JPH0489190A - Method for joining insulated electric wire and terminal - Google Patents
Method for joining insulated electric wire and terminalInfo
- Publication number
- JPH0489190A JPH0489190A JP2204237A JP20423790A JPH0489190A JP H0489190 A JPH0489190 A JP H0489190A JP 2204237 A JP2204237 A JP 2204237A JP 20423790 A JP20423790 A JP 20423790A JP H0489190 A JPH0489190 A JP H0489190A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- joining
- side walls
- insertion portion
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 16
- 238000003780 insertion Methods 0.000 claims abstract description 45
- 230000037431 insertion Effects 0.000 claims abstract description 45
- 230000001678 irradiating effect Effects 0.000 claims abstract description 6
- 238000002844 melting Methods 0.000 claims description 32
- 230000008018 melting Effects 0.000 claims description 32
- 239000011248 coating agent Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000007767 bonding agent Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 abstract description 16
- 238000010586 diagram Methods 0.000 description 9
- 239000000155 melt Substances 0.000 description 6
- 238000003825 pressing Methods 0.000 description 5
- 239000004962 Polyamide-imide Substances 0.000 description 4
- 229920003055 poly(ester-imide) Polymers 0.000 description 4
- 229920002312 polyamide-imide Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、導電体の外周が絶縁被膜で被覆された絶縁電
線を端子に接合して絶縁電線と端子との導通を取ること
が可能な絶縁電線と端子の接合方法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a method for connecting an insulated wire whose outer periphery is coated with an insulating film to a terminal to establish electrical continuity between the insulated wire and the terminal. This article relates to a method for joining insulated wires and terminals.
［従来の技術］
第６図は従来の絶縁電線と端子との接合方法（例えば特
開平１−９５８６８号公報等）を示す図である。[Prior Art] FIG. 6 is a diagram showing a conventional method of joining an insulated wire and a terminal (for example, Japanese Patent Laid-Open No. 1-95868, etc.).
導電体１０１の外周が絶縁被膜１０２で被覆された絶縁
電線１０３と端子１０４との接合は、予め絶縁電線１０
３の接合面に、銀ろう等の接合助剤１０５を付着させて
おいて、その絶縁電線１０３を端子１０４のＵ字形状の
挿入部１０６内に装填しておく。The insulated wire 103 whose outer periphery is coated with the insulating film 102 and the terminal 104 are bonded in advance to the insulated wire 10
A bonding aid 105 such as silver solder is applied to the bonding surface of the terminal 3, and the insulated wire 103 is loaded into the U-shaped insertion portion 106 of the terminal 104.
そして、挿入部１０６を加圧しながら画電極１０７．１
０８から電流を流して端子１０４の挿入部１０６を加熱
することによって、絶縁被膜１０２を溶融させて除去し
、さらに接合助剤１０５を溶融させて導電体１０１と端
子１０４の挿入部１０６との金属的接合を得ている。Then, while applying pressure to the insertion portion 106, the picture electrode 107.1 is inserted.
08 to heat the insertion part 106 of the terminal 104, the insulating coating 102 is melted and removed, and the bonding aid 105 is further melted to bond the conductor 101 and the insertion part 106 of the terminal 104 to metal. We are getting a lot of attention.
［発明が解決しようとする課題］
ところが、従来技術の接合方法おいては、画電極１０７
．１０８から端子１０４の挿入部１０６に電流を流して
、絶縁電線１０３と端子１０４とを接合するときに、電
極１０７．１０８と挿入部１０６との間で火花放電（ス
パーク）が生起する可能性があった。あるいは、電極１
０７．１０８の一部が溶融し飛散して端子の挿入部１０
６の表面に付着したり、逆に端子１０４の挿入部１０６
の一部が溶融し飛散して電極１０７．１０８の表面に付
着したりするスパッタが生起する可能性があった。この
ため、端子１０４の挿入部１０６または電極１０７．１
０８に電気的な磨耗が生じるという不具合があった。[Problems to be Solved by the Invention] However, in the bonding method of the prior art, the picture electrode 107
．． When a current is passed from 108 to the insertion part 106 of the terminal 104 to connect the insulated wire 103 and the terminal 104, there is a possibility that spark discharge (spark) will occur between the electrode 107, 108 and the insertion part 106. there were. Alternatively, electrode 1
07. A part of 108 melts and scatters and the terminal insertion part 10
6 or vice versa, the insertion part 106 of the terminal 104
There is a possibility that spatter may occur in which a part of the electrodes melts, scatters, and adheres to the surfaces of the electrodes 107 and 108. For this reason, the insertion portion 106 of the terminal 104 or the electrode 107.1
There was a problem with the 08 that caused electrical wear.
