JPH05147249A - Thermal head - Google Patents

Abstract

PURPOSE:To provide a thermal head which can form accurately a required print image even on a recording member consisting of a hard material which is hardly curved. CONSTITUTION:A plurality of heating resistors 2 are mounted on one main face 1a of an electrical insulating base sheet 1 and a driving IC 5 for performing selectively joule heat generation of the heating resistor 2 is mounted on another main face 1b. The surface of the side of the electrical insulating base sheet 1 on which the heating resistor 2 is mounted becomes approximately flat thereby and as the result, it is unnecessary to curve a recording member 6 when the recording member 6 is fed on the heating resistor 2 to form a print image and it is possible to form a good print image as it is even when the recording member 6 consists of a hard material such as a plastic.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、ワードプロセッサやフ
ァクシミリ等のプリンタ機構に搭載されるサーマルヘッ
ドの改良に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a thermal head mounted on a printer mechanism such as a word processor and a facsimile.

【０００２】[0002]

【従来技術及びその問題点】従来、ワードプロセッサ等
のプリンタ機構に組み込まれるサーマルヘッドは図３に
示す如く、アルミナセラミックス等から成る電気絶縁性
基板１１の一主面に窒化タンタル等から成る発熱抵抗体
１２とアルミニウム等から成る一対の導電層１３ａ、１
３ｂと窒化珪素等から成る保護層１４とを順次被着させ
るとともに前記一方の導電層１３ａを発熱抵抗体１２を
共通に接続する共通導電層１４に、また他方の導電層１
３ｂを基板１１の一主面に搭載され、発熱抵抗体１２を
選択的にジュール発熱させるための駆動用ＩＣ１５に夫
々電気的に接続させた構造となっている。2. Description of the Related Art Conventionally, as shown in FIG. 3, a thermal head incorporated in a printer mechanism such as a word processor has a heating resistor made of tantalum nitride or the like on one main surface of an electrically insulating substrate 11 made of alumina ceramics or the like. 12 and a pair of conductive layers 13a, 1 made of aluminum or the like.
3b and a protective layer 14 made of silicon nitride or the like are sequentially deposited, and the one conductive layer 13a is connected to the common conductive layer 14 commonly connected to the heating resistor 12, and the other conductive layer 1 is used.
3b is mounted on one main surface of the substrate 11 and is electrically connected to driving ICs 15 for selectively heating the heating resistors 12 by Joule heat.

【０００３】かかる上述のサーマルヘッドは、前記一対
の導電層１３ａと１３ｂの間に所定の電力を印加して発
熱抵抗体１２をジュール発熱させると共に、該発熱抵抗
体１２に記録部材１６をプラテンローラ１７により順次
押圧対接させ、記録部材１６に印字画像を形成すること
によってサーマルヘッドとして機能する。In the above-described thermal head, a predetermined electric power is applied between the pair of conductive layers 13a and 13b to heat the heating resistor 12 by Joule heat, and the recording member 16 is attached to the heating resistor 12 by a platen roller. The head 17 is pressed and brought into contact with each other in sequence to form a print image on the recording member 16, thereby functioning as a thermal head.

【０００４】しかしながら、この従来のサーマルヘッド
は、電気絶縁性基板１１の一主面側に発熱抵抗体１２と
該発熱抵抗体１２を選択的にジュール発熱させる駆動用
ＩＣ１５の両方が被着搭載されており、駆動用ＩＣ１５
の高さが発熱抵抗体１２の上面に比べて極めて高いこと
から記録部材１６を発熱抵抗体１２上に順次送り込んで
印字画像を形成させる際、記録部材１６は駆動用ＩＣ１
５に当たって送り込みが阻害されるのを有効に防止する
ために湾曲させて発熱抵抗体１２上に送り込まなければ
ならず、湾曲させるのが困難な、例えばプラスチック等
の硬い材料から成る記録部材には該記録部材が駆動用Ｉ
Ｃ１５に当たって所望する印字画像を正確に形成するこ
とができないという欠点を有していた。However, in this conventional thermal head, both the heating resistor 12 and the driving IC 15 for selectively heating the heating resistor 12 by Joule heat are attached and mounted on one main surface side of the electrically insulating substrate 11. Drive IC15
Since the height of the recording member 16 is extremely higher than the upper surface of the heating resistor 12, when the recording member 16 is sequentially fed onto the heating resistor 12 to form a printed image, the recording member 16 is driven by the driving IC 1
In order to effectively prevent the feed from being hindered by hitting 5, it must be bent and fed onto the heating resistor 12, and for a recording member made of a hard material such as plastic, which is difficult to bend, Recording member for driving I
It has a drawback that a desired printed image cannot be accurately formed by hitting C15.

