JPH0493159U - - Google Patents
Info
- Publication number
- JPH0493159U JPH0493159U JP40142290U JP40142290U JPH0493159U JP H0493159 U JPH0493159 U JP H0493159U JP 40142290 U JP40142290 U JP 40142290U JP 40142290 U JP40142290 U JP 40142290U JP H0493159 U JPH0493159 U JP H0493159U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990401422U JP2543452Y2 (ja) | 1990-12-21 | 1990-12-21 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990401422U JP2543452Y2 (ja) | 1990-12-21 | 1990-12-21 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0493159U true JPH0493159U (ja) | 1992-08-13 |
JP2543452Y2 JP2543452Y2 (ja) | 1997-08-06 |
Family
ID=31879518
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990401422U Expired - Fee Related JP2543452Y2 (ja) | 1990-12-21 | 1990-12-21 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2543452Y2 (ja) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001507522A (ja) * | 1997-06-28 | 2001-06-05 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 電子制御装置 |
JP2003298253A (ja) * | 2002-03-29 | 2003-10-17 | Denso Corp | 電子制御装置の筐体構造及び電子制御装置の搭載構造 |
WO2005117116A1 (ja) * | 2004-05-31 | 2005-12-08 | Sanken Electric Co., Ltd. | 半導体装置 |
WO2005124862A1 (ja) * | 2004-06-18 | 2005-12-29 | Sanken Electric Co., Ltd. | 半導体装置 |
JP2007250901A (ja) * | 2006-03-16 | 2007-09-27 | Nec Corp | 回路基板、移動通信端末 |
WO2008026485A1 (en) * | 2006-08-31 | 2008-03-06 | Daikin Industries, Ltd. | Electric power converter |
US7612448B2 (en) | 2004-12-13 | 2009-11-03 | Daikin Industries, Ltd. | Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner |
WO2009136591A1 (ja) * | 2008-05-08 | 2009-11-12 | トヨタ自動車株式会社 | 半導体装置 |
CN102074554A (zh) * | 2009-11-19 | 2011-05-25 | Nec爱克赛斯科技株式会社 | 导热板以及电子部件的安装方法 |
JP2013084675A (ja) * | 2011-10-06 | 2013-05-09 | Shindengen Electric Mfg Co Ltd | 半導体素子の電気接続構造 |
JP2013157398A (ja) * | 2012-01-27 | 2013-08-15 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
JPWO2013124940A1 (ja) * | 2012-02-23 | 2015-05-21 | パナソニックIpマネジメント株式会社 | 樹脂封止型半導体装置及びその製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02291160A (ja) * | 1989-04-28 | 1990-11-30 | Mitsubishi Electric Corp | 半導体装置 |
JPH04164384A (ja) * | 1990-10-29 | 1992-06-10 | Nec Corp | 電力用混成集積回路 |
JP3032443U (ja) * | 1996-06-14 | 1996-12-24 | 典生 河野 | 眼鏡フレーム |
-
1990
- 1990-12-21 JP JP1990401422U patent/JP2543452Y2/ja not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02291160A (ja) * | 1989-04-28 | 1990-11-30 | Mitsubishi Electric Corp | 半導体装置 |
JPH04164384A (ja) * | 1990-10-29 | 1992-06-10 | Nec Corp | 電力用混成集積回路 |
JP3032443U (ja) * | 1996-06-14 | 1996-12-24 | 典生 河野 | 眼鏡フレーム |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001507522A (ja) * | 1997-06-28 | 2001-06-05 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 電子制御装置 |
JP2003298253A (ja) * | 2002-03-29 | 2003-10-17 | Denso Corp | 電子制御装置の筐体構造及び電子制御装置の搭載構造 |
WO2005117116A1 (ja) * | 2004-05-31 | 2005-12-08 | Sanken Electric Co., Ltd. | 半導体装置 |
WO2005124862A1 (ja) * | 2004-06-18 | 2005-12-29 | Sanken Electric Co., Ltd. | 半導体装置 |
US7612448B2 (en) | 2004-12-13 | 2009-11-03 | Daikin Industries, Ltd. | Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner |
JP2007250901A (ja) * | 2006-03-16 | 2007-09-27 | Nec Corp | 回路基板、移動通信端末 |
WO2008026485A1 (en) * | 2006-08-31 | 2008-03-06 | Daikin Industries, Ltd. | Electric power converter |
US8030661B2 (en) | 2006-08-31 | 2011-10-04 | Daikin Industries, Ltd. | Power conversion apparatus |
WO2009136591A1 (ja) * | 2008-05-08 | 2009-11-12 | トヨタ自動車株式会社 | 半導体装置 |
JP2009272482A (ja) * | 2008-05-08 | 2009-11-19 | Toyota Motor Corp | 半導体装置 |
CN102074554A (zh) * | 2009-11-19 | 2011-05-25 | Nec爱克赛斯科技株式会社 | 导热板以及电子部件的安装方法 |
US8278750B2 (en) | 2009-11-19 | 2012-10-02 | Nec Access Technica, Ltd | Heat conduction board and mounting method of electronic components |
JP2013084675A (ja) * | 2011-10-06 | 2013-05-09 | Shindengen Electric Mfg Co Ltd | 半導体素子の電気接続構造 |
JP2013157398A (ja) * | 2012-01-27 | 2013-08-15 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
JPWO2013124940A1 (ja) * | 2012-02-23 | 2015-05-21 | パナソニックIpマネジメント株式会社 | 樹脂封止型半導体装置及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2543452Y2 (ja) | 1997-08-06 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19960423 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19970225 |
|
LAPS | Cancellation because of no payment of annual fees |