JPH05114788A - Manufacture of multilayer printed wiring board - Google Patents
Manufacture of multilayer printed wiring boardInfo
- Publication number
- JPH05114788A JPH05114788A JP27440291A JP27440291A JPH05114788A JP H05114788 A JPH05114788 A JP H05114788A JP 27440291 A JP27440291 A JP 27440291A JP 27440291 A JP27440291 A JP 27440291A JP H05114788 A JPH05114788 A JP H05114788A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- holes
- surface layer
- layer base
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、多層プリント配線板の
製造方法に係わり、特に中空の盲スルーホールに関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer printed wiring board, and more particularly to a hollow blind through hole.
【０００２】現在のプリント配線板は、微小ビアホー
ル，ＩＶＨ（内層間接続スルーホール) 技術の導入によ
り高密度化が進んでいる。また、貫通スルーホールを有
するバックボードプリント配線板にプレスフィットピン
を挿着してコネクタを形成することも実施されている。The density of the present printed wiring boards has been increased by the introduction of micro via holes and IVH (inner interlayer connection through holes) technology. Further, it has been practiced to insert a press-fit pin into a backboard printed wiring board having a through hole to form a connector.
【０００３】さらにまた、実装密度を上げるために、バ
ックボードプリント配線板を多層化し、両側からプレス
フィットピンを挿着できるように、バックボードプリン
ト配線板の両側に中空の盲スルーホールを形成すること
が実施されている。Furthermore, in order to increase the mounting density, the backboard printed wiring board is multi-layered and hollow blind through holes are formed on both sides of the backboard printed wiring board so that press-fit pins can be inserted from both sides. Is being implemented.
【０００４】上述のように中空の盲スルーホールを有す
る多層プリント配線板は、貫通スルーホール数を必要最
低限に少なくしたもので、配線板を貫通する孔が少ない
ので、それぞれの基材の面に高密度にパターンを形成す
ることができるという利点がある。As described above, the multilayer printed wiring board having hollow blind through-holes has the minimum number of through-holes, and since the number of holes penetrating the wiring board is small, the surface of each substrate is reduced. Moreover, there is an advantage that a pattern can be formed with high density.
【０００５】[0005]
【従来の技術】図４は従来方法による多層プリント配線
板の断面図、図５は他の従来方法による多層プリント配
線板の断面図である。2. Description of the Related Art FIG. 4 is a sectional view of a multilayer printed wiring board according to a conventional method, and FIG. 5 is a sectional view of a multilayer printed wiring board according to another conventional method.
【０００６】図４に示す多層プリント配線板は、表面層
基材11，プリプレグ21，ＩＶＨ６を有する内層基材13，
他のプリプレグ22及び他方の表面層基材12をこの順に重
畳し、加熱圧着した後に、表面層基材11に片面盲スルー
ホール用の下孔を、他の表面層基材12に盲スルーホール
用の下孔をそれぞれ穿孔し、さらに多層プリント配線板
を貫通する貫通スルーホール用の下孔を穿孔した後に、
めっきすることで、下孔の内壁にランドに繋がる導体層
を形成して、中空の盲スルーホール31b,32b 及び貫通ス
ルーホール５を設けたものである。The multilayer printed wiring board shown in FIG. 4 has a surface layer base material 11, a prepreg 21, an inner layer base material 13 having IVH6,
Another prepreg 22 and the other surface layer base material 12 are superposed in this order, and after thermocompression bonding, a prepared hole for a single-sided blind through hole is formed in the surface layer base material 11 and a blind through hole in the other surface layer base material 12. After drilling the pilot holes for each, and after drilling the pilot holes for through-holes that penetrate the multilayer printed wiring board,
By plating, a conductor layer connected to the land is formed on the inner wall of the pilot hole, and hollow blind through holes 31b, 32b and through through hole 5 are provided.
