JPH05114644A - Substrate positioning device - Google Patents

Substrate positioning device

Info

Publication number
JPH05114644A
JPH05114644A JP27527291A JP27527291A JPH05114644A JP H05114644 A JPH05114644 A JP H05114644A JP 27527291 A JP27527291 A JP 27527291A JP 27527291 A JP27527291 A JP 27527291A JP H05114644 A JPH05114644 A JP H05114644A
Authority
JP
Japan
Prior art keywords
substrate
plate
roller
holder
rolling element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27527291A
Other languages
Japanese (ja)
Inventor
Takeshi Naraki
剛 楢木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to JP27527291A priority Critical patent/JPH05114644A/en
Publication of JPH05114644A publication Critical patent/JPH05114644A/en
Pending legal-status Critical Current

Links

Landscapes

  • Liquid Crystal (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To enhance the stability of mechanical prealignment of a substrate and protect the substrate from warping. CONSTITUTION:During mechanical prealignment time, the end faces of a substrate 19 is thrust to an outer frame 1 of a reference roller. When it is necessary to absorb the substrate to the plane of a holder 20 under this thrust state, the reference roller is designed so that its elastic displacement may be available by a fine quantity in the direction of a shaft 5 (crossing direction to positioning direction).

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、大型のガラス基板や半
導体ウェハ等の基板を機械的に位置決めする装置、いわ
ゆるプリアライメント装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a so-called pre-alignment device for mechanically positioning a substrate such as a large glass substrate or a semiconductor wafer.

【0002】[0002]

【従来の技術】従来、液晶表示素子、あるいは半導体素
子等を製造する露光装置には、被露光基板となる矩形状
のガラス板(プレート)や円形の半導体ウェハを予め決
められた位置に予備的にアライメントするプリアライメ
ント機構が組み込まれている。このプリアライメント機
構はほとんどの場合、プレートやウェハ等の基板を機械
的に基準ピン(ローラ)等に押し付ける方式を採ってい
る。
2. Description of the Related Art Conventionally, in an exposure apparatus for manufacturing a liquid crystal display element, a semiconductor element or the like, a rectangular glass plate (plate) or a circular semiconductor wafer to be exposed is preliminarily placed at a predetermined position. It has a built-in pre-alignment mechanism. In most cases, this pre-alignment mechanism employs a method of mechanically pressing a substrate such as a plate or a wafer against a reference pin (roller) or the like.

【0003】この種のプリアライメント機構の全体的な
構成を図4に示す。図1は矩形のプレート19をホルダ
ー20上で位置決めする装置の一例であって、ホルダー
20及びプリアライメント機構は、露光装置であれば2
次元移動するXYステージ上に設けられる。ホルダー2
0にはプレート19を真空吸着するための載置面が形成
され、不図示の真空配管系を介してプレート19の裏面
と載置面とを密着させる。さて、ホルダー20の周辺に
は、プレート19のY方向の位置決めを行なう基準ロー
ラ16Aと、X方向の位置決めを行なう2つの基準ロー
ラ16B、16Cとがホルダー20の載置面の中心から
一定距離に配置される。プレート19を挾んで基準ロー
ラ16Aと反対側には、ホルダー20上のプレート19
をY方向に押圧するための押付けロー17Aと、その可
動機構18Aとが設けられる。同様に、プレート19を
挾んで基準ローラ16B、16Cと反対側にはプレート
19をX方向に押圧する押付けローラ17Bと、その可
動機構18Bとが設けられる。基準ローラ16A、16
B、16Cはホルダー20の載置面に対して沿直な方向
の軸を中心に自在回転可能であり、その周辺がプレート
19の端面と当接する。また各ローラ(16A〜16
C、17A、17B)の周面は、プレート19との接触
で発塵しないように、合成樹脂性(例えばデルリン、テ
フロン等)の素材で作られている。
FIG. 4 shows the overall structure of this type of pre-alignment mechanism. FIG. 1 is an example of an apparatus for positioning the rectangular plate 19 on a holder 20, and the holder 20 and the pre-alignment mechanism are two if the exposure apparatus.
It is provided on an XY stage that moves dimensionally. Holder 2
A mounting surface for vacuum suction of the plate 19 is formed at 0, and the back surface of the plate 19 and the mounting surface are brought into close contact with each other via a vacuum piping system (not shown). Around the holder 20, a reference roller 16A for positioning the plate 19 in the Y direction and two reference rollers 16B, 16C for positioning the plate 19 in the X direction are located at a fixed distance from the center of the mounting surface of the holder 20. Will be placed. The plate 19 on the holder 20 is placed on the opposite side of the reference roller 16A with the plate 19 interposed therebetween.
A pressing row 17A for pressing in the Y direction and a movable mechanism 18A thereof are provided. Similarly, a pressing roller 17B that presses the plate 19 in the X direction and a movable mechanism 18B are provided on the side opposite to the reference rollers 16B and 16C with the plate 19 interposed therebetween. Reference rollers 16A, 16
B and 16C are freely rotatable around an axis in a direction perpendicular to the mounting surface of the holder 20, and the periphery thereof contacts the end surface of the plate 19. In addition, each roller (16A-16
The peripheral surfaces (C, 17A, 17B) are made of a synthetic resin material (for example, Delrin, Teflon, etc.) so as not to generate dust when coming into contact with the plate 19.

