JPH0514558Y2 - - Google Patents
Info
- Publication number
- JPH0514558Y2 JPH0514558Y2 JP1987106778U JP10677887U JPH0514558Y2 JP H0514558 Y2 JPH0514558 Y2 JP H0514558Y2 JP 1987106778 U JP1987106778 U JP 1987106778U JP 10677887 U JP10677887 U JP 10677887U JP H0514558 Y2 JPH0514558 Y2 JP H0514558Y2
- Authority
- JP
- Japan
- Prior art keywords
- grounding
- shield cover
- conductor pattern
- circuit board
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 210000002105 tongue Anatomy 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 12
- 238000005476 soldering Methods 0.000 claims description 12
- 230000000694 effects Effects 0.000 description 11
- 230000002411 adverse Effects 0.000 description 7
- 238000005452 bending Methods 0.000 description 2
- 241000258920 Chilopoda Species 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
【考案の詳細な説明】
〔概要〕
回路基板の半田付け面から覆うシールドカバー
の接地構造の改良に関し、
周辺の電子回路に熱的悪影響を与えることなく
容易に接地位置を修正、あるいは追加できてシー
ルドをより効果的に行うことを目的とし、
接地用導体パターンと電子回路とを備えた回路
基板と、シールドすべき上記電子回路部を半田付
け面から覆う箱形金属製シールドカバー（以下、
シールドカバーと称す）と、帯状金属薄板の長手
方向両縁部を櫛形にし交互に立ち上げ折曲し上記
シールドカバーの側壁縁部の板厚を挟み圧接する
溝を形成する舌片と上記接地用導体パターン上に
載せ弾発接触するように僅かに弯曲した舌片とを
備えた接地ばねとからなり、上記シールドカバー
を上記回路基板の接地用導体パターンに上記接地
ばねを介して取付ねじで固定接地する。[Detailed explanation of the invention] [Summary] Regarding the improvement of the grounding structure of the shield cover that covers the soldering surface of the circuit board, the grounding position can be easily modified or added without causing adverse thermal effects on the surrounding electronic circuits. For the purpose of more effective shielding, a box-shaped metal shield cover (hereinafter referred to as
(hereinafter referred to as a shield cover), a tongue piece in which both longitudinal edges of the strip-shaped thin metal plate are made into a comb shape and are alternately raised and bent to form grooves that sandwich and press the thickness of the side wall edge of the shield cover; and the grounding tongue piece. and a grounding spring with a slightly curved tongue so as to be placed on the conductor pattern and come into contact with the conductor pattern, and the shield cover is fixed to the grounding conductor pattern of the circuit board with a mounting screw via the grounding spring. Ground.
本考案は回路基板の半田付け面から覆うシール
ドカバーの接地構造の改良に関する。
The present invention relates to an improvement in the grounding structure of a shield cover that covers the soldering surface of a circuit board.
回路基板に実装したシールドすべき電子回路を
半田付け面から覆う箱形金属製シールドカバーの
側壁縁部と回路基板の接地用導体パターン面とを
接地ばねを介して接地する際、シールド効果の大
きな位置を見出し局部的に接地している。 When the side wall edge of the box-shaped metal shield cover that covers the electronic circuit to be shielded mounted on the circuit board from the soldering surface and the grounding conductor pattern surface of the circuit board are grounded via a grounding spring, the shielding effect is large. It has found its location and is locally grounded.
しかしながら、シールドカバーの側壁縁部と半
田付け面との隙間が、例えば1/4λ波長を通すよ
うな隙間がなお残つている場合、周辺の電子回路
に悪影響を与えることなく容易に接地位置の修
正、あるいは介挿追加によりその隙間を塞いで接
地するシールドカバーの接地構造が要望されてい
る。 However, if there is still a gap between the side wall edge of the shield cover and the soldering surface that allows 1/4λ wavelength to pass through, for example, the grounding position can be easily corrected without adversely affecting the surrounding electronic circuits. Alternatively, there is a demand for a grounding structure for a shield cover that can be grounded by closing the gap by additional insertion.
従来は第４図の一部破断を含む要部斜視図に示
すように、電子部品（図示略）を実装し、接地用
導体パターン１１ａを半田付け面１１ｂに備えた
回路基板１１と、シールドすべき電子回路部を半
田付け面１１ｂから覆う箱形金属製シールドカバ
ー１２と、帯状金属薄板をＵ字形に折曲し、一方
の折曲部にスリツト１３ａ−１を入れて舌片１３
ａを形成し、他方の折曲部を取付け足部１３ｂと
する接地ばね１３とからなり、回路基板１１の接
地用導体パターン１１ａに接地ばね１３の取付け
足部１１ｂを半田付けし、シールドカバー１２の
内面に接地ばね１３の舌片１３ａを弾発接触して
取付ねじ１４で固定する接地構造である。
Conventionally, as shown in a partially cutaway perspective view of main parts in FIG. 4, a circuit board 11 on which electronic components (not shown) are mounted and a grounding conductor pattern 11a provided on a soldering surface 11b, and a shield A box-shaped metal shield cover 12 that covers the electronic circuit section to be soldered from the soldering surface 11b and a band-shaped thin metal plate are bent into a U shape, and a slit 13a-1 is inserted in one of the bent parts to form a tongue piece 13.
