JPH0488059U - - Google Patents
Info
- Publication number
- JPH0488059U JPH0488059U JP40104390U JP40104390U JPH0488059U JP H0488059 U JPH0488059 U JP H0488059U JP 40104390 U JP40104390 U JP 40104390U JP 40104390 U JP40104390 U JP 40104390U JP H0488059 U JPH0488059 U JP H0488059U
- Authority
- JP
- Japan
- Prior art keywords
- wedge
- ring
- lid
- flange
- wedge hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Amplifiers (AREA)
Description
第１図は正面図。第２図は一部断面を示す平面
図。第３図は断面図。第４図は楔を楔穴から外し
たところを示す正面図の一部。第５図はロツド集
合リングを回動する構造を示す別の実施例の断面
図。第６図及び第７図はロツド集合リングを回動
する構造を示す更に別の実施例であつて第６図は
側面断面図。第７図は一部断面を示す正面図の一
部。
２……本体フランジ、３……楔用穴付リング、
５……蓋、６……蓋付フランジ、１１……ロツド
集合リング、１２……ロツド、１４……楔、２８
……楔穴。
Figure 1 is a front view. FIG. 2 is a partially sectional plan view. Figure 3 is a sectional view. Figure 4 is a partial front view showing the wedge removed from the wedge hole. FIG. 5 is a sectional view of another embodiment showing a structure for rotating the rod collecting ring. 6 and 7 show still another embodiment of the structure for rotating the rod collection ring, and FIG. 6 is a side sectional view. FIG. 7 is a partial front view showing a partial cross section. 2...Body flange, 3...Ring with wedge hole,
5... Lid, 6... Flange with lid, 11... Rod collection ring, 12... Rod, 14... Wedge, 28
...Wedge hole.
Claims (1)
リングと、楔用穴付リングの楔穴へ押込み、蓋付
フランジを本体フランジ側へ押す楔と、楔と楔穴
を脱着するために蓋に放射状に設けたロツドと、
ロツドを往復動させるロツド集合リングから成る
ことを特徴とする圧力容器蓋の迅速開閉装置。 A ring with a wedge hole that is fixed to the main body flange, a wedge that is pushed into the wedge hole of the ring with a wedge hole and pushes the flange with a lid toward the main flange, and a wedge that is attached to the lid to attach and detach the wedge and the wedge hole. With rods arranged radially,
A quick opening/closing device for a pressure vessel lid, comprising a rod collection ring that reciprocates the rods.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40104390U JPH0488059U (en) | 1990-12-19 | 1990-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40104390U JPH0488059U (en) | 1990-12-19 | 1990-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0488059U true JPH0488059U (en) | 1992-07-30 |
Family
ID=31879202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP40104390U Pending JPH0488059U (en) | 1990-12-19 | 1990-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0488059U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS567460A (en) * | 1979-06-29 | 1981-01-26 | Hitachi Ltd | Semiconductor device |
| JPH0256460B2 (en) * | 1983-07-06 | 1990-11-30 | Sumikin Kozai Kogyo Kk |
-
1990
- 1990-12-19 JP JP40104390U patent/JPH0488059U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS567460A (en) * | 1979-06-29 | 1981-01-26 | Hitachi Ltd | Semiconductor device |
| JPH0256460B2 (en) * | 1983-07-06 | 1990-11-30 | Sumikin Kozai Kogyo Kk |