JPH0514322B2 - - Google Patents
Info
- Publication number
- JPH0514322B2 JPH0514322B2 JP58119236A JP11923683A JPH0514322B2 JP H0514322 B2 JPH0514322 B2 JP H0514322B2 JP 58119236 A JP58119236 A JP 58119236A JP 11923683 A JP11923683 A JP 11923683A JP H0514322 B2 JPH0514322 B2 JP H0514322B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- magnetic
- gap
- predetermined pattern
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 24
- 239000010409 thin film Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 10
- 238000000151 deposition Methods 0.000 claims description 9
- 238000000059 patterning Methods 0.000 claims description 3
- 239000010408 film Substances 0.000 description 19
- 229910000889 permalloy Inorganic materials 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 238000000206 photolithography Methods 0.000 description 8
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Magnetic Heads (AREA)
Description
【発明の詳細な説明】
(a) 発明の技術分野
本発明は薄膜磁気ヘツドの製造方法に係り、特
に薄膜磁気ヘツドの磁極先端部を高精度に形成
し、該磁気ヘツドの磁気記録・再生の効率を向上
させる方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a method for manufacturing a thin-film magnetic head, and in particular to a method for manufacturing a thin-film magnetic head with high precision, and for forming the magnetic pole tip of the thin-film magnetic head with high precision and improving the magnetic recording/reproducing performance of the magnetic head. It is about how to improve efficiency.
(b) 従来の背景
磁気デイスクに対する磁気ヘツドの高記録密度
化、高効率化の為に、その形状寸法は益々小型
化、高精度化の傾向にあり、これに加えて量産
性、低価格な磁気ヘツドが要望されている。この
ような条件を満たす磁気ヘツドとして、記録に寄
与する磁極先端の磁気ギヤツプ構成部分でのヘツ
ド磁界分布が急峻で高密度な記録ができ、かつ一
括生産によつて低価格化と特性の均一が図れる小
型な薄膜磁気ヘツドが実用化されつつあり、種々
のタイプのものが提案されている。(b) Conventional Background In order to increase the recording density and efficiency of magnetic heads for magnetic disks, their shapes and dimensions are becoming increasingly smaller and more precise. A magnetic head is required. A magnetic head that satisfies these conditions has a steep magnetic field distribution in the magnetic gap component at the tip of the magnetic pole that contributes to recording, allowing for high-density recording, and can be produced in bulk to reduce costs and provide uniform characteristics. Small-sized thin film magnetic heads that can be used in a magnetic field are being put into practical use, and various types have been proposed.
(c) 従来技術と問題点
ところで上記した薄膜磁気ヘツドは、従来例え
ば第１図に示すようにガラスやセラミツク等から
成る非磁性基板１上にパーマロイ（Ni−Fi合金）
から成る下部磁性層２及び二酸化珪素（SiO2）
等のギヤツプ層３とをスパツタリング法などの薄
膜形成方法及びフオトリソ技法等によつて所定パ
ターンに形成する。次いで第２図に示すように該
ギヤツプ層３上に、キユアされた樹脂膜、即ち、
熱硬化性樹脂膜から成る絶縁層４を介してCu等
の導体をスパツタリング法等により被着した後、
フオトリソ技法によつてコイル導体層５を形成す
る。次ぎに該コイル導体層５を含む前記絶縁層４
上に、該絶縁層４と同材質の絶縁層６を被着形成
し、更に前記絶縁層４，６を同時に図示のように
所定パターン形状にパターニングする。その後こ
のように構成された基板１上にパーマロイ（Ni
−Fe合金）から成る上部磁性層７をスパツタリ
ング法等により被着した後、フオトリソ技法によ
つて所定パターンに形成して、第３図の上面図及
び第３図に示す−′切断線に沿つた第４図の
断面図に示すように、下部磁性層２と上部磁性層
７からなる磁極がコイル導体層５及びギヤツプ層
３を挟む形にＵ字形に形成している。(c) Prior Art and Problems By the way, the above-mentioned thin-film magnetic head has conventionally been manufactured using permalloy (Ni-Fi alloy) on a non-magnetic substrate 1 made of glass, ceramic, etc., as shown in FIG.