【０００７】これらの中空の盲スルーホール31b,32b
は、コネクタのプレスフィットピンを挿着するためのも
ので、その内径は例えば0.9mm である。また貫通スルー
ホール５は、表面層基材11のパターンと他の表面層基材
12のパターン、表面層基材11のパターンと内層基材13の
パターン及び表面層基材12のパターンを接続するスルー
ホールである。These hollow blind through holes 31b, 32b
Is for inserting the press-fit pin of the connector, and its inner diameter is, for example, 0.9 mm. Further, the through through holes 5 are formed on the surface layer base material 11 and other surface layer base materials.
The through-holes connect the 12 patterns, the surface layer base material 11 pattern, the inner layer base material 13 pattern, and the surface layer base material 12 pattern.
【０００８】図５に示す多層プリント配線板は、表面層
基材11及び表面層基材12にそれぞれ単体の状態で、下孔
を穿孔した後にめっきして、表面層基材11にスルーホー
ル31を、表面層基材12にスルーホール32をそれぞれ設
け、その後表面層基材11，プリプレグ21，内層基材13，
他のプリプレグ22，他方の表面層基材12を、この順に重
畳し、加熱圧着してスルーホール31,32 の位置にそれぞ
れ中空の盲スルーホール31a,32a を設けたものである。In the multilayer printed wiring board shown in FIG. 5, the surface layer base material 11 and the surface layer base material 12 are individually placed in a single state, and then a pilot hole is punched and then plated to form a through hole 31 in the surface layer base material 11. Through holes 32 are provided in the surface layer base material 12, and then the surface layer base material 11, the prepreg 21, the inner layer base material 13,
The other prepreg 22 and the other surface layer base material 12 are superposed in this order, and thermocompression bonded to provide hollow blind through holes 31a and 32a at the positions of the through holes 31 and 32, respectively.
【０００９】なお、図５においては各基材の表面に形成
した導体パターン間を接続する貫通スルーホールは図示
省略している。In FIG. 5, through-holes for connecting the conductor patterns formed on the surface of each base material are not shown.
【００１０】[0010]
【発明が解決しようとする課題】ところで前者（図４に
示した方法によるもの) 、即ち基材とプリプレグを積層
後に盲スルーホールの下孔を穿孔し、その後めっきし
て、下孔の内壁に導体層を形成する方法は、下孔の底部
が塞がっているために下孔の奥までめっき液が十分に行
き届かない。このために孔の内壁に均一な導体層が形成
されなくなり、多層プリント配線板に実装する搭載部品
の電気的接続ピンと、上記盲スルーホールとの接触の信
頼度が劣るという問題点があった。By the way, the former (by the method shown in FIG. 4), that is, after the base material and the prepreg are laminated, the blind through hole is punched and then plated to form the inner wall of the pilot hole. In the method of forming the conductor layer, since the bottom of the pilot hole is closed, the plating solution does not reach the back of the pilot hole sufficiently. Therefore, a uniform conductor layer is not formed on the inner wall of the hole, and there is a problem in that the reliability of contact between the electrical connection pin of the mounted component mounted on the multilayer printed wiring board and the blind through hole is poor.
【００１１】一方、後者（図５に示した方法によるも
の) 、即ち表面層基材に予めスルーホールを形成した後
に、基材とプリプレグを積層し、加熱圧着して多層プリ
ント配線板とする方法は、プリプレグの樹脂が溶けて上
記スルーホールの中に侵入し、スルーホールの深さを小
さくする恐れがある。或いは上記スルーホールの内壁に
プリプレグが付着する恐れがある。On the other hand, the latter (by the method shown in FIG. 5), that is, a method of forming through holes in the surface layer base material in advance, then laminating the base material and prepreg, and thermocompression bonding to obtain a multilayer printed wiring board. May melt the resin of the prepreg and penetrate into the through hole to reduce the depth of the through hole. Alternatively, the prepreg may adhere to the inner wall of the through hole.
