JPH0493805A - Waveguide type optical device - Google Patents
Waveguide type optical deviceInfo
- Publication number
- JPH0493805A JPH0493805A JP20651690A JP20651690A JPH0493805A JP H0493805 A JPH0493805 A JP H0493805A JP 20651690 A JP20651690 A JP 20651690A JP 20651690 A JP20651690 A JP 20651690A JP H0493805 A JPH0493805 A JP H0493805A
- Authority
- JP
- Japan
- Prior art keywords
- waveguide
- optical fiber
- housing
- optical
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 48
- 239000013307 optical fiber Substances 0.000 claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 238000003466 welding Methods 0.000 claims description 3
- 238000005219 brazing Methods 0.000 claims description 2
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910003327 LiNbO3 Inorganic materials 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Landscapes
- Optical Couplings Of Light Guides (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は導波路型光デバイスに係り、特に導波路基板を
収容する筐体の光フアイバ取出し部の気密化構造を改良
した導波路型光デバイスに関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a waveguide type optical device, and in particular to a waveguide type optical device that has an improved airtight structure at an optical fiber extraction portion of a casing that accommodates a waveguide substrate. Regarding devices.
一般に、導波路型光デバイスは、強誘導体や半導体材料
からなる基板中に、光を閉じ込めて導波させる屈折率の
高い導波路を形成したものとされている。この導波路の
上部または近傍に、電圧を印加するための電極が形成さ
れている。この電極に外部から電圧を印加することによ
って基板中の導波路の屈折率を変化させ、光の位相や強
度の変調あるいは光路の切換えが行われる。Generally, a waveguide type optical device is considered to be one in which a waveguide with a high refractive index that confines and guides light is formed in a substrate made of a ferroconductor or semiconductor material. An electrode for applying voltage is formed above or near the waveguide. By applying a voltage from the outside to this electrode, the refractive index of the waveguide in the substrate is changed, and the phase and intensity of the light is modulated or the optical path is switched.
従来、このような導波路型光デバイスとして、強誘電体
材料の中で比較的高い電気光学効果を有するニオブ酸リ
チウム基板（ＬｉＮｂ０３基板）を用いた光デバイスが
知られている。この光デバイスは、第３図および第４図
に示すように、ＬｉＮ ｂ ０３基板１にチタン膜（Ｔ
ｉ膜）を成膜し、所望の導波路パターンにバターニング
した後、１０００°Ｃ前後の高温で数時間熱拡散して導
波路２を形成し、これに二酸化シリコンバッファ層（Ｓ
ｉｎ、層）３を成膜し、その上面に金属膜により電極４
を形成し、これを機能素子とした光デバイスである。Conventionally, as such a waveguide type optical device, an optical device using a lithium niobate substrate (LiNb03 substrate), which has a relatively high electro-optic effect among ferroelectric materials, is known. As shown in FIGS. 3 and 4, this optical device includes a titanium film (T) on a LiN b 03 substrate 1.
After forming a silicon dioxide buffer layer (S i film) and patterning it into a desired waveguide pattern, thermal diffusion is performed at a high temperature of around 1000°C for several hours to form a waveguide 2.
In, layer) 3 is formed into a film, and an electrode 4 is formed on the top surface by a metal film.
This is an optical device that uses this as a functional element.
このようにして製作された光導波路素子はウェハ切断後
、端面研摩されてチップ化され、さらに光導波路と光フ
ァイバとの光軸調整および固定の後、筐体に実装される
。そして、筐体に設けられた信号端子と光導波路素子の
電極パッド間がワイヤボンディングにより接続される。The optical waveguide device manufactured in this way is cut into a wafer, polished at its end face to form a chip, and then mounted in a housing after adjusting and fixing the optical axes of the optical waveguide and optical fiber. Then, the signal terminal provided on the casing and the electrode pad of the optical waveguide element are connected by wire bonding.
