JPH0487971A - Electrical charging preventive and/or static electricity shielding packaging container - Google Patents
Electrical charging preventive and/or static electricity shielding packaging containerInfo
- Publication number
- JPH0487971A JPH0487971A JP2184272A JP18427290A JPH0487971A JP H0487971 A JPH0487971 A JP H0487971A JP 2184272 A JP2184272 A JP 2184272A JP 18427290 A JP18427290 A JP 18427290A JP H0487971 A JPH0487971 A JP H0487971A
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- conductive
- laminated
- paperboard
- piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003068 static effect Effects 0.000 title claims abstract description 18
- 230000005611 electricity Effects 0.000 title claims abstract description 15
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- 230000003449 preventive effect Effects 0.000 title 1
- 239000011087 paperboard Substances 0.000 claims abstract description 52
- 239000000123 paper Substances 0.000 claims abstract description 19
- 238000012545 processing Methods 0.000 claims abstract description 8
- 238000003860 storage Methods 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims 2
- 238000000034 method Methods 0.000 abstract description 14
- 239000000835 fiber Substances 0.000 abstract description 13
- 239000006229 carbon black Substances 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 8
- 239000011888 foil Substances 0.000 abstract description 8
- 239000004094 surface-active agent Substances 0.000 abstract description 8
- 229920000049 Carbon (fiber) Polymers 0.000 abstract description 7
- 239000004917 carbon fiber Substances 0.000 abstract description 7
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 2
- 239000010935 stainless steel Substances 0.000 abstract description 2
- 230000002265 prevention Effects 0.000 abstract 1
- 239000004698 Polyethylene Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000004033 plastic Substances 0.000 description 7
- 229920003023 plastic Polymers 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- -1 polyethylene Polymers 0.000 description 5
- 229920000573 polyethylene Polymers 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000003708 ampul Substances 0.000 description 2
- 239000011111 cardboard Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229920006328 Styrofoam Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 239000008261 styrofoam Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000009816 wet lamination Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Packages (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、帯電防止および又は静電気シールド用包装容
器に関するもので、更に詳しくは、片面に導電層を有す
る積層板紙から加工成形された電子部品等の包装容器に
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to antistatic and/or static shielding packaging containers, and more particularly to electronic components processed and formed from laminated paperboard having a conductive layer on one side. This relates to packaging containers such as.
［従来の技術］
半導体ＩＣやＬＳＩ等の電子部品、プリント基板、磁気
テープ等は包装、出荷、輸送の工程で静電気によるほこ
りの吸着や静電気帯電によるトラブルから製品を保護す
る必要があり、特に最近よく用いられるＣ−ＭＯＳ型の
ＩＣ等は静電気により絶縁破壊を起しやすいので帯電防
止および静電気シールドは不可欠となっている。[Prior art] Electronic components such as semiconductor ICs and LSIs, printed circuit boards, magnetic tapes, etc. need to be protected from problems caused by static electricity and dust adsorption during the packaging, shipping, and transportation processes. Since commonly used C-MOS type ICs are susceptible to dielectric breakdown due to static electricity, antistatic and static electricity shielding are essential.
各種電子機器に使用される電子部品、特に集積回路（半
導体ＩＣ，混成ＩＣ等）、半導体素子（シリコンダイオ
ード、整流素子、トランジスタ、サイリスク、光電変換
素子、その他の半導体素子）の輸送、保管に使用される
フィルムや成形品としては次のものがある。Used for transporting and storing electronic components used in various electronic devices, especially integrated circuits (semiconductor ICs, hybrid ICs, etc.), semiconductor elements (silicon diodes, rectifying elements, transistors, SIRISK, photoelectric conversion elements, and other semiconductor elements) The following films and molded products are used.
（１）キャリヤーテープ
チップ形部品のテーピング、リード形部品のテーピング
があるが、 Ａ９に送り丸穴を打ち抜いた紙テープ、装
着用のくぼみ穴を成形加工したプラスチック製のエンボ
ステープが使用されており、プラスチックエンボスチー
ブとしてはＰＶＣ，Ｐｓ、ｐｐ等の樹脂が使用されてお
り、これらの樹脂に静電対策のためカーボングラツクそ
の他のフィラーの練り込みまたは界面活性剤系塗料の塗
布が行われている。(1) Carrier tape There is taping for chip-shaped parts and taping for lead-shaped parts, but paper tape with A9 feed round holes punched out and plastic embossed tape with molded recessed holes for attachment are used. Resins such as PVC, Ps, and PP are used for plastic embossing, and these resins are kneaded with carbon grains and other fillers or coated with surfactant-based paints to prevent static electricity. .