【００１２】プリプレグが上記スルーホールの深さを小
さくするにせよ、スルーホールの内壁付着するにせよ、
いずれも搭載部品の電気的接続ピンと、上記スルーホー
ルとの接触の信頼度が劣るという問題点があった。Whether the prepreg reduces the depth of the through hole or adheres to the inner wall of the through hole,
Each of them has a problem that the reliability of contact between the electrical connection pin of the mounted component and the through hole is poor.
【００１３】本発明はこのような点に鑑みて創作された
もので、搭載部品の電気的接続ピンと盲スルーホールの
接触の信頼度が高い多層プリント配線板の製造方法を提
供することを目的としている。The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method for manufacturing a multilayer printed wiring board having high reliability of contact between an electrical connection pin of a mounted component and a blind through hole. There is.
【００１４】[0014]
【課題を解決するための手段】上記の目的を達成するた
めに本発明は、図１に例示したように、２枚の表面層基
材11,12 の少なくとも何れか一方に、予め孔の内壁に導
体層を形成したスルーホール31,32 を設ける。一方、そ
れぞれの表面層基材11,12 の裏面に密着させるプリプレ
グ21,22 に、それぞれのスルーホールに対応した位置に
孔41, 42を穿孔する。In order to achieve the above-mentioned object, the present invention is, as illustrated in FIG. 1, provided on at least one of the two surface layer base materials 11 and 12 in advance with the inner wall of the hole. Through holes 31 and 32 having a conductor layer formed therein are provided. On the other hand, holes 41 and 42 are formed in the prepregs 21 and 22 that are brought into close contact with the back surfaces of the surface layer base materials 11 and 12 at positions corresponding to the through holes.
【００１５】そして、表面層基材11, プリプレグ21, 内
層基材13, 他のプリプレグ22, 他方の表面層基材12をこ
の順に重畳し、加熱圧着して、中空の盲スルーホール31
a ,32aを有する多層プリント配線板を製造するものとす
る。Then, the surface layer base material 11, the prepreg 21, the inner layer base material 13, the other prepreg 22, and the other surface layer base material 12 are superposed in this order and heat-pressed to form a hollow blind through hole 31.
A multilayer printed wiring board having a and 32a shall be manufactured.
【００１６】或いは、図２に例示したように、２枚の表
面層基材11,12 の少なくとも何れか一方に、予め孔の内
壁に導体層を形成したスルーホール31,32 を設ける。ま
た、それぞれの表面層基材11,12 の裏面に密着させるプ
リプレグ21,22 に、近接したスルーホールに連通する大
形孔51,52 を穿孔する。そして、表面層基材11, プリプ
レグ21, 内層基材13, 他のプリプレグプリプレグ22, 他
方の表面層基材12をこの順に重畳し、加熱圧着して、中
空の盲スルーホール31a,32a を有する多層プリント配線
板を製造するものとする。Alternatively, as illustrated in FIG. 2, through holes 31 and 32 having conductor layers previously formed on the inner walls of the holes are provided in at least one of the two surface layer base materials 11 and 12. Further, large holes 51, 52 communicating with the adjacent through holes are drilled in the prepregs 21, 22 which are brought into close contact with the back surfaces of the respective surface layer base materials 11, 12. Then, the surface layer base material 11, the prepreg 21, the inner layer base material 13, the other prepreg prepreg 22, and the other surface layer base material 12 are superposed in this order, and thermocompression bonded to have hollow blind through holes 31a, 32a. A multilayer printed wiring board shall be manufactured.
【００１７】或いはまた、図３に例示したように、２枚
の表面層基材11,12 の少なくとも何れか一方に、予め孔
の内壁に導体層を形成したスルーホール31,32 を設け、
スルーホール31,32 と同位置に孔を穿孔した複数のプリ
プレグを所望数重畳して表面層基材11,12 間に挿入し、
加熱圧着して、表面層基材11,12 のそれぞれに中空の盲
スルーホール31a,32a を設けるものとする。Alternatively, as illustrated in FIG. 3, through holes 31 and 32 having conductor layers previously formed on the inner walls of the holes are provided on at least one of the two surface layer base materials 11 and 12.
