JPH0513665A - Ｔａｂチツプ実装方法 - Google Patents

Ｔａｂチツプ実装方法

Info

Publication number
JPH0513665A
JPH0513665A JP18349891A JP18349891A JPH0513665A JP H0513665 A JPH0513665 A JP H0513665A JP 18349891 A JP18349891 A JP 18349891A JP 18349891 A JP18349891 A JP 18349891A JP H0513665 A JPH0513665 A JP H0513665A
Authority
JP
Japan
Prior art keywords
tab
chip
bumps
chips
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18349891A
Other languages
English (en)
Inventor
Fushimi Yamauchi
節美 山内
Masaru Kawazumi
優 河住
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP18349891A priority Critical patent/JPH0513665A/ja
Publication of JPH0513665A publication Critical patent/JPH0513665A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】 【目的】 プリント基板上でのＴＡＢチップの実装率を
向上する。 【構成】 ＴＡＢチップ２ａ，２ａを上下に重ね合せて
プリント基板１上に実装することにより、チップ２ａの
プリント基板１上での実装率を向上する。

Description

【発明の詳細な説明】
【０００１】
【産業上の利用分野】本発明はパッケージに関し、特に
ＴＡＢチップの実装方法に関する。
【０００２】
【従来の技術】従来、ＴＡＢチップの実装方法に関して
は図２に示すように、ＴＡＢチップ２をプリント基板１
上に並列に置き、チップ２のバンプ３をプリント基板１
に半田４により接続する方法であった。
【０００３】
【発明が解決しようとする課題】この従来の実装方法
は、ＴＡＢチップを並列に実装するため、実装面積が広
く必要であるという問題点があった。
【０００４】本発明の目的は、前記課題を解決したＴＡ
Ｂチップ実装方法を提供することにある。
【０００５】
【課題を解決するための手段】前記目的を達成するた
め、本発明に係るＴＡＢチップ実装方法においては、少
なくとも２個のＴＡＢチップを上下に重ね合せ、これら
をプリント基板上に実装するものである。
【０００６】また、前記２個のＴＡＢチップは、バンプ
が設けられていない端面同士を突き合せ、ＴＡＢチップ
積層体の上下端面にバンプを配置して重ね合せるもので
ある。
【０００７】
【作用】本発明では、ＴＡＢチップを上下方向に重ね合
せて実装することにより、横方向の寸法を縮小させたも
のである。
【０００８】
【実施例】以下、本発明の一実施例を図により説明す
る。
【０００９】図１は、本発明の一実施例を示す図であ
る。図１において、本実施例では、少なくとも２個のＴ
ＡＢチップ２ａ，２ａは、バンプ３が設けられていない
端面同士を突き合せて接着剤７で接合し、ＴＡＢチップ
積層体２の上下端面にバンプ３を配置して重ね合せる。
【００１０】次いで、下段のＴＡＢチップ２ａのバンプ
３をプリント基板１に半田４で接合させる。
【００１１】一方、上段のＴＡＢチップ２ａのバンプ３
にはワイヤーリード６の一端を接合し、ワイヤーリード
６の他端を、プリント基板１のパッドに接合することに
より、実装を完了させる。
【００１２】
【発明の効果】以上説明したように本発明は、ＴＡＢチ
ップを上下に重ね合わせることにより、プリント基板上
での実装率を向上できるとともに、プリント基板上での
ＴＡＢチップ実装面積を実質的に縮小できる。
【図面の簡単な説明】
【図１】本発明の一実施例を示す図である。
【図２】従来例を示す図である。
【符号の説明】
１ プリント基板 ２ ＴＡＢチップ積層体 ２ａ ＴＡＢチップ ３ バンプ ４ 半田 ５ パッド ６ ワイヤーリード ７ 接着剤
フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 1/18 Ｓ 6736−4Ｅ

Claims (2)

    【特許請求の範囲】
  1. 【請求項１】 少なくとも２個のＴＡＢチップを上下に
    重ね合せ、これらをプリント基板上に実装することを特
    徴とするＴＡＢチップ実装方法。
  2. 【請求項２】 前記２個のＴＡＢチップは、バンプが設
    けられていない端面同士を突き合せ、ＴＡＢチップ積層
    体の上下端面にバンプを配置して重ね合せることを特徴
    とする請求項１に記載のＴＡＢチップ実装方法。
JP18349891A 1991-06-28 1991-06-28 Ｔａｂチツプ実装方法 Pending JPH0513665A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18349891A JPH0513665A (ja) 1991-06-28 1991-06-28 Ｔａｂチツプ実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18349891A JPH0513665A (ja) 1991-06-28 1991-06-28 Ｔａｂチツプ実装方法

Publications (1)

Publication Number Publication Date
JPH0513665A true JPH0513665A (ja) 1993-01-22

Family

ID=16136878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18349891A Pending JPH0513665A (ja) 1991-06-28 1991-06-28 Ｔａｂチツプ実装方法

Country Status (1)