（２）マガジンレール
キャリヤーテープでは輸送、保管のできないＩＣなどの
半導体や異形の電子部品の輸送、保管、自動実装に使用
する製品で、プラスチック製のマガジンが主体になって
いる。ｐｖｃ、ｐｓが一般的な樹脂材料で、ＩＣなどが
静電気に弱いことからカーボンブラックのフィラーを入
れたり、帯電防止材料を塗布している。(2) Magazine rail Carrier tape is a product used for the transportation, storage, and automatic mounting of semiconductors such as ICs and odd-shaped electronic components that cannot be transported or stored using carrier tape, and is mainly made of plastic magazines. PVC and PS are common resin materials, and because ICs are sensitive to static electricity, they are filled with carbon black or coated with antistatic materials.
（３）静電気シールドバッグ、帯電防止バッグ静電気シ
ールドバッグとしては、半透明タイプ（導電繊維入りの
フィルム構造の蒸着フィルム、主にカーボンブラック等
の導電材格子印刷フィルム等を含む）と、不透明タイプ
（ポリエチレンフィルムに導電剤としてカーボンブラッ
クを練り込んだもの）がある。(3) Static electricity shielding bag, antistatic bag There are two types of static electricity shielding bag: translucent type (includes vapor-deposited film with a film structure containing conductive fibers, mainly conductive material grid printed film such as carbon black), and opaque type ( There is a polyethylene film in which carbon black is kneaded as a conductive agent).
帯電防止バッグとしては、−ａにポリエチレンに界面活
性剤を練り込んだフィルム（表面抵抗１０６〜１０１２
Ω／口）で、インフレーション法で生産される。As an antistatic bag, -a is a film made of polyethylene mixed with a surfactant (surface resistance 106 to 1012).
Ω/mouth) and is produced by the inflation method.
（４）トレイ、コンテナ
トレイヒしては、ＩＣのフラットパッケージ用途が主で
あり、静電気対策を行う必要があることから、カーボン
ブラックを練り込んだタイプと、界面活性剤を練り込む
か、塗布したタイプがあり、トレイの材料としてはｐｖ
ｃ、ｐｓが使用されている。(4) Trays and containers Trays are mainly used for flat packaging of ICs, and it is necessary to take measures against static electricity, so there are types that incorporate carbon black and those that incorporate or coat surfactants. There are different types, and the material for the tray is PV.
c, ps are used.
コンテナーとしては、電子部品の種類によって、カーボ
ンブラックを練り込んだ導電タイプが使用されている。Depending on the type of electronic component, a conductive type containing carbon black is used as the container.
（５）クツション材
発泡スチロールに連続気泡緩衝材、ウレタンフオーム、
ポリエチレンフオームが使用される。(5) Cushion material Styrofoam, open cell cushioning material, urethane foam,
Polyethylene foam is used.
（６）その他
段ボール箱（導電塗料で塗工したもの、導電繊維素紙を
使用したもの、カーボンブラ・ンクや界面活性剤を練り
込んだプラスチック段ボールケースを含む）、ＰＥフィ
ルムのバッグ等がある。(6) Other types of cardboard boxes (including those coated with conductive paint, those using conductive fiber paper, and plastic cardboard cases mixed with carbon blank and surfactants), PE film bags, etc. .
［発明が解決しようとする課題１
上記したように従来使用されている半導体等の電子部品
の包装容器は一般に静電対策を施したプラスチック製品
が用いられ、紙製品は僅か（こ静電対策を必要としない
紙テープとして使用されてし）るに止まる。[Problem to be Solved by the Invention 1] As mentioned above, conventionally used packaging containers for electronic components such as semiconductors are generally made of plastic products with anti-static measures, and only a few paper products (those with anti-static measures) are used. It is only used as paper tape that is not needed.
しかるに静電対策を施したプラスチ・ンク製品は一般に
価格が高く、かつ、環境公害の問題を含んでいるので、
これに代る製品が待望されてしする。However, plastic products with static electricity countermeasures are generally expensive and involve environmental pollution issues.
A replacement product has been long awaited.
本発明はこの点に鑑みなされたもので、従来の静電対策
を施したプラスチック製品の問題点を解決することをそ
の目的とする。The present invention has been made in view of this point, and its purpose is to solve the problems of conventional plastic products with anti-static measures.
［課題を解決するための手段］
本発明の帯電防止および又は静電気シールド効果を有す
る包装容器は、上記目的を達成するだめの手段として、
先ず片面に導電層を有する積層板紙を素材として使用す
る。[Means for Solving the Problems] The packaging container having antistatic and/or static electricity shielding effects of the present invention has the following features as a means to achieve the above object:
First, a laminated paperboard with a conductive layer on one side is used as the material.