A desired number of prepregs having holes formed at the same positions as the through holes 31, 32 are superposed and inserted between the surface layer base materials 11, 12.
It is assumed that hollow blind through holes 31a and 32a are provided in the surface layer base materials 11 and 12 by thermocompression bonding.
【００１８】[0018]
【作用】本発明方法は、盲スルーホールに対応する位置
に孔を穿孔したプリプレグと、予めスルーホールを設け
た表面層基材とを重畳し、その後加熱圧着して多層プリ
ント配線板を製造している。According to the method of the present invention, a prepreg having a hole formed at a position corresponding to a blind through hole and a surface layer base material having a through hole provided in advance are superposed on each other and then heat-pressed to produce a multilayer printed wiring board. ing.
【００１９】このように表面層基材の単体の状態で貫通
孔の内壁に銅等をめっきして導体層を形成したものであ
るから、盲スルーホールの導体層は均一で且つ十分な厚
さにすることができる。Since the conductor layer is formed by plating the inner wall of the through hole with copper or the like in the single state of the surface layer base material, the conductor layer of the blind through hole has a uniform and sufficient thickness. Can be
【００２０】また、プリプレグには盲スルーホールに対
応して孔を穿孔してあるので、加熱圧着した時に溶けた
プリプレグがスルーホールの中に侵入するのが防止され
る。また、溶けたプリプレグがスルーホールの内壁に付
着することが防止される。Further, since the prepreg is provided with holes corresponding to the blind through holes, it is possible to prevent the prepreg melted at the time of heat-pressing from entering the through holes. Further, the melted prepreg is prevented from adhering to the inner wall of the through hole.
【００２１】したがって、多層プリント配線板に実装す
る搭載部品の電気的接続ピンと、盲スルーホールとの接
触の信頼度が高い。一方、図３に例示した発明によれ
ば、複数のプリプレグが多層になっているので、表裏の
表面層基材間の間隔が大きく、加熱圧着したときに、溶
けたプリプレグのスルーホール内への侵入防止の効果が
大きい。Therefore, the reliability of the contact between the electrical connection pin of the mounting component mounted on the multilayer printed wiring board and the blind through hole is high. On the other hand, according to the invention illustrated in FIG. 3, since the plurality of prepregs are multi-layered, the distance between the front and back surface layer base materials is large, and when heated and pressure-bonded, the melted prepregs are inserted into the through holes. The effect of preventing intrusion is great.
【００２２】[0022]
【実施例】以下図を参照しながら、本発明を具体的に説
明する。なお、全図を通じて同一符号は同一対象物を示
す。The present invention will be described in detail with reference to the drawings. The same reference numerals denote the same objects throughout the drawings.
【００２３】図１は本発明の実施例の図で(A) は積層前
の斜視図、(B) は積層後の断面図、図２は本発明の他の
実施例の積層前の斜視図、図３は本発明のさらに他の実
施例の図で、(A) は積層前の斜視図、(B)は積層後の断
面図である。FIG. 1 is a diagram of an embodiment of the present invention, (A) is a perspective view before lamination, (B) is a sectional view after lamination, and FIG. 2 is a perspective view before lamination of another embodiment of the present invention. FIG. 3 is a view of still another embodiment of the present invention, (A) is a perspective view before lamination, and (B) is a sectional view after lamination.
【００２４】図１において、表面層基材11は単体の状態
で、下孔を穿孔した後にめっきして、所望の位置にスル
ーホール31を配設したものであり、他方の表面層基材12
もまた同様に、単体の状態で下孔を穿孔した後にめっき
して、所望の位置にスルーホール32を配設したものであ
る。In FIG. 1, the surface layer base material 11 is in the state of a single body, and a through hole is plated after forming a through hole 31 and a through hole 31 is arranged at a desired position.