A lower magnetic layer 2 consisting of silicon dioxide (SiO 2 )
The gap layer 3 is formed into a predetermined pattern by a thin film forming method such as a sputtering method, a photolithography technique, or the like. Next, as shown in FIG. 2, a cured resin film, ie,
After depositing a conductor such as Cu by a sputtering method or the like via an insulating layer 4 made of a thermosetting resin film,
Coil conductor layer 5 is formed by photolithography. Next, the insulating layer 4 including the coil conductor layer 5
An insulating layer 6 made of the same material as the insulating layer 4 is deposited thereon, and the insulating layers 4 and 6 are simultaneously patterned into a predetermined pattern as shown. After that, permalloy (Ni
-Fe alloy) is deposited by a sputtering method or the like, and then formed into a predetermined pattern by photolithography along the top view of FIG. 3 and the -' cutting line shown in FIG. As shown in the cross-sectional view of FIG. 4, a magnetic pole consisting of a lower magnetic layer 2 and an upper magnetic layer 7 is formed in a U-shape with a coil conductor layer 5 and a gap layer 3 sandwiched therebetween.
又一方、かかる上部及び下部磁性層２，７の磁
性先端部分の所定膜厚に対して、該両磁性層２，
７の他の部分の膜厚を厚く形成して、前記磁極先
端部に磁束を集中し易くし、磁気記録・再生効率
を向上するために、例えば第５図に示すようにガ
ラス等から成る非磁性基板１上に、パーマロイ
（Ni−Fe合金）から成る下部磁性層２を、磁極先
端部となる部分の膜厚に対してコイル導体層５形
成部分の膜厚が厚くなるように第一の下部磁性層
２ａと第二の下部磁性層２ｂを図示のようにずら
して所定パターン形状に形成し、その上面に二酸
化珪素（SiO2）等のギヤツプ層３を被着形成す
る。次いで第６図に示すように前記ギヤツプ層３
の所定領域面上にキユアされた樹脂膜から成る絶
縁層４を介してCu等の導体をスパツタリング法
等により被着した後、フオトリソ技法によつてコ
イル導体層５を形成する。次ぎに該コイル導体層
５を含む前記絶縁層４上に、該絶縁層４と同材質
の絶縁層６を被着形成し、更に前記絶縁層４，６
を同時に所定パターン形状にパターニングする。
しかる後、第７図に示すように磁極先端部となる
部分を除くギヤツプ層３、前記絶縁層６及び第二
の下部磁性層２ｂの各部分上にパーマロイ（Ni
−Fe合金）から成る第一の上部磁性層７ａを被
着形成し、更に前記磁極先端部となる部分のギヤ
ツプ層３上をも含む第一の上部磁性層７ａの上面
に同じくパーマロイ（Ni−Fe合金）から成る第
二の上部磁性層７ｂを被着した後、フオトリソ技
法によつて所定パターンに形成して目的とする薄
膜磁気ヘツドを得るようにしている。 On the other hand, for a given film thickness of the magnetic tip portions of the upper and lower magnetic layers 2, 7, both the magnetic layers 2,
In order to increase the thickness of the other parts of the magnetic pole 7 to make it easier to concentrate the magnetic flux at the tip of the magnetic pole and to improve the magnetic recording/reproducing efficiency, for example, as shown in FIG. A lower magnetic layer 2 made of permalloy (Ni-Fe alloy) is placed on a magnetic substrate 1 in a first layer such that the thickness of the coil conductor layer 5 is thicker than that of the magnetic pole tip. The lower magnetic layer 2a and the second lower magnetic layer 2b are formed into a predetermined pattern by being shifted as shown in the figure, and a gap layer 3 of silicon dioxide (SiO 2 ) or the like is deposited on the upper surface thereof. Next, as shown in FIG.
A conductor such as Cu is deposited on a predetermined area of the coil by sputtering or the like via an insulating layer 4 made of a cured resin film, and then a coil conductor layer 5 is formed by photolithography. Next, an insulating layer 6 made of the same material as the insulating layer 4 is deposited on the insulating layer 4 including the coil conductor layer 5, and further the insulating layers 4, 6
are simultaneously patterned into a predetermined pattern shape.