１３図および第４図に示した光導波路型デバイスは、方
向性結合型光スィッチであり、その作動原理を簡単に説
明する。上述のように、ＬｉＮｂＯ３基板ｌに一基板長
さで近接した部分を有する２本の導波路２が形成されて
おり、この２本の導波路２の上部にＳｉ○２バッファ層
３を介して金属膜からなる電極４が形成されている。電
極４に電圧が印加されていない状態では、２本の近接し
た導波路２間でモード結合が起り、一方の導波路２Ａか
ら入力された光は、他方の導波路２Ｂへ移行する。近接
部分の長さを導波路２の製作条件に応じて適当に選択す
ると、導波路２Ａからの光は略１００％導波路２Ｂへ移
行させることができる（この場合の近接部の長さは「完
全結合長」と呼ばれる）。一方、導波路２の上部に設け
られた２本の電極４の片方をグランドにし、他方に電圧
を印加すると、第４図に示すように、基板１中の導波路
２に縦方向に電界Ｃが発生し、ＬｉＮｂＯ３基板のもつ
電気光学効果により導波路２の屈折率が変化し、２本の
導波路２の結合状態が変化し、印加電圧を適当な電圧値
に設定すると、導波路２Ａから入力した光をそのまま導
波路２Ａから出力させることができる。このようにして
導波路２を用いてスイッチング機能を実現できる。The optical waveguide type device shown in FIG. 13 and FIG. 4 is a directional coupling type optical switch, and its operating principle will be briefly explained. As mentioned above, two waveguides 2 having portions close to each other by one substrate length are formed on the LiNbO3 substrate l, and a SiO2 buffer layer 3 is placed on top of these two waveguides 2. An electrode 4 made of a metal film is formed. When no voltage is applied to the electrode 4, mode coupling occurs between two adjacent waveguides 2, and light input from one waveguide 2A moves to the other waveguide 2B. If the length of the adjacent portion is appropriately selected according to the manufacturing conditions of the waveguide 2, approximately 100% of the light from the waveguide 2A can be transferred to the waveguide 2B (the length of the adjacent portion in this case is (called the "full bond length"). On the other hand, when one of the two electrodes 4 provided on the top of the waveguide 2 is grounded and a voltage is applied to the other, an electric field C is generated vertically in the waveguide 2 in the substrate 1, as shown in FIG. occurs, the refractive index of the waveguide 2 changes due to the electro-optic effect of the LiNbO3 substrate, the coupling state of the two waveguides 2 changes, and when the applied voltage is set to an appropriate voltage value, from the waveguide 2A. The input light can be directly output from the waveguide 2A. In this way, the switching function can be realized using the waveguide 2.
このような導波路型光デバイスは、上述したスイッチン
グ機能を基板上に集積できることから、光交換システム
用マトリクス光スィッチや、０ＴＤＲ用の光路切換え用
光スィッチとして開発が進於られている。また、光を高
速に変調することができるので、大容量光通信用の外部
変調器としても実用化が期待されている。Such waveguide type optical devices are capable of integrating the above-mentioned switching functions on a substrate, and are therefore being developed as matrix optical switches for optical switching systems and optical path switching optical switches for 0TDR. Furthermore, since light can be modulated at high speed, it is expected to be put to practical use as an external modulator for large-capacity optical communications.
第５図および第６図は、それぞれ異なる導波路型光デバ
イスの構造を示している。FIG. 5 and FIG. 6 each show the structure of a different waveguide type optical device.
通常、導波路型デバイスでは、導波路への人力用として
、チップ両端面に光ファイバが固着される。そこで第５
図のものでは、光ファイバ５が両端面に固着された導波
路基板１を筐体６に実装する際に、予め筐体５の側面に
上部からＵ溝７を設けておき、このＵ溝７部分に光ファ
イバ５をのせて樹脂８により固着し、筐体６にカバー９
を被せている。なお１０は上ヤトイである。Typically, in a waveguide type device, optical fibers are fixed to both end faces of the chip for manual input to the waveguide. Therefore, the fifth
In the figure, when mounting the waveguide substrate 1 with the optical fibers 5 fixed to both end faces on the housing 6, a U-groove 7 is provided in the side surface of the housing 5 from above in advance, and the U-groove 7 is An optical fiber 5 is placed on the part and fixed with resin 8, and a cover 9 is attached to the housing 6.
is covered with Note that 10 is upper yatoi.