The grounding spring 13 is made of a grounding spring 13 with the other bent part serving as a mounting leg 13b, and the mounting leg 11b of the grounding spring 13 is soldered to the grounding conductor pattern 11a of the circuit board 11, and the shield cover 12 is assembled. This is a grounding structure in which the tongue piece 13a of the grounding spring 13 is brought into elastic contact with the inner surface of the grounding spring 13 and fixed with the mounting screw 14.
ところが上記構造によれば、接地ばねの半田付
けが電子部品を実装した後の作業となるため、半
田付け部の周囲に熱的悪影響を与えることや電子
回路の電気的特性試験でシールド効果のチエツク
の結果、接地位置がずれていたり、さらに別の隙
間を塞ぐ必要が生じた場合、接地ばねの位置修正
や追加が容易でないといつた問題があつた。
However, according to the above structure, the soldering of the grounding spring is done after the electronic components are mounted, which may cause an adverse thermal effect on the surroundings of the soldered part and make it difficult to check the shielding effect during the electrical characteristic test of the electronic circuit. As a result, if the ground contact position is shifted or if it becomes necessary to close another gap, there is a problem that it is not easy to correct the position or add a ground contact spring.
上記問題点に鑑み、本考案は周辺の電子回路に
熱的悪影響を与えることなく容易に接地位置を修
正、あるいは追加できてシールドをより効果的に
行うためのシールドカバーの接地構造を提供する
ことを目的とする。 In view of the above problems, the present invention provides a grounding structure for a shield cover that allows the grounding position to be easily modified or added without adversely affecting the surrounding electronic circuits, thereby making shielding more effective. With the goal.
従来構造における上記問題点は、接地用導体パ
ターンと電子回路とを備えた回路基板と、シール
ドすべき上記電子回路部を半田付け面から覆うシ
ールドカバーと、帯状金属薄板の長手方向両端部
を櫛形にし交互に立ち上げ折曲し上記シールドカ
バーの側壁縁部の板厚を挟み圧接する溝を形成す
る舌片と上記接地用導体パターン上に載せ弾発接
触するように僅かに弯曲した舌片とを備えた接地
ばねとからなり、上記シールドカバーを上記回路
基板の接地用導体パターンに上記接地ばねを介し
て取付ねじで固定接地することによつて解決され
る。
The above-mentioned problems with the conventional structure include: a circuit board equipped with a grounding conductor pattern and an electronic circuit; a shield cover that covers the electronic circuit part to be shielded from the soldering surface; tongue pieces that are alternately raised and bent to form grooves that pinch and press against the plate thickness of the side wall edge of the shield cover, and tongue pieces that are slightly curved so as to be placed on the grounding conductor pattern and come into resilient contact. The problem is solved by fixing and grounding the shield cover to the grounding conductor pattern of the circuit board with a mounting screw via the grounding spring.
接地ばねの舌片はシールドカバーの側壁縁部の
板厚を圧接挟持し、且つ弯曲した舌片が回路基板
の接地用導体パターン面に半田付けされることな
く弾発接触しているため、接地ばねを摺動して最
適接地位置に移動修正したり、あるいは介挿追加
が容易に可能となり、シールドカバーの側壁縁部
と接地用導体パターンとの必要な箇所の隙間を塞
ぐことができる。
The tongue of the grounding spring presses against the thickness of the edge of the side wall of the shield cover, and the curved tongue makes elastic contact with the grounding conductor pattern surface of the circuit board without being soldered. The spring can be moved and corrected to the optimum grounding position by sliding, or it can be easily inserted and added, and the gap between the side wall edge of the shield cover and the grounding conductor pattern can be closed at a necessary location.
