JPH05144602A - Square-shaped chip resistor - Google Patents
Square-shaped chip resistorInfo
- Publication number
- JPH05144602A JPH05144602A JP3303022A JP30302291A JPH05144602A JP H05144602 A JPH05144602 A JP H05144602A JP 3303022 A JP3303022 A JP 3303022A JP 30302291 A JP30302291 A JP 30302291A JP H05144602 A JPH05144602 A JP H05144602A
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- Japan
- Prior art keywords
- chip resistor
- pair
- layer
- electrode layers
- surface electrode
- Prior art date
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- Non-Adjustable Resistors (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は高密度配線回路に用いら
れる角形チップ抵抗器に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rectangular chip resistor used in a high density wiring circuit.
【０００２】[0002]
【従来の技術】近年、電子機器の軽薄短小化に対する要
求がますます増大していく中、回路基板の配線密度を高
めるため、抵抗素子には非常に小型な角形チップ抵抗器
が多く用いられるようになってきた。また、更に近年で
は実装速度を速めるため、多数のチップ部品を同時に実
装する一括マウントが行われるようになってきている。2. Description of the Related Art In recent years, with the ever-increasing demand for smaller, lighter, smaller electronic devices, in order to increase the wiring density of circuit boards, very small rectangular chip resistors are often used as resistive elements. Has become. Further, in recent years, in order to increase the mounting speed, collective mounting for mounting a large number of chip components at the same time has been performed.
【０００３】従来の厚膜タイプの角形チップ抵抗器の構
造の一例を、図４に示す。従来の角形チップ抵抗器は厚
み方向の長さが、幅方向の長さの１０％〜７０％の長さ
である角板形の絶縁性の９６アルミナ基板１０と、この
９６アルミナ基板１０上に形成された一対の厚膜電極に
よる上面電極層１１と、この上面電極層１１と接続する
ように形成されたルテニウム系厚膜抵抗による抵抗層１
２と、抵抗層を覆うガラス層１４と、上面電極層の一部
と重なる端面電極層１３とからなっており、露出電極面
にははんだ付け性を確保するためにＮｉめっき層１５と
はんだめっき層１６を電解メッキにより形成している。An example of the structure of a conventional thick film type rectangular chip resistor is shown in FIG. The conventional rectangular chip resistor has a rectangular plate-shaped insulating 96 alumina substrate 10 whose length in the thickness direction is 10% to 70% of the length in the width direction, and on this 96 alumina substrate 10. An upper surface electrode layer 11 formed of a pair of thick film electrodes formed and a resistance layer 1 formed of a ruthenium-based thick film resistor formed so as to be connected to the upper surface electrode layer 11.
2, a glass layer 14 covering the resistance layer, and an end face electrode layer 13 overlapping a part of the upper face electrode layer, and the Ni plating layer 15 and the solder plating on the exposed electrode face in order to secure solderability. The layer 16 is formed by electrolytic plating.
【０００４】[0004]
【発明が解決しようとする課題】しかし、従来の角形チ
ップ抵抗器は先に述べた一括マウントを行う場合、部品
が実装されるとき、図５のように角形チップ抵抗器１７
が基板の主面ではなく側面側で実装されると半田付けさ
れる半田１８の量（半田付け部の投射面積）が減るた
め、十分な固着強度が得られない。また、一括実装機内
の搬送チューブは角形チップ抵抗器の方向を定めるた
め、角形である必要があり、この角形の搬送チューブは
角形チップ抵抗器が途中で詰まり易いという欠点があっ
た。However, in the conventional rectangular chip resistor, when the above-mentioned collective mounting is performed, when the components are mounted, the rectangular chip resistor 17 as shown in FIG.
However, if it is mounted not on the main surface of the board but on the side surface, the amount of solder 18 to be soldered (projected area of the soldering portion) is reduced, so that sufficient fixing strength cannot be obtained. In addition, the carrier tube in the collective mounting machine needs to be rectangular in order to determine the direction of the rectangular chip resistor, and this rectangular carrier tube has a drawback that the rectangular chip resistor is easily clogged on the way.