本発明に用いる片面に導電層を有する積層板紙（以下積
層板紙と称する）とは、板紙の片面に導電層を形成した
もので、板紙と導電紙、各種導電フィルム、金属箔をド
ライラミネーション、ウェットラミネーション、エクス
トルージョンラミネション等一般に用いられる貼合方法
で積層可能であり、用いられる板紙は波形状片等を構成
する場合、坪量１００〜３００ｇ／ｒｒ１ｔが好ましい
。１００ｇ／ｒｎ”未満では波形状等の剛性が低く本発
明の用途に適さず、３００ｇ／ｒｎ’を越えると成形時
の折り抵抗が高すぎ、又割れも生じ易く不適当である。The laminated paperboard having a conductive layer on one side (hereinafter referred to as laminated paperboard) used in the present invention is a paperboard with a conductive layer formed on one side.The laminated paperboard used in the present invention is a paperboard with a conductive layer formed on one side. Lamination can be performed by a commonly used bonding method such as lamination or extrusion lamination, and when the paperboard used is used to form a corrugated piece or the like, the basis weight is preferably 100 to 300 g/rr1t. If it is less than 100 g/rn', the rigidity of the wave shape etc. will be low and it will not be suitable for the use of the present invention, and if it exceeds 300 g/rn', the folding resistance during molding will be too high and cracking will easily occur, making it unsuitable.
成形加工されない台紙を構成する場合は、特に制限はな
いが坪量１００〜４００ ｇ／ｍ”が使用し易い。When constructing a mount that is not subjected to molding processing, there is no particular restriction, but a basis weight of 100 to 400 g/m'' is easy to use.
導電層を形成する材料としては前述のように種々のもの
が使用されるが成形されて波形状片等を構成する場合、
導電紙はバルブシート中に導電物質（カーボン粒子や金
属炭素繊維等）を分散させたシートで、坪量３０〜１０
０ｇ／ｒｎ”が好ましく、３０ｇ／ｒｎ”未満は強度が
低く板紙との貼合が難しくなり、１００ｇ／ｒｎ’を越
えると導電性がそれほど向上しないにもかかわらず積層
板紙全体の厚さを必要以上に厚くしてしまうので不適当
である。導電フィルムには、導電加工によって金属イオ
ン又は金属化合物が化学的に結合された導電性有機繊維
が熱可塑性樹脂中に分散された透明フィルム（特開昭６
０−１３８１９号）例えばオークチック１２２．１３２
（三島製紙製）等があり（フィルムの厚さ３０〜９５μ
）、炭素繊維が同様に分散された透明フィルム（特開昭
６０−１６２９００号）例えばオークチック２３２（三
島製紙製）等があり（フィルムの厚さ３０〜６０μ）、
金属繊維等が同様に分散された透明フィルム（特開昭６
１−１ ｆｉ、・８２３７号）（フィルムの厚さ３０〜
５０μ）がある。カーボンブラックをポリエチレンに練
り込んだ不透明なフィルム（フィルムの厚さ５０〜１０
０μ〕、アンチスタチックＰＥと呼ばれる界面活性剤を
ポリエチレンに練り込んだ透明なフィルム（フィルムの
厚さ５０〜１００μ）、ポリエステルフィルムにＡｌ１
、Ｎｉの金属蒸着後アンチスタチックＰＥを積層した多
層構造の蒸着フィルム（フィルムの厚さ７５〜１００μ
）、と種々のタイプがあり、これらフィルムの厚さはい
ずれも３０〜１００μの範囲にあり好ましい、３０μ未
満では板紙との貼合が難しく、１００μを越えると導電
性の向上に寄与しないだけでなく、コスト高となり、又
本発明の包装容器の廃棄の際、焼却処理が難しくなるの
で不適当である。金属箔はＡｌ１箔が入手し易く、７〜
１５μ程度のものが好適に用いられ、焼却後の後処理を
考慮すると、出来るだけ厚さを低くおさえることが必要
である。又、成形加工されない台紙を構成する積層板紙
、導電紙、導電フィルム、積層フィルムとして用いる場
合、パルプ繊維を主成分とする導電紙は特に制限はない
が、合成樹脂を主成分とする各種導電フィルムと金属箔
は強度がゆるす限り厚さを薄くすることが、コストと焼
却の容易さの点で好ましい。As mentioned above, various materials are used to form the conductive layer, but when molded to form a corrugated piece etc.
