JPH0499838U - - Google Patents
Info
- Publication number
- JPH0499838U JPH0499838U JP1991005005U JP500591U JPH0499838U JP H0499838 U JPH0499838 U JP H0499838U JP 1991005005 U JP1991005005 U JP 1991005005U JP 500591 U JP500591 U JP 500591U JP H0499838 U JPH0499838 U JP H0499838U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
- G01N21/9503—Wafer edge inspection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991005005U JPH0499838U (ja) | 1991-02-08 | 1991-02-08 | |
| US07/833,096 US5233203A (en) | 1991-02-08 | 1992-02-10 | Apparatus for detecting surface defects on a semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991005005U JPH0499838U (ja) | 1991-02-08 | 1991-02-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0499838U true JPH0499838U (ja) | 1992-08-28 |
Family
ID=11599444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991005005U Pending JPH0499838U (ja) | 1991-02-08 | 1991-02-08 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US5233203A (ja) |
| JP (1) | JPH0499838U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116465730A (zh) * | 2023-02-21 | 2023-07-21 | 湖南中核岩土工程有限责任公司 | 一种地质岩土勘察强度试验装置 |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5790252A (en) * | 1995-09-27 | 1998-08-04 | Shin-Etsu Handotai Co., Ltd. | Method of and apparatus for determining residual damage to wafer edges |
| US5701174A (en) * | 1996-07-15 | 1997-12-23 | Taiwan Semiconductor Manufacturing Company Ltd. | Template mask for assisting in optical inspection of oxidation induced stacking fault (OISF) |
| US5747794A (en) * | 1996-10-16 | 1998-05-05 | Steris Corporation | Scanning device for evaluating cleanliness and integrity of medical and dental instruments |
| US5969370A (en) * | 1997-04-28 | 1999-10-19 | International Business Machines Corporation | Surface inspection tool |
| US6624884B1 (en) * | 1997-04-28 | 2003-09-23 | International Business Machines Corporation | Surface inspection tool |
| US5923432A (en) * | 1997-12-18 | 1999-07-13 | Steris Corporation | Cleaning efficacy real time indicator |
| KR100568032B1 (ko) * | 2003-06-24 | 2006-04-05 | 동부아남반도체 주식회사 | 포토레지스트 코팅불량 감지방법 및 그 검출장치 |
| US7765868B2 (en) * | 2003-09-23 | 2010-08-03 | Evotec Technologies Gmbh | Climate chamber for microscopes |
| CN100369228C (zh) * | 2004-12-24 | 2008-02-13 | 中国电子科技集团公司第二十四研究所 | 硅键合片界面缺陷的检测方法 |
| FR2931295B1 (fr) * | 2008-05-13 | 2010-08-20 | Altatech Semiconductor | Dispositif et procede d'inspection de plaquettes semi-conductrices |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62127652A (ja) * | 1985-11-29 | 1987-06-09 | Toshiba Corp | 半導体ウエハの表面欠陥検査装置 |
| US4740708A (en) * | 1987-01-06 | 1988-04-26 | International Business Machines Corporation | Semiconductor wafer surface inspection apparatus and method |
| US5127726A (en) * | 1989-05-19 | 1992-07-07 | Eastman Kodak Company | Method and apparatus for low angle, high resolution surface inspection |
| US4943732A (en) * | 1989-08-16 | 1990-07-24 | Micrion Corporation | Method and apparatus for defect detection and location |
-
1991
- 1991-02-08 JP JP1991005005U patent/JPH0499838U/ja active Pending
-
1992
- 1992-02-10 US US07/833,096 patent/US5233203A/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116465730A (zh) * | 2023-02-21 | 2023-07-21 | 湖南中核岩土工程有限责任公司 | 一种地质岩土勘察强度试验装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US5233203A (en) | 1993-08-03 |