てから加熱圧着ロールによってＴＡＢの端部から熱圧着
していって最終的に全面を貼着するものであるから、Ｔ
ＡＢと金属基板との間に包含される気泡は完全に追い出
されるために気泡の巻き込みは完全に防止されることに
なる。また、本発明の貼着方法によれば、前段の仮付け
工程を行なうに際してＴＡＢの金属基板上への位置決め
を正確に行なってさえおれば、ヒートブロックの圧着に
よる仮付け面積が小さいので圧着に際しての材料間のず
れを全く生ずることがないので、後段のロールによる熱
圧着を行なうことによって位置精度の高い貼着物を得る
ことができるのである。According to the present invention, as described above, after the TAB having the adhesive on its back surface is accurately positioned and placed on the metal substrate, a part of the TAB is partially temporarily attached to the metal substrate. Then, the thermo-bonding roll is used to thermo-compress from the end of the TAB to finally bond the entire surface.
The bubbles contained between the AB and the metal substrate are completely expelled, so that the inclusion of bubbles is completely prevented. Further, according to the pasting method of the present invention, if the TAB is accurately positioned on the metal substrate during the preliminary tacking step, the tacking area of the heat block is small, so that the tacking is performed. Since there is no deviation between the materials of (1) and (2), it is possible to obtain a bonded article with high positional accuracy by performing thermocompression bonding with a roll in the subsequent stage.
【０００８】[0008]
【実施例】次に本発明の実施例について説明する。EXAMPLES Next, examples of the present invention will be described.
【０００９】図１は本発明のＴＡＢ貼着方法を実施する
ための装置の一実施例を示すものの概略平面図、図２は
１パターン毎に切り離して裏面に接着剤を付与したＴＡ
ＢをＴＡＢマガジンから取り出すための機構説明図、図
３は仮付けステージの作動の詳細を示す側面図、図４は
ＴＡＢ加熱圧着ロールの側面図である。FIG. 1 is a schematic plan view showing an embodiment of an apparatus for carrying out the TAB attaching method of the present invention, and FIG. 2 is a TA in which an adhesive is applied to the back surface by separating each pattern.
FIG. 3 is a side view showing a mechanism for taking out B from the TAB magazine, FIG. 3 is a side view showing details of the operation of the temporary attachment stage, and FIG.
【００１０】図において、１は仮付けステージ、２はＴ
ＡＢ加熱圧着ロールであり、両者は移送用レール３にて
連結されている。４は金属基板で、仮付けステージ１の
側方に積み重ねられていてその一枚づつが基板移送機構
５によって、仮付けステージ上に搭載される。５ａは基
板移送機構５におけるＹ軸方向移送機、５ｂはＹ軸方向
移送機に設けられた基板移送搭載用アームである。In the figure, 1 is a temporary mounting stage, 2 is T
AB heating and pressing rolls, both of which are connected by a transfer rail 3. Reference numeral 4 denotes a metal substrate, which is stacked on the side of the temporary mounting stage 1 and one by one is mounted on the temporary mounting stage by the substrate transfer mechanism 5. Reference numeral 5a is a Y-axis direction transfer device in the substrate transfer mechanism 5, and 5b is a substrate transfer mounting arm provided in the Y-axis direction transfer device.
【００１１】６は１パターン毎に切り離されて裏面に接
着剤を付与したＴＡＢであり、該ＴＡＢ６は金属基板４
の積み重ね位置と仮付けステージ１を介して反対側の側
方に位置するＴＡＢマガジン９にストックされていて、
図２に示されるようにＴＡＢ移送機構７に設置された回
転角θを有する真空吸着ヘッド７ａがＴＡＢマガジン９
上に来ると上下機構１０が作動して金属基板４は真空吸
着ヘッド７ａ面まで上昇し、一枚づつ吸着されてＴＡＢ
マガジン９から取り出され、該移送機構７のＹ軸方向移
送機７ｃ、Ｘ軸方向移送機７ｂの操作により仮付けステ
ージ１上の金属基板４上に載置される。Reference numeral 6 is a TAB which is separated for each pattern and is provided with an adhesive on the back surface thereof. The TAB 6 is a metal substrate 4.
Are stocked in the TAB magazine 9 located on the opposite side through the stacking position and the temporary mounting stage 1.