Similarly, in the same manner, the through hole 32 is provided at a desired position by forming a pilot hole in a single state and then plating.
【００２５】表面層基材11の裏面側に密着させるプリプ
レグ21は、スルーホール31に対向する個所にスルーホー
ル31の孔径に等しいか或いはそれより大きい内径の孔41
を穿孔してある。The prepreg 21, which is brought into close contact with the back surface side of the surface layer base material 11, has a hole 41 having an inner diameter equal to or larger than the hole diameter of the through hole 31 at a portion facing the through hole 31.
Is perforated.
【００２６】また、表面層基材12の裏面側に密着させる
プリプレグ22は、スルーホール32に対向する個所にスル
ーホール32の孔径に等しいか或いはそれより大きい内径
の孔42を穿孔してある。Further, the prepreg 22 adhered to the back surface side of the surface layer base material 12 has a hole 42 having an inner diameter equal to or larger than the hole diameter of the through hole 32 at a position facing the through hole 32.
【００２７】13は、表裏の両面に形成したパターンを接
続するビア６を有する内層基材である。そして、表面層
基材11，プリプレグ21，内層基材13，他のプリプレグ2
2、及び他方の表面層基材12をこの順に重畳し加熱圧着
して多層プリント配線板としている。Reference numeral 13 is an inner layer base material having vias 6 for connecting patterns formed on both front and back surfaces. Then, the surface layer base material 11, the prepreg 21, the inner layer base material 13, and the other prepreg 2
The second surface layer base material 12 and the other surface layer base material 12 are superposed in this order and thermocompression bonded to form a multilayer printed wiring board.
【００２８】上述のように、表面層基材11,12 の単体の
状態で貫通孔の内壁に銅等をめっきして導体層を形成し
たものであるから、中空の盲スルーホール31a,32a の導
体層は均一で且つ十分に厚い。As described above, since the conductor layers are formed by plating the inner walls of the through holes with copper or the like in the single state of the surface layer base materials 11 and 12, the hollow blind through holes 31a and 32a are formed. The conductor layer is uniform and sufficiently thick.
【００２９】またプリプレグ21,22 には対応するスルー
ホール31,32 に対応して孔を穿孔してあるので、加熱圧
着した時に、スルーホールの奥底に溶けたプリプレグが
侵入したり、或いはスルーホールの内壁に溶けたプリプ
レグが付着することがない。Since the prepregs 21 and 22 are provided with holes corresponding to the corresponding through holes 31 and 32, when the prepreg is heated and pressure-bonded, the melted prepreg penetrates into the bottom of the through holes or the through holes are penetrated. The melted prepreg does not adhere to the inner wall of the.
【００３０】即ち、中空の盲スルーホール31a,32a に搭
載部品のプレスフィットピン等を圧入した場合に、ピン
と盲スルーホール31a,32a との接触の信頼度が高い。な
お、各基材の表面に形成した導体パターン間を接続する
貫通スルーホールは図示省略している。That is, when the press-fit pin or the like of the mounted component is press-fitted into the hollow blind through holes 31a, 32a, the reliability of contact between the pin and the blind through holes 31a, 32a is high. It should be noted that the through-holes for connecting the conductor patterns formed on the surface of each base material are omitted in the drawing.
【００３１】図２において、表面層基材11の裏面に密着
させるプリプレグ21には、近接したスルーホール31を連
通する長円状或いは鍵形の大形孔51を設けている。ま
た、表面層基材12の裏面に密着させるプリプレグ22に
は、近接したスルーホール32を連通する長円状或いは鍵
形の大形孔52を設けている。In FIG. 2, the prepreg 21 closely attached to the back surface of the surface layer base material 11 is provided with an oval-shaped or key-shaped large hole 51 that connects adjacent through holes 31 to each other. In addition, the prepreg 22 that is brought into close contact with the back surface of the surface layer base material 12 is provided with an oval-shaped or key-shaped large hole 52 that connects adjacent through holes 32 to each other.