【０００５】そこで上記欠点を解消するために図４に示
す如く、金属基板２０の一部に凹部を設け、該凹部内に
駆動用ＩＣ２５を収容した後、金属基板２０及び駆動用
ＩＣ２５の上面に耐熱性有機絶縁膜２１を間に配して発
熱抵抗体２２及び一対の導電層２３ａ、２３ｂをスパッ
タリング法により被着させた表面が平坦なサーマルヘッ
ドが提案されている（特開昭６１−１６９２６２号参
照）。Therefore, in order to solve the above-mentioned drawback, as shown in FIG. 4, a recess is provided in a part of the metal substrate 20, and the driving IC 25 is housed in the recess, and then the upper surfaces of the metal substrate 20 and the driving IC 25 are covered. There is proposed a thermal head having a flat surface on which a heat-generating resistor 22 and a pair of conductive layers 23a and 23b are deposited by a sputtering method with a heat-resistant organic insulating film 21 interposed therebetween (Japanese Patent Laid-Open No. 61-169262). No.).

【０００６】しかしながら、このサーマルヘッドは金属
基板２０及び駆動用ＩＣ２５の上面に耐熱性有機絶縁膜
２１を被着させる際、あるいは更にその上面に発熱抵抗
体２２や一対の導電層２３ａ、２３ｂを被着させる際、
約３００℃の温度が必要であり、この熱が駆動用ＩＣ２
５に印加されて駆動用ＩＣ２５に熱破壊や熱劣化を招来
させ、サーマルヘッドを常に正常、安定に作動させるこ
とが不可となる欠点を有している。However, in this thermal head, when the heat-resistant organic insulating film 21 is deposited on the upper surfaces of the metal substrate 20 and the driving IC 25, or further on the upper surfaces thereof, the heating resistor 22 and the pair of conductive layers 23a and 23b are coated. When dressing
A temperature of about 300 ° C is required, and this heat is used by the driving IC2.
5 has a drawback that it causes thermal destruction or thermal deterioration of the driving IC 25, which makes it impossible to always operate the thermal head normally and stably.

【０００７】[0007]

【発明の目的】本発明は上記諸欠点に鑑み案出されたも
ので、その目的は湾曲が困難な硬質材料から成る記録部
材にも所望する印字画像を正確に形成することができる
サーマルヘッドを提供することにある。SUMMARY OF THE INVENTION The present invention has been conceived in view of the above drawbacks, and an object thereof is to provide a thermal head capable of accurately forming a desired printed image on a recording member made of a hard material which is difficult to bend. To provide.

【０００８】[0008]

【問題点を解決するための手段】本発明のサーマルヘッ
ドは、電気絶縁性基板の一主面に複数個の発熱抵抗体
を、他主面に前記発熱抵抗体を選択的にジュール発熱さ
せるための駆動用ＩＣを搭載したことを特徴とする。SUMMARY OF THE INVENTION The thermal head of the present invention has a plurality of heating resistors on one main surface of the electrically insulating substrate and selectively heats the heating resistors on the other main surface by Joule heat. Is equipped with a driving IC.

【０００９】[0009]

【実施例】以下、本発明の実施例を添付した図面に基づ
いて説明する。Embodiments of the present invention will be described below with reference to the accompanying drawings.

【００１０】図１は本発明のサーマルヘッドの一実施例
を示す斜視図、図２は図１のＸ−Ｘ’線断面図であり、
１は電気絶縁性基板、２は発熱抵抗体、５は駆動用ＩＣ
である。FIG. 1 is a perspective view showing an embodiment of the thermal head of the present invention, and FIG. 2 is a sectional view taken along line XX 'of FIG.
1 is an electrically insulating substrate, 2 is a heating resistor, and 5 is a driving IC
Is.

