JPH05106006A - Method for smoothing plated surface of hot-dip solder or tin plated material - Google Patents
Method for smoothing plated surface of hot-dip solder or tin plated materialInfo
- Publication number
- JPH05106006A JPH05106006A JP23414591A JP23414591A JPH05106006A JP H05106006 A JPH05106006 A JP H05106006A JP 23414591 A JP23414591 A JP 23414591A JP 23414591 A JP23414591 A JP 23414591A JP H05106006 A JPH05106006 A JP H05106006A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- plating
- plating bath
- plated
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、種々材質の金属線や
帯材等の金属材料の全面あるいは所要部に設けられた半
田または錫めっき表面の平滑化を図る方法に係り、先に
全面あるいは所要部に半田または錫めっきを被着した金
属材料の全面に油を塗布し、これを溶融めっき浴中を通
過させ加熱不活性ガスを噴きつけながらめっき浴から引
き上げることにより、表面が平滑化されてめっき厚みが
均一でかつ濡れ性が良好な半田めっきまたは錫めっきを
得ることができる半田または錫溶融めっき材のめっき表
面平滑化方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for smoothing a solder or tin-plated surface provided on the entire surface or a required portion of a metal material such as a metal wire or a band material of various materials. The surface is smoothed by applying oil to the entire surface of the metal material coated with solder or tin plating on the required part, passing it through the hot dip plating bath, and pulling it up from the plating bath while spraying a heated inert gas. The present invention relates to a method for smoothing a plated surface of a solder or tin hot-dip plated material, which can obtain solder plating or tin plating having a uniform plating thickness and good wettability.
【０００２】[0002]
【従来の技術】従来から半田めっき金属線として、コン
デンサ、抵抗等の端子線として用いられている半田めっ
き銅線、半田めっきＣＰ線等が知られている。2. Description of the Related Art Solder-plated metal wires, such as solder-plated copper wires and solder-plated CP wires, which are used as terminal wires for capacitors and resistors, have been known.
【０００３】これらの半田めっき金属線は、通常、電気
半田めっき方法または溶融半田めっき方法にて製造され
る。設備費用や生産性等の観点からは溶融半田めっき方
法が良く、しかも電気半田めっき方法による半田めっき
層と比較して若干半田の濡れ性が良いとされるが、金属
線の円周方向における半田めっき厚さが不均一となるた
め、製品の信頼性の観点から製品コストが高くなっても
電気半田めっき方法を採用する場合が多い。These solder-plated metal wires are usually manufactured by an electric solder plating method or a molten solder plating method. From the viewpoint of equipment cost and productivity, it is said that the molten solder plating method is good, and the solder wettability is slightly better than that of the solder plating layer formed by the electric solder plating method. Since the plating thickness becomes non-uniform, the electric solder plating method is often adopted from the viewpoint of product reliability even if the product cost is high.
【０００４】このような溶融半田めっき方法の欠点を解
消して、本来有する長所を積極的に活用する方法とし
て、金属線を溶融半田めっき浴中を通過させ、被半田め
っき金属線を前記溶融半田めっき浴からほぼ垂直に引き
上げ、０．３〜２．５秒間の自然冷却した後、所定の条
件にて噴霧された噴霧液滴中を通過させて冷却すること
によって、金属線の円周方向における半田めっき厚さを
均一とする方法が提案されている。（特公平１−１６３
０６号）As a method of solving the above drawbacks of the hot-dip solder plating method and positively utilizing the inherent advantages of the hot-dip solder plating method, a metal wire is passed through a hot-dip solder plating bath and the metal wire to be solder-plated is melted by the hot-dip solder. In the circumferential direction of the metal wire, the metal wire was pulled up almost vertically from the plating bath, naturally cooled for 0.3 to 2.5 seconds, and then passed through the spray droplets sprayed under predetermined conditions to cool the metal wire. A method of making the solder plating thickness uniform has been proposed. (Tokuhei 1-163
No. 06)
【０００５】[0005]
【発明が解決しようとする課題】上記の溶融半田めっき
方法によって、半田めっき厚さが比較的均一な半田めっ
き金属線を得ることが可能となったが、噴霧冷却条件、
すなわち噴霧液滴が金属線に到達する時の速度や液滴密
度、液滴粒径等を所定範囲で正確に制御する必要があ
り、必ずしも工業的規模の量産において容易に実施可能
な方法とは言い難く、また、この方法だけでは溶融半田
めっき浴表面等に存在するスラッジ（半田の酸化物）の
巻き込みを防ぐことができず、半田めっき表面に凹凸を
形成したり、濡れ性を低下させる等の問題点を有してい
る。また、金属線の表面に一旦形成されてしまっためっ
き表面の凹凸を平滑化する方法は提案されておらず、め
っき厚さの均一度は最初のめっき浴への浸漬引上げ条件
で決定されてしまう。With the above-mentioned hot-dip solder plating method, it is possible to obtain a solder-plated metal wire having a relatively uniform solder-plating thickness.
That is, it is necessary to accurately control the speed at which the spray droplets reach the metal wire, the droplet density, the droplet diameter, etc. within a predetermined range, and it is not always a method that can be easily implemented in mass production on an industrial scale. It is difficult to say, and it is not possible to prevent the inclusion of sludge (solder oxide) existing on the surface of the molten solder plating bath, etc., by this method alone, and thus unevenness is formed on the solder plating surface or wettability is reduced. Has the problem. Further, no method has been proposed for smoothing the unevenness of the plating surface once formed on the surface of the metal wire, and the uniformity of the plating thickness is determined by the conditions of the first immersion in the plating bath. ..
【０００６】金属線に一定間隔で半田めっきを部分的に
設ける方法は、例えば、発明者が先に提案（特開平２−
１７６２１号公報）した、金属線の外周面に一定間隔で
転写ロールに載せた半田ペーストを転写してフュージン
グする方法があるが、これを溶融半田めっき法で行う
と、非めっき部にマスキングを施した金属線をめっき浴
に浸漬するが、垂直に引き上げる際に表面張力によって
めっき部の下方に半田が溜まって表面に凹凸が形成され
てしまい、溶融半田めっき法ではめっき厚さが均一な部
分めっきは困難である。A method of partially providing solder plating on a metal wire at regular intervals has been proposed by the inventor, for example (JP-A-2-
No. 17621), there is a method of transferring and fusing the solder paste placed on the transfer roll on the outer peripheral surface of the metal wire at a constant interval. However, when this is performed by the molten solder plating method, the non-plated portion is masked. The metal wire is immersed in a plating bath, but when it is pulled up vertically, surface tension causes the solder to accumulate under the plated part and form irregularities on the surface. It is difficult.
【０００７】この発明は、このような問題点を解消し
て、工業的規模の量産で種々材質の金属線や帯材に対し
て容易に実施可能で、半田または錫めっき厚さが均一で
あり、しかもスラッジの巻き込みが少なく、めっき表面
の凹凸が極めて少なく濡れ性の良い半田または錫めっき
金属材料を提供できる半田または錫溶融めっき材のめっ
き表面平滑化方法の提供を目的とするものである。The present invention solves the above problems and can be easily applied to metal wires and strips of various materials in mass production on an industrial scale, and has a uniform thickness of solder or tin plating. Moreover, it is an object of the present invention to provide a method for smoothing a plated surface of a solder or tin hot-dip plated material, which can provide a solder or tin-plated metal material with less sludge entrapment, extremely small unevenness on the plating surface and good wettability.