Conductive paper is a sheet with conductive substances (carbon particles, metal carbon fibers, etc.) dispersed in the valve seat, and has a basis weight of 30 to 10
0g/rn'' is preferable; less than 30g/rn'' will result in low strength and difficulty in bonding with paperboard, and if it exceeds 100g/rn', the overall thickness of the laminated paperboard will be required even though the conductivity will not improve that much. This is inappropriate because it makes it thicker than the above. The conductive film is a transparent film in which conductive organic fibers to which metal ions or metal compounds are chemically bonded through conductive processing are dispersed in a thermoplastic resin (Japanese Unexamined Patent Publication No. 6
0-13819) For example, Oakchick 122.132
(manufactured by Mishima Paper Industries), etc. (film thickness 30-95μ
), transparent films in which carbon fibers are similarly dispersed (JP-A-60-162900), for example, Oaktic 232 (manufactured by Mishima Paper Industries) (film thickness 30-60μ),
A transparent film in which metal fibers, etc. are similarly dispersed (Japanese Patent Application Laid-open No.
1-1 fi, No. 8237) (film thickness 30~
50μ). Opaque film made by kneading carbon black into polyethylene (film thickness 50-10
0μ], a transparent film made by kneading a surfactant called anti-static PE into polyethylene (film thickness 50-100μ), polyester film with Al1
, a multilayered vapor-deposited film with anti-static PE laminated after Ni metal vapor deposition (film thickness 75-100 μm)
), and the thickness of these films is preferably in the range of 30 to 100 μm. If it is less than 30 μm, it is difficult to bond with paperboard, and if it exceeds 100 μm, it will not contribute to improving the conductivity. This is not appropriate because it increases costs and makes it difficult to incinerate the packaging container of the present invention when disposing of it. As for metal foil, Al1 foil is easily available, and 7~
A thickness of about 15 μm is preferably used, and in consideration of post-treatment after incineration, it is necessary to keep the thickness as low as possible. In addition, when used as a laminated paperboard, conductive paper, conductive film, or laminated film that constitutes a mount that is not molded, there are no particular restrictions on the conductive paper whose main component is pulp fiber, but various conductive films whose main component is synthetic resin can be used. It is preferable in terms of cost and ease of incineration to make the thickness of the metal foil as thin as possible.
なお、上記使用される導電紙、各種導電フィルム、金属
箔はいずれも良好な導電層を形成しつるが、導電紙は紙
粉の発生、炭素繊維又は金属繊維が分散した透明フィル
ムは成形加工での繊維の折れや脱落、カーボンブラック
練り込みフィルムはカーボンブラックの脱落、界面活性
剤練り込みフィルムおよびアンチスタチックＰＥ積層蒸
着フィルムは界面活性剤の転移汚れが完全に避けられな
いので収納される内容物によっては使用を限定される。The conductive paper, various conductive films, and metal foils used above all form a good conductive layer, but the conductive paper generates paper dust, and the transparent film in which carbon fibers or metal fibers are dispersed is difficult to form. Fiber folding and falling off, carbon black falling off from carbon black-mixed films, surfactant transfer staining from surfactant-mixed films and anti-static PE laminated vapor deposited films cannot be completely avoided. The use of some items is limited.
又、金属箔も焼却後の処理が必要で、導電加工された有
機繊維が分散したフィルムが制限もなく最も好ましい。Further, metal foil also requires treatment after incineration, and a film in which electrically conductive treated organic fibers are dispersed is most preferable without any limitation.
積層板紙を作る貼合方法は、導電紙、金属箔を用いる場
合、ウエットラミネークー又はドライラミネーターが一
般的で、各種導電フィルムを用いる場合、ドライラミネ
ーター又はエクストルージョンラミネークーが一般的で
あるが、特にこれらに限定されるものではない。The laminating method for making laminated paperboard is generally wet lamination or dry laminator when using conductive paper or metal foil, and dry laminator or extrusion lamination when using various conductive films. It is not particularly limited to these.
本発明の帯電防止および又は静電気シールド包装容器の
成形方法として。As a method for forming an antistatic and/or static electricity shielding packaging container of the present invention.
■積層板紙を波形状片に成形する工程と、該波形状片と
台紙を接着又は融合固着する工程がある（実施例１〜３
）
■積層板紙を折曲げ固着成形する工程（実施例があり、
■の工程を述べると、本発明の波形状片は、第５図に示
したようにスイス、ディビデラ社のマルチフオームシス
テム装置を用いた加工方法の一例では加工の進行方向と
直角に波形が形成され、波の幅即ちトレイやキャリアの
幅や３０〜２００ｍｍの範囲、トレイやキャリアの長さ
は最小は１つの波から、可能な限り長くした連続の巻取
状の範囲まで選択でき、波形状片の波の形の断面は第６
図の略式図に示したように三角形、台形、直方形から選
択でき、波の山の幅、高さ、波の谷の幅は各々次の範囲
から選択される。■There is a process of forming the laminated paperboard into a corrugated piece, and a process of gluing or fusing the corrugated piece and the backing paper (Examples 1 to 3).