【００１１】前記基板１は例えばポリイミド樹脂等の電
気絶縁性材料から成っており、その上面に被着される発
熱抵抗体３の発する熱を蓄積及び放散しサーマルヘッド
の熱応答特性を良好に維持する作用を為す。The substrate 1 is made of, for example, an electrically insulating material such as polyimide resin, and accumulates and dissipates heat generated by the heating resistor 3 attached to the upper surface of the substrate 1 to maintain good thermal response characteristics of the thermal head. Make the action.

【００１２】また前記基板１の一主面１ａと他主面１ｂ
の間には、多数のコンタクトホール１ｃが形成されてお
り、該コンタクトホール１ｃ内には銅等から成る導電部
材３ｃが充填され、後述する基板１の一主面１ａに被着
形成される導電層３ｂと他主面１ｂに搭載される駆動用
ＩＣ５とを電気的に接続している。Further, one main surface 1a and the other main surface 1b of the substrate 1
A large number of contact holes 1c are formed between them, and a conductive member 3c made of copper or the like is filled in the contact holes 1c to form a conductive film formed on one main surface 1a of the substrate 1 described later. The layer 3b and the driving IC 5 mounted on the other main surface 1b are electrically connected.

【００１３】前記導電部材３ｃが充填されたコンタクト
ホール１ｃを有する基板１は、先ずポリイミド樹脂等か
ら成る板状体を準備し、次に該板状体に所定のエッチン
グ処理を施すことによって多数のコンタクトホール１ｃ
を形成し、最後に該コンタクトホール１ｃの内部に銅等
から成る導電部材３ｃをメッキ法等を採用し充填させる
ことによって製作される。The substrate 1 having the contact hole 1c filled with the conductive member 3c is prepared by first preparing a plate-like body made of polyimide resin or the like, and then subjecting the plate-like body to a predetermined etching treatment to obtain a large number of plates. Contact hole 1c
Is formed, and finally the inside of the contact hole 1c is filled with a conductive member 3c made of copper or the like by a plating method or the like.

【００１４】前記基板１はまたその一主面１ａに多数の
発熱抵抗体２が被着配列されており、該発熱抵抗体２は
それ自体が所定の電気抵抗率を有し、後述する一対の導
電層３ａ、３ｂを介して所定の電力が印加されると感熱
紙等の記録部材６に印字画像を形成するに必要な温度に
ジュール発熱する作用を為す。The substrate 1 also has a large number of heat generating resistors 2 attached and arranged on one main surface 1a thereof. The heat generating resistors 2 themselves have a predetermined electric resistivity, and a pair of them will be described later. When a predetermined electric power is applied through the conductive layers 3a and 3b, Joule heat is generated at a temperature required to form a print image on the recording member 6 such as thermal paper.

【００１５】前記発熱抵抗体２は窒化タンタル等から成
り、従来周知のスパッタリング法及びフォトリソグラフ
ィー技術等を採用することによって基板１の一主面１ａ
に被着配列される。The heat generating resistor 2 is made of tantalum nitride or the like, and one main surface 1a of the substrate 1 is formed by adopting the conventionally known sputtering method and photolithography technique.
It is deposited and arranged on.

【００１６】また前記各発熱抵抗体２の上面には間に一
定の間隔をもった一対の導電層３ａ、３ｂが被着されて
おり、該一方の導電層３ａは発熱抵抗体２を共通接続し
て大きな電流の流れを許容する共通導電層４に、また他
方の導電層３ｂは基板１の各コンタクトホール１ｃに充
填した導電部材３ｃを介して後述する基板１の他主面１
ｂに搭載される駆動用ＩＣ５に電気的接続されており、
前記一対の導電層３ａ、３ｂは発熱抵抗体２をジュール
発熱させるための所定電力を印加する作用を為す。Further, a pair of conductive layers 3a and 3b having a constant interval are deposited on the upper surface of each heating resistor 2, and the one heating layer 2 is commonly connected to the one conductive layer 3a. The common conductive layer 4 which allows a large current to flow, and the other conductive layer 3b through the conductive member 3c filled in each contact hole 1c of the substrate 1 and the other main surface 1 of the substrate 1 described later.
It is electrically connected to the driving IC 5 mounted on b.
The pair of conductive layers 3a and 3b serve to apply a predetermined electric power for causing the heating resistor 2 to generate Joule heat.