As shown in FIG. 2, the vacuum suction head 7 a having the rotation angle θ installed in the TAB transfer mechanism 7 is attached to the TAB magazine 9
When it comes to the top, the up-and-down mechanism 10 operates and the metal substrates 4 rise up to the surface of the vacuum suction head 7a, and are sucked one by one to the TAB.
It is taken out from the magazine 9 and placed on the metal substrate 4 on the temporary mounting stage 1 by operating the Y-axis direction transfer device 7c and the X-axis direction transfer device 7b of the transfer mechanism 7.
【００１２】ＴＡＢの金属基板４上への載置に際して
は、図３に示されるように仮付けステージ１の上方には
位置決め装置（画像処理用カメラ）８が設置されてい
て、予め金属基板４とＴＡＢ６にそれぞれ設定された会
わせマーク４ａおよび６ａが一致するように、ＴＡＢ移
送機構７における回転角θを有する吸着ヘッド、Ｙ軸移
送機７ｃ、Ｘ軸移送機７ｂをそれぞれ調整して位置修正
を行ないＴＡＢの載置位置の正確な位置決めが行なわ
れ、位置決め完了後ＴＡＢ６は真空吸着ヘッド７ａによ
り吸着されたまま金属基板４上に載置される。When mounting the TAB on the metal substrate 4, a positioning device (image processing camera) 8 is installed above the temporary mounting stage 1 as shown in FIG. And the TAB 6 are adjusted so that the matching marks 4a and 6a set respectively on the TAB 6 and the TAB 6 are adjusted by adjusting the suction head having the rotation angle θ, the Y-axis transfer machine 7c, and the X-axis transfer machine 7b. The TAB 6 is placed on the metal substrate 4 while being sucked by the vacuum suction head 7a.
【００１３】ＴＡＢ６を金属基板４上に載置した後に、
ヒートブロック１２を降下させてＴＡＢ６と金属基板４
とを仮付けステージ１のバックアッププレート１１との
間で押圧加熱した後、真空吸着ヘッド７ａの真空破壊を
行ない、ＴＡＢ６を放す。ＴＡＢ６の裏面には熱硬化性
の接着剤が付与されているのでＴＡＢ６と金属基板４と
はヒートブロック１２によって押圧された部分のみが接
着される。この場合ヒートブロック１２による押圧面積
を小さく採ることによって接着部分の面積は極めて小さ
くなるので気泡の含有される機会は殆どない。このよう
に仮付けステージ１において部分的に貼着されたＴＡＢ
６と金属基板４とは移送機構（図示せず）により移送レ
ール３上をＴＡＢ加熱圧着ロール２に移送される。After mounting the TAB 6 on the metal substrate 4,
Lower the heat block 12 to move the TAB 6 and the metal substrate 4 together.
After pressing and heating between and with the backup plate 11 of the temporary mounting stage 1, the vacuum suction head 7a is broken in vacuum, and the TAB 6 is released. Since a thermosetting adhesive is applied to the back surface of the TAB 6, only the portion of the TAB 6 and the metal substrate 4 pressed by the heat block 12 is bonded. In this case, since the area of the bonded portion becomes extremely small by making the pressing area of the heat block 12 small, there is almost no chance of inclusion of bubbles. Thus, the TAB partially attached on the temporary mounting stage 1
6 and the metal substrate 4 are transferred to the TAB heating pressure bonding roll 2 on the transfer rail 3 by a transfer mechanism (not shown).
【００１４】ＴＡＢ加熱圧着ロール２に移送されたＴＡ
Ｂ６と金属基板４は、図４に示されるように回転する二
つのヒートローラー１３間に部分的に貼着された先端側
より送り込まれる。このようにすることによってＴＡＢ
６と金属基板４とは貼着された先端側から順次ヒートロ
ーラー１３間で熱圧着されながらローラー回転方向へと
進むので両者は位置ずれを生ずることがなく、またその
間に気泡を巻き込むこともなく全面的に貼着を行なうこ
とができる。TA transferred to the TAB heating and compression roll 2
B6 and the metal substrate 4 are fed from the front end side partially adhered between the two heat rollers 13 that rotate as shown in FIG. By doing this, TAB
6 and the metal substrate 4 proceed in the roller rotation direction while being thermocompressed between the heat rollers 13 sequentially from the front end side where they are adhered, so that they are not displaced and there is no entrapment of air bubbles between them. The entire surface can be attached.