また、接地ばねは接地用導体パターンに半田付
けしないため、電子部品に熱的悪影響を与えるこ
とはなくなる。また更に、この接地ばねは櫛形舌
片を両側から左右交互にＬ型に折曲して立ち上げ
ているため、板金のような薄い板厚でも平行に挟
める溝幅に形成することができ、両側から交互に
ばね圧接するため、確実に十分な圧接力で挟持す
ることができ、一方、左右交互に残る櫛形舌片
は、そのままばね変形可能に開脚し、確実に接地
接触することができる。 Furthermore, since the grounding spring is not soldered to the grounding conductor pattern, it will not have any adverse thermal effects on electronic components. Furthermore, since this grounding spring has comb-shaped tongues that are bent alternately from both sides into an L shape, it is possible to form grooves with a width that allows even thin plates such as sheet metal to be sandwiched in parallel. Since the spring pressure contact is alternately applied from the top to the right, it is possible to reliably clamp with a sufficient pressure contact force, and on the other hand, the comb-shaped tongue pieces remaining alternately on the left and right sides can be opened as they are so that they can be spring-deformed, and the ground contact can be ensured.
以下図面に示す一実施例により本考案の要旨を
具体的に説明する。
The gist of the present invention will be specifically explained below with reference to an embodiment shown in the drawings.
第１図の一部破断を含む要部斜視図に示すよう
に、回路基板１は、電子部品（図示略）を実装
し、接地用導体パターン１ａを半田付け面１ｂに
備える。 As shown in the partially broken perspective view of FIG. 1, the circuit board 1 has electronic components (not shown) mounted thereon and has a grounding conductor pattern 1a on the soldering surface 1b.
箱形金属製シールドカバー２は、回路基板１の
半田付け面１ｂからシールドすべき電子回路部
（図示略）を覆う。 The box-shaped metal shield cover 2 covers an electronic circuit section (not shown) to be shielded from the soldering surface 1b of the circuit board 1.
接地ばね３は、第２図の平面図と第３図の断面
図とに示すように、帯状金属薄板の長手方向両縁
部を櫛形にし交互に立ち上げ折曲し、その先端を
シールドカバー２の側壁縁部２ａの板厚板厚より
僅かにすぼませて挟み圧接するように溝Ａを形成
する舌片３ａと、接地用導体パターン１ａ上に載
せ弾発接触するように僅かに弯曲Ｃした舌片１ｂ
とを備える。 As shown in the plan view of FIG. 2 and the cross-sectional view of FIG. 3, the grounding spring 3 is constructed by forming both longitudinal edges of a strip-shaped thin metal plate into a comb shape, raising and bending the ends alternately, and attaching the ends to the shield cover 2. A tongue piece 3a is slightly narrower than the plate thickness of the side wall edge 2a of the plate, and a groove A is formed so that the tongue piece A is pinched and press-contacted with the plate. tongue piece 1b
Equipped with.
シールドカバー２は、回路基板１の接地用導体
パターン１ａ上に接地ばね３を介して取付ねじ４
で固定接地される。 The shield cover 2 is attached to a mounting screw 4 via a grounding spring 3 on the grounding conductor pattern 1a of the circuit board 1.
Fixedly grounded.
接地ばねは、シールドカバーの側壁縁部に簡単
に着脱容易に嵌着でき、しかも舌片は側壁縁部と
接地用導体パターン面とに圧接して側壁縁部とパ
ターン面間に生じる隙間を塞いでシールドでき
る。 The grounding spring can be easily attached to and removed from the side wall edge of the shield cover, and the tongue piece presses against the side wall edge and the grounding conductor pattern surface to close the gap between the side wall edge and the pattern surface. You can shield with.
また、接地ばねは嵌着したまま摺動できるた
め、シールド効果の高い適接地位置に移動させた
り、あるいは必要に応じて更に別体の接地ばねの
介挿追加が容易に可能となる。 Further, since the grounding spring can be slid while being fitted, it can be easily moved to an appropriate grounding position with a high shielding effect, or a separate grounding spring can be inserted as needed.
また、接地ばねは半田付けされないため、接地
位置周辺の電子部品に熱的悪影響を与えることは
なくなる。 Furthermore, since the grounding spring is not soldered, it will not have any adverse thermal effects on electronic components around the grounding position.
〔考案の効果］
以上、詳述したように本考案によれば、シール
ドカバーの局部的接地が接地位置周辺の電子部品
に熱的悪影響を与えることはなく容易に修正、あ
るいは追加でき、また接地ばねは、どんな薄い板
厚のシールドカバーでも面接触して密着圧接する
ことができ、従つて確実で十分な圧接力を得るこ
とができる。しかも、Ｌ型折曲後の左右交互に残
る櫛形舌片は、百足形にばね性を有して開脚して
いるため、接触点を多数に備えて接地接触を確実
なものとすることができる。また、製造上、接地
ばねの形状は帯状金属薄板を櫛形にプレス加工
し、その櫛形舌片を左右交互にＬ型折曲加工する
だけで、同時に接地足を多数に開脚形成できるた
め、簡単に板金加工できるといつた実用上極めて
有用な効果を発揮する。[Effects of the invention] As described in detail above, according to the invention, local grounding of the shield cover does not have an adverse thermal effect on electronic components around the grounding position, and can be easily modified or added to. The spring can bring surface contact into close pressure contact with any thin shield cover, and therefore can obtain a reliable and sufficient pressure contact force. In addition, the comb-shaped tongues that remain alternately on the left and right after the L-shape bend have spring characteristics and open legs in a centipede shape, so it is possible to provide a large number of contact points to ensure ground contact. can. In addition, in manufacturing, the shape of the grounding spring can be easily formed by pressing a band-shaped thin metal plate into a comb shape, and then bending the comb-shaped tongues into an L shape alternately on the left and right sides to form multiple grounding legs at the same time. It has extremely useful effects in practical terms, such as being able to process sheet metal.