【００１７】前記一対の導電層３ａ、３ｂはアルミニウ
ム等から成り、従来周知のスパッタリング法等を採用す
ることによって発熱抵抗体２の上面に間に一定の間隔を
もって被着される。The pair of conductive layers 3a and 3b are made of aluminum or the like, and are adhered to the upper surface of the heating resistor 2 at a constant interval by using a conventionally known sputtering method or the like.

【００１８】また前記発熱抵抗体２及び一対の導電層３
ａ、３ｂの上面には、大気中の水分等の接触による酸化
腐食や記録部材６の摺動による摩耗から発熱抵抗体２や
一対の導電層３ａ、３ｂを保護するための保護層７が被
着されており、該保護層７は窒化珪素等を従来周知のス
パッタリング法等を採用することによって発熱抵抗体２
及び一対の導電層３ａ、３ｂの上面に被着される。The heating resistor 2 and the pair of conductive layers 3 are also provided.
A protective layer 7 for protecting the heat generating resistor 2 and the pair of conductive layers 3a, 3b from oxidation corrosion due to contact with moisture in the atmosphere or abrasion due to sliding of the recording member 6 is provided on the upper surfaces of a and 3b. The protective layer 7 is formed of silicon nitride or the like by employing a conventionally known sputtering method or the like.
And the upper surfaces of the pair of conductive layers 3a and 3b.

【００１９】一方、前記基板１の他主面１ｂには基板１
に設けた各コンタクトホール１ｃ内の導電部材３ｃと電
気的に接続された多数の導電層３ｄが被着されており、
該導電層３ｄには駆動用ＩＣ５が半田５ａ等を介して電
気的接続されている。On the other hand, on the other main surface 1b of the substrate 1, the substrate 1
A large number of conductive layers 3d electrically connected to the conductive members 3c in the respective contact holes 1c provided in
A driving IC 5 is electrically connected to the conductive layer 3d via solder 5a or the like.

【００２０】前記導電層３ｄはアルミニウム等の金属材
料から成り、従来周知のスパッタリング法を採用するこ
とによって基板１の他主面１ｂ表面で、各コンタクトホ
ール１ｃ内の導電部材３ｃと電気的に接続するようにし
て被着される。The conductive layer 3d is made of a metal material such as aluminum, and is electrically connected to the conductive member 3c in each contact hole 1c on the surface of the other main surface 1b of the substrate 1 by adopting a conventionally known sputtering method. To be applied.

【００２１】また前記基板１に被着された導電層３ｄに
接続される前記駆動用ＩＣ５は、発熱抵抗体２を選択的
にジュール発熱させる作用を為し、外部電気信号に対応
して駆動用ＩＣ５を駆動させると記録部材に所望する印
字画像が正確に得られるよう発熱抵抗体２が選択的にジ
ュール発熱する。The driving IC 5 connected to the conductive layer 3d adhered to the substrate 1 has a function of selectively causing the heating resistor 2 to generate Joule heat, and is driven in response to an external electric signal. When the IC 5 is driven, the heating resistor 2 selectively generates Joule heat so that a desired printed image can be accurately obtained on the recording member.

【００２２】尚、前記駆動用ＩＣ５は、前記基板１の他
主面１ｂに被着された導電層３ｄにフェイスボンディン
グ法等を採用することによって電気的接続され、同時に
基板１の他主面１ｂに搭載される。The driving IC 5 is electrically connected to the conductive layer 3d deposited on the other main surface 1b of the substrate 1 by face bonding or the like, and at the same time the other main surface 1b of the substrate 1 is connected. Will be installed in.