本発明は、端子の挿入部または電極の電気的な磨耗を防
止できる絶縁電線と端子との接合方法の提供を目的とす
る。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for joining an insulated wire and a terminal, which can prevent electrical abrasion of the terminal insertion portion or electrode.
［課題を解決するための手段］
本発明の絶縁電線と端子との接合方法は、導電体の外周
を絶縁被膜で被覆した絶縁電線を、端子の挿入部内に挿
入し、前記絶縁電線の接合面と前記端子の接合面との間
に、前記絶縁被膜より融点が高く、前記端子より融点が
低い導電性の接合助剤を介在させて、
前記挿入部にレーザ光を照射することによって、前記挿
入部の温度が前記絶縁被膜の融点以上、且つ前記接合助
剤の融点未満の温度となるように前記挿入部を加熱した
後に、前記挿入部を加圧しなからレーザ光を照射するこ
とによって、前記挿入部の温度が前記接合助剤の融点以
上、且つ前記端子の融点未満の温度となるように前記挿
入部を加熱する技術手段を採用した。[Means for Solving the Problem] The method of joining an insulated wire and a terminal of the present invention includes inserting an insulated wire whose outer periphery of a conductor is coated with an insulating film into an insertion portion of a terminal, A conductive bonding agent having a melting point higher than that of the insulating film and lower than that of the terminal is interposed between the bonding surface of the terminal and the bonding surface of the terminal, and the insertion portion is irradiated with a laser beam. After heating the insertion portion so that the temperature of the insertion portion is equal to or higher than the melting point of the insulating coating and lower than the melting point of the bonding aid, the insertion portion is irradiated with laser light without pressurizing the insertion portion. A technical means was adopted to heat the insertion part so that the temperature of the insertion part was higher than the melting point of the bonding aid and lower than the melting point of the terminal.
［作用］
導電体の外周を絶縁被膜で被覆した絶縁電線を、端子の
挿入部内に挿入する。このとき、絶縁電線の接合面と端
子の接合面との間に導電性の接合助剤を介在させておく
。[Operation] An insulated wire whose outer periphery is coated with an insulating film is inserted into the insertion portion of the terminal. At this time, a conductive bonding aid is interposed between the bonding surface of the insulated wire and the bonding surface of the terminal.
そして、レーザ光を端子の挿入部に照射することによっ
て、絶縁被膜の融点以上で接合助剤の融点未満の温度と
なるように端子の挿入部を加熱する。このため、接合助
剤が未だ剛性を有しており、この接合助剤の存在によっ
て絶縁被膜が溶融して導電体の外周から除去される。Then, by irradiating the insertion portion of the terminal with laser light, the insertion portion of the terminal is heated to a temperature that is higher than the melting point of the insulating coating and lower than the melting point of the bonding aid. Therefore, the bonding aid still has rigidity, and the presence of the bonding aid melts the insulating coating and removes it from the outer periphery of the conductor.
その後に、端子の挿入部を加圧しなからレーザ光を端子
の挿入部に照射することによって、接合助剤の融点以上
で端子の融点未満の温度となるように端子の挿入部を加
熱する。このため、接合助剤が溶融するので、導電体と
端子の挿入部とが金属的に接合される。Thereafter, the insertion portion of the terminal is heated by irradiating the insertion portion of the terminal with a laser beam while pressurizing the insertion portion of the terminal to a temperature that is higher than the melting point of the bonding agent and lower than the melting point of the terminal. Therefore, since the bonding aid melts, the conductor and the terminal insertion portion are metallically bonded.
［発明の効果］
抵抗加熱を用いることなく、導電体と端子の挿入部とを
金属的に接合できるので、電極と挿入部との間でスパー
クが生起したり、電極または端子の挿入部にスパッタが
生起したりする不具合を防止できる。このため、電極ま
たは端子の挿入部が電気的に磨耗することを防止できる
。[Effects of the Invention] Since the conductor and the terminal insertion part can be joined metallically without using resistance heating, sparks do not occur between the electrode and the insertion part, and spatter does not occur on the electrode or the terminal insertion part. It is possible to prevent problems that may occur. Therefore, electrical abrasion of the insertion portion of the electrode or terminal can be prevented.
