JPH05117789A - Base material of substrate for electronic and electrical appliances - Google Patents
Base material of substrate for electronic and electrical appliancesInfo
- Publication number
- JPH05117789A JPH05117789A JP30525091A JP30525091A JPH05117789A JP H05117789 A JPH05117789 A JP H05117789A JP 30525091 A JP30525091 A JP 30525091A JP 30525091 A JP30525091 A JP 30525091A JP H05117789 A JPH05117789 A JP H05117789A
- Authority
- JP
- Japan
- Prior art keywords
- base material
- substrate
- electronic
- electrical appliances
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、高強度とすぐれた熱
伝導性を有し、したがって薄肉化および小型化した状態
での実用に際しても変形することなく、一段とすぐれた
放熱効果を発揮する電子電気機器用基板のベース材に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is an electronic device having high strength and excellent thermal conductivity, and therefore exhibiting a further excellent heat dissipation effect without being deformed even in practical use in a thinned and downsized state. The present invention relates to a base material for electric equipment substrates.
【０００２】[0002]
【従来の技術】従来、一般に、電子電気機器用回路基板
や、高級通信機器および計測機器用回路基板、さらに高
密度ハイブリッドＩＣ用基板などの各種の電子電気機器
用基板として、例えば金属ベース銅張積層板や穴開金属
芯銅張積層板が用いられ、これら銅張積層板が、例えば
無酸素銅からなるベースまたは穴開芯（これらを総称し
て「ベース材」という）に、絶縁樹脂層を介して銅箔を
接合したものからなることも知られている。2. Description of the Related Art Conventionally, as a circuit board for electronic and electrical equipment, a circuit board for high-grade communication equipment and measuring equipment, and a board for high-density hybrid ICs, various electronic and electrical equipment substrates, such as metal-based copper-clad substrates Laminates and perforated metal core copper clad laminates are used. These copper clad laminates are made of, for example, a base or perforated core made of oxygen-free copper (these are collectively referred to as "base material") It is also known that it consists of a copper foil bonded via.
【０００３】[0003]
【発明が解決しようとする課題】一方、近年の各種電子
電気機器の高性能化および高出力化、並びに軽量化およ
び小型化はめざましく、これに伴ない、これらの構造部
材である各種基板のベース材にも薄肉化が強く要求され
ているが、上記の通り無酸素銅からなる従来ベース材に
おいては、常温および高温強度が十分でなく、このため
薄肉化すると、絶縁樹脂層との２００〜４５０℃に０．
５〜１．５時間保持の条件での接着後や、高集積化およ
び高出力化による大量の局部的発熱などで、基板に変形
が発生し易くなることから、薄肉化をはかることができ
ないのが現状である。On the other hand, in recent years, the performance and output of various electronic and electric devices have been remarkably improved, and the weight and size of them have been remarkably reduced, and accordingly, the bases of various substrates, which are these structural members, have been developed. Although the material is also strongly required to be thin, the conventional base material made of oxygen-free copper does not have sufficient room temperature and high temperature strength as described above. 0 ° C.
After adhesion under the condition of holding for 5 to 1.5 hours, or because a large amount of local heat is generated due to high integration and high output, the substrate is likely to be deformed, so that the thickness cannot be reduced. Is the current situation.