【０００５】本発明は、このような課題を一挙に解決す
るもので、角形チップ抵抗器が側面で実装されても十分
な固着強度が得られる角形チップ抵抗器を提供すること
を第１の目的とし、同時に搬送チューブ内で詰まりにく
い円筒チューブを採用することが可能な角形チップ抵抗
器を提供することを第２の目的とする。SUMMARY OF THE INVENTION The first object of the present invention is to solve the above problems, and it is a first object of the present invention to provide a rectangular chip resistor capable of obtaining a sufficient fixing strength even when the rectangular chip resistor is mounted on the side surface. At the same time, it is a second object of the present invention to provide a rectangular chip resistor capable of adopting a cylindrical tube that is less likely to be clogged in the transfer tube.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するため
に本発明は、角板形の絶縁性の焼結基板と、この前記焼
結基板の一方の主面上に形成された一対の上面電極層
と、この一対の上面電極層の一部に重なる抵抗層と、前
記焼結基板の他方の主面上の一対の裏面電極層と、前記
一対の上面電極層と一対の裏面電極層とを電気的に接続
する一対の端面電極層とを有し、完成寸法で厚み方向の
長さが幅方向の長さの８０％〜１２０％であるものであ
る。In order to achieve the above object, the present invention provides a square plate-shaped insulating sintered substrate and a pair of upper surfaces formed on one main surface of the sintered substrate. An electrode layer, a resistance layer overlapping a part of the pair of upper surface electrode layers, a pair of back surface electrode layers on the other main surface of the sintered substrate, the pair of upper surface electrode layers and a pair of back surface electrode layers. And a pair of end face electrode layers for electrically connecting with each other, and the length in the thickness direction is 80% to 120% of the length in the width direction in a completed dimension.
【０００７】[0007]
【作用】本発明によれば、角形チップ抵抗器が側面で実
装されても側面電極に半田付けされる半田量は変化しな
いので十分な固着強度が得られるもので、更に、角形チ
ップ抵抗器の形状を円筒に近くすることで、実装機内の
搬送チューブとして円筒チューブを採用することがで
き、搬送チューブ内で角形チップ抵抗器が詰まり難くな
る。なお、角形チップ抵抗器の形状が円筒に近くなるた
め、従来の円筒チップ抵抗器用の一括実装機への適用性
を持たせることができる。According to the present invention, even if the rectangular chip resistor is mounted on the side surface, the amount of solder to be soldered to the side surface electrode does not change, so that sufficient fixing strength can be obtained. By making the shape close to a cylinder, a cylindrical tube can be adopted as the transfer tube in the mounting machine, and the rectangular chip resistor is less likely to be clogged in the transfer tube. Since the shape of the rectangular chip resistor is close to a cylinder, it can be applied to the conventional collective mounting machine for cylindrical chip resistors.
【０００８】[0008]
【実施例】（実施例１）以下、本発明の一実施例１の角
形チップ抵抗器について、図面を用いて説明する。(Embodiment 1) Hereinafter, a rectangular chip resistor according to Embodiment 1 of the present invention will be described with reference to the drawings.
【０００９】図１（ａ）は本発明の実施例１を示す断面
図である。図１(ａ)において、本発明の角形チップ抵抗
器は、９６アルミナ基板１と、この９６アルミナ基板１
の一方の主面上の銀系厚膜の一対の上面電極層２と、前
記９６アルミナ基板１の他方の主面上の裏面電極層３
と、前記上面電極層２の一部に重なるルテニウム系厚膜
の抵抗層４と、前記抵抗層４を完全に覆う第１保護層６
と、前記裏面電極層３の一部に重なる第２保護層７と、
前記上面電極層２と前記裏面電極層３の一部に重なる銀
系厚膜の端面電極層８とから構成される。なお、露出電
極面にははんだ付け性を向上させるために、Ｎｉめっき
層９とＳｎ−Ｐｂめっき層１０を電解めっきにより施し
ている。FIG. 1A is a sectional view showing a first embodiment of the present invention. In FIG. 1A, a square chip resistor according to the present invention includes a 96 alumina substrate 1 and the 96 alumina substrate 1.
A pair of silver-based thick film upper surface electrode layers 2 on one main surface, and a back surface electrode layer 3 on the other main surface of the 96 alumina substrate 1.
And a resistance layer 4 of a ruthenium-based thick film that overlaps a part of the upper electrode layer 2, and a first protection layer 6 that completely covers the resistance layer 4.
And a second protective layer 7 overlapping a part of the back electrode layer 3,
It is composed of the upper surface electrode layer 2 and an end surface electrode layer 8 of a silver-based thick film that overlaps a part of the back surface electrode layer 3. The exposed electrode surface is electrolytically plated with a Ni plating layer 9 and a Sn-Pb plating layer 10 in order to improve solderability.