) ■The process of bending and fixing the laminated paperboard (there are examples,
To describe the process (2), the wave-shaped piece of the present invention is formed in an example of a processing method using a multiform system device manufactured by Dividera, Switzerland, as shown in FIG. The width of the waves, i.e. the width of the tray or carrier, ranges from 30 to 200 mm, and the length of the tray or carrier can be selected from a minimum of one wave to a continuous winding range as long as possible. The wave-shaped cross section of the piece is the 6th
As shown in the schematic diagram in the figure, the shape can be selected from triangle, trapezoid, and rectangular parallelepiped, and the width, height, and width of wave troughs are each selected from the following ranges.
波の山の幅 ｍ： ２〜１５ｍｍ
〃 高さ ｈ： ５〜５０ｍｍ
波の谷の幅 ℃： ３〜１００ｍｍ
以上の選択範囲は収納される内容物の形状、大きさ、使
用方法等によって適宜選択できるが成形装置は特に限定
されるものではなく、内容物によって決定される形、大
きさに加工しつるプレス機、形押し機を用いる方法も適
用できる。台紙と波形状片を固着する工程は、フィルム
とフィルムの場合にヒートシール等の融合が用いられる
以外は接着剤、粘着テープ及びヒートシールを併用して
固着される。Wave crest width m: 2 to 15 mm Height h: 5 to 50 mm Wave trough width C: 3 to 100 mm The above selection range can be selected as appropriate depending on the shape, size, usage method, etc. of the contents to be stored. However, the molding device is not particularly limited, and a method using a vine press or a stamping machine for processing into the shape and size determined by the contents can also be applied. In the step of fixing the corrugated piece to the mount, adhesives, adhesive tapes, and heat seals are used in combination, except that in the case of films, fusion such as heat seals is used.
■の工程は形押し後折り曲げ固着成形するが、一端でつ
き合わせてテープ止め又は−面で重なりを作り、接着又
は融合固着できる。In the process (2), after stamping, the pieces are bent and fixed, but one end can be brought together and taped, or an overlap can be made with a negative side, and the pieces can be glued or fused and fixed.
本発明の包装容器は板紙がその構成の大半を占めている
ことから、コスト、加工の容易性とともに、廃棄の際、
焼却が容易で環境問題の懸念が少ないことが特徴であり
、包装容器全体で板紙とフィルムの割合は（４０〜３）
対ｌが適当で、黒煙の発生具合から３対ｌがフィルムの
占める上限である。Since the packaging container of the present invention is mostly made of paperboard, it is easy to reduce costs and process, and is also easy to dispose of.
It is characterized by easy incineration and low environmental concerns, and the ratio of paperboard and film in the entire packaging container is (40-3).
A ratio of 1 to 1 is appropriate, and 3 to 1 is the upper limit for the film based on the degree of black smoke generation.
本発明は上述のごとく素材の板紙として、波形に加工す
る場合＝１００〜３００ｇ／ｒｒＩｔ、波形に加工しな
い場合＝１００〜４００ｇ／ｒｎ’の厚さのものを使用
し、また導電層としては各種材質のものを加工および電
気的特性を考慮した厚さのものを使用するので、各種加
工装置（例えば、スイス国ディビデラ社のマルチフオー
ム機、ロントレージョン、アンプルベツド機）で容易多
量生産的に、トレイ、キャリア、マガジン等各種形状の
包装容器が製造され、電子機器の帯電防止と静電気シー
ルドの効果を発揮させることができる。As described above, the present invention uses a paperboard having a thickness of 100 to 300 g/rrIt when processed into a corrugated shape, and 100 to 400 g/rn' when not processed into a corrugated shape, and various types of conductive layers are used. Since the material is processed and the thickness is taken into consideration of the electrical characteristics, it can be easily mass-produced using various processing equipment (for example, the multiform machine, rontrayon, and ampoule bed machine manufactured by Dividera of Switzerland). Packaging containers of various shapes, such as trays, carriers, and magazines, are manufactured and can provide antistatic and static shielding effects for electronic devices.