【０００４】[0004]
【課題を解決するための手段】そこで、本発明者等は、
上述のような観点から、高強度を有する基板ベース材を
開発すべく、熱伝導性にすぐれたＣｕ合金に着目し研究
を行なった結果、基板のベース材を、重量％（以下％は
重量％を示す）、 Ｃｒ：０．１〜１％、を含有し、さらに必要に応じて、 Ｚｒ：０．００５〜０．２％、 ＳｉおよびＭｇのうちの１種または２種：０．００１〜
０．５％、のいずれか、または両方、を含有し、残りが
Ｃｕと不可避不純物からなる組成を有するＣｕ合金で構
成すると、この結果の基板ベース材は、特にＣｒの作用
で常温および高温強度が向上するようになるので、薄肉
化が可能となり、さらに製品とするために施される切断
加工や穴開加工に際してのバリ発生がきわめて僅かで、
したがってバリ取りの必要なく、支持体への密着取り付
けが可能になるという研究結果を得たのである。Therefore, the present inventors have
From the above viewpoints, in order to develop a substrate base material having high strength, a study was conducted by focusing on a Cu alloy having excellent thermal conductivity. As a result, the base material of the substrate was expressed as% by weight (hereinafter,% means% by weight). ), Cr: 0.1 to 1%, and, if necessary, Zr: 0.005 to 0.2%, one or two of Si and Mg: 0.001 to
When it is made of a Cu alloy containing 0.5%, either or both of them, and the balance of Cu and unavoidable impurities, the resulting substrate base material has a room temperature and high temperature strength due to the action of Cr. Since it is possible to reduce the thickness, it is possible to reduce the wall thickness, and the burrs generated during the cutting process and the drilling process for producing the product are extremely small.
Therefore, we obtained the research results that it is possible to attach the support to the support closely without deburring.
【０００５】この発明は、上記の研究結果にもとづいて
なされたものであって、 Ｃｒ：０．１〜１％、を含有し、さらに必要に応じて、 （ａ） Ｚｒ：０．００５〜０．２％、 （ｂ） ＳｉおよびＭｇのうちの１種または２種：０．
００１〜０．５％、以上（ａ）および（ｂ）のうちのい
ずれか、または両方を含有し、残りがＣｕと不可避不純
物からなる組成を有するＣｕ合金で構成してなる電子電
気機器用基板ベース材に特徴を有するものである。The present invention was made based on the above research results, and contains Cr: 0.1 to 1%, and, if necessary, (a) Zr: 0.005 to 0. 0.2%, (b) one or two of Si and Mg: 0.
001-0.5%, containing either or both of (a) and (b) or both, and the rest being composed of a Cu alloy having a composition of Cu and inevitable impurities It is characterized by the base material.
【０００６】つぎに、この発明の基板ベース材におい
て、これを構成するＣｕ合金の成分組成を上記の通りに
限定した理由を説明する。 （ａ） Ｃｒ Ｃｒ成分には、高い熱伝導性を保持した上で、常温およ
び高温強度を向上させると共に、ハリ発生を抑制する作
用があるが、その含有量が０．１％未満では前記作用に
所望の効果が得られず、一方その含有量が１％を越える
と、熱伝導性の低下が著しくなり、導電率（％ＩＡＣ
Ｓ）で８０％以下となってしまうことから、その含有量
を０．１〜１％と定めた。Next, the reason why the component composition of the Cu alloy constituting the substrate base material of the present invention is limited as described above will be explained. (A) Cr The Cr component has an effect of improving the normal temperature and high temperature strength and suppressing the occurrence of strain while maintaining high thermal conductivity, but if the content is less than 0.1%, the above-mentioned effect is obtained. However, if the content exceeds 1%, the decrease in thermal conductivity becomes remarkable, and the conductivity (% IAC
Since S) will be 80% or less, the content thereof is set to 0.1 to 1%.
【０００７】（ｂ） Ｚｒ Ｚｒ成分には、Ｃｒ成分との共存において、Ｃｒ成分に
よってもたらされる上記作用、すなわち常温および高温
強度、並びにバリ発生抑制作用を一段と向上させる作用
があるので、必要に応じて含有されるが、その含有量が
０．００５％未満では前記作用に所望の向上効果が得ら
れず、一方その含有量が、０．２％を越えても前記作用
により一段の向上効果は現われないことから、その含有
量を０．００５〜０．２％と定めた。(B) Zr The Zr component, in the coexistence with the Cr component, has the above-mentioned action brought about by the Cr component, that is, the action to further improve the room temperature and high temperature strength, and the burr generation inhibiting action, so that it is necessary. However, if the content is less than 0.005%, the desired improvement effect on the above-mentioned action cannot be obtained. On the other hand, if the content exceeds 0.2%, the above-mentioned action does not further improve the effect. Since it does not appear, its content was set to 0.005 to 0.2%.