Thereafter, as shown in FIG. 7, permalloy (Ni
A first upper magnetic layer 7a made of permalloy (Ni-Fe alloy) is deposited on the upper surface of the first upper magnetic layer 7a, including the gap layer 3 at the portion that will become the magnetic pole tip. After depositing the second upper magnetic layer 7b made of (Fe alloy), it is formed into a predetermined pattern by photolithography to obtain the desired thin film magnetic head.
ところがこのような形成方法によつて形成され
た上記磁気ヘツドにあつては、下部磁性層２と上
部磁性層７からなるＵ字形磁極の先端部の磁気ギ
ヤツプ構成部分における特に上部磁性層７の膜
厚、パターン幅形成精度が、コイル導体層５構成
部との高段差下での被着形成に起因して著しく低
下し、本来では±1μｍ以下の形成精度が要求さ
れているにも拘わらず、約±2μｍ程度の形成精
度しか得られないといつた欠点があつた。 However, in the above-mentioned magnetic head formed by such a forming method, the film of the upper magnetic layer 7, especially in the magnetic gap constituting portion at the tip of the U-shaped magnetic pole consisting of the lower magnetic layer 2 and the upper magnetic layer 7, is The thickness and pattern width formation accuracy are significantly reduced due to the adhesion formation under a high level difference with the coil conductor layer 5 constituent parts, even though formation accuracy of ±1 μm or less is originally required. The drawback was that the formation accuracy was only about ±2 μm.
(d) 発明の目的
本発明は上記従来の欠点を除去する為、Ｕ字形
磁極を構成する上部磁性層を磁極先端部となる部
分とその他の部分とに別けて個別に被着形成する
ようにして、上部磁性層の磁極先端部となる部分
の膜厚、及びパターン幅を薄膜コイル構成部との
高段差に影響されることなく、高精度に形成する
ことができる新規な薄膜磁気ヘツドの製造方法を
提供することを目的とするるものである。(d) Purpose of the Invention In order to eliminate the above-mentioned drawbacks of the conventional method, the present invention provides a structure in which the upper magnetic layer constituting the U-shaped magnetic pole is separately deposited on the portion that will become the tip of the magnetic pole and the other portions. Manufacturing a new thin-film magnetic head in which the film thickness and pattern width of the portion of the upper magnetic layer that will become the magnetic pole tip can be formed with high precision without being affected by the high level difference with the thin-film coil component. The purpose is to provide a method.
(e) 発明の構成
そしてこの目的は本発明によれば、基板上に下
部磁性層とギヤツプ層とを所定パターンに順次被
着形成した後、該ギヤツプ層上の磁気ギヤツプ部
構成予定領域に第一の上部磁性層を所定パターン
に被着形成する工程と、前記ギヤツプ層上の他の
領域に絶縁層を介してコイル導体層、絶縁層を順
に積層形成する工程と、前記第一の上部磁性層上
の一部を含む絶縁層上に第二の上部磁性層を被着
してから所定パターン形状にパターニングする工
程とを備えたことを特徴とする薄膜磁気ヘツドの
製造方法を提供することによつて達成される。(e) Structure of the Invention According to the present invention, after sequentially depositing a lower magnetic layer and a gap layer on a substrate in a predetermined pattern, a magnetic gap layer is formed on the gap layer in a region where the magnetic gap portion is to be formed. a step of depositing and forming a first upper magnetic layer in a predetermined pattern; a step of sequentially laminating a coil conductor layer and an insulating layer on other areas on the gap layer via an insulating layer; To provide a method for manufacturing a thin film magnetic head, comprising the steps of depositing a second upper magnetic layer on the insulating layer including a part of the layer and patterning the second upper magnetic layer into a predetermined pattern shape. It is achieved by doing so.
(f) 発明の実施例
以下図面を用いて本発明の実施例について詳細
に説明する。(f) Embodiments of the invention Examples of the invention will be described in detail below with reference to the drawings.