【0004】このような構造によってプレート19をプ
リアライメントするとき、可動機構18A、18Bが2
つの押付けローラ17A、17Bを退避した位置へセッ
トした後、不図示のプレート搬送系によりプレート19
をホルダー20上に載置する。このとき、ホルダー20
は、不図示の気体供給源からの圧力気体を載置面とプレ
ート19の裏面との間に供給する。これによってホルダ
ー20とプレート19との間に、ミクロンオーダの気体
層(エアベアリング)が形成される。その後、可動機構
18A、18Bによって押付けローラ17A、17Bを
それぞれX、Y方向に移動させて、プレート19の2辺
を基準ローラ16A、16B、16Cの夫々に所定の力
で押し付ける。その状態で、ホルダー20に対する圧力
気体の供給が停止され、真空吸着に切り替えられる。
When the plate 19 is pre-aligned by such a structure, the movable mechanisms 18A and 18B are
After setting the two pressing rollers 17A and 17B to the retracted positions, the plate 19 is moved by a plate conveying system (not shown).
Is placed on the holder 20. At this time, the holder 20
Supplies a pressure gas from a gas supply source (not shown) between the mounting surface and the back surface of the plate 19. As a result, a micron-order gas layer (air bearing) is formed between the holder 20 and the plate 19. After that, the movable mechanisms 18A and 18B move the pressing rollers 17A and 17B in the X and Y directions, respectively, and press the two sides of the plate 19 against the reference rollers 16A, 16B, and 16C with a predetermined force. In that state, the supply of the pressure gas to the holder 20 is stopped, and the vacuum suction is switched to.

【0005】これによりプレート19はホルダー19上
の一定位置にプリアライメントされて吸着される。その
後、押付けローラ17A、17Bは再び退避位置まで戻
される。
As a result, the plate 19 is pre-aligned and attracted to a predetermined position on the holder 19. After that, the pressing rollers 17A and 17B are returned to the retracted position again.

【0006】[0006]