また第６図のものでは、素線にメタライズされた光ファ
イバ５を、予め筐体６の側面に設けられた孔１１から挿
入して、導波路と光軸調整した後、筐体６と素線の隙間
をハンダ１２により固着し、気密化を図っている。In the case shown in FIG. 6, an optical fiber 5 whose strands are metallized is inserted through a hole 11 provided in advance on the side surface of the casing 6, and after adjusting the waveguide and optical axis, the casing 6 and the element are The gaps between the wires are fixed with solder 12 to achieve airtightness.
ところで、導波路型光デバイスの実用化に当たっては、
高い信頼性を得るために特に耐湿性を十分検討する必要
がある。すなわち、導波路デバイスは前述のように、基
板中に形成された数μｍの幅の導波路の上部に、これと
固定度の数μｍ幅の電極が形成されており、スイッチン
グさせるには通常、数Ｖから１００ｖ程度の電圧をこの
電極に印加する。すると、特に高湿床中では、電極近傍
で空気中の水分が電気分解が起こり、電極が著しく劣化
するのである。また、導波路と光ファイバとの固着は、
両者を直接当接して行うので、接着剤を用いて行われる
ことが多いが、接着剤は一般に湿度に対して弱（、この
点でも耐湿性を高めておく必要がある。さらに、導波路
素子と信号端子間の接続には、ワイヤボンディングが用
いられるのが一般的であり、やはり耐湿性が重要となる
。By the way, in the practical application of waveguide type optical devices,
In order to obtain high reliability, it is necessary to carefully consider moisture resistance in particular. That is, as mentioned above, in a waveguide device, an electrode with a width of several micrometers is formed on top of a waveguide with a width of several micrometers formed in a substrate, and is fixed to the waveguide. A voltage of several volts to about 100 volts is applied to this electrode. Then, especially in a highly humid bed, electrolysis of moisture in the air occurs near the electrodes, causing significant deterioration of the electrodes. In addition, the adhesion between the waveguide and the optical fiber is
Since this is done by bringing the two into direct contact, adhesives are often used, but adhesives are generally sensitive to humidity (and moisture resistance must be increased in this respect as well. Wire bonding is generally used for connections between signal terminals and signal terminals, and moisture resistance is also important.
従来の導波路型光スイッチにおいては、第５図のもので
は、筐体６の側面にＵ溝７を設け、このＵ溝７に光ファ
イバ５を樹脂８により固着するため、十分な気密がなさ
れず、高湿下では信頼性が低下する。また、第６図に示
すものでは、光ファイバ５と筐体６との隙間をハンダ１
２により埋めるた約、第４図のものに比して耐湿性は優
れるが、予め光ファイバ５を筐体６の側面の孔１１に通
し、先端に端末付をしなければならないうえ、光フアイ
バ素線をメタライズして素線の状態で先端に端末を付け
なければならず、これが非常に困難である。また、導波
路との光軸調整および固定作業については、光ファイバ
５を筐体６側面の孔１１から通した状態で、筐体６の内
部で行われなければならず、著しく作業性が悪い。In the conventional waveguide type optical switch shown in FIG. 5, a U-groove 7 is provided on the side surface of the housing 6, and the optical fiber 5 is fixed to this U-groove 7 with resin 8, so that sufficient airtightness is achieved. First, reliability decreases under high humidity. In addition, in the case shown in FIG. 6, the gap between the optical fiber 5 and the housing 6 is filled with solder 1.
2 has better moisture resistance than the one in Figure 4, but the optical fiber 5 must be passed through the hole 11 on the side of the housing 6 in advance and a terminal attached to the tip, and the optical fiber The wire must be metalized and a terminal attached to the tip of the wire, which is extremely difficult. In addition, the optical axis adjustment and fixing work with the waveguide must be performed inside the housing 6 with the optical fiber 5 passed through the hole 11 on the side of the housing 6, which is extremely inefficient. .
本発明はこのような事情に鑑みてなされたもので、容易
かつ確実に筐体内部の気密化が実現でき、導波路素子お
よび電極の信頼性向上、導波路と光ファイバとの固着箇
所やワイヤボンディング部の信頼性向上等が図れる導波
路型光デバイスを提供することを目的とする。The present invention was made in view of the above circumstances, and it is possible to easily and reliably make the inside of the casing airtight, improve the reliability of waveguide elements and electrodes, and reduce the bonding points between the waveguide and optical fibers and the wires. It is an object of the present invention to provide a waveguide type optical device that can improve the reliability of a bonding part.
