JPH05136550A - Method of forming printed circuit - Google Patents
Method of forming printed circuitInfo
- Publication number
- JPH05136550A JPH05136550A JP32666091A JP32666091A JPH05136550A JP H05136550 A JPH05136550 A JP H05136550A JP 32666091 A JP32666091 A JP 32666091A JP 32666091 A JP32666091 A JP 32666091A JP H05136550 A JPH05136550 A JP H05136550A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- circuit
- resist film
- film
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント回路の形成方
法に関し、とくにフリップチップを実装するためのプリ
ント回路を製造する方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a printed circuit, and more particularly to a method for manufacturing a printed circuit for mounting a flip chip.
【０００２】[0002]
【従来の技術】従来、プリント回路板は、片面板、両面
板、または多層板のいずれに関わらず、回路銅箔を保護
し、はんだの付着部分を規定するため、レジスト剤が回
路上に被覆されてきた。この皮膜は、半導体チップを直
接搭載するフリップチップ回路においては、はんだバン
プの溶融時にはんだのにじみ出しを防ぐための堰として
も用いられてきた。すなわち、回路の一部に形成された
パット部の一部を皮膜で覆い、この皮膜がパッドの中心
部にくるようにレジスト剤がスクリーン印刷されあるい
は光硬化性レジストにおいてはこの部分が硬化せずに洗
い流される仕組みになっていた。2. Description of the Related Art Conventionally, a printed circuit board, regardless of whether it is a single-sided board, a double-sided board, or a multi-layer board, protects a circuit copper foil and regulates a soldering portion, so that a resist agent is coated on the circuit. It has been. This film has also been used as a weir for preventing the exudation of the solder when the solder bump is melted in a flip chip circuit in which a semiconductor chip is directly mounted. That is, a part of the pad part formed on a part of the circuit is covered with a film, and the resist agent is screen-printed so that the film is located at the center of the pad or this part is not cured in the photocurable resist. It was designed to be washed away.
【０００３】しかしながら、最近のプリント回路の微細
化が進むにつれて、パッドの中心にこのようなレジスト
の『穴』を設けることは、寸法精度の面できわめて難し
くなってきた。とくにフリップチップの実装において
は、１００μｍ程度のパッド部の中心に５０μｍのレジ
ストの『穴』を１５０μｍピッチで設ける、などの例で
分かるように、きわめて精度の高い加工が要求されるよ
うになってきた。通常、プリント回路の形成方法におい
て、このような高い精度を出すことはきわめて困難であ
り、このため精度の高い回路形成方法の開発が望まれて
きた。However, with recent miniaturization of printed circuits, it has become extremely difficult to form such a resist "hole" at the center of the pad in terms of dimensional accuracy. Especially in flip-chip mounting, extremely accurate processing is required, as can be seen from the example in which 50 μm resist “holes” are provided at a 150 μm pitch in the center of a pad portion of about 100 μm. It was Usually, it is extremely difficult to obtain such high precision in a printed circuit forming method, and therefore, development of a highly accurate circuit forming method has been desired.
【０００４】[0004]
【発明の目的】本発明の目的は、回路上に精度の高いレ
ジストの『穴』を形成し、とくにパッド部に精度の高い
レジストの『穴』を形成して、フリップチップ搭載など
に適用可能な精度の高いプリント回路板を形成すること
にある。The object of the present invention is to form a highly accurate resist "hole" on a circuit, and particularly to form a highly accurate resist "hole" on a pad portion, and can be applied to flip chip mounting and the like. To form a highly accurate printed circuit board.
【０００５】[0005]
【発明の構成】本発明は、回路導体をレジスト皮膜で被
覆後、該皮膜をレーザーでエッチングすることを特徴と
するプリント回路形成方法である。DETAILED DESCRIPTION OF THE INVENTION The present invention is a method for forming a printed circuit, which comprises coating a circuit conductor with a resist film and then etching the film with a laser.
【０００６】さらに本発明は、パッド部をレジスト皮膜
で被覆後、該皮膜をレーザーでエッチングすることを特
徴とするプリント回路形成方法である。Furthermore, the present invention is a method for forming a printed circuit, which comprises coating the pad portion with a resist film and then etching the film with a laser.