［実施例］
本発明の絶縁電線と端子との接合方法を第１図ないし第
５図に示す一実施例に基づき説明する。[Example] A method of joining an insulated wire and a terminal according to the present invention will be described based on an example shown in FIGS. 1 to 5.
第１図は絶縁電線１と端子２どの接合状態を示す。FIG. 1 shows how an insulated wire 1 and a terminal 2 are connected.
絶縁電線１は、径が００５ｍの細いポリアミドイミド・
ポリエステルイミドニ重被覆構造銅線であって、断面形
状が円形状の導電体１１、およびこの導電体１１の外周
に被覆されたポリエステルイミドとポリアミドイミドの
二重絶縁被膜１２を備える。The insulated wire 1 is made of thin polyamideimide with a diameter of 0.05 m.
The copper wire has a polyesterimide overcoated structure, and includes a conductor 11 having a circular cross-sectional shape, and a double insulation coating 12 of polyesterimide and polyamideimide coated on the outer periphery of the conductor 11.
端子２は、Ｓｎ鍍金軟鋼板（ＳＰＴＥ）製で、先端部に
Ｕ字形状の挿入部２１を有する。この挿入部２１は、対
向する一対の側壁２２．２３、および一対の側壁２２．
２３を連結するコーナ部２４からなる。なお、絶縁電線
１の接合面と端子２の接合面との間には、絶縁液８１２
より融点が高く、端子２より融点が低い導電性の接合助
剤３．４が配設されている。The terminal 2 is made of Sn-plated mild steel plate (SPTE) and has a U-shaped insertion portion 21 at the tip. The insertion portion 21 includes a pair of opposing side walls 22.23 and a pair of side walls 22.23.
It consists of a corner part 24 that connects 23. Note that there is an insulating liquid 812 between the bonding surface of the insulated wire 1 and the bonding surface of the terminal 2.
A conductive bonding aid 3.4 having a higher melting point and a lower melting point than the terminal 2 is provided.
この接合助剤３．４は、例えば一対の側壁２２．２３の
内側面に付着さぜる。接合助剤３．４としては、３０１
ＪＩＩ厚さの箔状の銀ろう（ＢＡｇ−８：Ａｇ７１〜７
３重量％、Ｐ ｂ ＋ Ｆ ｅ ０．１５重量％以下、
Ｃｕ残：融点７８０℃）が使用される。This bonding aid 3.4 is applied, for example, to the inner surfaces of the pair of side walls 22.23. As the bonding aid 3.4, 301
Foil-shaped silver solder with JII thickness (BAg-8: Ag71-7
3% by weight, P b + Fe 0.15% by weight or less,
Cu residue (melting point: 780°C) is used.
絶縁電線１と端子２とを接合する接合装置は、対向配置
された一対の加圧治具５．６、およびレーザ光を放射す
るレーザ装置（第３図参照）を備え、加熱と加圧とを同
時に行えるものである。The bonding device for bonding the insulated wire 1 and the terminal 2 is equipped with a pair of pressing jigs 5.6 arranged opposite to each other and a laser device (see Fig. 3) that emits laser light, and is capable of heating and pressurizing. can be done at the same time.
一対の加圧治具５．６は、接合するときに一対の側壁２
２．２３の外側面に接触して図示矢印方向に絶縁電線１
および一対の側壁２２．２３を加圧する。A pair of pressure jigs 5.6 are used to press a pair of side walls 2 when joining.
2. Insulated wire 1 in contact with the outer surface of 23 in the direction of the arrow shown in the figure.
and pressurizes the pair of side walls 22,23.
また、一対の加圧治具５．６は、第２図に示すように、
加圧力が２段階となるように制御装置によって制御され
る。In addition, the pair of pressure jigs 5.6, as shown in FIG.
The control device controls the pressurizing force in two stages.
ここで、第３図および第４図を用いて、レーザ光による
加熱加工のメカニズムを説明する。Here, the mechanism of heating processing using laser light will be explained using FIGS. 3 and 4.