【００３２】上述のように大形孔をプリプレグに穿孔す
ることで、加熱圧着した時にスルーホールの奥底に溶け
たプリプレグが侵入したり、或いはスルーホールの内壁
に溶けたプリプレグが付着することが殆どなくなる。By forming a large hole in the prepreg as described above, it is almost the case that the melted prepreg intrudes into the bottom of the through hole or the melted prepreg adheres to the inner wall of the through hole when thermocompression bonding is performed. Disappear.
【００３３】図３において、表面層基材11は単体の状態
で、下孔を穿孔した後にめっきして、所望の位置にスル
ーホール31を配設したものであり、他方の表面層基材12
もまた同様に、単体の状態で下孔を穿孔した後にめっき
して、所望の位置にスルーホール32を配設したものであ
る。In FIG. 3, the surface layer base material 11 is a single body, and a through hole 31 is plated after forming a pilot hole and a through hole 31 is arranged at a desired position.
Similarly, in the same manner, the through hole 32 is provided at a desired position by forming a pilot hole in a single state and then plating.
【００３４】表面層基材11,12 に密着させるプリプレグ
21-1,21-2 は、スルーホール31,32に対向する個所にス
ルーホール31又は32の孔径に等しいか或いはそれより大
きい内径の孔41又は42を穿孔してある。Prepreg adhered to the surface layer base materials 11 and 12
21-1 and 21-2 have holes 41 or 42 having an inner diameter equal to or larger than the hole diameter of the through hole 31 or 32 at a position facing the through hole 31, 32.
【００３５】そして、表面層基材11，プリプレグ21-1,2
1-2 , 及び他方の表面層基材12をこの順に重畳し加熱圧
着して多層プリント配線板としている。上述のように、
プリプレグが２重となっているので、表裏の表面層基材
11,12間の間隔が大きいので、加熱圧着時に溶けたプリ
プレグがスルーホールの中に侵入したり、或いはスルー
ホールの内壁に付着することがない。Then, the surface layer base material 11 and the prepregs 21-1, 2
1-2 and the other surface layer base material 12 are superposed in this order and thermocompression bonded to form a multilayer printed wiring board. As mentioned above,
Since the prepreg is doubled, front and back surface layer base materials
Since the distance between 11 and 12 is large, the melted prepreg does not penetrate into the through hole or adhere to the inner wall of the through hole during thermocompression bonding.
【００３６】したがって、多層プリント配線板の層構成
等の条件により、複数のプリプレグを重畳することは有
効な手段となる。また、双方の表面層基材に設けたスル
ーホール31,32 の軸心が一致した場合においても、搭載
部品のピンの先端が相手方のピンに接触することがな
い。Therefore, it is an effective means to overlap a plurality of prepregs depending on the conditions such as the layer structure of the multilayer printed wiring board. Further, even when the through holes 31 and 32 provided in both surface layer base materials have the same axis center, the tips of the pins of the mounted component do not come into contact with the counterpart pins.
【００３７】[0037]
【発明の効果】以上説明したように本発明は、中空の盲
スルーホールに対応する位置に孔を穿孔したプリプレグ
と、予めスルーホールを設けた表面層基材とを重畳し、
その後加熱圧着して多層プリント配線板を製造するよう
にしたことにより、導体層が均一で且つ十分な厚さの中
空の盲スルーホールが得られ、且つ加熱圧着した時にス
ルーホールの中に溶けたプリプレグが侵入したり、或い
はスルーホールの内壁に溶けたプリプレグが付着するこ
とがない。As described above, according to the present invention, a prepreg having a hole formed at a position corresponding to a hollow blind through hole and a surface layer base material having a through hole are superposed on each other.