第８図及び第９図は本発明に拘る薄膜磁気ヘツ
ドの製造方法の一実施例を工程順に説明する要部
断面図である。 FIGS. 8 and 9 are sectional views of essential parts illustrating one embodiment of the method for manufacturing a thin film magnetic head according to the present invention in the order of steps.
まず第８図に示すように、例えばガラス、セラ
ミツク、或いはアルミナ・チタン・カーバイト
（Al2O3・Ti・Ｃ）等から成るスライダを兼ねる
非磁性基板１１上に、従来と同様の工程によつて
パーマロイ（Ni−Fe）から成る下部磁性層１２、
及び二酸化珪素（SiO2）等のギヤツプ層１３と
をメツキ法、或いはスパツタリング法及びフオト
リソ技法等によつて所定パターンに形成する。次
いで前記ギヤツプ層１３上にコイル導体層を形成
する前に、そのギヤツプ層１３上のギヤツプ部構
造予定領域にパーマロイ（Ni−Fe）等から成る
第一の上部磁性層１４ａを所定の厚さに所定のパ
ターンに被着し、かつ所定パターン形状にパター
ニングすることにより、その周囲に段差を有する
膜が存在しないため前記第１の上部磁性層１４ａ
のパターン精度が向上する。次いで前記ギヤツプ
層１３上の他の領域にキユアされた樹脂膜、即
ち、熱硬化性樹脂膜から成る絶縁層１５を介して
Cu等の導体からなるコイル導体層１６、前記絶
縁層１５と同材質の絶縁層１７を順に積層形成す
る。更に前記絶縁層１５，１７を同時に図示のよ
うに所定パターン形状にパターニングする。その
後このように構成された基板１１上の、前記第一
の上部磁性層１４ａ上の一部を含む絶縁層１７上
に、第９図に示すようにパーマロイ（Ni−Fe合
金）から成る第二の上部磁性膜１４ｂをスパツタ
リング法等により被着した後、フオトリソ技法等
によつて所定パターン形状にパターニングするこ
とによつて、前記第１の上部磁性層１４ａと絶縁
層１７が被覆されたコイル導体層１６との上面は
段差の小さい面となつているため、該第１の上部
磁性層１４ａ上の一部より絶縁層１７が被覆され
たコイル導体層１６上に配設される第二の上部磁
性層１４ｂの膜厚が均一化すると共に、そのパタ
ーン幅の形成精度が前記段差に影響されることな
く高精度に形成することできる。 First, as shown in FIG. 8, a non-magnetic substrate 11 made of glass, ceramic, alumina, titanium, carbide (Al 2 O 3 , Ti, C), etc., which also serves as a slider, is first placed on a non-magnetic substrate 11 made of glass, ceramic, or alumina, titanium, carbide (Al 2 O 3, Ti, C), etc., in the same process as in the past. Therefore, a lower magnetic layer 12 made of permalloy (Ni-Fe),
and a gap layer 13 made of silicon dioxide (SiO 2 ) or the like are formed into a predetermined pattern by plating, sputtering, photolithography, or the like. Next, before forming a coil conductor layer on the gap layer 13, a first upper magnetic layer 14a made of permalloy (Ni-Fe) or the like is formed to a predetermined thickness in the area where the gap structure is planned on the gap layer 13. The first upper magnetic layer 14a is deposited in a predetermined pattern and patterned into a predetermined pattern shape, so that there is no film having a step around the first upper magnetic layer 14a.
pattern accuracy is improved. Next, the insulation layer 15 made of a cured resin film, that is, a thermosetting resin film, is applied to other areas on the gap layer 13.
A coil conductor layer 16 made of a conductor such as Cu and an insulating layer 17 made of the same material as the insulating layer 15 are laminated in this order. Further, the insulating layers 15 and 17 are simultaneously patterned into a predetermined pattern shape as shown in the figure. Thereafter, as shown in FIG. 9, a second layer made of permalloy (Ni-Fe alloy) is placed on the insulating layer 17 including a part of the first upper magnetic layer 14a on the substrate 11 configured in this manner. A coil conductor coated with the first upper magnetic layer 14a and the insulating layer 17 is formed by depositing the upper magnetic film 14b by sputtering or the like, and then patterning it into a predetermined pattern shape by photolithography or the like. Since the upper surface with respect to the layer 16 is a surface with a small difference in level, the second upper magnetic layer 14 disposed on the coil conductor layer 16 covered with the insulating layer 17 from a part of the first upper magnetic layer 14a. The thickness of the magnetic layer 14b is made uniform, and the pattern width can be formed with high accuracy without being affected by the step.