このメカニズムは、照射したレーザ光を被照射物内に吸
収させ、レーザ光を熱に変換してその熱で被照射物を高
温にしたり溶融させたりする方法である。したがって、
本実施例では、波長１０．６−のＣＯ２レーザ光を比較
的吸収し易く、熱拡散の小さい鉄鋼系のＳｎ鍍金軟鋼板
を被照射物（端子）に採用した。また、レーザ光の集中
点を被接触物の表面とせず、照射領域の拡大を図るため
に焦点ぼかしく第３図参照）ｊを施した。This mechanism is a method in which the irradiated laser beam is absorbed into the irradiated object, the laser beam is converted into heat, and the heat is used to heat or melt the irradiated object. therefore,
In this example, a steel-based Sn-plated mild steel plate that relatively easily absorbs CO2 laser light with a wavelength of 10.6- and has low thermal diffusion was used as the irradiated object (terminal). In addition, the focal point of the laser beam was not set at the surface of the object to be contacted, but in order to expand the irradiation area, the focal point was blurred (see FIG. 3).
第４図はレーザ照射時の被照射物の温度変化を示す模式
図である。第４図において、Ｔ１は絶縁電線１の絶縁被
膜１２の融点を示し、Ｔ２は接合助剤３．４の融点を示
し、Ｔ、は端子２の融点を示す。FIG. 4 is a schematic diagram showing the temperature change of the object to be irradiated during laser irradiation. In FIG. 4, T1 indicates the melting point of the insulating coating 12 of the insulated wire 1, T2 indicates the melting point of the bonding aid 3.4, and T indicates the melting point of the terminal 2.
このようにしてレーザ光を照射された被照射物の温度は
、第４図に示すように、照射開始直後の緩やかな昇温（
Ａ−Ｂ）の後に急激に上昇する。As shown in Figure 4, the temperature of the object irradiated with the laser beam in this way gradually increases (
It rises sharply after A-B).
これは、酸化膜形成に伴う吸収率の急増現象であると考
えられる。そして、本実施例では、温度Ｔ１から温度Ｔ
２までの間で接合助剤３．４を溶融させずに絶縁被膜１
２を破壊、除去し、温度１２以上で接合助剤３．４を溶
融さぜるとともに加圧力を増し、良好な接合を達成する
というものである。This is considered to be a phenomenon in which the absorption rate rapidly increases due to the formation of an oxide film. In this embodiment, from temperature T1 to temperature T
Insulating coating 1 without melting bonding aid 3.4 between 2 and 2.
2 is destroyed and removed, and the bonding aid 3.4 is melted and stirred at a temperature of 12 or higher, and the pressure is increased to achieve good bonding.
なお、実施例で使用したレーザ装置は、連続照射可能な
ＣＯ２レーザ装置であり、良好な接合を達成するための
照射時間は１秒以下であった。The laser device used in the examples was a CO2 laser device capable of continuous irradiation, and the irradiation time to achieve good bonding was 1 second or less.
第５図は実施例におけるレーザ照射エネルギー密度と接
合部の抵抗値との関係を表したグラフである。FIG. 5 is a graph showing the relationship between the laser irradiation energy density and the resistance value of the joint in the example.
なお、レーザ照射エネルギー密度Ｅは、（照射パワー）
×（照射時間）／（照射面積）で表され、レーザ照射エ
ネルギー密度Ｅがある範囲内であれば本発明の基本的プ
ロセスに基づいた良好な接合状態を得ることができる。In addition, the laser irradiation energy density E is (irradiation power)
It is expressed as ×(irradiation time)/(irradiation area), and if the laser irradiation energy density E is within a certain range, a good bonding state based on the basic process of the present invention can be obtained.
ところが、過大なレーザ照射エネルギー密度Ｅに対して
、接合部の抵抗値は目標を満足するが、導電体が溶融し
接合部強度は低下することが確認された。However, it was confirmed that when the laser irradiation energy density E was excessively large, the resistance value of the joint portion met the target, but the conductor melted and the strength of the joint portion decreased.
本実施例の絶縁電線１と端子２どの接合方法を第１図お
よび第２図に基づき説明する。The method of joining the insulated wire 1 and the terminal 2 of this embodiment will be explained based on FIGS. 1 and 2.