After that, by performing thermocompression bonding to produce a multilayer printed wiring board, a hollow blind through hole having a uniform and sufficient conductor layer was obtained and melted into the through hole when thermocompression bonding was performed. The prepreg does not enter, or the melted prepreg does not adhere to the inner wall of the through hole.
【００３８】したがって、多層プリント配線板に実装す
る搭載部品の電気的接続ピンと、中空の盲スルーホール
との接続の、信頼度が高いという実用上で優れた効果を
有する。Therefore, the connection between the electrical connection pin of the mounting component to be mounted on the multilayer printed wiring board and the hollow blind through hole has a practically excellent effect of high reliability.
【００３９】また、貫通スルーホール数を必要最低限に
少なくし、中空の盲スルーホールを設けたものであるか
ら、それぞれの基材の面に高密度にパターンを形成する
ことができ、また高密度に部品を実装し得るという効果
がある。Further, since the number of through-holes is reduced to the necessary minimum and the hollow blind through-holes are provided, it is possible to form a high-density pattern on the surface of each base material, and There is an effect that components can be mounted at a high density.
【図１】 本発明の実施例の図で、(A) は積層前の斜視
図 (B) は積層後の断面図FIG. 1 is a diagram of an embodiment of the present invention, in which (A) is a perspective view before stacking and (B) is a cross-sectional view after stacking.
【図２】 本発明の他の実施例の積層前の斜視図FIG. 2 is a perspective view of another embodiment of the present invention before stacking.
【図３】 本発明のさらに他の実施例の図で、(A) は積
層前の斜視図 (B) は積層後の断面図FIG. 3 is a view of yet another embodiment of the present invention, in which (A) is a perspective view before stacking and (B) is a cross-sectional view after stacking.
【図４】 従来方法による多層プリント配線板の断面図FIG. 4 is a sectional view of a multilayer printed wiring board according to a conventional method.
【図５】 他の従来方法による多層プリント配線板の断
面図FIG. 5 is a cross-sectional view of a multilayer printed wiring board according to another conventional method.
５ 貫通スルーホール、 ６ ＩＶ
Ｈ、11,12 表面層基材、 13 内
層基材、21,21-1,21-2,22 プリプレグ、 3
1,32 スルーホール、41,42 孔、
51,52 大形孔、31a,32a,31b,32b 盲ス
ルーホール5 through-holes, 6 IV
H, 11,12 surface layer base material, 13 inner layer base material, 21,21-1,21-2,22 prepreg, 3
1,32 through holes, 41,42 holes,
51,52 Large hole, 31a, 32a, 31b, 32b Blind through hole
───────────────────────────────────────────────────── フロントページの続き (72)発明者 萩原 真理 神奈川県川崎市中原区上小田中1015番地 富士通株式会社内 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Mari Hagiwara 1015 Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Fujitsu Limited
Claims (3)
何れか一方に、予め孔の内壁に導体層を形成したスルー
ホール(31,32) を設け、 それぞれの該表面層基材(11,12) の裏面に密着させるプ
リプレグ(21,22) に、それぞれの該スルーホールに対応
した位置に孔(41,42) を穿孔した後に、 該表面層基材(11), 該プリプレグ(21), 内層基材(13),
他の該プリプレグ(22), 他方の該表面層基材(12)をこの
順に重畳し、加熱圧着して、中空の盲スルーホール(31
a,32a) を設けることを特徴とする多層プリント配線板
の製造方法。1. A through hole (31, 32) having a conductor layer formed in advance on the inner wall of the hole is provided on at least one of the two surface layer base materials (11, 12), and each of the surface layer bases is provided. After forming holes (41, 42) at positions corresponding to the respective through holes in the prepreg (21, 22) which is adhered to the back surface of the material (11, 12), the surface layer base material (11), Prepreg (21), inner layer base material (13),
The other prepreg (22) and the other surface layer substrate (12) are superposed in this order and heat-pressed to form a hollow blind through hole (31
a, 32a) is provided, and a method for manufacturing a multilayer printed wiring board.