【０００７】本発明において、回路導体は通常のプリン
ト回路形成方法にしたがって基板材料の上にサブトラク
ティブ法またはアディティブ法で形成される。ここで使
用される基板材料は、ガラス繊維を補強材とし、エポキ
シ樹脂、ポリイミド樹脂、ポリエステル樹脂などをマト
リックス樹脂とした積層板、アラミド繊維やポリエステ
ル系繊維などを補強材とし、エポキシ樹脂、ポリイミド
樹脂、ポリエステル樹脂などをマトリックスとした積層
板、あるいはセラミック、ポリイミドフィルム、アラミ
ドフィルム、ポリエステル系フィルムなど、すべての積
層板材料を指す。In the present invention, the circuit conductor is formed on the substrate material by a subtractive method or an additive method according to a conventional printed circuit forming method. The substrate material used here is a laminated board using glass fiber as a reinforcing material and epoxy resin, polyimide resin, polyester resin or the like as a matrix resin, aramid fiber or polyester fiber as a reinforcing material, and epoxy resin or polyimide resin. , A laminated board using a polyester resin as a matrix, or ceramics, a polyimide film, an aramid film, a polyester film, or any other laminated board material.
【０００８】本発明において、レジスト皮膜はエポキシ
樹脂、ポリイミド樹脂、アクリル系樹脂、ポリエステル
系樹脂など、あらゆる樹脂が使用できる。とくに感光性
エポキシ樹脂、感光性ポリイミド樹脂は、本発明の効果
を発揮する上で好ましい。In the present invention, the resist film may be made of any resin such as epoxy resin, polyimide resin, acrylic resin, polyester resin and the like. Particularly, a photosensitive epoxy resin and a photosensitive polyimide resin are preferable for exhibiting the effects of the present invention.
【０００９】該レジスト皮膜は、プリント回路板の外層
に保護膜として使用される。通常、レジスト皮膜は、あ
とではんだ被覆を施す回路を除いてほぼ全面に形成され
る。本発明においても、レジスト皮膜の形成は通常のプ
リント回路と同じく、ほぼ全面に形成され、パッド部分
はすべて被覆される。その後、パッド部分などに穴明け
などを行うに際し、レーザーでレジストをエッチングす
る点が従来の方法と異なる。The resist film is used as a protective film on the outer layer of the printed circuit board. Usually, the resist film is formed on almost the entire surface except for the circuit to which the solder coating is applied later. Also in the present invention, the resist film is formed on almost the entire surface as in a normal printed circuit, and the pad portion is entirely covered. After that, when a hole is formed in a pad portion or the like, a point that a resist is etched with a laser is different from the conventional method.
【００１０】本発明において、パッド部分などに被覆さ
れたレジストは、レーザーでエッチングされる。ここで
用いるレーザーは、炭酸ガスレーザー、ＹＡＧレーザ
ー、エキシマレーザーのいずれであってもよいが、エキ
シマレーザーが最も精度の高いエッチングが可能である
点で好ましい。In the present invention, the resist coated on the pad portion is etched by laser. The laser used here may be any of a carbon dioxide gas laser, a YAG laser, and an excimer laser, but the excimer laser is preferable because it enables the most accurate etching.
【００１１】エキシマレーザーで穴明けする場合、マス
クの適用方法としては、マスクイメージ法、コンタクト
マスク法、コンフォーマルマスク法のいずれであっても
よい。When making a hole with an excimer laser, the mask may be applied by any of a mask image method, a contact mask method and a conformal mask method.
【００１２】[0012]
【発明の効果】本発明の回路形成方法は、精度の高いエ
ッチングをレジストに施すことができるため、例えばフ
リップチップ実装用基板のパッド部分のレジストを穴明
けする場合などに応用すれば、きわめて精度の高い回路
を得ることができる。この場合、回路とレジストの位置
ずれが多少起きても、レジストに等間隔でレーザー穴明
けすれば、このような位置ずれは問題なくなる。このた
めフリップチップのはんだバンプの融解に際してそのバ
ンプの広がりをレジストの穴で規定し、それによって多
数のバンプの高さを均一化することができる。このよう
に、精度の高い基板は、実装の信頼性を高めることがで
きる。Since the circuit forming method of the present invention can perform highly accurate etching on a resist, it can be applied with a very high accuracy when applied to, for example, drilling a resist on a pad portion of a flip chip mounting substrate. It is possible to obtain a high circuit. In this case, even if the circuit and the resist are misaligned to some extent, such laser misalignment is not a problem if laser holes are formed in the resist at equal intervals. Therefore, when the solder bumps of the flip chip are melted, the spread of the bumps can be defined by the holes of the resist, whereby the heights of many bumps can be made uniform. Thus, a highly accurate board can improve the reliability of mounting.