一対の加圧治具５．６の間に端子２を挟み込み、端子３
の一対の側壁２２．２３の内側面に接合助剤３．４を装
填し、これらの接合助剤３．４間に絶縁電線１を挿入す
る。そして、第２図のａ時間〜ｂ時間において、一対の
加圧治具５．６によって端子３の一対の側壁２２．２３
を加圧する。Sandwich the terminal 2 between the pair of pressure jigs 5.6, and
A bonding aid 3.4 is loaded onto the inner surfaces of the pair of side walls 22, 23, and the insulated wire 1 is inserted between these bonding aids 3.4. Then, from time a to time b in FIG. 2, the pair of side walls 22 and 23 of the terminal 3 are
Pressurize.
なお、このときに使用する接合助剤３．４は、絶縁被膜
１２の軟化破壊過程温度まで絶縁被膜１２を破壊するた
めに可能な限り剛性（硬さ）を有している必要があり、
破壊後は、端子２が溶融するよりも低い温度で溶融し、
導電体１１と融合する性質を持ったものを選択する必要
がある。すなわち、接合助剤３．４の融点は、絶縁被膜
１２の融点よりも高く、端子２および導電体１１の融点
よりも低いことが必要である。Note that the bonding aid 3.4 used at this time needs to have as much rigidity (hardness) as possible in order to destroy the insulation coating 12 up to the softening and destruction process temperature of the insulation coating 12.
After destruction, it melts at a lower temperature than that of terminal 2,
It is necessary to select a material that has the property of merging with the conductor 11. That is, the melting point of the bonding aid 3.4 needs to be higher than the melting point of the insulating coating 12 and lower than the melting points of the terminal 2 and the conductor 11.
そして、第２図のｂ時間〜Ｃ時間において、対の加圧治
具５．６によって端子３の一対の側壁２２．２３を加圧
しながらレーザ光を端子２の一対の側壁２２．２３に照
射する。このため、端子２の一対の側壁２２．２３は、
絶縁被膜１２の融点以上で接合助剤３．４の融点未満の
温度となるように加熱される。よって、絶縁被膜１２が
溶融、破壊するとともに、接合助剤３．４によって導電
体１１の外周から完全に除去される。Then, from time b to time C in FIG. 2, laser light is applied to the pair of side walls 22.23 of the terminal 2 while pressing the pair of side walls 22.23 of the terminal 3 using the pair of pressing jigs 5.6. do. Therefore, the pair of side walls 22 and 23 of the terminal 2 are
It is heated to a temperature that is higher than the melting point of the insulating coating 12 and lower than the melting point of the bonding aid 3.4. Therefore, the insulating coating 12 is melted and destroyed, and is completely removed from the outer periphery of the conductor 11 by the bonding aid 3.4.
その後に、第２図のＣ時間〜ｄ時間において、一対の加
圧治具５．６によって端子３の一対の側壁２２．２３を
加圧しながらレーザ光を端子２の一対の側壁２２．２３
に照射する。このため、端子３の一対の側壁２２．２３
は、接合助剤３．４の融点以上で端子２の融点未満の温
度で加熱される。よって、接合助剤３．４が溶融して導
電体１１と端子２の一対の側壁２２．２３との金属的な
接合が達成される。After that, from time C to time d in FIG. 2, the pair of side walls 22.23 of the terminal 3 are pressed by the pair of pressure jigs 5.6 while the laser beam is applied to the pair of side walls 22.23 of the terminal 2.
irradiate. For this reason, the pair of side walls 22 and 23 of the terminal 3
is heated at a temperature above the melting point of the bonding aid 3.4 and below the melting point of the terminal 2. Accordingly, the bonding aid 3.4 melts and metallic bonding between the conductor 11 and the pair of side walls 22,23 of the terminal 2 is achieved.
したがって、抵抗加熱を行わないので、電極と一対の側
壁２２．２３との間でスパークが生起したり、電極また
は端子２の一対の側壁２２．２３にスパッタが生起した
りすることはないので、電極または端子２が電気的に磨
耗することを防げる。Therefore, since resistance heating is not performed, sparks do not occur between the electrode and the pair of side walls 22.23, and spatter does not occur on the electrode or the pair of side walls 22.23 of the terminal 2. Electrical abrasion of the electrode or terminal 2 can be prevented.