［実 施 例］
実施例について図面を参照して説明すると、第１図は本
発明の実施例１のトレイで（Ａ）は片面に導電層１ａを
有する積層板紙ｌを加工して、上面に導電層１ａを有す
る断面波形状片３に形成し、下面に積層板紙１の板紙層
１ｂを積層されてなるものであり、（Ｂ）は下面に板紙
２を接着されてなるものである。内容物は該波形状片３
の山部にまたがって、又は谷部に収納される。種々の積
層板紙の表面電気抵抗率の範囲を表−１に示した。導電
層としての導電紙（炭素繊維内添）、■導電フィルム（
導電加工された有機繊維分散）、■導電フィルム（炭素
繊維分散）、■導電フィルム（ステンレススチール繊維
分散）、■導電フィルム（カーボンブラック練り込み）
、■導電フィルム（界面活性剤練り込み）、■導電フィ
ルム（アンチスタチックＰＥと積層した蒸着）、■八で
箔が用いられているもので、各々導電繊維等の量が異な
る品種を含むため表面電気抵抗率は範囲で示した。なお
、積層板紙の成形前と後では表面電気抵抗率に殆ど差は
見られなかった。作製したトレイの帯電防止性も評価し
た。[Example] An example will be described with reference to the drawings. Fig. 1 shows a tray of Example 1 of the present invention, and (A) shows a tray prepared by processing a laminated paperboard l having a conductive layer 1a on one side, and forming a layer on the upper surface. It is formed into a cross-sectionally corrugated piece 3 having a conductive layer 1a, and the paperboard layer 1b of the laminated paperboard 1 is laminated on the bottom surface, and (B) is formed by bonding the paperboard 2 to the bottom surface. The contents are the corrugated piece 3
It is stored across the peaks or in the valleys. Table 1 shows the range of surface electrical resistivity of various laminated paperboards. Conductive paper (with carbon fiber added) as a conductive layer, ■ Conductive film (
conductive processed organic fiber dispersion), ■conductive film (carbon fiber dispersion), ■conductive film (stainless steel fiber dispersion), ■conductive film (carbon black kneaded)
, ■ Conductive film (surfactant mixed in), ■ Conductive film (evaporated film laminated with anti-static PE), ■ Foil is used in 8, and each includes types with different amounts of conductive fibers, etc. Surface electrical resistivity is expressed as a range. There was almost no difference in surface electrical resistivity before and after the laminated paperboard was formed. The antistatic properties of the produced trays were also evaluated.
表−１ 積層板紙及び波形状片トレイの帯電防止性板紙を使用。Table-1 Uses anti-static paperboard in laminated paperboard and corrugated strip trays.
トレイは実施例１の（Ｂ）で評価 △やや長筒２図は
本発明の実施例２を示すキャリアで、片面に導電層１ａ
を有する積層板紙ｌを加工して下面に導電層１ａを有す
る断面波形状片３に形成し、下面に導電フィルム又は導
電紙を（Ａ）、あるいは積層板紙ｌ又は積層フィルムの
導電層１ａを（Ｂ）、接着または融合固着されてなり、
内部表面が導電性を呈する筒状内部空間内に内容物を収
納するものである。The tray was evaluated according to (B) in Example 1. △Slightly long cylinder 2 Figure shows a carrier showing Example 2 of the present invention, with a conductive layer 1a on one side.
A laminated paperboard l having a conductive layer 1a is processed to form a cross-sectional corrugated piece 3 having a conductive layer 1a on the lower surface, and a conductive film or conductive paper is formed on the lower surface (A), or a laminated paperboard l or a conductive layer 1a of the laminated film is formed on the lower surface (A). B) is bonded or fused,
The contents are stored in a cylindrical internal space whose internal surface exhibits conductivity.
第３図は本発明の実施例３を示すキャリアで、第２図（
Ａ）、（Ｂ）の上面に板紙２を接着して補強したもので
第２図と同じ筒状内部空間内に内容物を収納するもので
ある。ここで実施例１と同じ■〜■の導電層を用いて第
２図（Ａ）（Ｂ）、第３図（Ａ）、（Ｂ）のキャリアを
作製し静電気シールド効果を表２に示した。導電層が同
じであれば実施例２．３とも差はほとんどみられず、導
電層に用いた材料による差がみられ、カボンブラック及
び界面活性剤練り込みフィルムを用いたものは評価は低
かった。なお、本発明の実施例では導電層を構成する材
料は組合わせを同一としたが、これに限らず異なった組
合わせも本発明に含まれるものである。Figure 3 shows a carrier showing Embodiment 3 of the present invention, and Figure 2 (
A) and (B) are reinforced by adhering paperboard 2 to their upper surfaces, and the contents are stored in the same cylindrical internal space as shown in Fig. 2. Here, the carriers shown in Figures 2 (A), (B), 3 (A), and (B) were prepared using the same conductive layers ■ to ■ as in Example 1, and the static electricity shielding effects are shown in Table 2. . If the conductive layer is the same, there is almost no difference between Examples 2 and 3, and there are differences depending on the material used for the conductive layer, and the evaluation was low for the one using carbon black and a surfactant-mixed film. . In the embodiments of the present invention, the combination of materials constituting the conductive layer is the same, but the present invention is not limited to this and includes different combinations.