【０００８】[0008]
【課題を解決するための手段】この発明は、全面あるい
は所要部に半田または錫の溶融めっきを設けた金属材料
の全面に溶融半田または錫めっき浴の温度以下で蒸発す
る油を塗布した後、該溶融めっき浴中を通過させてめっ
きを再溶融させ、めっき浴から上方に引き上げ、好まし
くは引き上げに際し、金属材料に加熱不活性ガスを噴き
つけながら、あるいはさらに振動を加えながら引き上げ
てめっき厚みの均一性を改善することを特徴とする半田
または錫溶融めっき材のめっき表面平滑化方法である。According to the present invention, an oil that evaporates below the temperature of a molten solder or tin plating bath is applied to the entire surface of a metal material having solder or tin hot-dip plated on the entire surface or a required portion, It is passed through the hot dip plating bath to re-melt the plating, and is pulled upward from the plating bath, preferably at the time of pulling, while blowing a heated inert gas onto the metal material or further applying vibration to raise the plating thickness. A method for smoothing a plated surface of a solder or tin hot-dip plated material, which is characterized by improving uniformity.
【０００９】また、この発明は、上記構成の方法におい
て、金属材料に油を塗布しその後溶融めっき浴中に浸漬
し再溶融させてめっき浴から上方に引き上げる工程を繰
り返すことを特徴とする半田または錫溶融めっき材のめ
っき表面平滑化方法である。Further, the present invention is characterized in that, in the method of the above construction, the step of applying oil to the metal material, then dipping it in a hot dip plating bath to re-melt it and pulling it up from the plating bath is repeated. This is a method for smoothing the plating surface of a tin hot-dip plated material.
【００１０】[0010]
【作用】以下、この発明を詳述するにあたり主に半田め
っきについて説明する。なお、錫めっきの場合も後述す
る半田めっきの場合と同様の作用効果を奏する。この発
明は、従来から知られる金属材料を溶融半田めっき浴中
を通過させ、該めっき浴から上方に引き上げたのち、冷
却によって金属材料の周囲に半田をめっきする溶融半田
めっき方法において、工業的規模の量産で種々材質の金
属材料に対して容易に実施可能で、得られた金属材料の
めっき表面の凹凸を平滑化してその厚みを均一化できる
方法を目的に種々検討した結果、先の半田めっきを完了
した後、半田めっき金属材料の外周全面に灯油等の溶融
半田めっき浴の温度以下で蒸発する油を塗布し、再度、
溶融半田めっき浴中を通過させることにより、半田めっ
き厚みの均一性が改善されることを知見し、完成したも
のである。In the following, the solder plating will be mainly described in detailing the present invention. In addition, in the case of tin plating, the same operation and effect as in the case of solder plating described later can be obtained. This invention relates to a molten solder plating method of passing a conventionally known metal material through a molten solder plating bath, pulling it upward from the plating bath, and then plating solder around the metal material by cooling, on an industrial scale. It is possible to mass-produce various metal materials easily, and the result of various studies aimed at the method of smoothing the unevenness of the plating surface of the obtained metal material and making the thickness uniform is the result. After completing the above, apply oil that evaporates below the temperature of the molten solder plating bath such as kerosene to the entire outer circumference of the solder plated metal material, and
It has been completed by finding that the uniformity of the solder plating thickness is improved by passing it through the molten solder plating bath.
【００１１】詳述すると、金属材料の全面にめっきされ
た半田は、溶融半田めっき浴を通過する際に、蒸発して
ガス状となる油によって保護された状態で再溶融する。
さらに再溶融した半田には前記油により浴中の周囲の半
田が再度溶着することなく、余分な半田のみが金属材料
の引き上げ時に表面張力や重力によりガス化した油膜を
通して溶湯中に戻ると考えられ、従って半田めっき膜の
表面の平滑化を図ることができ偏肉率を小さくできる。More specifically, the solder plated on the entire surface of the metal material is remelted while passing through the molten solder plating bath while being protected by oil that is vaporized and becomes gaseous.
Furthermore, it is considered that the re-melted solder does not re-weld the surrounding solder in the bath due to the oil and only the excess solder returns to the molten metal through the oil film gasified by the surface tension or gravity when the metal material is pulled up. Therefore, the surface of the solder plating film can be smoothed and the uneven thickness ratio can be reduced.
【００１２】さらに、溶融半田めっき浴表面等に存在す
るスラッジや、金属材料に溶着した半田が新たに大気に
曝されて酸素と反応して生成するスラッジ等の巻き込み
を防ぐため、溶融半田めっき浴から上方に引き上げる金
属材料に、加熱不活性ガスを噴きつけることにより、上
記のスラッジを浴湯中に押し流し、金属材料に溶着した
半田へのスラッジ巻き込みを防止できることを知見し、
半田めっき厚さが均一であり、しかもスラッジの巻き込
みが少なく、めっき表面の凹凸が少なく極めて濡れ性の
良い半田めっきが得られる。Further, in order to prevent the inclusion of sludge existing on the surface of the molten solder plating bath or sludge which is generated when the solder deposited on the metal material is newly exposed to the atmosphere and reacts with oxygen, the molten solder plating bath is included. From the above, it was found that by spraying a heated inert gas onto the metal material that is pulled up from above, the above sludge is washed away into the bath water, and it is possible to prevent the inclusion of sludge in the solder that has been welded to the metal material.
Solder plating having a uniform solder plating thickness, less entrainment of sludge, less unevenness on the plating surface, and extremely good wettability can be obtained.
【００１３】また、材料表面の所要部にストライプ状、
アイランド状に半田めっきされた金属材料の場合、上述
の如く材料の引き上げ方向に非連続な半田めっきは浴中
で再溶融する。また、金属材料の全面に塗布した油が半
田めっき浴中でガス状となって材料表面を保護すること
から、半田めっきの非被着部に浴中の周囲の半田が溶着
することがない。さらに再溶融した半田のうち余分な半
田が少量である場合は、金属材料の引き上げ時に表面張
力や重力では被着部の余分な半田が溶湯中へ移動するこ
とが困難であるため、引き上げ時に金属材料に加熱不活
性ガスを噴きつけ、あるいはさらに振動させることによ
り、半田めっき膜の表面の平滑化を図ることができ偏肉
率を小さくできる。なお、材料の引き上げ方向に連続な
ストライプ状の場合は、半田めっきの非被着部に半田が
溶着されない以外は、前述の全面めっきと同様である。In addition, stripes are formed on required parts of the material surface,
In the case of the island-shaped solder-plated metal material, the discontinuous solder plating in the pulling direction of the material is remelted in the bath as described above. Further, since the oil applied to the entire surface of the metal material becomes gaseous in the solder plating bath to protect the surface of the material, the solder around the bath is not welded to the non-adhered portion of the solder plating. Furthermore, if there is a small amount of excess solder in the remelted solder, it is difficult to move the excess solder in the adhered part into the molten metal due to surface tension or gravity when the metal material is pulled up, so it is difficult By spraying a heated inert gas on the material or further vibrating the material, the surface of the solder plating film can be smoothed and the uneven thickness ratio can be reduced. In the case of a striped pattern continuous in the pulling direction of the material, it is the same as the above-mentioned whole surface plating except that the solder is not welded to the non-adhered portion of the solder plating.