【００１０】次に、図１(ａ)に示した本実施例の角形チ
ップ抵抗器の製造方法ついて説明する。まず、耐熱性お
よび絶縁性に優れた９６アルミナ基板１を受け入れる。
この９６アルミナ基板１には短冊状、および個片状に分
割するために、分割のための溝（グリーンシート時に金
型成形）が形成されている（基板の厚みは０.６３５mm
で、分割のための溝は、１.５mmおよび０.８mmピッチで
形成されている。）。次に、前記９６アルミナ基板１の
表面に厚膜銀ペーストをスクリーン印刷・乾燥し、更
に、前記９６アルミナ基板１の裏面に厚膜銀ペーストを
スクリーン印刷・乾燥し、ベルト式連続焼成炉によって
８５０℃の温度で、ピーク時間６分、ＩＮ−ＯＵＴ時間
４５分のプロファイルによって焼成し、上面電極層２お
よび裏面電極層３を同時に形成する。次に、上面電極層
２の一部に重なるように、ＲｕＯ2を主成分とする厚膜
抵抗ペーストをスクリーン印刷・乾燥し、ベルト式連続
焼成炉により８５０℃の温度でピーク時間６分、ＩＮ−
ＯＵＴ時間４５分のプロファイルによって焼成し、抵抗
層４を形成する。次に、前記上面電極層２間の前記抵抗
層４の抵抗値を揃えるために、レーザー光によって、前
記抵抗層４の一部を破壊し抵抗値修正（Ｌカット、１０
０mm／秒、１２KHz、５Ｗ）を行う。続いて、前記抵抗
層４を完全に覆うように、ホウケイ酸鉛系ガラスペース
ト（黒色）をスクリーン印刷・乾燥し、更に前記裏面電
極層３の一部に重なるようにホウケイ酸鉛系ガラスペー
スト（黒色）をスクリーン印刷・乾燥し、ベルト式連続
焼成炉によって５９０℃の温度で、ピーク時間６分、Ｉ
Ｎ−ＯＵＴ時間５０分の焼成プロファイルによって焼成
し、第１保護層６および第２保護層７を同時に形成す
る。次に、端面電極を形成するための準備工程として、
端面電極を露出させるために、アルミナ基板１を短冊状
に分割（１.５mmピッチ側を分割）し、短冊状アルミナ
基板を得る。前記短冊状アルミナ基板の側面に、前記上
面電極層２および前記裏面電極層３の一部に重なるよう
に厚膜銀ペーストをローラーによって塗布し、ベルト式
連続焼成炉によって６００℃の温度で、ピーク時間６
分、ＩＮ−ＯＵＴ時間４５分の焼成プロファイルによっ
て焼成し端面電極層８を形成する。次に、電極メッキの
準備工程として、前記端面電極層８を形成済みの短冊状
アルミナ基板を個片に分割（０.８mmピッチ側を分割）
し、個片状アルミナ基板を得た。そして最後に、露出し
ている上面電極層２と裏面電極層３と端面電極層８のは
んだ付け時の電極喰われの防止およびはんだ付けの信頼
性の確保のため、電解めっきによってＮｉめっき層９と
Ｓｎ−Ｐｂのめっき層１０を形成する。Next, a method of manufacturing the rectangular chip resistor of this embodiment shown in FIG. 1A will be described. First, the 96 alumina substrate 1 having excellent heat resistance and insulating properties is received.
In order to divide the 96 alumina substrate 1 into strips and individual pieces, a dividing groove (molding at the time of green sheet) is formed (the thickness of the substrate is 0.635 mm).
The grooves for division are formed with a pitch of 1.5 mm and 0.8 mm. ). Next, the thick film silver paste is screen-printed and dried on the surface of the 96 alumina substrate 1, the thick film silver paste is screen-printed and dried on the back surface of the 96 alumina substrate 1, and 850 by a belt-type continuous firing furnace. The top surface electrode layer 2 and the back surface electrode layer 3 are formed at the same time by baking at a temperature of ° C according to a profile with a peak time of 6 minutes and an IN-OUT time of 45 minutes. Next, a thick film resistance paste containing RuO 2 as a main component is screen-printed and dried so as to overlap a part of the upper surface electrode layer 2, and a belt type continuous firing furnace is used at a temperature of 850 ° C. for a peak time of 6 minutes for IN. −
The resistance layer 4 is formed by firing according to the profile of the OUT time of 45 minutes. Next, in order to make the resistance value of the resistance layer 4 between the upper surface electrode layers 2 uniform, a part of the resistance layer 4 is destroyed by laser light to correct the resistance value (L cut, 10
0mm / sec, 12KHz, 5W). Subsequently, a lead borosilicate glass paste (black) is screen-printed and dried so as to completely cover the resistance layer 4, and further, a lead borosilicate glass paste (is overlapped with a part of the back electrode layer 3 ( (Black color) is screen-printed and dried, and a belt-type continuous firing furnace is used at a temperature of 590 ° C. for a peak time of 6 minutes.