何れか一方に、予め孔の内壁に導体層を形成したスルー
ホール(31,32) を設け、 それぞれの該表面層基材(11,12) の裏面に密着させるプ
リプレグ(21,22) のそれぞれに、近接した該スルーホー
ル(31,32) に連通する大形孔(51,52) を穿孔した後に、 該表面層基材(11), 該プリプレグ(21), 内層基材(13),
他の該プリプレグ(22), 他方の該表面層基材(12)をこの
順に重畳し、加熱圧着して、中空の盲スルーホールを設
けることを特徴とする多層プリント配線板の製造方法。2. A through hole (31, 32) having a conductor layer previously formed on the inner wall of the hole is provided on at least one of the two surface layer base materials (11, 12), and each of the surface layer bases is provided. After forming large holes (51, 52) communicating with the adjacent through holes (31, 32) in each of the prepregs (21, 22) that are closely attached to the back surface of the material (11, 12), the surface layer Base material (11), the prepreg (21), inner layer base material (13),
A method for producing a multilayer printed wiring board, characterized in that the other prepreg (22) and the other surface layer base material (12) are superposed in this order, and thermocompression bonded to provide a hollow blind through hole.
何れか一方に、予め孔の内壁に導体層を形成したスルー
ホール(31,32) を設け、 該スルーホール(31,32) と同位置に孔を穿孔した複数の
プリプレグを所望数重畳して該表面層基材(11,12) 間に
挿入し、加熱圧着して、該表面層基材(11,12)のそれぞ
れに中空の盲スルーホール(31a,32a) を設けることを特
徴とする多層プリント配線板の製造方法。3. A through hole (31, 32) having a conductor layer formed in advance on the inner wall of the hole is provided on at least one of the two surface layer base materials (11, 12), and the through hole (31, 32) is provided. 32) A desired number of prepregs having holes formed at the same position as 32) are superposed and inserted between the surface layer base materials (11, 12), followed by thermocompression bonding so that the surface layer base materials (11, 12) A method for manufacturing a multilayer printed wiring board, characterized in that hollow blind through holes (31a, 32a) are provided in each.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27440291A JPH05114788A (en) | 1991-10-23 | 1991-10-23 | Manufacture of multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27440291A JPH05114788A (en) | 1991-10-23 | 1991-10-23 | Manufacture of multilayer printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05114788A true JPH05114788A (en) | 1993-05-07 |
Family
ID=17541171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27440291A Withdrawn JPH05114788A (en) | 1991-10-23 | 1991-10-23 | Manufacture of multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05114788A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1259102A1 (en) * | 2001-05-14 | 2002-11-20 | Oki Printed Circuits Co., Ltd. | Multi-layer printed circuit bare board enabling higher density wiring and a method of manufacturing the same |
| US6492007B1 (en) | 2000-03-14 | 2002-12-10 | Oki Printed Circuits Co., Ltd. | Multi-layer printed circuit bare board enabling higher density wiring and a method of manufacturing the same |
| JP2008153456A (en) * | 2006-12-18 | 2008-07-03 | Fuji Electric Device Technology Co Ltd | Inductor and its manufacturing method |
-
1991
- 1991-10-23 JP JP27440291A patent/JPH05114788A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6492007B1 (en) | 2000-03-14 | 2002-12-10 | Oki Printed Circuits Co., Ltd. | Multi-layer printed circuit bare board enabling higher density wiring and a method of manufacturing the same |
| EP1259102A1 (en) * | 2001-05-14 | 2002-11-20 | Oki Printed Circuits Co., Ltd. | Multi-layer printed circuit bare board enabling higher density wiring and a method of manufacturing the same |
| JP2008153456A (en) * | 2006-12-18 | 2008-07-03 | Fuji Electric Device Technology Co Ltd | Inductor and its manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990107 |