【発明が解決しようとする課題】上記、従来の装置で使
われている基準ローラ16A(16B、16C)は、一
例として図2で示すように、ホルダー20に対して一定
の位置に植設された軸10と、ラジアルベアリング9
と、合成樹脂性の外輪8とで構成されている。そして従
来の基準ローラでは軸方向の自由移動がほとんどできな
いようになっている。そのため、ホルダー20上にプレ
ートを載置し、真空及び送風路20Aを介して圧力気体
を供給すると、プレート19' は想像線に示すようにホ
ルダー20からわずか上方に浮上して位置する。そして
押付けローラ17A、17Bによりプレート19' が基
準ローラ16Aの外輪8上部に当接した状態で真空吸着
に切り替えると、プレートと基準ローラ16Aとの軸方
向の摩擦係数、押し付け力、ホルダー20の吸着力等の
関係で、プレートは外輪8の上部に当接したまま、ホル
ダー20に吸着されることがある。すなわち、図2のプ
レート19のように基準ローラ16A(16B、16
C)と当接する周辺部分が上方にそったまま固定される
ことになる。この場合、プレート19は平面度異常を起
したことになるので、露光時にフォーカスエラーやアラ
イメントエラーが多発するという大きな問題が生じた。
この問題は、液晶表示素子製造用の大型ガラス基板(例
えば50cm角)等を扱う場合に顕著に現われる。
The reference roller 16A (16B, 16C) used in the above-mentioned conventional apparatus is planted at a fixed position with respect to the holder 20, as shown in FIG. 2 as an example. Shaft 10 and radial bearing 9
And an outer ring 8 made of synthetic resin. In addition, the conventional reference roller hardly allows free movement in the axial direction. Therefore, when the plate is placed on the holder 20 and the pressure gas is supplied through the vacuum and the air passage 20A, the plate 19 'is located slightly above the holder 20 as shown by an imaginary line. Then, when the plate 19 'is pressed by the pressing rollers 17A and 17B in contact with the upper portion of the outer ring 8 of the reference roller 16A, the vacuum suction is changed to the friction coefficient in the axial direction between the plate and the reference roller 16A, the pressing force, and the suction of the holder 20. Due to force and the like, the plate may be attracted to the holder 20 while being in contact with the upper portion of the outer ring 8. That is, like the plate 19 of FIG.
The peripheral portion that comes into contact with C) is fixed while keeping upward. In this case, since the plate 19 has an abnormal flatness, there is a big problem that a focus error and an alignment error frequently occur during exposure.
This problem remarkably appears when handling a large glass substrate (for example, 50 cm square) for manufacturing a liquid crystal display element.

【0007】そこで、このような問題点も解決し得る1
つの方法として、基準ローラ16A〜16Cも押付けロ
ーラ17A、17Bと同様に可動方式にすることも考え
られる。すなわちプリアライメント時には基準ローラの
夫々を所定の基準位置に配置し、プレートのホルダー2
0への真空吸着が完了した時点で基準ローラをプレート
の端面からわずかに離間させた退避位置へ移動させるの
である。このようにすると、図2のように上方へそり上
がったプレート周辺部は元通りほぼ平坦に復帰するの
で、平面度異常とはならない。しかしながら、このよう
に基準ローラも可動機構で支持するとなると、ホルダー
20周辺のスペースを広くする必要があり、また構造も
複雑になる。さらに本来基準となるべき基準ローラが可
動になるため、可動機構の設定誤差等によってプレート
の位置決め精度、再現性を低下させる恐れもある。
Therefore, such a problem can be solved 1
As one method, it may be considered that the reference rollers 16A to 16C are movable like the pressing rollers 17A and 17B. That is, at the time of pre-alignment, each of the reference rollers is arranged at a predetermined reference position, and the plate holder 2
When the vacuum suction to 0 is completed, the reference roller is moved to the retracted position slightly separated from the end surface of the plate. In this case, the peripheral portion of the plate that rises upward as shown in FIG. 2 returns to a substantially flat state as before, and thus the flatness is not abnormal. However, if the reference roller is also supported by the movable mechanism as described above, it is necessary to widen the space around the holder 20, and the structure becomes complicated. Further, since the reference roller, which is supposed to be the reference, is movable, the positioning accuracy and reproducibility of the plate may be deteriorated due to the setting error of the movable mechanism and the like.

【0008】そこで本発明は、上記のような複雑な構造
にしなくとも、簡単な改良によりプレートの周辺部での
そりを防止するとともに、安定した位置決め精度、再現
性が得られる位置決め装置を提供することを目的とす
る。
Therefore, the present invention provides a positioning device which can prevent warpage at the peripheral portion of the plate by a simple improvement and can obtain stable positioning accuracy and reproducibility without the complicated structure as described above. The purpose is to

【0009】[0009]

【課題を解決する為の手段】本発明では、基板(19)
の端面に当接する基準部材をローラ(外輪1)として転
動可能にするとともに、その軸(5)の方向にも所定量
だけ変位可能な軸受機構(2、3、4)を設け、さらに
基板の載置手段(ホルダー20)への吸着時に基板端面
が軸方向に変位するのに伴ってローラも軸方向に変位す
るように、ローラを変位可能な範囲内の所定位置に付勢
する付勢部材(バネ7)を設けるようにした。
According to the present invention, a substrate (19) is provided.
The reference member that comes into contact with the end surface of the roller is made rollable as a roller (outer ring 1), and a bearing mechanism (2, 3, 4) is provided which is also displaceable by a predetermined amount in the direction of its axis (5). A biasing force that biases the roller to a predetermined position within a displaceable range so that the roller is also displaced in the axial direction as the substrate end surface is displaced in the axial direction when adsorbed to the mounting means (holder 20). A member (spring 7) is provided.