【００１４】半田めっき金属材料の表面に塗布する油
は、粘度が小さく蒸発しても残渣が残らない灯油等の油
が好ましい。油を塗布せずに単に半田めっき金属材料を
溶融半田めっき浴中に通過させると、芯線の温度はめっ
き浴の温度より低いため、溶融半田が溶着し、金属材料
表面に２層状に半田めっきされる。従って、再度のめっ
き浴中の浸漬時間は、油の蒸発が終了する間に、１回目
にめっきされた半田が再溶融するように設定する必要が
ある。金属材料の表面への油塗布方法は、表面に油が所
要量均一に塗布されればいかなる手段でもよく、油を含
ませたフェルト内を通過させるか、油浴に浸漬したのち
にフェルト内を通過させて均一化する方法が採用でき
る。The oil applied to the surface of the solder-plated metal material is preferably oil such as kerosene which has a small viscosity and does not leave a residue even when evaporated. When the solder-plated metal material is simply passed through the molten solder plating bath without applying oil, the temperature of the core wire is lower than the temperature of the plating bath, so the molten solder is welded and the metal material surface is solder-plated into two layers. It Therefore, the immersion time in the plating bath again needs to be set so that the solder plated for the first time is remelted while the oil evaporation is completed. The method of applying oil to the surface of the metal material may be any means as long as the required amount of oil is evenly applied to the surface, and the oil may be passed through a felt containing oil or after being immersed in an oil bath, the inside of the felt may be washed. A method of passing and homogenizing can be adopted.
【００１５】この発明によるめっき表面平滑化方法を施
す前の半田めっき方法は、公知の何れの方法であっても
よいが、材料全面への溶融半田めっき方法の場合は、金
属線の外周全面にフラックスを塗布した後、前記金属線
を半田溶融めっき浴中を通過させて該めっき浴から上方
に引き上げるに際し、めっき金属線に加熱不活性ガスを
噴きつけながら引き上げ、その後冷却して半田溶融めっ
きを施す方法が好ましい。すなわち、金属材料をめっき
浴に浸漬する前に、材料の外周全面にフラックスを塗布
することにより、フラックスによって材料の表面が非常
に活性化し、材料の周囲に存在する溶融半田が極めて効
率良く材料に溶着するため、濡れ性がよい半田めっきが
容易に得られる。The solder plating method before applying the plating surface smoothing method according to the present invention may be any known method, but in the case of the molten solder plating method on the entire surface of the material, the entire outer circumference of the metal wire is covered. After applying the flux, when the metal wire is passed through the solder hot dip plating bath and pulled upward from the plating bath, it is pulled up while spraying a heated inert gas onto the plated metal wire, and then cooled to perform the solder hot dip plating. The method of application is preferred. That is, by applying the flux to the entire outer circumference of the material before immersing the metal material in the plating bath, the surface of the material is extremely activated by the flux, and the molten solder existing around the material becomes extremely efficient. Because of the welding, solder plating with good wettability can be easily obtained.
【００１６】金属材料の外周全面に塗布する上記フラッ
クスは、半田組成、めっき浴温度等、種々の条件に応じ
て公知のフラックスの中から選定することが望ましい
が、特に塩化亜鉛と塩化アンモニウム等の水溶性フラッ
クスが好ましい。金属材料にフラックスを塗布する方法
としては、金属材料をめっき浴に浸漬させる前に金属材
料の外周全面に塗布できれば、いかなる手段をも採用で
きるが、特に、フラックスを浸したフェルト等の布中を
金属材料が通過する構成となし線材全面にフラックスを
塗布する方法は、簡単な手段で効率よくフラックスを塗
布でき、工業的量産等に最適である。The above-mentioned flux applied to the entire outer circumference of the metal material is preferably selected from known fluxes according to various conditions such as solder composition and plating bath temperature, and zinc chloride and ammonium chloride are particularly preferable. Water soluble flux is preferred. As a method of applying the flux to the metal material, any means can be adopted as long as it can be applied to the entire outer periphery of the metal material before the metal material is immersed in the plating bath. The structure in which the metallic material passes and the method of applying the flux to the entire surface of the non-cored wire can apply the flux efficiently by a simple means and is most suitable for industrial mass production.
【００１７】溶融半田めっき浴中を通過する金属材料
は、その表面温度が溶融半田温度と同等温度まで昇温さ
れていることが必要で、表面温度が溶融半田温度より低
いと金属材料の表面がフラックスによって活性化せず、
有効な濡れ性が得られない。従って、所要の金属材料の
表面温度を得るためには、めっき浴の温度とともに後述
する金属材料の引き上げ速度等とも関連する金属材料の
浸漬時間等を考慮し、フラックス塗布前にある程度昇温
しておくか、めっき浴に十分浸漬するなどの手段を適宜
選定することが望ましい。事前に金属材料を昇温するに
は、環状炉を用いたり、光加熱、ガス加熱、通電加熱、
電磁誘導加熱などの各種加熱方法などが適宜選定でき、
ステンレス鋼線の場合は特にフラックス塗布前に昇温す
ることが望ましい。The metallic material passing through the molten solder plating bath must have its surface temperature raised to a temperature equal to the molten solder temperature. If the surface temperature is lower than the molten solder temperature, the surface of the metallic material will be Not activated by flux,
Effective wettability cannot be obtained. Therefore, in order to obtain the required surface temperature of the metal material, consider the immersion time of the metal material, which is related to the temperature of the plating bath and the pulling rate of the metal material described later, etc., and raise the temperature to some extent before applying the flux. It is desirable to appropriately select a means such as leaving it or immersing it sufficiently in a plating bath. To heat the metal material in advance, use a ring furnace, light heating, gas heating, electric heating,
Various heating methods such as electromagnetic induction heating can be selected appropriately,
In the case of stainless steel wire, it is especially desirable to raise the temperature before applying the flux.
【００１８】また、この発明によるめっき表面平滑化方
法を施す前の部分半田めっき方法としては公知のめっき
方法ほか、発明者が先に提案（特開平２−１７６２１号
公報）した、金属線の外周面に一定間隔で転写ロールに
載せた半田ペーストを転写してフュージングする方法
や、マスク材を用いた印刷手法によるものを採用するこ
とができる。例えば、マスク材を用いた印刷手法により
アイランド状に部分半田めっきを設ける場合、初期めっ
きで表面に凹凸が残存しても、続いてこの発明によるめ
っき表面平滑化方法の油塗布・めっき浴浸漬・引き上げ
工程を繰り返して施すことにより、簡単に１〜１５μｍ
厚み範囲で任意の厚みに均一なめっきを設けることがで
きる。Further, as a partial solder plating method before applying the plating surface smoothing method according to the present invention, in addition to a known plating method, the inventor has previously proposed (JP-A-2-17621) an outer periphery of a metal wire. It is possible to adopt a method of transferring and fusing the solder paste placed on a transfer roll on the surface at a constant interval, or a printing method using a mask material. For example, when partial solder plating is provided in an island shape by a printing method using a mask material, even if unevenness remains on the surface in the initial plating, oil plating, plating bath immersion By repeatedly performing the pulling process, 1 to 15 μm can be easily performed.