また、本実施例のように、絶縁電線１に径が０゜０５−
の細いポリアミドイミド・ポリエステルイミド二重被覆
構造銅線（φＯ１ｍ以下の耐熱細線）を用いた場合でも
、抵抗加熱を行わないので、端子２のコーナ部２４の過
熱による溶断を防止できる。Further, as in this embodiment, the insulated wire 1 has a diameter of 0°05-
Even when a thin polyamide-imide/polyesterimide double-coated copper wire (heat-resistant fine wire with a diameter of 1 m or less) is used, since resistance heating is not performed, it is possible to prevent the corner portion 24 of the terminal 2 from fusing due to overheating.
よって、絶縁電線１と端子２との接合強度に優れ１、電
気的にも電気抵抗の低い安定した数値を示す良好な接合
方法を提供できる。Therefore, it is possible to provide a good bonding method that exhibits excellent bonding strength 1 between the insulated wire 1 and the terminal 2, and exhibits low and stable electrical resistance.
つぎに、本発明と比較するために使用した比較例を示し
、その結果を述べる。Next, a comparative example used for comparison with the present invention will be shown and the results will be described.
端子にＳｎ鍍金軟鋼板（ＳＰＴＦ、）を用い、絶縁電線
にポリアミドイミド・ポリエステルイミド二重被覆構造
銅線φ０．０５■を用い、接合助剤に２５四厚さの箔状
のアモルファスリン銅ろう（Ｎｉ：９６％、Ｓｎ：９．
７％、Ｐ ７．０％、Ｃｕ残；融点６３５℃）を用いた
。A Sn-plated mild steel plate (SPTF) was used for the terminal, a polyamide-imide/polyesterimide double-coated copper wire with a diameter of 0.05 mm was used for the insulated wire, and a foil-shaped amorphous phosphorus copper solder with a thickness of 25 mm was used as a bonding agent. (Ni: 96%, Sn: 9.
7%, P 7.0%, Cu residue; melting point 635°C) was used.
これらを前述の実施例と同様なプロセスで絶縁電線と端
子との接合を試みたが、絶縁被膜は接合面外に完全には
除去されなかった。Although an attempt was made to join these to an insulated wire and a terminal using a process similar to that of the previous example, the insulating coating was not completely removed outside the joint surface.
この比較例の場合、接合助剤の融点が絶縁被膜の融点（
６００℃）とほぼ同一であったために、絶縁被膜除去に
有効な加圧力が作用しなかったと考えられる。In the case of this comparative example, the melting point of the bonding aid is the melting point of the insulating film (
600° C.), it is thought that no effective pressing force was applied to remove the insulating film.
（変形例）
本実施例では、端子の挿入部の形状としてＵの字形状を
採用したが、■の字形状やＯの字形状等の形状を採用し
ても良い。(Modified Example) In this embodiment, a U-shape is adopted as the shape of the terminal insertion portion, but a shape such as a ■-shape or an O-shape may also be adopted.
第１図ないし第３図は本発明の一実施例を示す。
第１図は絶縁電線と端子との接合状態を示す概略図、第
２図は絶縁電線と端子との接合方法を示す工程図、第３
図はレーザ光の焦点ばかしを示す概略図、第４図はレー
ザ照射時の被照射物の温度変化を示す模式図、第５図は
レーザ照射エネルギー密度と接合部の抵抗値との関係を
表したグラフである。
第６図は従来の絶縁電線と端子との接合状態を示す概略
図である。
図中
１・・・絶縁電線 ２・・・端子 ３．４・・・接合助
剤１１・・・導電体 １２・・・絶縁被膜 ２１・・・
挿入部第１図1 to 3 show one embodiment of the present invention. Fig. 1 is a schematic diagram showing the state of joining the insulated wire and the terminal, Fig. 2 is a process diagram showing the method of joining the insulated wire and the terminal, and Fig. 3
The figure is a schematic diagram showing the focal shift of the laser beam, Figure 4 is a schematic diagram showing the temperature change of the irradiated object during laser irradiation, and Figure 5 is a diagram showing the relationship between the laser irradiation energy density and the resistance value of the joint. This is a graph. FIG. 6 is a schematic diagram showing the state of connection between a conventional insulated wire and a terminal. In the figure 1...Insulated wire 2...Terminal 3.4...Joining aid 11...Conductor 12...Insulating coating 21...