【0010】[0010]

【作用】本発明によれば、基準部材としてのローラ(転
動体)が回転中心軸の方向に変位可能であるため、プリ
アライメント時に基板を載置面から気体吹き出しにより
浮上させた状態で基準ローラの上部に当接させた後、吸
着動作に切り替えたとしても、基準ローラの周面は基準
端面とともに沈み込むことになり、基板周辺部での平面
度異常の発生が防止される。また基準部材としてのロー
ラの軸は、従来通りに載置手段(ホルダー)に対して固
定した位置に植設されるため、位置決め精度、再現性は
何ら低下することがない。また、基準部材のローラ周面
と基板端面とが相対的に軸方向に摺動することも防げる
ので、基板表面に塗布された感光剤(レジスト)のうち
端面部分に回り込んだレジストを削り落す可能性も少な
くなり、レジスト粉の発生も押えられる。
According to the present invention, since the roller (rolling member) as the reference member can be displaced in the direction of the central axis of rotation, the reference roller can be floated from the mounting surface by gas blow during pre-alignment. Even if the suction operation is switched to after the contact with the upper part of the substrate, the peripheral surface of the reference roller sinks together with the reference end surface, thereby preventing the flatness abnormality from occurring in the peripheral portion of the substrate. Further, since the shaft of the roller as the reference member is planted at a position fixed to the mounting means (holder) as in the conventional case, the positioning accuracy and reproducibility are not deteriorated at all. Further, it is possible to prevent the roller peripheral surface of the reference member and the end face of the substrate from sliding relative to each other in the axial direction, so that the resist wrapping around the end face portion of the photosensitive agent (resist) applied to the substrate surface is scraped off. The possibility is reduced and the generation of resist powder is suppressed.

【0011】[0011]

【実施例】図3は本発明の実施例による基準ローラの構
造を示す断面図であり、このような基準ローラが図1中
のローラ16A、16B、16Cとして設けられる。図
3において、基準位置に植設された軸5の回りには円筒
状のリテーナ4に保持された複数のボール3が配置さ
れ、そのボール3の回りには外輪2がかん合される。そ
して外輪2の回りには合成樹脂で作られた円筒状の外枠
1が設けられる。
FIG. 3 is a sectional view showing the structure of a reference roller according to an embodiment of the present invention. Such reference rollers are provided as the rollers 16A, 16B and 16C in FIG. In FIG. 3, a plurality of balls 3 held by a cylindrical retainer 4 are arranged around a shaft 5 implanted at a reference position, and an outer ring 2 is fitted around the balls 3. A cylindrical outer frame 1 made of synthetic resin is provided around the outer ring 2.

【0012】プレートはこの外枠1の周面に、軸5の方
向と直交する方向から当接することで位置決めされる。
このような構造により、外枠1、外輪2からなる基準ロ
ーラは、軸5を中心として転動するとともに、軸方向に
も上下動することになり、リニアモーションベアリング
として作用する。
The plate is positioned by abutting on the peripheral surface of the outer frame 1 from a direction orthogonal to the direction of the shaft 5.
With such a structure, the reference roller including the outer frame 1 and the outer ring 2 rolls around the shaft 5 and also moves up and down in the axial direction, thus acting as a linear motion bearing.