Uniform plating can be provided in any thickness within the thickness range.
【００１９】この発明において、対象とする金属材料
は、鉄、銅、ステンレス、Ｆｅ−Ｎｉ合金、Ｆｅ−Ｃｕ
合金、コバール、銅合金などから用途や必要とする特性
などに応じて適宜選択でき、形状も線材、棒材、板材な
どを適宜選択できる。In the present invention, the target metallic material is iron, copper, stainless steel, Fe-Ni alloy, Fe-Cu.
It can be appropriately selected from alloys, Kovar, copper alloys, etc. according to the application and required characteristics, and the shape can also be appropriately selected from wire rods, rods, plates and the like.
【００２０】この発明において、溶融半田めっき浴の組
成は、公知のいずれの半田組成のものでも採用できる。
また、めっき浴温度は、当然半田の融点以上であるが、
ＳｎとＰｂとの組成比に応じて、最適温度を選定するこ
とが望ましい。また、溶融半田めっき浴槽としては、公
知のいずれのめっき浴槽をも採用できるが、特に良好な
る半田膜を形成するためには、金属材料が定温度で常に
新鮮な溶融半田内を通過できる噴流式半田めっき浴槽を
用いることが好ましい。In the present invention, the composition of the molten solder plating bath may be any known solder composition.
Also, the plating bath temperature is naturally higher than the melting point of the solder,
It is desirable to select the optimum temperature according to the composition ratio of Sn and Pb. Further, as the molten solder plating bath, any known plating bath can be adopted, but in order to form a particularly good solder film, the jet type in which the metal material can always pass through the fresh molten solder at a constant temperature. It is preferable to use a solder plating bath.
【００２１】この発明において、めっき浴からの金属材
料の引き上げ方法は、金属材料をめっき浴表面より上方
に引き上げるが、半田の被着偏りがなく、均一な厚みの
めっき膜が得られるように、垂直から３０°以内の傾斜
で引き上げる必要があり、さらに加熱不活性ガスを噴き
つけ効果を十分に得るために好ましくは垂直から１０°
以内の傾斜範囲内で引き上げる必要があり、最も好まし
くは垂直方向に引き上げることが必要である。また、金
属材料の引き上げ速度は、１ｍ／分〜５０ｍ／分が好ま
しい。引き上げ速度が１ｍ／分未満では、生産能率が非
常に悪く、また、５０ｍ／分を超える引き上げ速度で
は、一般的な大きさの浴槽では先のめっき温度が溶融半
田温度程度まで昇温することなく引き上げられ、表面が
平滑化された半田めっき膜が得られない。In the present invention, the method of pulling up the metal material from the plating bath pulls up the metal material above the surface of the plating bath. However, there is no uneven deposition of solder and a plating film having a uniform thickness can be obtained. It is necessary to pull up at an angle within 30 ° from the vertical, and preferably 10 ° from the vertical in order to obtain a sufficient effect by spraying a heated inert gas.
It is necessary to pull up within the tilt range within, and most preferably vertical pulling. The pulling rate of the metal material is preferably 1 m / min to 50 m / min. When the pulling rate is less than 1 m / min, the production efficiency is very poor, and when the pulling rate is more than 50 m / min, the plating temperature does not rise to about the molten solder temperature in a bath having a general size. It is not possible to obtain a solder plating film that has been pulled up and has a smooth surface.
【００２２】この発明において、めっき浴からほぼ垂直
方向に引き上げられるめっき金属材料に加熱不活性ガス
を噴きつけることが好ましく、不活性ガスとしてはＮ2
ガスまたはＡｒガスなどを使用することができ、いずれ
も濃度は５ｖｏｌ％以上とすることが望ましい。この加
熱不活性ガスによって、半田が溶着・凝固しつつある金
属材料表面周辺の酸素を除去し、半田表面の酸化を防ぐ
ことができ、例えば金属材料のほぼ垂直方向の引き上げ
直後から所要高さまでの金属材料表面周辺雰囲気を不活
性ガス雰囲気とするのもよい。In the present invention, it is preferable to spray a heated inert gas onto the plating metal material which is pulled up from the plating bath in a substantially vertical direction, and the inert gas is N 2
Gas or Ar gas can be used, and the concentration of each gas is preferably 5 vol% or more. This heated inert gas removes oxygen around the surface of the metal material where the solder is welding and solidifying, and prevents oxidation of the surface of the solder. For example, from immediately after pulling up the metal material in a substantially vertical direction to the required height. The atmosphere around the metal material surface may be an inert gas atmosphere.
【００２３】加熱不活性ガスの噴きつけに際し、溶融半
田めっき浴表面等に存在するスラッジや、金属材料に溶
着した半田が大気中の酸素と反応してできるスラッジ等
の巻き込みを防ぐためには、ガスノズルをできるだけ金
属材料に近づけて金属材料表面に平行に引き上げ方向と
は逆方向に吹きつけることが望ましい。また、ガスノズ
ルの吹き出し口を溶融めっき浴表面近くに配置すること
により、半田表面の酸化防止、スラッジ等の巻き込み防
止効果が著しく、ガスノズルも単に管口を金属材料に近
づけて下向きに配置するほか、金属材料の外周面に均一
に噴きつけるよう金属材料の外周面に近接させたリング
状のものなどを適宜採用できる。When the heated inert gas is sprayed, in order to prevent the inclusion of sludge existing on the surface of the molten solder plating bath or sludge formed by the reaction of the solder deposited on the metal material with the oxygen in the atmosphere, the gas nozzle is used. It is desirable to blow the as close to the metal material as possible and to spray it in a direction opposite to the pulling direction in parallel with the surface of the metal material. In addition, by arranging the outlet of the gas nozzle near the surface of the hot dip plating bath, the effect of preventing the oxidation of the solder surface and the inclusion of sludge etc. is remarkable, and the gas nozzle is also placed downward with the tube mouth simply approaching the metal material. A ring-shaped member close to the outer peripheral surface of the metal material or the like can be appropriately adopted so as to be uniformly sprayed onto the outer peripheral surface of the metal material.
【００２４】加熱不活性ガスの温度は、４０°Ｃから半
田融点が好ましく、特に半田の融点より３０°Ｃほど低
い温度が好ましい。不活性ガスの加熱方法は、実施例に
示す如くガス配管をめっき浴中に引き回して所要温度に
昇温させるほか、別途加熱装置、熱交換器等にて昇温さ
せるなどの手段を採用できる。また、加熱不活性ガスの
噴き出し量は、３〜５０ｌ／分が望ましい。The temperature of the heated inert gas is preferably 40 ° C. to the melting point of the solder, and particularly preferably 30 ° C. lower than the melting point of the solder. As a heating method of the inert gas, as shown in the examples, other means such as drawing the gas pipe into the plating bath to raise the temperature to a required temperature, or separately raising the temperature with a heating device, a heat exchanger, or the like can be adopted. The amount of heated inert gas blown out is preferably 3 to 50 l / min.