Insertion part diagram 1
Claims (1)
子の挿入部内に挿入し、 前記絶縁電線の接合面と前記端子の接合面との間に、前
記絶縁被膜より融点が高く、前記端子より融点が低い導
電性の接合助剤を介在させて、前記挿入部にレーザ光を
照射することによって、前記挿入部の温度が前記絶縁被
膜の融点以上、且つ前記接合助剤の融点未満の温度とな
るように前記挿入部を加熱した後に、 前記挿入部を加圧しながらレーザ光を照射することによ
って、前記挿入部の温度が前記接合助剤の融点以上、且
つ前記端子の融点未満の温度となるように前記挿入部を
加熱する絶縁電線と端子との接合方法。[Claims] 1) An insulated wire whose outer periphery is coated with an insulating coating is inserted into an insertion portion of a terminal, and the insulating coating is placed between the bonding surface of the insulated wire and the bonding surface of the terminal. By irradiating the insertion portion with a laser beam through the interposition of a conductive bonding aid having a higher melting point and a lower melting point than that of the terminal, the temperature of the insertion portion is equal to or higher than the melting point of the insulating coating, and the bonding is performed. After heating the insertion portion to a temperature below the melting point of the bonding agent, by irradiating the insertion portion with a laser beam while pressurizing the insertion portion, the temperature of the insertion portion becomes equal to or higher than the melting point of the bonding agent, and A method for joining an insulated wire and a terminal, in which the insertion portion is heated to a temperature below the melting point of the terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2204237A JPH0489190A (en) | 1990-07-31 | 1990-07-31 | Method for joining insulated electric wire and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2204237A JPH0489190A (en) | 1990-07-31 | 1990-07-31 | Method for joining insulated electric wire and terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0489190A true JPH0489190A (en) | 1992-03-23 |
Family
ID=16487123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2204237A Pending JPH0489190A (en) | 1990-07-31 | 1990-07-31 | Method for joining insulated electric wire and terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0489190A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6200245B1 (en) | 1997-11-26 | 2001-03-13 | Ishikawajima-Harima Heavy Industries Co., Ltd. | Apparatus and method for changing dies |
| US6463652B1 (en) | 1997-11-26 | 2002-10-15 | Ishikawajima-Harima Heavy Industries Co., Ltd. | Apparatus and methods for manufacturing hot rolled steel sheets |
| JP2012192417A (en) * | 2011-03-15 | 2012-10-11 | Japan Aviation Electronics Industry Ltd | Laser welding structure of electric wire and conductive metal plate |
| US20170050253A1 (en) * | 2015-06-23 | 2017-02-23 | Nexans | Method for manufacturing an effective electric contact point at the end of an electrical line |
| JP2022095743A (en) * | 2016-04-29 | 2022-06-28 | ヌブル インク | Electronic packaging, automotive electrical apparatus, battery, and visible laser welding of other components |
-
1990
- 1990-07-31 JP JP2204237A patent/JPH0489190A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6200245B1 (en) | 1997-11-26 | 2001-03-13 | Ishikawajima-Harima Heavy Industries Co., Ltd. | Apparatus and method for changing dies |
| US6463652B1 (en) | 1997-11-26 | 2002-10-15 | Ishikawajima-Harima Heavy Industries Co., Ltd. | Apparatus and methods for manufacturing hot rolled steel sheets |
| JP2012192417A (en) * | 2011-03-15 | 2012-10-11 | Japan Aviation Electronics Industry Ltd | Laser welding structure of electric wire and conductive metal plate |
| US8759679B2 (en) | 2011-03-15 | 2014-06-24 | Japan Aviation Electronics Industry, Ltd. | Wire to conductive metal plate laser welding structure |
| US20170050253A1 (en) * | 2015-06-23 | 2017-02-23 | Nexans | Method for manufacturing an effective electric contact point at the end of an electrical line |
| US10328512B2 (en) * | 2015-06-23 | 2019-06-25 | Nexans | Method for manufacturing an effective electric contact point at the end of an electrical line |
| JP2022095743A (en) * | 2016-04-29 | 2022-06-28 | ヌブル インク | Electronic packaging, automotive electrical apparatus, battery, and visible laser welding of other components |
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