本発明は、導波路が形成された導波路基板と、この導波
路基板の端面で導波路と光学的に結合される第１の光フ
ァイバと、これら導波路基板および第１の光ファイバを
収容する筐体と、この筐体の外側で第１の光ファイバと
光学的に結合される第２の光ファイバとを備えた導波路
型光デバイスにおいて、第１の光ファイバと第２の光フ
ァイバとの接続部をそれぞれ芯出しされたフェルールに
収容するとともに、これらのフェルールを前記した筐体
の側面に設けたスリーブに挿入して互いに当接すること
により光学的に接続し、もって気密性を向上させて前記
した目的を達成するものである。The present invention provides a waveguide substrate on which a waveguide is formed, a first optical fiber that is optically coupled to the waveguide at an end face of the waveguide substrate, and a housing that accommodates the waveguide substrate and the first optical fiber. In a waveguide type optical device, the first optical fiber and the second optical fiber are connected to each other. The connection parts with the ferrules are housed in centered ferrules, and these ferrules are inserted into the sleeves provided on the sides of the casing and abutted against each other to optically connect them, thereby improving airtightness. In this way, the above-mentioned purpose is achieved.
以下、本発明の一実施例を第１図および第２図を参照し
て説明する。なお、本実施例は導波路型光スイッチにつ
いてのもので、電圧を外部より印加することにより、光
をＯＮ−〇ＦＦできる機能を有するものである。An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. Note that this embodiment concerns a waveguide type optical switch, which has a function of turning light on and off by applying a voltage from the outside.
本実施例では、導波路が形成された導波路基板２１と、
この導波路基板２１の端面で導波路と光学的に結合され
る第１の光ファイバ２２と、これら導波路基板２１およ
び第１の光ファイバ２２を収容する筐体２３と、この筐
体２３の外側で第１の光ファイバ２２と光学的に結合さ
れる第２の光ファイバ２４とが備えられ、第１の光ファ
イバ２２と第２の光ファイバ２４との接続部が共に芯出
しされた７エルール２５ （２５ａ、 ２５ ｂ）に
収容されるとともに、このフェルール２５が筐体２３の
側面に設けたスリーブ２６に挿入されて、互いに当接す
ることにより光学的に接続されている。In this embodiment, a waveguide substrate 21 on which a waveguide is formed,
A first optical fiber 22 that is optically coupled to the waveguide at the end face of the waveguide substrate 21, a housing 23 that accommodates the waveguide substrate 21 and the first optical fiber 22, and a housing 23 that accommodates the waveguide substrate 21 and the first optical fiber 22. A second optical fiber 24 is provided which is optically coupled to the first optical fiber 22 on the outside, and a connection portion between the first optical fiber 22 and the second optical fiber 24 is centered together. The ferrules 25 are accommodated in the ferrules 25 (25a, 25b), and the ferrules 25 are inserted into a sleeve 26 provided on the side surface of the housing 23 and are optically connected by abutting each other.
導波路基板２１はＬｉＮｂ０．基板とされており、Ｔｉ
膜を成膜して方向性結合パターンを形成し、熱拡散した
後、５１０２バッファ層を介してＣｒ−Ａｕ電極を形成
し、チップ化して導波路素子としたものである。また、
導波路基板２１には保持ガラス２７および上ヤトイ２８
が設けられ、これらは導波路基板２１の切断後に接着し
て端末研摩されている。第１の光ファイバ２２の一端に
は光フアイバ端末２９が取付けられており、フランジ付
金具３０を用いて導波路基板２１に光軸調整された後、
接着剤により固着されている。The waveguide substrate 21 is made of LiNb0. The substrate is Ti
After a film was deposited to form a directional coupling pattern and thermally diffused, a Cr--Au electrode was formed via a 5102 buffer layer, and a waveguide element was formed by forming a chip. Also,
The waveguide substrate 21 has a holding glass 27 and an upper plate 28.
are provided, and after the waveguide substrate 21 is cut, these are adhered and the ends are polished. An optical fiber terminal 29 is attached to one end of the first optical fiber 22, and after the optical axis is adjusted to the waveguide substrate 21 using a flange fitting 30,
It is fixed with adhesive.