表−２
キャリアの静電気シールド効果
ＥＩＡ−５４１ｘ不良
第４図は本発明の実施例４を示すマガジンで、片面に導
電層１ａを有する積層板紙ｌを加工して、導電層１ａを
内面に有する断面形状が二重Ｕ字形の筒状体で、内部空
間に内容物を収納するものである。Table 2 Electrostatic Shielding Effect of Carrier EIA-541x Defective Figure 4 shows a magazine showing Example 4 of the present invention, in which a cross-section of laminated paperboard l having a conductive layer 1a on one side is processed to have a conductive layer 1a on the inner surface. It is a cylindrical body with a double U-shape, and the contents are stored in the internal space.
第５図は本発明の加工方法の１例を示すもので、ｌは片
面に導電層を有する積層板紙、２は下面に接着される板
紙、３は加工された断面波形状片、４はトレイ、５は内
容物である。FIG. 5 shows an example of the processing method of the present invention, where l is a laminated paperboard having a conductive layer on one side, 2 is a paperboard glued to the bottom surface, 3 is a processed piece with a corrugated cross section, and 4 is a tray. , 5 are the contents.
第６図は前記断面波形状片の各種断面形状を示すもので
、（Ａ）は長方形で谷が広いもの、（Ｂ）は長方形で山
が広いものの１例である。FIG. 6 shows various cross-sectional shapes of the wave-shaped cross-sectional piece, where (A) is a rectangular piece with wide valleys, and (B) is an example of a rectangular piece with wide peaks.
（Ｃ）は二等辺三角形、（Ｄ）は直角三角形、（Ｅ）は
台形である。(C) is an isosceles triangle, (D) is a right triangle, and (E) is a trapezoid.
（Ａ）〜（Ｅ）は例えばスイス国ディビデラ社製のマル
チフオーム機によって形成される。(A) to (E) are formed by, for example, a multiform machine manufactured by Dividera of Switzerland.
第６図（Ｆ）は例えばロントレージョン、アンプルベツ
ドにより形成されるもので１円形状のものである。FIG. 6(F) is a one-circle-shaped one formed by, for example, a long region or an ampoule bed.
［発明の効果〕 本発明によって奏される効果は次の通りである。[Effect of the invention〕 The effects achieved by the present invention are as follows.
（１）積層板紙を素材とするので、剛性でありながら柔
軟性があるので、加工成形および電子部品の保存が容易
完全に行われる。(1) Since it is made of laminated paperboard, it is rigid yet flexible, so processing, molding, and storage of electronic components can be easily and perfectly performed.
（２）焼却が容易で環境問題の懸念が少ない。(2) It is easy to incinerate and there are few environmental concerns.
（３）コストが低減される。(3) Costs are reduced.
（４）再使用可能である。(4) It is reusable.
（５）帯電防止および静電気シールド効果が多大である
。(5) Great antistatic and static shielding effects.
第１図〜第４図は本発明実施の第１例〜第４例を示す説
明図、第５図は本発明の加工方法の１例を示す説明図で
ある。また第６図（Ａ）〜（Ｆ）は波形状片の各種断面
形状を示す説明図である。
図中の符号はそれぞれ下記部材を示す。
１：積層板紙 ２：板紙
３：断面波形状片 ４ニドレイ
５：内容物 １ａ：導電層
１ｂ＝板紙層
山
Ｅｆ〉祝
相
ｄ−１隈1 to 4 are explanatory diagrams showing first to fourth examples of implementing the present invention, and FIG. 5 is an explanatory diagram showing one example of the processing method of the present invention. Moreover, FIGS. 6(A) to 6(F) are explanatory views showing various cross-sectional shapes of the corrugated piece. The symbols in the drawings indicate the following members, respectively. 1: Laminated paperboard 2: Paperboard 3: Cross-sectional corrugated piece 4 Nidrei 5: Contents 1a: Conductive layer 1b = Paperboard layer pile Ef〉Fold phase d-1 area
Claims (5)
該導電層に接触するように内容物を収納するようにした
ことを特徴とする帯電防止および又は静電気シールド用
包装容器。1. Constructed from laminated paperboard with a conductive layer on one side,
1. A packaging container for antistatic and/or static electricity shielding, characterized in that the contents are stored in contact with the conductive layer.