Country Link
JP (1) JPH0513665A (ja)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996017505A1 (en) * 1994-12-01 1996-06-06 Motorola Inc. Method, flip-chip module, and communicator for providing three-dimensional package
US6407456B1 (en) 1996-02-20 2002-06-18 Micron Technology, Inc. Multi-chip device utilizing a flip chip and wire bond assembly
US6552416B1 (en) 2000-09-08 2003-04-22 Amkor Technology, Inc. Multiple die lead frame package with enhanced die-to-die interconnect routing using internal lead trace wiring
US6555917B1 (en) 2001-10-09 2003-04-29 Amkor Technology, Inc. Semiconductor package having stacked semiconductor chips and method of making the same
US6642610B2 (en) 1999-12-20 2003-11-04 Amkor Technology, Inc. Wire bonding method and semiconductor package manufactured using the same
US6737750B1 (en) 2001-12-07 2004-05-18 Amkor Technology, Inc. Structures for improving heat dissipation in stacked semiconductor packages
US6798049B1 (en) 1999-08-24 2004-09-28 Amkor Technology Inc. Semiconductor package and method for fabricating the same
US6879047B1 (en) 2003-02-19 2005-04-12 Amkor Technology, Inc. Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor
US6900528B2 (en) 2001-06-21 2005-05-31 Micron Technology, Inc. Stacked mass storage flash memory package
US6946323B1 (en) 2001-11-02 2005-09-20 Amkor Technology, Inc. Semiconductor package having one or more die stacked on a prepackaged device and method therefor
US6951774B2 (en) * 2001-04-06 2005-10-04 Renesas Technology Corp. Semiconductor device and method of manufacturing the same
US7109059B2 (en) 1996-11-20 2006-09-19 Micron Technology, Inc. Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
US7154171B1 (en) 2002-02-22 2006-12-26 Amkor Technology, Inc. Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor
US7485490B2 (en) 2001-03-09 2009-02-03 Amkor Technology, Inc. Method of forming a stacked semiconductor package
US9768124B2 (en) 2007-02-21 2017-09-19 Amkor Technology, Inc. Semiconductor package in package

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996017505A1 (en) * 1994-12-01 1996-06-06 Motorola Inc. Method, flip-chip module, and communicator for providing three-dimensional package
US6407456B1 (en) 1996-02-20 2002-06-18 Micron Technology, Inc. Multi-chip device utilizing a flip chip and wire bond assembly
US7166495B2 (en) * 1996-02-20 2007-01-23 Micron Technology, Inc. Method of fabricating a multi-die semiconductor package assembly
US7109059B2 (en) 1996-11-20 2006-09-19 Micron Technology, Inc. Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
US7812436B2 (en) 1996-11-20 2010-10-12 Micron Technology, Inc. Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
US7776652B2 (en) 1996-11-20 2010-08-17 Micron Technology, Inc. Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
US7423338B2 (en) 1996-11-20 2008-09-09 Micron Technology, Inc. Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
US7423339B2 (en) 1996-11-20 2008-09-09 Mircon Technology, Inc. Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
US7411286B2 (en) 1996-11-20 2008-08-12 Micron Technology, Inc. Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
US7402902B2 (en) 1996-11-20 2008-07-22 Micron Technology, Inc. Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
US7282792B2 (en) 1996-11-20 2007-10-16 Micron Technology, Inc. Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
US6798049B1 (en) 1999-08-24 2004-09-28 Amkor Technology Inc. Semiconductor package and method for fabricating the same
US6803254B2 (en) 1999-12-20 2004-10-12 Amkor Technology, Inc. Wire bonding method for a semiconductor package
US6642610B2 (en) 1999-12-20 2003-11-04 Amkor Technology, Inc. Wire bonding method and semiconductor package manufactured using the same
US6552416B1 (en) 2000-09-08 2003-04-22 Amkor Technology, Inc. Multiple die lead frame package with enhanced die-to-die interconnect routing using internal lead trace wiring
US7485490B2 (en) 2001-03-09 2009-02-03 Amkor Technology, Inc. Method of forming a stacked semiconductor package
US6951774B2 (en) * 2001-04-06 2005-10-04 Renesas Technology Corp. Semiconductor device and method of manufacturing the same
US7262506B2 (en) 2001-06-21 2007-08-28 Micron Technology, Inc. Stacked mass storage flash memory package
US7375419B2 (en) 2001-06-21 2008-05-20 Micron Technology, Inc. Stacked mass storage flash memory package
US6900528B2 (en) 2001-06-21 2005-05-31 Micron Technology, Inc. Stacked mass storage flash memory package
US7999378B2 (en) 2001-06-21 2011-08-16 Round Rock Research, Llc Semiconductor devices including semiconductor dice in laterally offset stacked arrangement
US7998792B2 (en) 2001-06-21 2011-08-16 Round Rock Research, Llc Semiconductor device assemblies, electronic devices including the same and assembly methods
US8049342B2 (en) 2001-06-21 2011-11-01 Round Rock Research, Llc Semiconductor device and method of fabrication thereof
US7704794B2 (en) 2001-06-21 2010-04-27 Micron Technology, Inc. Method of forming a semiconductor device
US6555917B1 (en) 2001-10-09 2003-04-29 Amkor Technology, Inc. Semiconductor package having stacked semiconductor chips and method of making the same
US6946323B1 (en) 2001-11-02 2005-09-20 Amkor Technology, Inc. Semiconductor package having one or more die stacked on a prepackaged device and method therefor
US6919631B1 (en) 2001-12-07 2005-07-19 Amkor Technology, Inc. Structures for improving heat dissipation in stacked semiconductor packages
US6737750B1 (en) 2001-12-07 2004-05-18 Amkor Technology, Inc. Structures for improving heat dissipation in stacked semiconductor packages
US7154171B1 (en) 2002-02-22 2006-12-26 Amkor Technology, Inc. Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor
US6879047B1 (en) 2003-02-19 2005-04-12 Amkor Technology, Inc. Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor
US9768124B2 (en) 2007-02-21 2017-09-19 Amkor Technology, Inc. Semiconductor package in package

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