【0013】ただし、そのままでは基準ローラの自重に
よって軸5が植設されるベース側へ落下したままになる
ので、コイルバネ7を軸5と同軸に設けてローラを上下
動ストロークのほぼ中間位置に付勢するようにした。ま
た軸5の上端にはストッパー6が固定され、外輪2が軸
5から抜け出ないように係止する。図3に示したローラ
(外枠1、外輪2)は、同図の位置から下方へ変位する
ときはコイルバネ7の付勢力に抗することになるが、そ
の付勢力はローラの自重を支える程度に小さい。また図
3の位置から上方へローラが変位する場合は、バネ7と
ローラ下側との接触が断たれ、ローラのみがストッパー
6の位置まで移動可能となる。ただし、図3に示した構
造よりは多少複雑にはなるが、バネ7のローラ下側との
接触が断たれず、かつバネ7との接触部とは無関係に外
輪2が自在回転するような構成にしておけば、バネ7は
ローラの上下動のいずれに対しても付勢力を発生するこ
とになる。
However, if it is left as it is, the shaft 5 is still dropped to the base side where the shaft 5 is planted due to its own weight. Therefore, the coil spring 7 is provided coaxially with the shaft 5 so that the roller is provided at an intermediate position of the vertical movement stroke. I tried to get it going. A stopper 6 is fixed to the upper end of the shaft 5 and locks the outer ring 2 so as not to slip out of the shaft 5. The rollers (outer frame 1 and outer ring 2) shown in FIG. 3 resist the biasing force of the coil spring 7 when displaced downward from the position shown in the figure, but the biasing force supports the weight of the roller itself. Small. Further, when the roller is displaced upward from the position of FIG. 3, the contact between the spring 7 and the lower side of the roller is broken, and only the roller can move to the position of the stopper 6. However, although slightly more complicated than the structure shown in FIG. 3, the contact of the spring 7 with the lower side of the roller is not broken, and the outer ring 2 is freely rotated regardless of the contact portion with the spring 7. With this configuration, the spring 7 will generate an urging force with respect to both vertical movements of the roller.

【0014】さて、図4は本実施例の動作を説明する断
面図である。ホルダー20上のプレート19' (想像
線)は真空及び気体噴出路20Aから供給される空気に
より一定量だけ浮上した状態にあり、さらに押圧部材と
しての押付けローラ17A、17Bの動作によってロー
ラの外枠1' (想像線)の周面に当接している。次に真
空及び噴出路20Aを真空に切り替えると、プレート1
9はホルダー20の載置面に密着するように下方へ引き
寄せられ、これに伴ってローラの外枠1も下方へ沈み込
む。このときバネ7は圧縮され、上方への付勢力を発生
するが、バネ7の付勢力は極めて小さいものなので、プ
レート19の周辺部を変形させることはない。
FIG. 4 is a sectional view for explaining the operation of this embodiment. The plate 19 '(imaginary line) on the holder 20 is in a state of being floated by a certain amount by the air supplied from the vacuum and gas ejection passages 20A, and further, by the operation of the pressing rollers 17A, 17B as pressing members, the outer frame of the roller is It is in contact with the peripheral surface of 1 '(imaginary line). Next, when the vacuum and the ejection passage 20A are switched to the vacuum, the plate 1
9 is pulled downward so as to come into close contact with the mounting surface of the holder 20, and with this, the outer frame 1 of the roller also sinks downward. At this time, the spring 7 is compressed and an upward biasing force is generated. However, since the biasing force of the spring 7 is extremely small, the peripheral portion of the plate 19 is not deformed.

【0015】以上の図3、図4に示した基準ローラは、
図1と同様に3ヶ所に配置され、従来と全く同じシーケ
ンスでプレート19の位置決めが行なわれる。また以上
の実施例では付勢部材として、コイルバネ7を使った
が、板バネに変えてもよい。あるいは磁石の反発力を利
用して、ローラ(外枠1、外輪2、ボール3等)を変位
可能なストークの中間位置に浮上させるようにしてもよ
い。さらに本実施例ではプリアライメント時にプレート
をエアベエリングで浮上させるものとしたが、ホルダー
20の載置面内の3点〜5点から支持棒を数mm程度突出
させ、その支持棒の上端(例えばデルリン)でプレート
を保持した状態で押付けローラ17A、17Bによりプ
レートを押圧して位置決めした後、支持棒を載置面内に
沈み込ませてから真空吸着を行なう方式でも、図3に示
した基準ローラを使うことで同様の効果が得られる。
The reference roller shown in FIGS. 3 and 4 is as follows.
As in FIG. 1, the plates 19 are arranged at three places, and the plate 19 is positioned in the same sequence as in the conventional case. Further, although the coil spring 7 is used as the biasing member in the above embodiments, it may be replaced with a leaf spring. Alternatively, the repulsive force of the magnet may be used to float the roller (outer frame 1, outer ring 2, ball 3, etc.) to an intermediate position of the displaceable stalk. Further, in the present embodiment, the plate is floated by air beveling during pre-alignment. However, the support rod is projected by several mm from three to five points in the mounting surface of the holder 20, and the upper end of the support rod (for example, Delrin ), The plate is held by the pressing rollers 17A and 17B to position the plate, and then the support rod is sunk into the mounting surface before vacuum suction is performed. You can get the same effect by using.