このように高精度が要求される上部磁性層１４
の磁極先端部となる部分、即ち前記第一の上部磁
性層１４ａを第二の上部磁性層１４ｂの被着形成
に先立つて別個に形成することにより、従来の如
きコイル導体層１６構成部との高段差に影響され
ることなく、上部磁性層１４の磁極先端部の膜
厚、及びパターン幅等を±1μｍ以下の高精度に
形成することが可能になり、磁気記録・再生効率
の良い薄膜磁気ヘツドを得ることができる。 In this way, the upper magnetic layer 14 requires high precision.
By separately forming the portion that will become the magnetic pole tip, that is, the first upper magnetic layer 14a, prior to the formation of the second upper magnetic layer 14b, it is possible to separate the portion forming the coil conductor layer 16 from the conventional coil conductor layer 16. It is possible to form the film thickness of the magnetic pole tip of the upper magnetic layer 14 and the pattern width with high precision of ±1 μm or less without being affected by high steps, making it possible to form a thin film magnetic film with high magnetic recording and reproducing efficiency. You can get a head.
さて次ぎに第１０図及び第１１図は本発明の方
法にもとずく他の実施例を工程順に説明する要部
断面図である。本実施例は磁気ヘツドのＵ字形磁
極の先端部を構成する上部及び下部磁性層部分の
所定膜厚Ｔ１に対して、その他の上部及び下部磁
性層部分の膜厚Ｔ２をＴ１＜Ｔ２となるように形
成して磁気記録・再生効率の良い磁気ヘツドを得
る場合での本発明例を示すもので、まず第１０図
に示すように、例えばガラス、セラミツク或いは
アルミナ・チタン・カーバイト（Al2O3・Ti・
Ｃ）等から成るスライダを兼ねる非磁性基板２１
上に、従来と同様の工程によつてパーマロイ
（Ni−Fe合金）から成る下部磁性層２２を、磁極
先端部となる部分の膜厚Ｔ１に対してコイル導体
層２６形成部分の膜厚Ｔ２が厚くなるように第一
の下部磁性層２２ａと第二の下部磁性層２２ｂを
図示のようにずらして所定パターン形状に形成
し、その上面に二酸化珪素（SiO2）等のギヤツ
プ層２３を被着形成する。次いで前記ギヤツプ層
２３上の磁気ギヤツプ部構成予定領域にパーマロ
イ（Ni−Fe）等から成る第一の上部磁性層２４
ａを所定の厚さＴ１に選択的に被着し、かつ所定
パターン形状にパターニングする。次いで前記ギ
ヤツプ層２３上の他の領域に、キユアされた樹脂
膜、即ち、熱硬化性樹脂膜から成る絶縁層２５を
介してCu等の導体からなるコイル導体層２６、
前記絶縁層２５と同材質の絶縁層２７を順に積層
形成する。更に前記絶縁層２５，２７を同時に図
示のように所定パターン形状にパターニングす
る。その後このように構成された基板２１上の前
記第一の上部磁性層２４ａ上の一部を含む絶縁層
２７上に、第１１図に示すようにパーマロイ
（Ni−Fe合金）から成る第二の上部磁性層２４ｂ
を、その膜厚Ｔ２を前記第一の上部磁性層２４ａ
の膜厚Ｔ１よりも厚く被着した後、フオトリソ技
法によつて所定パターン形状に形成すれば、前記
第８図及び第９図による実施例と同様に、上部及
び下部磁性層２４，２２の磁極先端部の膜厚、及
びパターン幅等をコイル導体層２６構成部との高
段差に影響されることなく、±1μｍ以下の高精度
に形成することが可能になり、磁気記録・再生効
率の良い薄膜磁気ヘツドを得ることができる。 Next, FIGS. 10 and 11 are sectional views of main parts explaining another embodiment based on the method of the present invention in the order of steps. In this embodiment, with respect to a predetermined thickness T1 of the upper and lower magnetic layer portions constituting the tip of the U-shaped magnetic pole of the magnetic head, the thickness T2 of the other upper and lower magnetic layer portions is set such that T1<T2. This shows an example of the present invention in which a magnetic head with good magnetic recording and reproducing efficiency is obtained by forming a magnetic head using a material such as glass, ceramic, or alumina titanium carbide (Al 2 O). 3・Ti・
A non-magnetic substrate 21 that also serves as a slider consisting of C) etc.