光軸調整は、第１の光ファイバ２２の他端に設けられた
第１のフェルール２５ａに、光入出力用ファイバである
第２の光ファイバ２４を接続することにより行われてい
る。そして、第１のフェルール２５ａが、筐体２３の側
面に設けられたスリーブ２６に挿入され、導波路基板２
１が筐体２３に固着されている。さらに、信号入力端子
３１と導波路基板２１の電極とが、ボンディングワイヤ
３２により接続されている。Optical axis adjustment is performed by connecting a second optical fiber 24, which is a light input/output fiber, to a first ferrule 25a provided at the other end of the first optical fiber 22. Then, the first ferrule 25a is inserted into the sleeve 26 provided on the side surface of the housing 23, and the waveguide substrate 25a is inserted into the sleeve 26 provided on the side surface of the housing 23.
1 is fixed to the housing 23. Further, the signal input terminal 31 and the electrode of the waveguide substrate 21 are connected by a bonding wire 32.
また、スリーブ２６には、第２の光ファイバ２４の先端
に設けられた第２のフェルール２５ｂが筐体２３の外側
から挿入され、この第２のフェルール２５ｂの外端部に
キャップ状のフェルール金属部３３がシーム溶接ｍ３４
により固着されている。Further, a second ferrule 25b provided at the tip of the second optical fiber 24 is inserted into the sleeve 26 from the outside of the housing 23, and a cap-shaped ferrule metal is attached to the outer end of the second ferrule 25b. Part 33 is seam welded m34
It is fixed by.
なお、筐体２３とスリーブ２６との固着、および筐体２
３の外側にある第２のフェルール２５ｂとフェルール金
属部３３との固着は、共にろう付けまたは溶接による接
合部３７でなされている。Note that the housing 23 and the sleeve 26 are fixed together, and the housing 2
The second ferrule 25b on the outside of the ferrule 3 and the ferrule metal part 33 are both fixed at a joint 37 by brazing or welding.
また、第２の光ファイバ２４と第２のフェルール２５ｂ
との固着は、低融点ガラス３８を用いて行われている。Moreover, the second optical fiber 24 and the second ferrule 25b
The fixing is performed using a low melting point glass 38.
以上の如く構成された本実施例の導波路型光デバイスに
よると、芯出しされた第１のフェルール２５ａに収容さ
れた第１の光ファイバ２２を、導波路基板２１に光軸固
定し、この導波路基板２１を筐体２３に実装する一方で
、これとは別の芯出しされた第２のフェルール２５ｂに
収容された第２の光ファイバ２４を、筐体２３の外側に
容易する。そして、筐体２３の側面に設けられたスリー
ブ２６を用いて筐体２３の内側と筐体２３の外側とで光
ファイバ２２．２４を嵌合させる。これにより、両光フ
ァイバ２２．２４を容易に接続でき、しかも接続後は筐
体２３の外側のフェルール金属部３３と筐体２３とをシ
ーム溶接することにより、筐体２３の光フアイバ取出し
部を容易に気密化することができる。According to the waveguide type optical device of this embodiment configured as described above, the optical axis of the first optical fiber 22 accommodated in the centered first ferrule 25a is fixed to the waveguide substrate 21, and While the waveguide substrate 21 is mounted on the casing 23, the second optical fiber 24 accommodated in a separate centered second ferrule 25b is placed outside the casing 23. Then, the optical fibers 22 and 24 are fitted between the inside of the housing 23 and the outside of the housing 23 using the sleeve 26 provided on the side surface of the housing 23. This makes it easy to connect both optical fibers 22 and 24, and after the connection, by seam welding the ferrule metal part 33 on the outside of the housing 23 and the housing 23, the optical fiber extraction part of the housing 23 can be opened. Can be easily made airtight.