【0016】以上、本発明の実施例では矩形のガラス板
の位置決めについて説明したが、半導体ウェハ(円形)
の位置決めについても全く同様に本発明を適用できる。
さらに基板の吸着は、真空以外の静電吸着にしても全く
同様に本発明を適用できる。
Although the positioning of the rectangular glass plate has been described in the embodiment of the present invention, the semiconductor wafer (circular)
The present invention can be applied to the positioning of the above.
Further, the present invention can be applied in the same manner even if the substrate is attracted by electrostatic attraction other than vacuum.

【0017】[0017]

【発明の効果】以上本発明によれば、基板の位置決め精
度、再現性を低下させることなく、基板の平面度異常の
発生を皆無にすることができる。このため露光装置等に
おいては良好な露光結果が得られることになる。また基
板そのものが全体的に凸状、または凹状に湾曲している
場合、プリアライメント完了時に基板を載置面に吸着す
ると、基板が載置面の平面度に矯正されるとき基板端面
が高さ方向(軸方向)に変位することになる。この場合
でも本発明によれば基準部材が軸方向に変位可能である
ため、基板端面の吸着時の挙動を阻害することがなく、
しかも良好な吸着固定が行なえる。
As described above, according to the present invention, it is possible to eliminate the occurrence of abnormal flatness of the substrate without deteriorating the positioning accuracy and reproducibility of the substrate. Therefore, a good exposure result can be obtained in the exposure apparatus or the like. If the substrate itself is curved in a convex shape or a concave shape, if the substrate is adsorbed to the mounting surface when pre-alignment is completed, the height of the substrate end surface when the substrate is corrected to the flatness of the mounting surface. It will be displaced in the direction (axial direction). Even in this case, according to the present invention, since the reference member can be displaced in the axial direction, it does not hinder the behavior of the substrate end surface during adsorption,
Moreover, good adsorption and fixation can be performed.

【図面の簡単な説明】[Brief description of drawings]

【図1】従来の決め装置の構成を示す平面図FIG. 1 is a plan view showing the configuration of a conventional deciding device.

【図2】従来の装置における問題点を説明する断面図FIG. 2 is a cross-sectional view illustrating problems in the conventional device.

【図3】本発明の実施例による基準部材の構造を示す断
面図
FIG. 3 is a sectional view showing a structure of a reference member according to an embodiment of the present invention.

【図4】図3の構成による実施例の動作を説明する断面
FIG. 4 is a sectional view for explaining the operation of the embodiment having the configuration of FIG.

【主要部分の符号の説明】[Explanation of symbols for main parts]

1 外枠 2 外輪 3 ボール 5 軸 7 コイルバネ 16A、16B、16C 基準ローラ 17A、17B 押付けローラ 19 プレート(基板) 20 ホルダー 1 Outer Frame 2 Outer Ring 3 Ball 5 Axis 7 Coil Spring 16A, 16B, 16C Reference Roller 17A, 17B Pressing Roller 19 Plate (Board) 20 Holder