【００１３】[0013]
【実施例】ビスフェノールＡとホルムアルデヒドとの重
縮合物のグリシジルエーテル化物（エポキシ当量２０
８）８０重量部、ビスフェノールＡ型エポキシ樹脂（エ
ポキシ当量１８７）２０重量部およびテトラブロモビス
フェノールＡ３０重量部をジメチルイミダゾール０．０
３重量部の存在下で反応させてエポキシ当量３４２、ブ
ロム含有量２３重量％のエポキシ樹脂ａ―１を得た。次
にビスフェノールＡとホルムアルデヒドとを重縮合させ
て硬化物ｂ―１を得た。エポキシ樹脂ａ―１を５６重量
部、ブロム化ビスフェノールＡ型エポキシ樹脂（エポキ
シ当量４７０、ブロム含有量４８重量％）を２０重量
部、硬化剤ｂ―１を２４重量部配合し、これに２―エチ
ル―４―メチルイミダゾール０．０４重量部からなるエ
ポキシ樹脂組成物にメチルエチルケトン／エチレングリ
コールモノメチルエーテル混合溶剤（混合重量比１／
１）を加えて不揮発分６０重量％、ブロム含量２２．５
重量％（固形分対比）のワニスを調整した。EXAMPLE Glycidyl ether compound of polycondensation of bisphenol A and formaldehyde (epoxy equivalent 20
8) 80 parts by weight, 20 parts by weight of a bisphenol A type epoxy resin (epoxy equivalent 187) and 30 parts by weight of tetrabromobisphenol A are added to dimethylimidazole 0.0.
The reaction was carried out in the presence of 3 parts by weight to obtain an epoxy resin a-1 having an epoxy equivalent of 342 and a bromine content of 23% by weight. Next, bisphenol A and formaldehyde were polycondensed to obtain a cured product b-1. 56 parts by weight of epoxy resin a-1, 20 parts by weight of brominated bisphenol A type epoxy resin (epoxy equivalent: 470, brom content: 48% by weight) and 24 parts by weight of curing agent b-1 were mixed, and 2 Epoxy resin composition consisting of 0.04 parts by weight of ethyl-4-methylimidazole and a mixed solvent of methyl ethyl ketone / ethylene glycol monomethyl ether (mixing weight ratio 1 /
1) is added and the nonvolatile content is 60% by weight and the bromine content is 22.5.
A varnish of wt% (relative to solid content) was prepared.
【００１４】芳香族ポリアミド繊維（テクノーラ登録商
標，帝人（株）製，１．５デニール、３mm長）および水
系エポキシ樹脂バインダからなる芳香族ポリアミド繊維
紙（坪量５８ｇ／ｍ2 、厚み０．１６mm）に上述のワニ
スを含浸し１００℃で３分間乾燥しエポキシ樹脂組成物
含有量が６０重量％のプリプレグを得た。なお、プリプ
レグのみで積層した樹脂板の線膨張係数（熱力学分析
機，ＴＭＡで測定）は６．０ｐｐｍ／℃であった。Aromatic polyamide fiber paper (Technola registered trademark, Teijin Ltd., 1.5 denier, 3 mm long) and an aqueous epoxy resin binder (basis weight 58 g / m 2 , thickness 0.16 mm) ) Was impregnated with the above varnish and dried at 100 ° C. for 3 minutes to obtain a prepreg having an epoxy resin composition content of 60% by weight. The linear expansion coefficient (measured by a thermodynamic analyzer, TMA) of the resin plate laminated with only the prepreg was 6.0 ppm / ° C.
【００１５】このプリプレグを５枚と、その両面に厚み
１８μｍの銅箔を積層したのち最高温度１７５℃，圧力
４０ｋｇ／ｃｍ2 で熱プレスして銅張積層板を回路加工
し、パッド部のピッチ２００μｍ、パッド数２００のフ
リップチップ用回路板を形成した。さらにエポキシ系液
状フォトレジストを塗布し、光硬化によりレジストパタ
ーンを形成した。レジストの厚みは２０μｍであった。
この際、パッド部は全面にレジストが覆う構造とした。Five prepregs and a copper foil having a thickness of 18 μm were laminated on both surfaces of the prepreg, and the copper clad laminate was subjected to circuit processing by hot pressing at a maximum temperature of 175 ° C. and a pressure of 40 kg / cm 2 , and the pitch of the pad portion was measured. A circuit board for flip chip having a thickness of 200 μm and a pad number of 200 was formed. Further, an epoxy liquid photoresist was applied, and a resist pattern was formed by photo-curing. The thickness of the resist was 20 μm.