本実施例の導波路型光スイッチについて、耐湿性評価と
して高温高湿試験を行ったところ、以下の結果が得られ
た。なお、本実施例の導波路型光スイッチと、第５図に
示した樹脂を用いた従来の導波路型光スイッチとを比較
した。試験条件は６０°Ｃ１９５％であり、従来の導波
路型光スイッチでは約２００時間の連続使用でスイッチ
ング特性に劣化が生じ、十分なスイッチング機能を果た
さなくなった。特に電圧を印加した状態で、光が完全に
ＯＦＦ状態とならなくなることから、湿度が樹脂部分か
ら筐体内部に侵入し、電極を部分的に破壊したものと推
定される。また、約６００時間後には、試料の一部に全
く動作しないものが見られた。カバーを外し、内部を観
察すると、導波路基板の電極と信号入力端子とを接続す
るボンディングワイヤが、湿気によると考えられる腐食
により電極膜からはずれていた。When the waveguide type optical switch of this example was subjected to a high temperature and high humidity test as a moisture resistance evaluation, the following results were obtained. The waveguide type optical switch of this example was compared with the conventional waveguide type optical switch using resin shown in FIG. The test conditions were 60°C and 195%, and the switching characteristics of the conventional waveguide optical switch deteriorated after approximately 200 hours of continuous use, and it no longer had a sufficient switching function. In particular, since the light was not completely turned off when a voltage was applied, it is presumed that humidity entered the inside of the casing from the resin part and partially destroyed the electrode. Moreover, after about 600 hours, some of the samples were found to not work at all. When the cover was removed and the inside was observed, the bonding wire connecting the electrode of the waveguide substrate and the signal input terminal was separated from the electrode film due to corrosion thought to be caused by moisture.
これに対し、本実施例の導波路型光スイッチでは、約１
５００時間経過後も特性劣化は認められず、従来例のよ
うな不具合はなんら生じることなく、正常な動作が持続
した。したがって、本実施例によれば、完全な気密化が
図れ、デバイス全体の耐湿性を飛躍的に向上できること
が確認された。In contrast, in the waveguide type optical switch of this embodiment, approximately 1
Even after 500 hours had elapsed, no characteristic deterioration was observed, and normal operation continued without any problems as in the conventional example. Therefore, according to this example, it was confirmed that complete airtightness could be achieved and the moisture resistance of the entire device could be dramatically improved.
なお、実施例では、導波路型光デバイスのなかでも最も
単純な構成の光スィッチに適用したが、これに限らず種
々の構成の導波路型光デバイスに適用できることは勿論
である。例えば２×２光スイツチのように、片側に複数
の光ファイバを有する光デバイスに適用する場合には、
筐体の側面にその個数のスリーブを設ける構成とすれば
よい。In the embodiment, the present invention is applied to an optical switch having the simplest configuration among waveguide type optical devices, but it is of course applicable to waveguide type optical devices having various configurations. For example, when applied to an optical device having multiple optical fibers on one side, such as a 2×2 optical switch,
The configuration may be such that the number of sleeves is provided on the side surface of the housing.
以上のように、本発明によれば、筐体の側面にスリーブ
を設け、筐体内側の光ファイバと、デバイス本体の外側
にある光ファイバとを、スリーブ内で突合わせて接続さ
せることにより、容易かつ確実に筐体内部の気密化が実
現でき、これにより、導波路素子の特性変化の防止およ
び電極の信頼性向上が図れ、さらに導波路と光ファイバ
との固着箇所やワイヤボンディング部等の信頼性向上も
図れる等の優れた効果が奏される。As described above, according to the present invention, a sleeve is provided on the side surface of the casing, and the optical fiber inside the casing and the optical fiber outside the device main body are butted and connected within the sleeve. It is possible to easily and reliably make the inside of the housing airtight, thereby preventing changes in the characteristics of the waveguide element and improving the reliability of the electrodes. Excellent effects such as improved reliability can be achieved.