第１図は本考案による一実施例の一部破断を含
む要部斜視図、第２図は第１図の接地ばねの平面
図、第３図は第２図のＢ−Ｂ断面図、第４図は従
来技術による一部破断を含む要部斜視図である。
図において、１は回路基板、１ａは接地用導体
パターン、１ｂは半田付け面、２はシールドカバ
ー、２ａは側壁縁部、３は接地ばね、３ａ，３ｂ
は舌片、４は取付ねじを示す。
Fig. 1 is a partially cutaway perspective view of the main parts of an embodiment of the present invention, Fig. 2 is a plan view of the grounding spring shown in Fig. 1, and Fig. 3 is a sectional view taken along line B-B in Fig. 2; FIG. 4 is a partially cutaway perspective view of the main part according to the prior art. In the figure, 1 is a circuit board, 1a is a grounding conductor pattern, 1b is a soldering surface, 2 is a shield cover, 2a is a side wall edge, 3 is a grounding spring, 3a, 3b
4 indicates a tongue piece, and 4 indicates a mounting screw.
Claims (1)
回路基板１と、シールドすべき上記電子回路部を
半田付け面から覆う箱形金属製シールドカバー２
と、帯状金属薄板の長手方向両縁部に形成した櫛
形舌片の中、左右交互の舌片３ａをＬ型に折曲し
て立ち上げ上記シールドカバー２の側壁縁部２ａ
の板厚を挟み圧接する溝を形成し且つ左右交互に
残る舌片３ｂを僅かに弯曲させて載置面に弾発接
触するように形成した接地ばね３とからなり、 該接地ばね３を上記シールドカバー２の側壁縁
部２ａに挟んで上記回路基板１の接地用導体パタ
ーン１ａに載置し取付ねじで固定・接地したこと
を特徴とするシールドカバーの接地構造。[Claims for Utility Model Registration] A circuit board 1 having a grounding conductor pattern 1a and an electronic circuit, and a box-shaped metal shield cover 2 that covers the electronic circuit section to be shielded from the soldering surface.
Then, among the comb-shaped tongue pieces formed on both longitudinal edges of the strip-shaped thin metal plate, left and right alternate tongue pieces 3a are bent into an L shape and raised to form the side wall edge 2a of the shield cover 2.
A grounding spring 3 is formed with grooves sandwiching the thickness of the plate and pressed into contact with each other, and tongues 3b remaining alternately on the left and right sides are slightly curved so as to come into resilient contact with the mounting surface. A grounding structure for a shield cover, which is sandwiched between side wall edges 2a of a shield cover 2, placed on a grounding conductor pattern 1a of the circuit board 1, and fixed and grounded with a mounting screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987106778U JPH0514558Y2 (en) | 1987-07-10 | 1987-07-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987106778U JPH0514558Y2 (en) | 1987-07-10 | 1987-07-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6413195U JPS6413195U (en) | 1989-01-24 |
| JPH0514558Y2 true JPH0514558Y2 (en) | 1993-04-19 |
Family
ID=31340595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987106778U Expired - Lifetime JPH0514558Y2 (en) | 1987-07-10 | 1987-07-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0514558Y2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2695320B2 (en) * | 1991-10-08 | 1997-12-24 | コクヨ株式会社 | Moving partitioning device |
| JP5709704B2 (en) * | 2011-09-14 | 2015-04-30 | 三菱電機株式会社 | Semiconductor device |
| JP5953274B2 (en) * | 2013-08-27 | 2016-07-20 | 京セラドキュメントソリューションズ株式会社 | Image forming apparatus |
| JP6316336B2 (en) * | 2016-04-20 | 2018-04-25 | 三菱電機株式会社 | PCB holding structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55108794U (en) * | 1979-01-25 | 1980-07-30 |
-
1987
- 1987-07-10 JP JP1987106778U patent/JPH0514558Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6413195U (en) | 1989-01-24 |
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