A lower magnetic layer 22 made of permalloy (Ni-Fe alloy) is formed on the top by a process similar to the conventional method, so that the film thickness T2 of the coil conductor layer 26 forming part is smaller than the film thickness T1 of the part that will become the magnetic pole tip. The first lower magnetic layer 22a and the second lower magnetic layer 22b are shifted as shown in the figure to form a predetermined pattern shape so as to increase the thickness, and a gap layer 23 of silicon dioxide (SiO 2 ) or the like is deposited on the upper surface thereof. Form. Next, a first upper magnetic layer 24 made of permalloy (Ni-Fe) or the like is formed on the gap layer 23 in a region where the magnetic gap portion is to be formed.
A is selectively deposited to a predetermined thickness T1 and patterned into a predetermined pattern shape. Next, a coil conductor layer 26 made of a conductor such as Cu is applied to other areas on the gap layer 23 via an insulating layer 25 made of a cured resin film, that is, a thermosetting resin film.
An insulating layer 27 made of the same material as the insulating layer 25 is sequentially laminated. Further, the insulating layers 25 and 27 are simultaneously patterned into a predetermined pattern shape as shown in the figure. Thereafter, as shown in FIG. 11, a second layer made of permalloy (Ni-Fe alloy) is placed on the insulating layer 27 including a part of the first upper magnetic layer 24a on the substrate 21 configured in this way. Upper magnetic layer 24b
and the thickness T2 of the first upper magnetic layer 24a.
If the film is deposited thicker than the film thickness T1 and then formed into a predetermined pattern shape by photolithography, the magnetic poles of the upper and lower magnetic layers 24 and 22 can be formed in the same way as in the embodiments shown in FIGS. 8 and 9. It is now possible to form the film thickness and pattern width of the tip with high accuracy of ±1 μm or less without being affected by the high level difference with the coil conductor layer 26 component, resulting in high magnetic recording and reproducing efficiency. A thin film magnetic head can be obtained.
(g) 発明の効果
以上の説明から明らかなように、本発明に係る
薄膜磁気ヘツドの製造方法によれば、上部及び下
部磁性層によつて構成される磁極先端部の膜厚、
及びそのパターン幅がコイル導体層構成部との高
段差に影響されることなく、高精度に形成するこ
とが可能になり、磁気記録・再生効率の良い薄膜
磁気ヘツドを得ることができる。よつてこの種の
薄膜磁気ヘツドの製造方法に適用して極めて有利
であり、実用上優れた効果を奏する。(g) Effect of the invention As is clear from the above explanation, according to the method for manufacturing a thin film magnetic head according to the present invention, the thickness of the magnetic pole tip formed by the upper and lower magnetic layers,
The width of the pattern can be formed with high precision without being affected by a high level difference with the coil conductor layer constituent portion, and a thin film magnetic head with high magnetic recording/reproducing efficiency can be obtained. Therefore, it is extremely advantageous to apply it to a method of manufacturing this type of thin film magnetic head, and produces excellent practical effects.