【００２５】この発明において、めっき表面平滑化後の
金属材料の冷却は、大気中にて自然に冷却しても良い
が、必要に応じて不活性ガス中にて冷却しても良い。In the present invention, the metal material after the smoothing of the plating surface may be naturally cooled in the atmosphere, but may be cooled in an inert gas as necessary.
【００２６】この発明によるめっき表面平滑化方法は、
実施例に示す如く、金属材料の外周に溶着する半田めっ
きの厚さを従来になく薄く均一化でき、かつ安定して製
造することができるが、偏肉率が劣るものが僅かに不良
品として発生する場合、金属材料を溶融半田めっき浴か
ら上方に引き上げる際に、該金属材料に直交方向の振
動、すなわち垂直方向の引上げ時に水平方向の振動を与
えることが望ましく、該横振動を与えることによって、
余分な半田を落とし、偏肉のない均一なめっきが可能と
なり、上記の不良品発生率を０とすることができる。振
動数は、通常５０Ｈｚ〜１０００Ｈｚ程度の範囲で設定
することが望ましく、さらに望ましくは８０Ｈｚ〜３０
０Ｈｚ程度である。The plating surface smoothing method according to the present invention comprises:
As shown in the examples, the thickness of the solder plating deposited on the outer periphery of the metal material can be made thinner and more uniform than ever before, and stable manufacturing is possible, but the one with a poor thickness deviation is slightly defective. When it occurs, when the metal material is pulled upward from the molten solder plating bath, it is desirable to give the metal material a vibration in the orthogonal direction, that is, a horizontal vibration at the time of pulling in the vertical direction. ,
Excess solder can be dropped, uniform plating without uneven thickness can be performed, and the defective product occurrence rate can be reduced to zero. The frequency is preferably set within a range of about 50 Hz to 1000 Hz, and more preferably 80 Hz to 30 Hz.
It is about 0 Hz.
【００２７】[0027]
【実施例】半田溶融めっき方法を実施するためのめっき
装置は図１の左側（下側）に示すように、図示しない巻
戻し装置から送り出される金属材料１を、めっき浴槽２
周縁に配置するロール３とめっき浴４中に配置するシン
カーロール５間を通して溶融半田めっき浴４に浸漬した
後、シンカーロール５とその上方の浴外に配置されるタ
ーンロール６間をめっき浴に対して垂直方向に引き上
げ、ターンロール６で所要方向に転向して巻取り機にて
巻き取られるか、ルーパーに溜められて後述するこの発
明のめっき表面平滑化方法を実施するための図１の右側
（上側）に示す表面平滑化装置へ送られる。また金属材
料１はめっき浴４に浸漬される前に水溶性フラックスで
湿したフェルト７中を通過させてフラックスが塗布され
る。めっき浴４中を引き回して所要位置で立ち上がる不
活性ガス配管８は、金属材料１に平行にかつ管口が下向
きに配置されたガスノズル９，９を有し、同部より所定
の温度に加熱された加熱不活性ガスが引き上げられる金
属材料１に平行にめっき浴４方向に噴射する構成からな
る。EXAMPLE As shown in the left side (lower side) of FIG. 1, the plating apparatus for carrying out the solder hot dip plating method uses a metal bath 1 fed from a rewinding device (not shown) and a plating bath 2
After being immersed in the molten solder plating bath 4 through a roll 3 arranged at the periphery and a sinker roll 5 arranged in a plating bath 4, a space between the sinker roll 5 and a turn roll 6 arranged outside the bath is used as a plating bath. On the other hand, it is pulled up in the vertical direction, turned to a required direction by a turn roll 6 and wound up by a winder, or is stored in a looper and is used for carrying out a plating surface smoothing method of the present invention described later. It is sent to the surface smoothing device shown on the right side (upper side). Further, the metal material 1 is passed through a felt 7 moistened with a water-soluble flux before being dipped in the plating bath 4 to apply the flux. The inert gas pipe 8 which is drawn around the plating bath 4 and rises at a required position has gas nozzles 9 and 9 arranged in parallel with the metal material 1 and with its pipe mouth facing downward, and is heated to a predetermined temperature from the same portion. The heated inert gas is sprayed in the direction of the plating bath 4 in parallel with the metallic material 1 to be pulled up.
【００２８】また、この発明によるめっき表面平滑化方
法を実施するための表面平滑化装置は、前記ルーパーか
ら送り出される表面に半田を溶着した金属材料１を、め
っき浴槽１１の周縁に配置するロール１２とめっき浴１
３中に配置するシンカーロール１４間を通して溶融半田
めっき浴１３に浸漬した後、シンカーロール１４とその
上方の浴外に配置されるターンロール１６間をめっき浴
に対して垂直方向に引き上げ、ターンロール１６で所要
方向に転向して巻取り機１７にて巻き取られる。また金
属材料１はめっき浴１３に浸漬される前に灯油で湿した
フェルト１０中を通過させて所要量の灯油が塗布され
る。めっき浴１３中を引き回して所要位置で立ち上がる
不活性ガス配管１８は、金属材料１に平行にかつ管口が
下向きに配置されたガスノズル１９，１９を有し、同部
より所定の温度に加熱された加熱不活性ガスが引き上げ
られる金属材料１に平行にめっき浴１３方向に噴射する
構成からなる。また、めっき浴１３に対して垂直方向に
引き上げられた金属材料１は、水平方向の振動が与えら
れるようにバイブレーター１５がターン ロール１６の
下方に配置してある。Further, the surface smoothing apparatus for carrying out the plating surface smoothing method according to the present invention has a roll 12 for arranging the metal material 1 having solder deposited on the surface delivered from the looper at the periphery of the plating bath 11. And plating bath 1
After being immersed in the molten solder plating bath 13 through the sinker rolls 14 disposed in the No. 3, the sinker rolls 14 and the turn rolls 16 disposed above the turn rolls 16 are pulled up in the direction perpendicular to the plating bath, It is turned to a required direction at 16 and wound up by a winder 17. Further, the metal material 1 is passed through the felt 10 moistened with kerosene before being immersed in the plating bath 13, and a required amount of kerosene is applied. An inert gas pipe 18 which is drawn around the plating bath 13 and rises at a required position has gas nozzles 19 and 19 which are arranged in parallel with the metal material 1 and whose pipe openings face downward, and is heated to a predetermined temperature from the same portion. The heating inert gas is sprayed in the direction of the plating bath 13 in parallel with the metallic material 1 to be pulled up. Further, in the metallic material 1 pulled up in the vertical direction with respect to the plating bath 13, the vibrator 15 is arranged below the turn roll 16 so that horizontal vibration is applied.