【００２３】前記駆動用ＩＣ５は基板１の発熱抵抗体２
が被着形成されている一主面１ａとは反対の他主面１ｂ
に搭載されており、発熱抵抗体２の近傍に該発熱抵抗体
２の上面より高さが高くなる駆動用ＩＣ５が配されてい
ないため、基板１の発熱抵抗体２が被着された側の表面
は略平坦となり、その結果、発熱抵抗体２上に記録部材
６を送り込んで印字画像を形成する際、記録部材６を湾
曲させる必要は無く、記録部材６がプラスチック等の硬
い材料から成っていてもそのまま良好な印字画像を形成
することが可能となる。The driving IC 5 is the heating resistor 2 of the substrate 1.
The other main surface 1b opposite to the one main surface 1a on which
Since the driving IC 5 whose height is higher than the upper surface of the heating resistor 2 is not provided in the vicinity of the heating resistor 2 on the side of the substrate 1 on which the heating resistor 2 is attached, The surface is substantially flat, and as a result, when the recording member 6 is fed onto the heating resistor 2 to form a printed image, it is not necessary to bend the recording member 6, and the recording member 6 is made of a hard material such as plastic. However, it is possible to form a good printed image as it is.

【００２４】前記駆動用ＩＣ５を搭載した基板１の他主
面１ｂはまたエポキシ樹脂等から成る電気絶縁層８で覆
われており、該電気絶縁層８は導電層３ｄ等を大気中の
水分等の接触による酸化腐食から保護するとともに、導
電層３ｄと後述する支持体９とを電気的に絶縁する作用
を為す。The other main surface 1b of the substrate 1 on which the driving IC 5 is mounted is also covered with an electric insulating layer 8 made of epoxy resin or the like, and the electric insulating layer 8 covers the conductive layer 3d and the like in moisture in the atmosphere. Protects from oxidative corrosion due to contact with the conductive layer 3d and electrically insulates the conductive layer 3d from the support 9 described later.

【００２５】前記電気絶縁層８は例えばエポキシ樹脂と
なるワニスを導電層３ｄが被着された基板１の他主面１
ｂに従来周知のスクリーン印刷法等を採用することによ
って塗布すると共に該ワニスを熱硬化させることによっ
て基板１の他主面１ｂに被着される。The electrically insulating layer 8 is, for example, the other main surface 1 of the substrate 1 on which the conductive layer 3d is coated with a varnish made of epoxy resin.
It is applied to b by applying a conventionally known screen printing method or the like, and is applied to the other main surface 1b of the substrate 1 by thermosetting the varnish.

【００２６】前記電気絶縁層層８等を被着させた基板１
はまた他主面１ｂ側にアルミニウム等から成る支持体９
が配置されており、該支持体９は基板１に蓄積された熱
を該基板１の他主面１ｂと接触して伝導吸収することに
よって基板１の温度状態を良好に保つ作用を為す。この
場合、前記支持体９の駆動用ＩＣ５と対向する部位には
所定の大きさをもった凹部が形成され、該凹部に駆動用
ＩＣ５を収容させている。Substrate 1 to which the electric insulation layer 8 and the like are adhered
Is a support 9 made of aluminum or the like on the other main surface 1b side.
The support 9 serves to maintain the temperature condition of the substrate 1 in good condition by conducting and absorbing the heat accumulated in the substrate 1 by contacting with the other main surface 1b of the substrate 1. In this case, a recess having a predetermined size is formed in a portion of the support 9 facing the drive IC 5, and the drive IC 5 is accommodated in the recess.

【００２７】また前記支持体９は、基板１の他主面１ｂ
と支持体９との間に例えば粘着テープ１０等を介在させ
ておくことによって基板１の他主面１ｂに被着される。
この場合、前記粘着テープ１０を、少なくとも発熱抵抗
体２が被着配列された領域と対向する位置に介在させて
おけば、発熱抵抗体２の発する熱が基板１に過剰に蓄積
されて記録部材６に印字画像の濃淡むらを発生するのが
有効に防止される。The support 9 is the other main surface 1b of the substrate 1.
The adhesive tape 10 or the like is interposed between the substrate 9 and the support 9 to attach the substrate 1 to the other main surface 1b.
In this case, if the adhesive tape 10 is interposed at least at a position facing the area where the heating resistors 2 are arranged, the heat generated by the heating resistors 2 is excessively accumulated on the substrate 1 and the recording member. It is possible to effectively prevent uneven density of the printed image from occurring in No. 6.