The first protective layer 6 and the second protective layer 7 are formed at the same time by firing with a firing profile of N-OUT time of 50 minutes. Next, as a preparatory step for forming the end face electrodes,
In order to expose the end face electrodes, the alumina substrate 1 is divided into strips (1.5 mm pitch side is divided) to obtain strip-shaped alumina substrates. On the side surface of the strip-shaped alumina substrate, a thick film silver paste was applied by a roller so as to overlap a part of the upper surface electrode layer 2 and the rear surface electrode layer 3, and a peak was formed at a temperature of 600 ° C. by a belt type continuous firing furnace. Time 6
And the end surface electrode layer 8 is formed by baking according to a baking profile for 45 minutes and an IN-OUT time of 45 minutes. Next, as a preparatory step for electrode plating, the strip-shaped alumina substrate on which the end face electrode layer 8 has been formed is divided into pieces (divided on the 0.8 mm pitch side).
Then, an individual alumina substrate was obtained. And finally, in order to prevent electrode erosion during soldering of the exposed upper surface electrode layer 2, the rear surface electrode layer 3, and the end surface electrode layer 8 and to secure reliability of soldering, the Ni plating layer 9 is formed by electrolytic plating. And Sn—Pb plating layer 10 is formed.
【００１１】以上の工程により、本実施例による角形チ
ップ抵抗器を試作した（完成品の寸法は、長さが１.６m
m、幅が０.８mm、厚さが０.７４mmとなり、厚み方向の
寸法は幅方向の寸法の９２.５％となった。）。The square chip resistor according to the present embodiment was prototyped by the above steps (the finished product has a length of 1.6 m).
m, the width was 0.8 mm and the thickness was 0.74 mm, and the dimension in the thickness direction was 92.5% of the dimension in the width direction. ).
【００１２】本実施例の角形チップ抵抗器１９を図２の
ように基板の側面で実装したときでも十分な量の半田２
１で固定できるので、固着強度（角形チップ抵抗器のプ
リント基板と平行方向からの限界加重）は、基板の主面
で実装したときと同様となった（この場合、側面実装で
は約１０kg、表面実装は約１０kgであり、従来例の側面
実装は約５kgであった。）。Even when the rectangular chip resistor 19 of this embodiment is mounted on the side surface of the substrate as shown in FIG.
Since it can be fixed with 1, the fixing strength (the limit load from the direction parallel to the printed board of the rectangular chip resistor) is the same as when mounted on the main surface of the board (in this case, about 10 kg for side mounting, surface mounting) The mounting is about 10 kg, and the conventional side mounting is about 5 kg.)
【００１３】また、本実施例の角形チップ抵抗器１９は
図３に示すように、ランドパターン２２を有したプリン
ト基板のスルーホール２０内に半田２１で実装する場合
も、従来の角形チップ抵抗器に比べ詰まり難く、ガタも
少ないといった効果も確認した。Further, as shown in FIG. 3, the rectangular chip resistor 19 of the present embodiment is also mounted on the through hole 20 of the printed circuit board having the land pattern 22 with the solder 21 as in the conventional rectangular chip resistor. It was also confirmed that it was less likely to be clogged and had less backlash.
【００１４】更に、角形チップ抵抗器の形状を円筒に近
くすることで、実装機内の搬送チューブとして円筒チュ
ーブを採用することができ、搬送チューブ内で角形チッ
プ抵抗器が詰まり難くなる。Further, by making the shape of the rectangular chip resistor close to a cylinder, a cylindrical tube can be adopted as the transfer tube in the mounting machine, and the rectangular chip resistor is less likely to be clogged in the transfer tube.
【００１５】また、角形チップ抵抗器の形状が円筒に近
くなるため、従来の円筒チップ抵抗器用の一括実装機へ
の適用性を持たせることができる。Further, since the shape of the rectangular chip resistor is close to a cylinder, it can be applied to a conventional collective mounting machine for a cylindrical chip resistor.