【００２９】実施例１ 上述のめっき装置を用い、４２Ｎｉ−Ｆｅ合金線にフラ
ックスを塗布することなく、組成６３Ｓｎ−Ｐｂの２７
０°Ｃの溶融半田めっき浴に浸漬して１０ｍ／分の速度
で引き上げる条件で溶融めっきを実施した。その結果、
４２Ｎｉ−Ｆｅ合金線に厚み最小１μｍ、最大１００μ
ｍ、平均めっき厚さ２０μｍで偏肉率が８５％の半田め
っきを設けた。次に、この発明による表面平滑化装置に
て、上記はんだめっき線に灯油（商品名 出光＃１０）
を塗布したのち、組成６３Ｓｎ−Ｐｂの２８０°Ｃの溶
融半田めっき浴に浸漬して３０ｍ／分の速度で引き上げ
る条件、すなわち浸漬時間０．５秒の条件で半田表面の
平滑化を実施した。その結果、４２Ｎｉ−Ｆｅ合金線に
設けた半田めっきが、最小２μｍ、最大１５μｍ、平均
めっき厚さ８μｍで偏肉率が９５％に平滑化されてい
る。Example 1 Using the above-described plating apparatus, 27 of composition 63Sn-Pb was prepared without applying flux to the 42Ni-Fe alloy wire.
The hot dip plating was carried out under the condition of being immersed in a hot solder plating bath at 0 ° C and being pulled up at a speed of 10 m / min. as a result,
42Ni-Fe alloy wire with minimum thickness of 1μm and maximum of 100μ
m, the average plating thickness was 20 μm, and the solder plating having an uneven thickness ratio of 85% was provided. Next, with the surface smoothing device according to the present invention, kerosene (product name: Idemitsu # 10) was applied to the solder-plated wire.
Was applied, and the solder surface was smoothed under the condition of being dipped in a molten solder plating bath of composition 63Sn-Pb at 280 ° C. and pulled up at a speed of 30 m / min, that is, under the condition of dipping time of 0.5 seconds. As a result, the solder plating provided on the 42Ni—Fe alloy wire was smoothed to a minimum thickness of 2 μm, a maximum of 15 μm, an average plating thickness of 8 μm, and an uneven thickness ratio of 95%.
【００３０】実施例２ 上述のめっき装置を用い、４２Ｎｉ−Ｆｅ合金線に塩化
亜鉛と塩化アンモニウムからなる水溶性フラックスを塗
布したのち、組成６３Ｓｎ−Ｐｂの２７０°Ｃの溶融半
田めっき浴に浸漬して１０ｍ／分の速度で引き上げる
際、ガスノズル先端位置をめっき浴表面から５ｍｍに設
定し、１２０°Ｃの純Ｎ2ガスをガス量５ｌ／分で噴射
する条件で溶融めっきを実施した。その結果、４２Ｎｉ
−Ｆｅ合金線に最小１μｍ、最大５０μｍ、平均めっき
厚さ１５μｍで偏肉率が９０％の半田めっきを設けた。
次に、この発明による表面平滑化装置にて、実施例１と
同条件で引き上げる際、ガスノズル先端位置をめっき浴
表面から５ｍｍに設定し、１２０°Ｃの純Ｎ2ガスをガ
ス量５ｌ／分で噴射する条件で、半田表面の平滑化を実
施した。その結果、４２Ｎｉ−Ｆｅ合金線に設けた部分
半田めっきが、最小２μｍ、最大１５μｍ、平均めっき
厚さ５μｍで偏肉率が９８％に平滑化された。Example 2 Using the above-mentioned plating apparatus, a 42Ni-Fe alloy wire was coated with a water-soluble flux composed of zinc chloride and ammonium chloride, and then immersed in a molten solder plating bath having a composition of 63Sn-Pb at 270 ° C. When the gas was pulled up at a speed of 10 m / min, the tip position of the gas nozzle was set to 5 mm from the surface of the plating bath, and hot dipping was carried out under the condition that pure N 2 gas at 120 ° C. was sprayed at a gas amount of 5 l / min. As a result, 42Ni
A solder plating having a minimum thickness of 1 μm, a maximum thickness of 50 μm, an average plating thickness of 15 μm and an uneven thickness ratio of 90% was provided on the —Fe alloy wire.
Next, with the surface smoothing device according to the present invention, when pulling up under the same conditions as in Example 1, the gas nozzle tip position was set to 5 mm from the plating bath surface, and pure N 2 gas at 120 ° C. was added at a gas amount of 5 l / min. The surface of the solder was smoothed under the condition of spraying with. As a result, the partial solder plating formed on the 42Ni—Fe alloy wire was smoothed to a minimum thickness of 2 μm, a maximum of 15 μm, an average plating thickness of 5 μm, and an uneven thickness ratio of 98%.
【００３１】実施例３ 実施例２において、表面平滑化装置の振動数１００Ｈｚ
のバイブレーターを作動させて半田表面の平滑化を実施
したところ、上記の９５％以下のの偏肉率の不良品発生
率が無使用時の０．５％から０％となり、全品が従来に
ない低偏肉率の半田めっきが被着されていた。Example 3 In Example 2, the frequency of the surface smoothing device was 100 Hz.
When the surface of the solder was smoothed by operating the vibrator, the defective product occurrence rate of the uneven thickness ratio of 95% or less was changed from 0.5% when not in use to 0%, and all products were unprecedented. Solder plating with a low thickness deviation was applied.
【００３２】実施例４ 直径０．６ｍｍの４２Ｎｉ−Ｆｅ合金線に所要ピッチで
転写ロールに載せた半田ペーストを転写してフェージン
グすることにより１０ｍｍ長さのはんだ被着部を設け
た。その結果、図２のＡに示す如く、４２Ｎｉ−Ｆｅ合
金線に厚み最小１μｍ、最大１５０μｍ、平均めっき厚
さ２５μｍの部分半田めっきを設けた。次に、この発明
による表面平滑化装置にて、上記はんだめっき線に灯油
（商品名 出光＃１０）を塗布したのち、組成６３Ｓｎ
−Ｐｂの２８０°Ｃの溶融半田めっき浴に浸漬して３０
ｍ／分の速度、すなわち浸漬時間０．５秒の条件で引き
上げ、その際にガスノズル先端位置をめっき浴表面から
５ｍｍに設定し、１２０°Ｃの純Ｎ2ガスをガス量５ｌ
／分で噴射する条件で半田めっき表面の平滑化を実施し
た。その結果、図２のＢに示す如く、４２Ｎｉ−Ｆｅ合
金線に設けた部分半田めっきが、最小２μｍ、最大１５
μｍ、平均めっき厚さ５μｍで偏肉率が９８％に平滑化
された。Example 4 A solder adhered portion having a length of 10 mm was provided by transferring a solder paste placed on a transfer roll at a required pitch to a 42 Ni—Fe alloy wire having a diameter of 0.6 mm and fading. As a result, as shown in FIG. 2A, the 42Ni—Fe alloy wire was provided with partial solder plating having a minimum thickness of 1 μm, a maximum thickness of 150 μm, and an average plating thickness of 25 μm. Next, kerosene (product name: Idemitsu # 10) was applied to the solder-plated wire with the surface smoothing device according to the present invention, and then the composition 63Sn was used.
-Pb immersed in a 280 ° C molten solder plating bath for 30
At a speed of m / min, that is, at a dipping time of 0.5 seconds, the gas nozzle tip position was set to 5 mm from the surface of the plating bath, and pure N 2 gas at 120 ° C. was added in a gas amount of 5 l.