【００１５】[0015]
【発明の効果】本発明は上記したように、裏面に接着剤
を付与したＴＡＢを金属基板上に正確に位置決めして載
置した後、ＴＡＢの一部を部分的に金属基板に仮付けし
ておいてから加熱圧着ロールによってＴＡＢの端部から
熱圧着していって最終的に全面を貼着するものであるか
ら、貼着に際しての両者の位置ずれを生ずることがなく
正確な位置精度で貼着を行なうことができ、またＴＡＢ
と金属基板との間における気泡の巻き込みを完全に防止
することができる。従ってこれによって得られたリード
フレームはその信頼性が高い。As described above, according to the present invention, after the TAB having the adhesive on its back surface is accurately positioned and placed on the metal substrate, a part of the TAB is temporarily attached to the metal substrate. Since the entire surface is finally bonded by thermocompression bonding from the end of the TAB by the thermocompression bonding roll, there is no positional deviation between the two when bonding and accurate positioning accuracy is achieved. Can be pasted and TAB
It is possible to completely prevent the inclusion of bubbles between the metal substrate and the metal substrate. Therefore, the lead frame thus obtained has high reliability.
【図１】本発明のＴＡＢ貼着装置の一実施例を示す概略
平面図である。FIG. 1 is a schematic plan view showing an embodiment of a TAB attaching apparatus of the present invention.
【図２】ＴＡＢをＴＡＢマガジンから取り出すための機
構説明図である。FIG. 2 is an explanatory view of a mechanism for taking out a TAB from a TAB magazine.
【図３】仮付けステージの作動の詳細を示す側面図であ
る。FIG. 3 is a side view showing details of the operation of the tacking stage.
【図４】ＴＡＢ熱圧着ロールの作動側面図である。FIG. 4 is an operation side view of the TAB thermocompression bonding roll.
１ 仮付けステージ ２ ＴＡＢ加熱圧着ロール ３ 移送用レール ４ 金属基板 ４ａ 基板合せ用マーク ５ 金属基板移送機構 ５ａ Ｙ軸方向基板移送機 ５ｂ 基板移送用アーム ６ ＴＡＢ ６ａ ＴＡＢ合せ用マーク ７ ＴＡＢ移送機構 ７ａ 真空吸着ヘッド ７ｂ Ｘ軸方向ＴＡＢ移送機 ７ｃ Ｙ軸方向ＴＡＢ移送機 ８ 位置決め装置（画像処理用カメラ） ９ ＴＡＢマガジン １０ ＴＡＢ上下機構 １１ バックアッププレート １２ ヒートブロック １３ ヒートローラー DESCRIPTION OF SYMBOLS 1 Temporary mounting stage 2 TAB heating and pressure bonding roll 3 Transfer rail 4 Metal substrate 4a Substrate alignment mark 5 Metal substrate transport mechanism 5a Y-axis direction substrate transport machine 5b Substrate transport arm 6 TAB 6a TAB alignment mark 7 TAB transport mechanism 7a Vacuum suction head 7b X-axis direction TAB transfer machine 7c Y-axis direction TAB transfer machine 8 Positioning device (image processing camera) 9 TAB magazine 10 TAB lifting mechanism 11 Backup plate 12 Heat block 13 Heat roller
Claims (3)
て裏面に接着剤を付与したＴＡＢを貼着するに際して行
なわれる一連の工程であって、 ａ）：ＴＡＢを仮付け用加熱ステージ上に搭載された金
属基板上の所定位置に正確に載置する工程、 ｂ）：該ＴＡＢの端部をヒートブロックにて押圧して金
属基板とＴＡＢの一部を仮付けする工程、および ｃ）：前記ｂ）工程においてＴＡＢを仮付けした金属基
板を、ＴＡＢを仮付けした側から上下二個の加熱した回
転ロール間を通過させることによってＴＡＢと金属基板
とを加熱圧着する工程とよりなることを特徴とするＴＡ
Ｂの貼着方法。1. A series of steps carried out when a TAB having a back surface and an adhesive applied thereto is attached to a metal substrate by separating each pattern, wherein a): TAB is placed on a heating stage for temporary attachment. Accurately mounting at a predetermined position on the mounted metal substrate, b): pressing the end portion of the TAB with a heat block to temporarily attach the metal substrate and a part of the TAB, and c): In the step b), the step of passing the metal substrate to which the TAB has been temporarily attached between the two upper and lower heated rotating rolls from the side to which the TAB has been temporarily attached to perform thermocompression bonding of the TAB and the metal substrate. Characteristic TA
How to attach B.