【０００８】（ｃ） ＳｉおよびＭｇ これらの成分は、酸素との親和力が強く、強力な脱酸作
用を発揮し、もって靱性を向上させる作用をもつので、
必要に応じて含有されるが、その含有量が０．００１％
未満では前記作用に所望の効果が得られず、一方その含
有量が０．５％を越えると導電率が急激に低下するよう
になることから、その含有量を０．００１〜０．５％と
定めた。(C) Si and Mg These components have a strong affinity with oxygen, exert a strong deoxidizing action, and have the action of improving toughness,
It is contained if necessary, but its content is 0.001%
If the content is less than 0.001 to 0.5%, the desired effect cannot be obtained, and if the content exceeds 0.5%, the conductivity is rapidly reduced. I decided.
【０００９】[0009]
【実施例】つぎに、この発明の基板ベース材を実施例に
より具体的に説明する。通常の低周波溝型誘導炉を用
い、木炭粉で被覆した状態で、それぞれ第１表に示され
る組成をもったＣｕ合金溶湯を調整し、半連続鋳造法に
て厚：１５０mm×幅：４００mm×長さ：１５００mmの寸
法をもった鋳塊とし、これに通常の条件で熱間圧延を施
して厚さ：１１mmの熱延板とし、ついで両面面削後、冷
間圧延にて厚さ：３mmの冷延板とすることにより本発明
基板ベース材１〜１２、および無酸素銅からなる従来基
板ベース材をそれぞれ製造した。EXAMPLES Next, the substrate base material of the present invention will be specifically described by way of examples. Using a normal low-frequency groove-type induction furnace, the Cu alloy molten metal having the composition shown in Table 1 was prepared in a state of being covered with charcoal powder, and the semi-continuous casting method had a thickness of 150 mm and a width of 400 mm. × Length: An ingot having a size of 1500 mm, which is hot-rolled under normal conditions to a hot-rolled sheet having a thickness of 11 mm. By making a cold-rolled sheet of 3 mm, the substrate base materials 1 to 12 of the present invention and the conventional substrate base material made of oxygen-free copper were manufactured.
【００１０】[0010]
【表１】 [Table 1]
【００１１】ついで、この結果得られた各種の基板ベー
ス材について、常温および絶縁樹脂層との接合に際して
とられる最高接着温度である４５０℃での引張強さを測
定して常温および高温強度を評価し、また熱伝導性を評
価するために導電率を測定し、さらにバリ発生状況を観
察するために、プレス打抜き加工により直径：１０mmの
穴開加工を行ない、穴周辺に発生したバリの最高バリ高
さを隙間ゲージを用いて測定した。これらの測定結果を
表１に示した。Then, with respect to the various substrate base materials obtained as a result, the tensile strength at room temperature and 450 ° C. which is the maximum bonding temperature taken at the time of joining with the insulating resin layer was measured to evaluate the room temperature and high temperature strength. In addition, in order to evaluate the thermal conductivity and to measure the electrical conductivity, and in order to observe the burr generation status, a punching process was performed to punch a hole with a diameter of 10 mm. The height was measured using a gap gauge. The results of these measurements are shown in Table 1.
【００１２】[0012]
【発明の効果】表１に示される結果から、本発明基板ベ
ース材１〜１２は、いずれもすぐれた熱伝導性を保持し
た状態で、従来基板ベース材に比して一段と高い常温お
よび高温強度を有し、かつバリ発生も著しく小さいこと
が明らかである。From the results shown in Table 1, all of the substrate base materials 1 to 12 of the present invention have a higher room temperature and high temperature strength as compared with the conventional substrate base materials while maintaining excellent thermal conductivity. And it is clear that the occurrence of burrs is extremely small.
【００１３】上述のように、この発明の基板ベース材
は、すぐれた熱伝導性を保持した状態で、高強度を有す
るので、基板ベース材自体の薄肉化が可能となり、軽量
化および小型化に大いに寄与するものであり、さらに切
断加工や穴開加工でのバリ発生がきわめて少ないので、
加工ままの状態で支持体への密着取り付けが可能となる
など工業上有用な特性を有するのである。As described above, since the substrate base material of the present invention has high strength while maintaining excellent thermal conductivity, it is possible to reduce the thickness of the substrate base material itself, and to reduce the weight and size. It greatly contributes, and since burr generation during cutting and drilling is extremely small,
It has industrially useful properties such that it can be closely attached to a support in the as-processed state.