【００１６】（実施例２）次に本発明の他の実施例につ
いて説明する。本実施例は実施例１の第１保護層６と第
２保護層７の部分をそれぞれ９６アルミナ基板１の主面
上の端部にまで至らないように形成したものである。本
実施例では保護層が９６アルミナ基板１の主面上の端部
にまで至っていないので、図１(ｂ)に示すように実施例
１に比して更に円筒チップ抵抗器の形状に近くなる。こ
のため自動実装機での搬送チューブ内でのつまりを実施
例１の角形チップ抵抗器より少なくすることができる
（実施例１の角形チップ抵抗器と同様の電極固着強度を
有することは言うまでもない。）。(Embodiment 2) Next, another embodiment of the present invention will be described. In this embodiment, the first protective layer 6 and the second protective layer 7 of the first embodiment are formed so as not to reach the end portions on the main surface of the 96 alumina substrate 1. In this embodiment, since the protective layer does not reach the end portion on the main surface of the 96 alumina substrate 1, the shape of the cylindrical chip resistor becomes closer to that of the first embodiment as shown in FIG. 1B. .. Therefore, the clogging in the carrier tube in the automatic mounting machine can be made smaller than that of the rectangular chip resistor of the first embodiment (it goes without saying that it has the same electrode fixing strength as the rectangular chip resistor of the first embodiment). ).
【００１７】なお、本実施例において基板の厚みを０.
６３５mm、角形チップ抵抗器を０.８mmとしたが、当然
他の寸法でも効果は得られ、比率としては厚み方向の長
さが幅方向の長さの７５％〜１１０％の基板であれば適
用できることは言うまでもない（望ましくは、９０％〜
１００％）。ただし、完成品で８０％〜１２０％の範囲
を外れると、表面実装時と側面実装時での固着強度に大
きな差がでてくる。In the present embodiment, the thickness of the substrate is set to 0.
635 mm and the rectangular chip resistor is 0.8 mm, but other dimensions can of course be obtained, and the ratio is applied if the length-wise length of the substrate is 75% to 110% of the width-wise length. It goes without saying that it is possible (preferably 90% to
100%). However, if the finished product is out of the range of 80% to 120%, there will be a large difference in the bonding strength between the surface mounting and the side mounting.
【００１８】また、実施例１，２では保護層６，７はガ
ラス系のものを用いたが、これは他の保護層（例えば樹
脂等）でもよい。また、保護層を角形チップ抵抗器の両
主面に形成したがこれは、その他の側面にも形成しても
よい。Further, in Examples 1 and 2, the protective layers 6 and 7 are made of glass, but other protective layers (for example, resin) may be used. Further, although the protective layers are formed on both main surfaces of the rectangular chip resistor, they may be formed on other side surfaces.
【００１９】[0019]
【発明の効果】以上の説明より明らかなように、本発明
の角形チップ抵抗器によれば、形状が従来の角形チップ
抵抗器に比べ円筒形に近くなるので、角形チップ抵抗器
が側面で実装されても側面電極に半田付けされる半田量
は変化しないので十分な固着強度が得られる。また一括
実装機内の搬送チューブで方向を定める必要がなくな
り、搬送チューブとして円筒チューブを用いることがで
きるので一括マウント時の搬送時の詰まりが減少する。
更に従来の円筒チップ抵抗器の一括実装機との互換性を
もつといった優れた効果を有する。As is apparent from the above description, according to the rectangular chip resistor of the present invention, the shape is closer to the cylindrical shape as compared with the conventional rectangular chip resistor, so that the rectangular chip resistor is mounted on the side surface. Even if it is done, the amount of solder to be soldered to the side surface electrode does not change, so that sufficient fixing strength can be obtained. Further, since it is not necessary to determine the direction by the transfer tube in the collective mounting machine, and a cylindrical tube can be used as the transfer tube, clogging during transfer at the time of collective mounting is reduced.
Further, it has an excellent effect that it is compatible with a conventional collective mounting machine of cylindrical chip resistors.
【図１】(ａ)は本発明の第１の実施例の角形チップ抵抗
器の構造を示す断面図 (ｂ)は本発明の第２の実施例の角形チップ抵抗器の構造
を示す斜視図1A is a sectional view showing the structure of a rectangular chip resistor according to a first embodiment of the present invention, and FIG. 1B is a perspective view showing the structure of a rectangular chip resistor according to a second embodiment of the present invention.