The surface of the solder plating was smoothed under the condition of spraying at a speed of 1 / min. As a result, as shown in FIG. 2B, the partial solder plating provided on the 42Ni—Fe alloy wire had a minimum of 2 μm and a maximum of 15
The thickness deviation was smoothed to 98% at a thickness of 5 μm and an average plating thickness of 5 μm.
【００３３】実施例５ 上述のめっき装置を用い、リン青銅（組成６Ｓｎ−０．
０３Ｐ−Ｃｕ）帯材、ベリリウム銅（組成１．９Ｂｅ−
Ｃｕ）帯材にフラックスとして塩化亜鉛＋塩化アンモニ
ウムを塗布し、組成６３Ｓｎ−Ｐｂの２７０°Ｃの溶融
半田めっき浴に浸漬して１０ｍ／分の速度で引き上げる
条件で溶融めっきを実施した。その結果、各帯材に厚み
最小３μｍ、最大２００μｍの半田めっきを設けた。次
に、この発明による表面平滑化装置にて、上記半田めっ
き帯材に灯油（商品名 出光＃１０）を塗布したのち、
組成６３Ｓｎ−Ｐｂの２８０°Ｃの溶融半田めっき浴に
浸漬して、引き上げ速度３０ｍ／分、浸漬時間０．５
秒、バイブレーターの振動数１００Ｈｚ、ガスノズル先
端位置をめっき浴表面から５ｍｍに設定し、１２０°Ｃ
の純Ｎ2ガスをガス量５ｌ／分で噴射する条件で半田め
っき表面の平滑化を実施した。その結果、各帯材に設け
た半田めっきは、最小２μｍ、最大１０μｍ厚さに平滑
化された。Example 5 Phosphor bronze (composition 6Sn-0.
03P-Cu) strip material, beryllium copper (composition 1.9Be-
Zinc chloride + ammonium chloride as a flux was applied to the Cu) strip material, and the hot dipping was carried out under the condition that it was immersed in a molten solder plating bath of composition 63Sn-Pb at 270 ° C and pulled up at a speed of 10 m / min. As a result, each strip was provided with solder plating having a minimum thickness of 3 μm and a maximum thickness of 200 μm. Next, after applying kerosene (product name: Idemitsu # 10) to the solder plating strip with the surface smoothing device according to the present invention,
Immersion in a molten solder plating bath of composition 63Sn-Pb at 280 ° C., pulling speed 30 m / min, immersion time 0.5
Second, the vibration frequency of the vibrator 100 Hz, the gas nozzle tip position is set to 5 mm from the plating bath surface, 120 ° C
The surface of the solder plating was smoothed under the condition that the pure N 2 gas of was sprayed at a gas amount of 5 l / min. As a result, the solder plating provided on each strip was smoothed to a minimum thickness of 2 μm and a maximum thickness of 10 μm.
【００３４】実施例６ ３６Ｎｉ−Ｆｅ合金帯材の所要位置に転写ロールに載せ
た所要幅の半田ペーストを転写してフェージングするこ
とにより長手方向にストライプ状に半田被着部を設け
た。その結果、帯材に厚み最小３μｍ、最大２００μｍ
のストライプ状錫めっきを設けた。次に、この発明によ
る表面平滑化装置にて、上記錫めっき帯材に灯油（商品
名出光＃１０）を塗布したのち、組成１００％Ｓｎの２
７０°Ｃの溶融錫めっき浴に浸漬して、引き上げ速度３
０ｍ／分、浸漬時間０．５秒、バイブレーターの振動数
１００Ｈｚ、ガスノズル先端位置をめっき浴表面から５
ｍｍに設定し、１２０°Ｃの純Ｎ2ガスをガス量５ｌ／
分で噴射する条件で錫めっき表面の平滑化を実施した。
その結果、帯材に設けた錫めっきは、最小２μｍ、最大
７μｍ厚さに平滑化された。Example 6 A solder adhered portion was provided in a stripe shape in the longitudinal direction by transferring a solder paste having a required width placed on a transfer roll to a required position of a 36 Ni—Fe alloy strip and fading. As a result, the strip material has a minimum thickness of 3 μm and a maximum thickness of 200 μm.
Striped tin plating of. Next, kerosene (product name Idemitsu # 10) was applied to the tin-plated strip using the surface smoothing device according to the present invention, and then 2% of composition 100% Sn was applied.
Immerse in hot-dip tin bath at 70 ° C and pull up speed 3
0 m / min, dipping time 0.5 sec, vibrator frequency 100 Hz, gas nozzle tip position 5 from plating bath surface
mm, and a pure N 2 gas at 120 ° C. was used for a gas amount of 5 l /
The tin-plated surface was smoothed under the condition of spraying in minutes.
As a result, the tin plating provided on the strip was smoothed to a minimum thickness of 2 μm and a maximum thickness of 7 μm.
【００３５】実施例７ 上述のめっき装置を用い、ＳＵＳ３０４のステンレス鋼
帯に転写ロールに載せた半田ペースト（６３Ｓｎ−Ｐ
ｂ）を長手方向にアイランド状に転写した後、フュージ
ングして固着して各帯材に厚み最小３μｍ、最大２００
μｍの半田めっきを設けた。次に、この発明による表面
平滑化装置にて、上記半田めっき帯材に灯油（商品名
出光＃１０）を塗布したのち、組成６３Ｓｎ−Ｐｂの２
８０°Ｃの溶融半田めっき浴に浸漬して、引き上げ速度
３０ｍ／分、浸漬時間０．５秒、バイブレーターの振動
数１００Ｈｚ、ガスノズル先端位置をめっき浴表面から
５ｍｍに設定し、１２０°Ｃの純Ｎ2ガスをガス量５ｌ
／分で噴射する条件で行う半田めっき表面の平滑化を２
回連続してこの発明を実施した。その結果、各帯材に設
けた半田めっきは、最小２μｍ、最大７μｍ厚さに平滑
化された。Example 7 Using the above-mentioned plating apparatus, a solder paste (63Sn-P) placed on a transfer roll on a stainless steel strip of SUS304.
After b) is transferred in the shape of an island in the longitudinal direction, it is fused and fixed to each strip to a minimum thickness of 3 μm and a maximum of 200.
A μm solder plating was provided. Next, with the surface smoothing device according to the present invention, kerosene (product name
After applying Idemitsu # 10), 2 of composition 63Sn-Pb was applied.
Immersion in a molten solder plating bath at 80 ° C, pulling speed 30 m / min, immersion time 0.5 sec, vibrator frequency 100 Hz, gas nozzle tip position set to 5 mm from plating bath surface, 120 ° C pure The amount of N 2 gas is 5 liters
Smoothing of the solder plating surface under the condition of spraying at 2 / min.
The present invention was carried out consecutively. As a result, the solder plating provided on each strip was smoothed to a minimum thickness of 2 μm and a maximum thickness of 7 μm.