導電層を有する断面波形状片に形成し、該波形状片の下
面に板紙または前記積層板紙の板紙部分を該波形状片の
谷部で接着したトレイで、前記波形状片の山部または谷
部に内容物を収納するようにしてなる請求項１に記載の
集積回路装置用収納保持トレイ。2. A laminated paperboard having a conductive layer on one side is processed to form a cross-sectional corrugated piece having the conductive layer on the upper side, and the paperboard or a paperboard portion of the laminated paperboard is placed on the lower side of the corrugated piece at the troughs of the corrugated piece. 2. The storage and holding tray for an integrated circuit device according to claim 1, wherein the tray is bonded with a wafer and the contents are stored in the peaks or troughs of the corrugated piece.
導電層を有する断面波形状片に形成し、該波形状片の下
面に前記積層板紙の導電層部分または他の導電フィルム
、導電紙、積層フィルムの導電層部分を該波形状片の谷
部で接着または融合固着してなる内部表面が導電性を呈
する筒状内部空間を有する複合物で、該筒状内部空間内
に内容物を収納するようにしてなる請求項１に記載の集
積回路装置用キャリア。3. A laminated paperboard having a conductive layer on one side is processed to form a cross-sectional corrugated piece having the conductive layer on the lower side, and a conductive layer portion of the laminated paperboard or other conductive film, conductive paper, on the lower side of the corrugated piece. A composite material having a cylindrical internal space whose internal surface exhibits conductivity, made by adhering or fusing the conductive layer portion of a laminated film at the valleys of the corrugated piece, and storing contents within the cylindrical internal space. The carrier for an integrated circuit device according to claim 1, which is configured to do so.
導電層を有する断面波形状片に形成し、該波形状片の下
面に前記積層板紙の導電層部分または他の導電フィルム
、導電紙、積層フィルムの導電層部分を該波形状片の谷
部で接着または融着固着し、また該波形状片の上面に板
紙を接着してなる内部表面が導電性を呈する筒状内部空
間を有する複合物で、該筒状内部空間内に内容物を収納
するようにしてなる請求項１又は３に記載の集積回路装
置用キャリア。4. A laminated paperboard having a conductive layer on one side is processed to form a cross-sectional corrugated piece having the conductive layer on the lower side, and a conductive layer portion of the laminated paperboard or other conductive film, conductive paper, on the lower side of the corrugated piece. A composite having a cylindrical internal space whose inner surface exhibits conductivity, the conductive layer portion of the laminated film being adhered or fused to the troughs of the corrugated piece, and a paperboard adhered to the top surface of the corrugated piece. 4. The carrier for an integrated circuit device according to claim 1, wherein the carrier is made of a cylindrical inner space and stores contents therein.
部表面が導電性を呈する内部空間を有し断面形状が長方
形、二重Ｕ字形等各種形状の筒状体片で、該内部空間に
内容物を収納するようにした請求項１に記載のＩＣ等収
納マガジン。5. It is a cylindrical piece made by processing laminated paperboard with a conductive layer on one side, and has an internal space whose internal surface exhibits conductivity, and whose cross section is rectangular, double U-shaped, etc., and has contents in the internal space. 2. The IC storage magazine according to claim 1, which is adapted to store objects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2184272A JPH0487971A (en) | 1990-07-13 | 1990-07-13 | Electrical charging preventive and/or static electricity shielding packaging container |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2184272A JPH0487971A (en) | 1990-07-13 | 1990-07-13 | Electrical charging preventive and/or static electricity shielding packaging container |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0487971A true JPH0487971A (en) | 1992-03-19 |
Family
ID=16150420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2184272A Pending JPH0487971A (en) | 1990-07-13 | 1990-07-13 | Electrical charging preventive and/or static electricity shielding packaging container |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0487971A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100417910B1 (en) * | 2001-03-19 | 2004-02-14 | 이문수 | Method product and tile for protecting static electricity |
| WO2023203955A1 (en) * | 2022-04-20 | 2023-10-26 | 株式会社村田製作所 | Carrier tape |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6047277B2 (en) * | 1974-02-08 | 1985-10-21 | ギスト・ブロカデス・ナ−ムロ−ゼ・フエンノ−トチヤツプ | Method for producing cephalosporanic acid derivatives |
-
1990
- 1990-07-13 JP JP2184272A patent/JPH0487971A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6047277B2 (en) * | 1974-02-08 | 1985-10-21 | ギスト・ブロカデス・ナ−ムロ−ゼ・フエンノ−トチヤツプ | Method for producing cephalosporanic acid derivatives |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100417910B1 (en) * | 2001-03-19 | 2004-02-14 | 이문수 | Method product and tile for protecting static electricity |
| WO2023203955A1 (en) * | 2022-04-20 | 2023-10-26 | 株式会社村田製作所 | Carrier tape |
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