【図２】本発明の実施例１の角形チップ抵抗器が側面で
実装された状態を示す説明図FIG. 2 is an explanatory diagram showing a state in which the rectangular chip resistor according to the first embodiment of the present invention is mounted on the side surface.
【図３】本発明の実施例１の角形チップ抵抗器をプリン
ト基板のスルーホール内に実装した状態を示す説明図FIG. 3 is an explanatory view showing a state where the rectangular chip resistor according to the first embodiment of the present invention is mounted in a through hole of a printed board.
【図４】従来の角形チップ抵抗器の構造を示す断面図FIG. 4 is a sectional view showing the structure of a conventional rectangular chip resistor.
【図５】従来の角形チップ抵抗器が側面で実装された状
態を示す説明図FIG. 5 is an explanatory view showing a state where a conventional rectangular chip resistor is mounted on a side surface.
１ ９６アルミナ基板 ２ 上面電極層 ３ 裏面電極層 ４ 抵抗層 ６ 第１保護層 ７ 第２保護層 ８ 端面電極層 ９ Ｎｉめっき層 １０ Ｓｎ−Ｐｂめっき層 1 96 Alumina Substrate 2 Top Electrode Layer 3 Back Electrode Layer 4 Resistance Layer 6 First Protective Layer 7 Second Protective Layer 8 End Face Electrode Layer 9 Ni Plating Layer 10 Sn-Pb Plating Layer
Claims (3)
結基板の一方の主面上に形成された一対の上面電極層
と、この一対の上面電極層の一部に重なる抵抗層と、前
記焼結基板の他方の主面上の一対の裏面電極層と、前記
一対の上面電極層と一対の裏面電極層とを電気的に接続
する一対の端面電極層とを有し、完成寸法で厚み方向の
長さが幅方向の長さの８０％〜１２０％であることを特
徴とする角形チップ抵抗器。1. A rectangular plate-shaped insulating sintered substrate, a pair of upper surface electrode layers formed on one main surface of the sintered substrate, and a part of the pair of upper surface electrode layers. It has a resistance layer, a pair of back surface electrode layers on the other main surface of the sintered substrate, and a pair of end surface electrode layers electrically connecting the pair of top surface electrode layers and the pair of back surface electrode layers. A rectangular chip resistor characterized in that the length in the thickness direction is 80% to 120% of the length in the width direction in the completed dimension.
１００％の長さの角板形の絶縁性の焼結基板と、この前
記焼結基板の一方の主面上に形成された一対の上面電極
層と、この一対の上面電極層の一部に重なる抵抗層と、
この抵抗層を完全に覆う第１保護層と、前記焼結基板の
他方の主面上の一対の裏面電極層と、この裏面電極層の
一部に重なる第２保護層と、前記一対の上面電極層と一
対の裏面電極層とを電気的に接続する一対の端面電極層
とから構成されることを特徴とする請求項１記載の角形
チップ抵抗器。2. The length in the thickness direction is 90% to the length in the width direction.
A rectangular plate-shaped insulating sintered substrate having a length of 100%, a pair of upper surface electrode layers formed on one main surface of the sintered substrate, and a part of the pair of upper surface electrode layers. Overlapping resistive layers,
A first protective layer that completely covers the resistive layer, a pair of back electrode layers on the other main surface of the sintered substrate, a second protective layer that partially overlaps the back electrode layer, and a pair of upper surfaces. 2. The rectangular chip resistor according to claim 1, comprising an electrode layer and a pair of end surface electrode layers electrically connecting the pair of back surface electrode layers.
上で、その主面の端部まで形成されず独立であることを
特徴とする請求項２記載の角形チップ抵抗器。3. The rectangular chip resistor according to claim 2, wherein the first protective layer and the second protective layer are independent on each main surface without being formed up to the end of the main surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3303022A JPH05144602A (en) | 1991-11-19 | 1991-11-19 | Square-shaped chip resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3303022A JPH05144602A (en) | 1991-11-19 | 1991-11-19 | Square-shaped chip resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05144602A true JPH05144602A (en) | 1993-06-11 |
Family
ID=17915995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3303022A Pending JPH05144602A (en) | 1991-11-19 | 1991-11-19 | Square-shaped chip resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05144602A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017117952A (en) * | 2015-12-24 | 2017-06-29 | Koa株式会社 | Chip resistor |
-
1991
- 1991-11-19 JP JP3303022A patent/JPH05144602A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017117952A (en) * | 2015-12-24 | 2017-06-29 | Koa株式会社 | Chip resistor |
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