第１図乃至第４図は従来の薄膜磁気ヘツドの製
造方法を工程順に説明する図、第５図乃至第７図
は従来の他の薄膜磁気ヘツドの製造方法を工程順
に説明する図、第８図及び第９図は本発明に係る
薄膜磁気ヘツドの製造方法の一実施例を工程順に
説明する要部断面図、第１０図及び第１１図は本
発明の方法にもとずく他の実施例を工程順に説明
する要部断面図である。
図面において、１１，２１は非磁性基板、１
２，２２は下部磁性層、２２ａは第一の下部磁性
層、２２ｂは第二の下部磁性層、１３，２３はギ
ヤツプ層、１４，２４は上部磁性層、１４ａ，２
４ａは第一の上部磁性層、１４ｂ，２４ｂは第二
の上部磁性層、１５，１７及び２５，２７は絶縁
層、１６，２６はコイル導体層を示す。
1 to 4 are diagrams explaining a conventional method for manufacturing a thin film magnetic head in the order of steps, FIGS. 5 to 7 are diagrams explaining another conventional method for manufacturing a thin film magnetic head in order of steps, and FIG. 9 and 9 are cross-sectional views of main parts explaining one embodiment of the method for manufacturing a thin film magnetic head according to the present invention in the order of steps, and FIGS. 10 and 11 are other embodiments based on the method of the present invention. FIG. 2 is a cross-sectional view of main parts explaining the process in the order of steps. In the drawings, 11 and 21 are nonmagnetic substrates;
2, 22 are lower magnetic layers, 22a is a first lower magnetic layer, 22b is a second lower magnetic layer, 13, 23 are gap layers, 14, 24 are upper magnetic layers, 14a, 2
4a is a first upper magnetic layer, 14b and 24b are second upper magnetic layers, 15, 17 and 25, 27 are insulating layers, and 16, 26 are coil conductor layers.
Claims (1)
ターンに順次被着形成した後、該ギヤツプ層上の
磁気ギヤツプ部構成予定領域に第一の上部磁性層
を所定パターンに被着形成する工程と、前記ギヤ
ツプ層上の他の領域に絶縁層を介してコイル導体
層、絶縁層を順に積層形成する工程と、前記第一
の上部磁性層上の一部を含む絶縁層上に第二の上
部磁性層を被着してから所定パターン形状にパタ
ーニングする工程とを備えたことを特徴とする薄
膜磁気ヘツドの製造方法。1. A step of sequentially depositing a lower magnetic layer and a gap layer on a substrate in a predetermined pattern, and then depositing a first upper magnetic layer in a predetermined pattern in a region on the gap layer where the magnetic gap portion is to be formed. , forming a coil conductor layer and an insulating layer in order on other areas on the gap layer via an insulating layer, and forming a second upper layer on the insulating layer including a part on the first upper magnetic layer. 1. A method for manufacturing a thin-film magnetic head, comprising the steps of depositing a magnetic layer and patterning it into a predetermined pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11923683A JPS6010409A (en) | 1983-06-29 | 1983-06-29 | Production of thin film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11923683A JPS6010409A (en) | 1983-06-29 | 1983-06-29 | Production of thin film magnetic head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6010409A JPS6010409A (en) | 1985-01-19 |
| JPH0514322B2 true JPH0514322B2 (en) | 1993-02-24 |
Family
ID=14756329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11923683A Granted JPS6010409A (en) | 1983-06-29 | 1983-06-29 | Production of thin film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6010409A (en) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0810485B2 (en) * | 1989-03-20 | 1996-01-31 | 株式会社日立製作所 | Magnetic disk device, thin film magnetic head mounted thereon, manufacturing method thereof, and information writing / reading method |
| US5452164A (en) * | 1994-02-08 | 1995-09-19 | International Business Machines Corporation | Thin film magnetic write head |
| JP2784431B2 (en) * | 1994-04-19 | 1998-08-06 | インターナショナル・ビジネス・マシーンズ・コーポレイション | Thin-film magnetic write head, read / write magnetic head, disk drive, and method of manufacturing thin-film magnetic write head |
| US5798897A (en) * | 1996-10-21 | 1998-08-25 | International Business Machines Corporation | Inductive write head with insulation stack configured for eliminating reflective notching |