ステージおよびＴＡＢ加熱圧着ロール、仮付けステージ
上に金属基板を搭載するための金属基板移送機構、１パ
ターン毎に切り離して裏面に接着剤を付与したＴＡＢを
仮付けステージに搭載した金属基板上に載置するための
ＴＡＢ移送機構、仮付けステージにおいてＴＡＢを正確
に金属基板上に載置するための位置決め機構および仮付
けステージ上のＴＡＢと金属基板とを部分的に仮付けす
るためのヒートブロックとよりなるＴＡＢ貼着装置。2. A temporary mounting stage and a TAB thermocompression bonding roll connected by a transfer rail, a metal substrate transfer mechanism for mounting a metal substrate on the temporary mounting stage, and an adhesive is applied to the back surface by separating each pattern. TAB transfer mechanism for mounting the formed TAB on the metal substrate mounted on the temporary mounting stage, positioning mechanism for accurately mounting the TAB on the metal substrate at the temporary mounting stage, and TAB and metal on the temporary mounting stage A TAB sticking device including a heat block for temporarily temporarily attaching a substrate.
にそれぞれ設定した位置合せマークを画像処理カメラに
よって合致させるように構成した請求項２記載のＴＡＢ
貼着装置。3. The positioning mechanism includes a metal substrate and a TAB.
The TAB according to claim 2, wherein the alignment marks respectively set in the
Sticking device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34245391A JPH0831503B2 (en) | 1991-11-30 | 1991-11-30 | TAB sticking method and sticking apparatus used therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34245391A JPH0831503B2 (en) | 1991-11-30 | 1991-11-30 | TAB sticking method and sticking apparatus used therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05152386A true JPH05152386A (en) | 1993-06-18 |
| JPH0831503B2 JPH0831503B2 (en) | 1996-03-27 |
Family
ID=18353864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34245391A Expired - Lifetime JPH0831503B2 (en) | 1991-11-30 | 1991-11-30 | TAB sticking method and sticking apparatus used therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0831503B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001176895A (en) * | 1994-10-31 | 2001-06-29 | Hitachi Chem Co Ltd | Laminating method, die-bonding method, laminating device, and die-bonding device of film-shaped organic die-bonding material, and semiconductor device and manufacturing method thereof using the same |
| US6717242B2 (en) | 1995-07-06 | 2004-04-06 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
| US6825249B1 (en) | 1994-12-26 | 2004-11-30 | Hitachi Chemical Co., Ltd. | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device |
| US6855579B2 (en) | 1995-07-06 | 2005-02-15 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
-
1991
- 1991-11-30 JP JP34245391A patent/JPH0831503B2/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001176895A (en) * | 1994-10-31 | 2001-06-29 | Hitachi Chem Co Ltd | Laminating method, die-bonding method, laminating device, and die-bonding device of film-shaped organic die-bonding material, and semiconductor device and manufacturing method thereof using the same |
| US6825249B1 (en) | 1994-12-26 | 2004-11-30 | Hitachi Chemical Co., Ltd. | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device |
| US6717242B2 (en) | 1995-07-06 | 2004-04-06 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
| US6855579B2 (en) | 1995-07-06 | 2005-02-15 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
| US7012320B2 (en) | 1995-07-06 | 2006-03-14 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
| US7057265B2 (en) | 1995-07-06 | 2006-06-06 | Hitachi Chemical Co., Ltd. | Semiconductor device and process for fabrication thereof |
| US7078094B2 (en) | 1995-07-06 | 2006-07-18 | Hitachi Chemical Co., Ltd. | Semiconductor device and process for fabrication thereof |
| US7387914B2 (en) | 1995-07-06 | 2008-06-17 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
| US7781896B2 (en) | 1995-07-06 | 2010-08-24 | Hitachi Chemical Co., Ltd. | Semiconductor device and process for fabrication thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0831503B2 (en) | 1996-03-27 |
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