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 位置決めすべき基板を載置する載置面を
有し、該載置面に前記基板を吸着する載置手段と、該載
置手段の載置面に対して所定の位置関係で配置され、前
記基板の端面と当接して前記基板を載置手段上で位置決
めする基準部材と、前記載置手段上の基板を前記基準部
材の方向へ押圧する押圧部材とを備え、 前記基準部材に当接させた状態で前記基板を前記載置手
段に吸着する位置決め装置において、 前記基準部材は、前記載置手段の載置面に対してほぼ鉛
直な方向に延びた軸を中心として転動可能に軸支され、
周面が前記基板の端面と当接する転動体と、該転動体を
軸方向に所定量だけ変位可能に支持する軸受機構とで構
成され;さらに、前記基板の載置面への吸着時に前記基
板の端面が前記軸方向に変位するのに伴って前記転動体
が軸方向に変位するように、前記転動体を前記変位可能
な範囲内の特定の位置に付勢する付勢部材を設けたこと
を特徴とする基板の位置決め装置。
1. A mounting means having a mounting surface for mounting a substrate to be positioned, wherein the mounting means adsorbs the substrate to the mounting surface, and a predetermined positional relationship with respect to the mounting surface of the mounting means. And a reference member that contacts the end surface of the substrate to position the substrate on the mounting means, and a pressing member that presses the substrate on the mounting means in the direction of the reference member. In the positioning device for adsorbing the substrate to the placing means in a state of being brought into contact with the member, the reference member rolls around an axis extending in a direction substantially vertical to the placing surface of the placing means. Movably pivoted,
The rolling element has a peripheral surface in contact with the end surface of the substrate, and a bearing mechanism that supports the rolling element so that the rolling element can be displaced by a predetermined amount in the axial direction; A biasing member that biases the rolling element to a specific position within the displaceable range so that the rolling element is axially displaced as the end surface of the rolling element is axially displaced. A substrate positioning device characterized by the following.
JP27527291A 1991-10-23 1991-10-23 Substrate positioning device Pending JPH05114644A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27527291A JPH05114644A (en) 1991-10-23 1991-10-23 Substrate positioning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27527291A JPH05114644A (en) 1991-10-23 1991-10-23 Substrate positioning device

Publications (1)

Publication Number Publication Date
JPH05114644A true JPH05114644A (en) 1993-05-07

Family

ID=17553116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27527291A Pending JPH05114644A (en) 1991-10-23 1991-10-23 Substrate positioning device

Country Status (1)

Country Link
JP (1) JPH05114644A (en)

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JP2007273501A (en) * 2006-03-30 2007-10-18 Kyocera Corp Alignment device
JP2008034710A (en) * 2006-07-31 2008-02-14 Nitto Denko Corp Method for sticking adhesive tape to semiconductor wafer, and method for detaching protective tape from semiconductor wafer
JP2008060278A (en) * 2006-08-30 2008-03-13 Hitachi High-Technologies Corp Positioning device, stage, and device for inspecting or processing
JP2008304836A (en) * 2007-06-11 2008-12-18 Nsk Ltd Substrate transfer mechanism for exposure apparatus and substrate position adjustment method using mechanism
JP2011062908A (en) * 2009-09-17 2011-03-31 Seiko Epson Corp Assembly tool for inkjet head, and method for assembling inkjet head
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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000014761A1 (en) * 1998-09-07 2000-03-16 Canon Kabushiki Kaisha Method and apparatus for producing electron source
US6726520B2 (en) 1998-09-07 2004-04-27 Canon Kabushiki Kaisha Apparatus for producing electron source
US7189427B2 (en) 1998-09-07 2007-03-13 Canon Kabushiki Kaisha Manufacturing method of an image forming apparatus
CN100377276C (en) * 1998-09-07 2008-03-26 佳能株式会社 Method and apparatus for producing electron source
JP2007273501A (en) * 2006-03-30 2007-10-18 Kyocera Corp Alignment device
JP2008034710A (en) * 2006-07-31 2008-02-14 Nitto Denko Corp Method for sticking adhesive tape to semiconductor wafer, and method for detaching protective tape from semiconductor wafer
JP4711904B2 (en) * 2006-07-31 2011-06-29 日東電工株式会社 Adhesive tape affixing method to semiconductor wafer and protective tape peeling method from semiconductor wafer
JP2008060278A (en) * 2006-08-30 2008-03-13 Hitachi High-Technologies Corp Positioning device, stage, and device for inspecting or processing
JP4616812B2 (en) * 2006-08-30 2011-01-19 株式会社日立ハイテクノロジーズ Positioning device, stage and inspection or processing device
JP2008304836A (en) * 2007-06-11 2008-12-18 Nsk Ltd Substrate transfer mechanism for exposure apparatus and substrate position adjustment method using mechanism
JP2011062908A (en) * 2009-09-17 2011-03-31 Seiko Epson Corp Assembly tool for inkjet head, and method for assembling inkjet head
WO2016117440A1 (en) * 2015-01-21 2016-07-28 シャープ株式会社 Deformation correction device and method for bonding panel members

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