| US5805391A (en) * | 1996-10-28 | 1998-09-08 | International Business Machines Corporation | Write head with recessed stitched yoke on a planar portion of an insulation layer defining zero throat height |
| JPH11288503A (en) | 1998-04-02 | 1999-10-19 | Tdk Corp | Thin-film magnetic head and its production |
| JPH11353614A (en) | 1998-06-08 | 1999-12-24 | Nec Corp | Thin-film magnetic head and magnetic memory device using the same |
| JPH11353616A (en) | 1998-06-11 | 1999-12-24 | Tdk Corp | Thin-film magnetic head and its production |
| JP3755560B2 (en) | 1998-06-30 | 2006-03-15 | 富士通株式会社 | Magnetic head and manufacturing method thereof |
| US6510024B2 (en) | 1998-06-30 | 2003-01-21 | Fujitsu Limited | Magnetic head and method of manufacturing the same |
| JP3292148B2 (en) | 1998-07-15 | 2002-06-17 | 日本電気株式会社 | Thin-film magnetic head, method of manufacturing the same, and magnetic storage device |
| US6317288B1 (en) | 1998-08-28 | 2001-11-13 | Tdk Corporation | Thin-film magnetic head and method of manufacturing same |
| JP3781399B2 (en) | 1998-12-08 | 2006-05-31 | Ｔｄｋ株式会社 | Thin film magnetic head and manufacturing method thereof |
| JP3784182B2 (en) | 1998-12-11 | 2006-06-07 | Ｔｄｋ株式会社 | Manufacturing method of thin film magnetic head |
| JP3530064B2 (en) | 1999-03-29 | 2004-05-24 | Ｔｄｋ株式会社 | Thin-film magnetic head, method of manufacturing the same, material for thin-film magnetic head, and method of manufacturing the same |
| JP3856587B2 (en) | 1999-04-06 | 2006-12-13 | Ｔｄｋ株式会社 | Thin film magnetic head and manufacturing method thereof |
| JP3856591B2 (en) | 1999-04-28 | 2006-12-13 | Ｔｄｋ株式会社 | Thin film magnetic head and manufacturing method thereof |
| JP3421635B2 (en) | 1999-06-04 | 2003-06-30 | ティーディーケイ株式会社 | Thin film magnetic head and method of manufacturing the same |
| JP3522593B2 (en) | 1999-06-15 | 2004-04-26 | Ｔｄｋ株式会社 | Thin film magnetic head and method of manufacturing the same |
| JP3527138B2 (en) | 1999-06-17 | 2004-05-17 | Ｔｄｋ株式会社 | Thin-film magnetic head and method of manufacturing the same, thin-film coil element and method of manufacturing the same |
| US7012784B2 (en) | 1999-07-08 | 2006-03-14 | Tdk Corporation | Thin-film magnetic head and method of manufacturing same |
| JP3859398B2 (en) | 1999-07-08 | 2006-12-20 | Ｔｄｋ株式会社 | Thin film magnetic head and manufacturing method thereof |
| JP3490643B2 (en) | 1999-07-14 | 2004-01-26 | Ｔｄｋ株式会社 | Method for manufacturing thin-film magnetic head |
| JP2001034911A (en) | 1999-07-16 | 2001-02-09 | Tdk Corp | Thin film magnetic head and fabrication method thereof |
| JP3530084B2 (en) | 1999-09-07 | 2004-05-24 | Ｔｄｋ株式会社 | Thin film magnetic head and method of manufacturing the same |
| JP3560872B2 (en) | 1999-10-12 | 2004-09-02 | Ｔｄｋ株式会社 | Thin film magnetic head and method of manufacturing the same |
| US7002776B2 (en) | 1999-12-06 | 2006-02-21 | Tdk Corporation | Thin film magnetic head and method of manufacturing same |
| US6687096B2 (en) | 2000-06-21 | 2004-02-03 | Tdk Corporation | Thin-film magnetic head and method of manufacturing same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5778613A (en) * | 1980-10-30 | 1982-05-17 | Canon Inc | Thin film magnetic head and its manufacture |
-
1983
- 1983-06-29 JP JP11923683A patent/JPS6010409A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5778613A (en) * | 1980-10-30 | 1982-05-17 | Canon Inc | Thin film magnetic head and its manufacture |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6010409A (en) | 1985-01-19 |
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