【００３６】[0036]
【発明の効果】この発明は、所要の半田めっきを完了し
た金属材料の外周全面に灯油等の溶融半田めっき浴の温
度以下で蒸発する油を塗布し、再度、溶融半田めっき浴
中を通過させ、引上げ時に金属材料に加熱不活性ガスを
噴きつけたり、あるいはさらに金属材料を振動させるこ
とにより、塗布した油が半田めっき浴中でガス状となっ
て材料表面を保護して新たな半田を付着させることな
く、引き上げ時に表面張力や重力により被着部の余分な
半田を溶湯中へ移動させ、半田めっき膜の表面の平滑化
を図ることができ偏肉率を小さくできる。According to the present invention, oil that evaporates below the temperature of the molten solder plating bath such as kerosene is applied to the entire outer circumference of the metal material for which the required solder plating has been completed, and the molten solder plating bath is passed again. By spraying a heated inert gas on the metal material when pulling it up, or by further vibrating the metal material, the applied oil becomes a gas in the solder plating bath to protect the material surface and attach new solder. Without this, excess solder on the adhered portion can be moved into the molten metal by surface tension or gravity during pulling up, the surface of the solder plating film can be smoothed, and the uneven thickness ratio can be reduced.
【００３７】さらに、この発明にて得られる被めっき金
属材料の用途として、従来からある半田めっき線や半田
めっきＣＰ線の用途だけでなく、ＥＬ（エリンバー）、
形状記憶合金等、あらゆる用途や機能性を持つ金属材料
に半田または錫めっきを施すことができ、かつめっき表
面が極めて均一に平滑化され、細い中空パイプのシー
ル、回路構成部品等に活用でき、電子部品用材料として
その用途を拡大できる。Further, as the use of the metal material to be plated obtained by the present invention, not only the use of the conventional solder-plated wire and the CP-solder-plated wire but also EL (elinvar),
It is possible to apply solder or tin plating to metal materials with various uses and functionality such as shape memory alloys, and the plated surface is smoothed extremely uniformly, which can be used for sealing thin hollow pipes, circuit components, etc. The use can be expanded as a material for electronic parts.
【図１】めっき装置とこの発明による半田表面の平滑化
方法を実施するための表面平滑化装置の構成を示す説明
図である。FIG. 1 is an explanatory diagram showing a configuration of a plating apparatus and a surface smoothing apparatus for carrying out a solder surface smoothing method according to the present invention.
【図２】半田表面の状態を示す説明図である。Ａは平滑
化方法の実施前、Ｂは平滑化方法の実施後を示す。FIG. 2 is an explanatory diagram showing a state of a solder surface. A shows before performing the smoothing method, and B shows after performing the smoothing method.
１ 金属材料 ２，１１ めっき浴槽 ３，１２ ロール ４，１３ めっき浴 ５，１４ シンカーロール ６，１６ ターンロール ７，１０ フェルト ８，１８ 不活性ガス配管 ９，１９ ガスノズル １５ バイブレーター １７ 巻取り機 1 Metallic Material 2,11 Plating Bath 3,12 Roll 4,13 Plating Bath 5,14 Sinker Roll 6,16 Turn Roll 7,10 Felt 8,18 Inert Gas Pipe 9,19 Gas Nozzle 15 Vibrator 17 Winder
Claims (4)
融めっきを設けた金属材料の全面に溶融半田または錫め
っき浴の温度以下で蒸発する油を塗布した後、該溶融め
っき浴中を通過させてめっきを再溶融させ、めっき浴か
ら上方に引き上げてめっき厚みの均一性を改善すること
を特徴とする半田または錫溶融めっき材のめっき表面平
滑化方法。1. An oil that evaporates below the temperature of the molten solder or tin plating bath is applied on the entire surface or on the entire surface of a metal material on which hot dipping of solder or tin is provided, and then pass through the molten plating bath. A method for smoothing the plating surface of a solder or tin hot-dip plated material, characterized in that the plating is re-melted and pulled up from the plating bath to improve the uniformity of the plating thickness.
料に加熱不活性ガスを噴きつけながら引き上げることを
特徴とする請求項１記載の半田または錫溶融めっき材の
めっき表面平滑化方法。2. The method for smoothing the plating surface of a solder or tin hot-dip plated material according to claim 1, wherein the metal material is pulled up while spraying a heated inert gas when it is pulled up from the plating bath.
料に振動を加えながら引き上げることを特徴とする請求
項２記載の半田または錫溶融めっき材のめっき表面平滑
化方法。3. The method for smoothing the plating surface of a solder or tin hot-dip plated material according to claim 2, wherein the metal material is lifted while vibrating when being lifted from the plating bath.
し再溶融させてめっき浴から上方に引き上げる工程を繰
り返すことを特徴とする請求項２または請求項３記載の
半田または錫溶融めっき材のめっき表面平滑化方法。4. The solder or tin hot-dip plated material according to claim 2 or 3, wherein the steps of applying oil, immersing it in a hot-dip galvanizing bath, re-melting it, and pulling it upward from the galvanizing bath are repeated. Method for smoothing plating surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23414591A JP2808200B2 (en) | 1991-08-20 | 1991-08-20 | Method for smoothing plating surface of solder or tin hot-dip material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23414591A JP2808200B2 (en) | 1991-08-20 | 1991-08-20 | Method for smoothing plating surface of solder or tin hot-dip material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05106006A true JPH05106006A (en) | 1993-04-27 |
| JP2808200B2 JP2808200B2 (en) | 1998-10-08 |
Family
ID=16966353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23414591A Expired - Lifetime JP2808200B2 (en) | 1991-08-20 | 1991-08-20 | Method for smoothing plating surface of solder or tin hot-dip material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2808200B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102006057178A1 (en) * | 2006-12-03 | 2008-06-05 | Waldemar Hoening Ohg | network |
| WO2013187362A1 (en) * | 2012-06-11 | 2013-12-19 | 千住金属工業株式会社 | Device for coating thin molten solder film, thin solder film-covered component and manufacturing method therefor |
| CN114437394A (en) * | 2020-11-06 | 2022-05-06 | 湖南七点钟文化科技有限公司 | Zinc-based high-resistance film coating liquid, preparation method thereof and preparation method of zinc-based high-resistance film |
-
1991
- 1991-08-20 JP JP23414591A patent/JP2808200B2/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102006057178A1 (en) * | 2006-12-03 | 2008-06-05 | Waldemar Hoening Ohg | network |
| WO2013187362A1 (en) * | 2012-06-11 | 2013-12-19 | 千住金属工業株式会社 | Device for coating thin molten solder film, thin solder film-covered component and manufacturing method therefor |
| CN104395029A (en) * | 2012-06-11 | 2015-03-04 | 千住金属工业株式会社 | Device for coating thin molten solder film, thin solder film-covered component and manufacturing method therefor |
| KR20150028986A (en) * | 2012-06-11 | 2015-03-17 | 센주긴조쿠고교 가부시키가이샤 | Device for coating thin molten solder film, thin solder film-covered component and manufacturing method therefor |
| US9956634B2 (en) | 2012-06-11 | 2018-05-01 | Senju Metal Industry Co., Ltd. | Device for coating thin molten solder film, thin solder film-covered component and manufacturing method therefor |
| CN114437394A (en) * | 2020-11-06 | 2022-05-06 | 湖南七点钟文化科技有限公司 | Zinc-based high-resistance film coating liquid, preparation method thereof and preparation method of zinc-based high-resistance film |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2808200B2 (en) | 1998-10-08 |
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