【００２８】かくして、本発明のサーマルヘッドは、一
対の導電層３ａと３ｂの間に外部電気信号に対応させて
所定の電力を印加し、発熱抵抗体２を選択的にジュール
発熱させると共に、該発熱した熱を順次送り込まれてく
る記録部材６に伝導させ、記録部材６に印字画像を形成
することによってサーマルヘッドとして機能する。Thus, the thermal head of the present invention applies a predetermined electric power between the pair of conductive layers 3a and 3b in response to an external electric signal to selectively heat the heating resistor 2 by Joule heat. The generated heat is conducted to the recording member 6 which is sequentially fed, and a printed image is formed on the recording member 6, thereby functioning as a thermal head.

【００２９】尚、本発明は上述した実施例に限定される
ものでは無く、本発明の趣旨を逸脱しない範囲において
種々の変更、改良等が可能であり、例えば前記ポリイミ
ド樹脂製の基板に代えて、アルミナ製の基板や表面を電
気絶縁膜で被覆した金属基板等を使用しても本実施例と
同様の効果を得ることができる。It should be noted that the present invention is not limited to the above-described embodiments, and various modifications and improvements can be made without departing from the gist of the present invention. For example, the above-mentioned polyimide resin substrate may be used instead. Even if an alumina substrate or a metal substrate whose surface is coated with an electric insulating film is used, the same effect as that of the present embodiment can be obtained.

【００３０】[0030]

【発明の効果】本発明のサーマルヘッドによれば、電気
絶縁性基板の一主面に複数個の発熱抵抗体を、他主面に
前記発熱抵抗体を選択的にジュール発熱させるための駆
動用ＩＣを搭載したことから、電気絶縁性基板の発熱抵
抗体が被着された側の表面は略平坦となり、その結果、
発熱抵抗体上に記録部材を送り込んで印字画像を形成す
る際、記録部材を湾曲させる必要は無く、記録部材がプ
ラスチック等の硬い材料から成っていてもそのまま良好
な印字画像を形成することが可能となる。According to the thermal head of the present invention, a plurality of heat generating resistors are provided on one main surface of the electrically insulating substrate, and the heat generating resistors are selectively driven by Joule heat on the other main surface. Since the IC is mounted, the surface of the electrically insulating substrate on which the heating resistor is applied is substantially flat, and as a result,
It is not necessary to bend the recording member when the recording member is fed onto the heating resistor to form a printed image, and a good printed image can be formed as it is even if the recording member is made of a hard material such as plastic. Becomes

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明のサーマルヘッドの斜視図である。FIG. 1 is a perspective view of a thermal head of the present invention.

【図２】図１のＸ−Ｘ’線による断面図である。FIG. 2 is a cross-sectional view taken along line X-X ′ of FIG.

【図３】従来のサーマルヘッドの断面図である。FIG. 3 is a sectional view of a conventional thermal head.

【図４】従来第２のサーマルヘッドの断面図である。FIG. 4 is a sectional view of a second conventional thermal head.

【符号の説明】[Explanation of symbols]

１・・・基板 １ａ・・・一主面 １ｂ・・・他主面 １ｃ・・・コンタクトホール ２・・・発熱抵抗体 ３ａ、３ｂ・・・一対の導電層 ５・・・駆動用ＩＣ ６・・・記録部材 DESCRIPTION OF SYMBOLS 1 ... Substrate 1a ... One main surface 1b ... Other main surface 1c ... Contact hole 2 ... Heating resistor 3a, 3b ... A pair of conductive layers 5 ... Driving IC 6 ... Recording members

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.⁵ 識別記号 庁内整理番号 ＦＩ 技術表示箇所 8906−2Ｃ Ｂ４１Ｊ 3/20 １１３ Ａ 8906−2Ｃ １１３ Ｂ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification number Office reference number FI technical display location 8906-2C B41J 3/20 113 A 8906-2C 113 B

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】電気絶縁性基板の一主面に複数個の発熱抵
抗体を、他主面に前記発熱抵抗体を選択的にジュール発
熱させるための駆動用ＩＣを搭載したことを特徴とする
サーマルヘッド。1. A plurality of heating resistors are mounted on one main surface of an electrically insulating substrate, and a driving IC for selectively heating the heating resistors by Joule heat is mounted on the other main surface. Thermal head.