Claims (4)
純物からなる組成を有するＣｕ合金で構成したことを特
徴とする電子電気機器用基板のベース材。1. A base for a substrate for electronic and electrical equipment, comprising a Cu alloy containing Cr: 0.1 to 1% by weight and the balance of Cu and inevitable impurities. Material.
％、を含有し、残りがＣｕと不可避不純物からなる組成
を有するＣｕ合金で構成したことを特徴とする電子電気
機器用基板のベース材。2. By weight%, Cr: 0.1-1%, Zr: 0.005-0.2
%, And the rest is made of a Cu alloy having a composition of Cu and inevitable impurities.
ｇのうちの１種または２種：０．００１〜０．５％、を
含有し、残りがＣｕと不可避不純物からなる組成を有す
るＣｕ合金で構成したことを特徴とする電子電気機器用
基板のベース材。3. By weight percent, Cr: 0.1-1%, further comprising Si and M
1 or 2 kinds of g: 0.001 to 0.5%, and the rest is composed of a Cu alloy having a composition of Cu and unavoidable impurities. Base material.
０５〜０．２％、を含有し、さらに、ＳｉおよびＭｇの
うちの１種または２種：０．００１〜０．５％、を含有
し、残りがＣｕと不可避不純物からなる組成を有するＣ
ｕ合金で構成したことを特徴とする電子電気機器用基板
のベース材。4. Cr: 0.1 to 1%, Zr: 0.0
C containing 0.5 to 0.2%, further containing one or two of Si and Mg: 0.001 to 0.5%, and the balance Cu and unavoidable impurities.
A base material for a substrate for electronic and electrical equipment, which is composed of a u alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30525091A JPH05117789A (en) | 1991-10-24 | 1991-10-24 | Base material of substrate for electronic and electrical appliances |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30525091A JPH05117789A (en) | 1991-10-24 | 1991-10-24 | Base material of substrate for electronic and electrical appliances |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05117789A true JPH05117789A (en) | 1993-05-14 |
Family
ID=17942842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30525091A Pending JPH05117789A (en) | 1991-10-24 | 1991-10-24 | Base material of substrate for electronic and electrical appliances |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05117789A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006005095A1 (en) * | 2004-07-15 | 2006-01-19 | Plansee Se | Material for conductor tracks made of copper alloy |
| WO2006112063A1 (en) | 2005-04-15 | 2006-10-26 | Jfe Precision Corporation | Alloy material for dissipating heat from semiconductor device and method for production thereof |
| US7416620B2 (en) | 1996-08-29 | 2008-08-26 | Luvata Oy | Copper alloy and method for its manufacture |
| JPWO2013153771A1 (en) * | 2012-04-13 | 2015-12-17 | 日本発條株式会社 | Copper base circuit board |
| CN115491542A (en) * | 2022-09-28 | 2022-12-20 | 中色奥博特铜铝业有限公司 | Etching type temperature-uniforming plate copper-chromium-zirconium alloy strip and processing method and application thereof |
-
1991
- 1991-10-24 JP JP30525091A patent/JPH05117789A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7416620B2 (en) | 1996-08-29 | 2008-08-26 | Luvata Oy | Copper alloy and method for its manufacture |
| WO2006005095A1 (en) * | 2004-07-15 | 2006-01-19 | Plansee Se | Material for conductor tracks made of copper alloy |
| WO2006112063A1 (en) | 2005-04-15 | 2006-10-26 | Jfe Precision Corporation | Alloy material for dissipating heat from semiconductor device and method for production thereof |
| JPWO2013153771A1 (en) * | 2012-04-13 | 2015-12-17 | 日本発條株式会社 | Copper base circuit board |
| CN115491542A (en) * | 2022-09-28 | 2022-12-20 | 中色奥博特铜铝业有限公司 | Etching type temperature-uniforming plate copper-chromium-zirconium alloy strip and processing method and application thereof |
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