At this time, the pad portion was structured to cover the entire surface with the resist.
【００１６】パッド先端部のレジストをエキシマレーザ
ーで穴明けした。レーザーの波長は２４８ｎｍ、出力は
２００ｍＪ、周波数は２００Ｈｚで、８００ショット、
すなわち４秒間照射した。照射位置におけるレーザー光
は、幅３ｍｍ、長さ１２ｍｍの楕円状であった。マスク
はレンズの上部に配置した。マスクのパターンは、径８
０μｍの穴が２００μｍ間隔で１列に並ぶ構造とした。
パッド部はシリコンチップの４辺に対応して正方形状に
配置しているので、レーザー光による穴明けは基板を載
せたテーブルを動かすことによって１辺ずつ行った。The resist at the tip of the pad was punched with an excimer laser. Laser wavelength is 248 nm, output is 200 mJ, frequency is 200 Hz, 800 shots,
That is, irradiation was performed for 4 seconds. The laser light at the irradiation position was elliptical with a width of 3 mm and a length of 12 mm. The mask was placed on top of the lens. The mask pattern has a diameter of 8
The structure was such that 0 μm holes were arranged in a line at 200 μm intervals.
Since the pad portions are arranged in a square shape corresponding to the four sides of the silicon chip, the holes are made by laser light one by one by moving the table on which the substrate is placed.
【００１７】得られた穴は、径ほぼ８０μｍの円形に近
いもので、きれいな列を作っていた。この穴の列に径６
０μｍのはんだボールを入れ、リフロー炉（最高温度２
４０℃、５秒）で溶融してバンプを形成した。この上に
１辺約１２ｍｍのシリコンチップを搭載した。The holes obtained were close to a circle with a diameter of approximately 80 μm and formed a clean row. Diameter 6 in this row of holes
Reflow furnace (maximum temperature 2
The bumps were formed by melting at 40 ° C. for 5 seconds). A silicon chip with a side of about 12 mm was mounted on this.
Claims (2)
をレーザーでエッチングすることを特徴とするプリント
回路形成方法。1. A method for forming a printed circuit, which comprises coating a circuit conductor with a resist film and then etching the film with a laser.
をレーザーでエッチングすることを特徴とするプリント
回路形成方法。2. A method of forming a printed circuit, which comprises coating a pad portion with a resist film and then etching the film with a laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32666091A JPH05136550A (en) | 1991-11-15 | 1991-11-15 | Method of forming printed circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32666091A JPH05136550A (en) | 1991-11-15 | 1991-11-15 | Method of forming printed circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05136550A true JPH05136550A (en) | 1993-06-01 |
Family
ID=18190248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32666091A Pending JPH05136550A (en) | 1991-11-15 | 1991-11-15 | Method of forming printed circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05136550A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10308576A (en) * | 1997-01-10 | 1998-11-17 | Ibiden Co Ltd | Printed wiring board and its manufacture |
| US8124325B2 (en) * | 2005-04-21 | 2012-02-28 | 3T Technologies Limited | Methods and apparatus for the manufacture of microstructures |
-
1991
- 1991-11-15 JP JP32666091A patent/JPH05136550A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10308576A (en) * | 1997-01-10 | 1998-11-17 | Ibiden Co Ltd | Printed wiring board and its manufacture |
| US6986917B2 (en) | 1997-01-10 | 2006-01-17 | Ibiden Co., Ltd. | Printed wiring board and method of manufacturing the same |
| US7594320B2 (en) | 1997-01-10 | 2009-09-29 | Ibiden Co., Ltd. | Method of manufacturing printed wiring board |
| US7765692B2 (en) | 1997-01-10 | 2010-08-03 | Ibiden Co., Ltd. | Method of manufacturing printed wiring board |
| US8124325B2 (en) * | 2005-04-21 | 2012-02-28 | 3T Technologies Limited | Methods and apparatus for the manufacture of microstructures |
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