第１図は本発明の一実施例を示す縦断面図、第２図は第
１図の要部拡大図、第３図は導波路型光デバイスである
方向性結合型スイッチ素子作動原理を示す上面図、第４
図は第３図のＩＶ−ＩＶ線断面図、第５図は従来例を示
す斜視図、第６図は他の従来例を示す斜視図である。
２１・・・・・・導波路基板、
２２・・・・・・第１の光ファイバ、
２３・・・・・・筐体、２４・・・・・・第２の光ファ
イバ２５（２５ａ、２５ ｂ ）・＝−・・フェルール
、２６・・・・・・スリーブ。
出 願 人 日本電気株式会社代 理 人
弁理士 山内梅雄第
図
第２図
？６
第３図
第４図Fig. 1 is a vertical cross-sectional view showing an embodiment of the present invention, Fig. 2 is an enlarged view of the main part of Fig. 1, and Fig. 3 shows the operating principle of a directional coupling type switch element, which is a waveguide type optical device. Top view, 4th
The figures are a sectional view taken along the line IV--IV in FIG. 3, FIG. 5 is a perspective view showing a conventional example, and FIG. 6 is a perspective view showing another conventional example. 21... Waveguide substrate, 22... First optical fiber, 23... Housing, 24... Second optical fiber 25 (25a, 25 b)・=-・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・Sleeve. Applicant: NEC Corporation Agent
Patent attorney Umeo Yamauchi Figure 2? 6 Figure 3 Figure 4
Claims (1)
の端面で導波路と光学的に結合される第１の光ファイバ
と、これら導波路基板および第１の光ファイバを収容す
る筐体と、この筐体の外側で第１の光ファイバと光学的
に結合される第２の光ファイバとを備えた導波路型光デ
バイスにおいて、第１の光ファイバと第２の光ファイバ
との接続部をそれぞれ芯出しされたフェルールに収容す
るとともに、これらのフェルールを筐体の側面に設けた
スリーブに挿入して互いに当接することにより光学的に
接続してなることを特徴とする導波路型光デバイス。 ２、フェルールと筐体およびスリーブとを、ろう付けま
たは溶接により固着したことを特徴とする請求項１記載
の導波路型光デバイス。[Claims] 1. A waveguide substrate on which a waveguide is formed, a first optical fiber optically coupled to the waveguide at the end face of the waveguide substrate, and A waveguide type optical device including a housing that accommodates an optical fiber and a second optical fiber that is optically coupled to the first optical fiber outside the housing. The connection parts with the two optical fibers are accommodated in each centered ferrule, and these ferrules are inserted into a sleeve provided on the side of the housing and brought into contact with each other, thereby optically connecting them. Features of waveguide type optical device. 2. The waveguide type optical device according to claim 1, wherein the ferrule, the housing, and the sleeve are fixed to each other by brazing or welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2206516A JP2682209B2 (en) | 1990-08-03 | 1990-08-03 | Waveguide type optical device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2206516A JP2682209B2 (en) | 1990-08-03 | 1990-08-03 | Waveguide type optical device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0493805A true JPH0493805A (en) | 1992-03-26 |
| JP2682209B2 JP2682209B2 (en) | 1997-11-26 |
Family
ID=16524660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2206516A Expired - Lifetime JP2682209B2 (en) | 1990-08-03 | 1990-08-03 | Waveguide type optical device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2682209B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5845029A (en) * | 1995-12-19 | 1998-12-01 | Emit-Seiko Co., Ltd. | Optical connector having means for positioning tilted convex surface of ferrule |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6323107A (en) * | 1986-03-28 | 1988-01-30 | Kyocera Corp | Connector for optical fiber |
| JPS6349711A (en) * | 1986-08-20 | 1988-03-02 | Nippon Telegr & Teleph Corp <Ntt> | Optical fixing tool and optical connector using same |
| JPS63316812A (en) * | 1987-06-19 | 1988-12-26 | Toshiba Corp | Photosemiconductor device |
| JPH0267508A (en) * | 1988-09-02 | 1990-03-07 | Nippon Telegr & Teleph Corp <Ntt> | Optical fiber fixing method |
-
1990
- 1990-08-03 JP JP2206516A patent/JP2682209B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6323107A (en) * | 1986-03-28 | 1988-01-30 | Kyocera Corp | Connector for optical fiber |
| JPS6349711A (en) * | 1986-08-20 | 1988-03-02 | Nippon Telegr & Teleph Corp <Ntt> | Optical fixing tool and optical connector using same |
| JPS63316812A (en) * | 1987-06-19 | 1988-12-26 | Toshiba Corp | Photosemiconductor device |
| JPH0267508A (en) * | 1988-09-02 | 1990-03-07 | Nippon Telegr & Teleph Corp <Ntt> | Optical fiber fixing method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5845029A (en) * | 1995-12-19 | 1998-12-01 | Emit-Seiko Co., Ltd. | Optical connector having means for positioning tilted convex surface of ferrule |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2682209B2 (en) | 1997-11-26 |
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