JPH0487673U - - Google Patents
Info
- Publication number
- JPH0487673U JPH0487673U JP12903190U JP12903190U JPH0487673U JP H0487673 U JPH0487673 U JP H0487673U JP 12903190 U JP12903190 U JP 12903190U JP 12903190 U JP12903190 U JP 12903190U JP H0487673 U JPH0487673 U JP H0487673U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- pairs
- pair
- placed opposite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
【図１】本考案の実施例を示す結合印刷回路基
板の要部縦断側面図である。FIG. 1 is a longitudinal sectional side view of main parts of a combined printed circuit board showing an embodiment of the present invention.
【図２】本考案の他
の実施例を示す結合印刷回路基板の要部縦断側面
図である。FIG. 2 is a longitudinal cross-sectional side view of main parts of a combined printed circuit board showing another embodiment of the present invention.
【図３】結合回路基板の従来例を示す
縦断側面図である。FIG. 3 is a longitudinal sectional side view showing a conventional example of a coupling circuit board.
【図４】従来の結合回路基板
における半田ブリツジにより結合状態の例を示す
要部縦断側面図である。FIG. 4 is a vertical sectional side view of a main part showing an example of a state of bonding by solder bridges in a conventional bonding circuit board.
【図５】従来の結合回路
基板における半田ブリツジによる結合状態の例を
示す要部縦断側面図である。FIG. 5 is a longitudinal sectional side view of a main part showing an example of a state of bonding by solder bridges in a conventional bonded circuit board.
【図６】従来の結合
回路基板における半田ブリツジによる結合状態の
例を示す要部縦断側面図である。
符号の説明、１……印刷回路基板、２……印刷
回路基板、３……ランド電極、７……ランド電極
、８……貫通孔、９……半田ブリツジ、１１……
凹部。FIG. 6 is a longitudinal sectional side view of a main part showing an example of a state of bonding by solder bridges in a conventional bonding circuit board. Explanation of symbols, 1...Printed circuit board, 2...Printed circuit board, 3...Land electrode, 7...Land electrode, 8...Through hole, 9...Solder bridge, 11...
recess.
Claims (1)
，２に各々一対以上の半田結合用のランド電極３
，７を互いに対向させて形成し、これらランド電
極３，７を半田ブリツジ９により互いに半田付け
してなる結合印刷回路基板おいて、少なくとも一
方の印刷回路基板２の前記ランド電極７の部分に
貫通孔８が形成されていることを特徴とする結合
印刷回路基板。 (2) 対向して配置された一対の印刷回路基板１
，２に各々一対以上の半田結合用のランド電極３
，７を互いに対向させて形成し、これらランド電
極３，７を半田ブリツジ９により互いに半田付け
してなる結合印刷回路基板おいて、少なくとも一
方の印刷回路基板２の前記ランド電極７の部分に
凹部１１が形成されていることを特徴とする結合
印刷回路基板。[Scope of claims for utility model registration] (1) A pair of printed circuit boards 1 placed opposite each other
, 2 each have one or more pairs of land electrodes 3 for solder bonding.
. A bonded printed circuit board characterized in that a hole 8 is formed. (2) A pair of printed circuit boards 1 placed opposite each other
, 2 each have one or more pairs of land electrodes 3 for solder bonding.
. 11. A bonded printed circuit board characterized in that: 11 is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12903190U JPH0487673U (en) | 1990-11-30 | 1990-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12903190U JPH0487673U (en) | 1990-11-30 | 1990-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0487673U true JPH0487673U (en) | 1992-07-30 |
Family
ID=31876456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12903190U Pending JPH0487673U (en) | 1990-11-30 | 1990-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0487673U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002015652A1 (en) * | 2000-08-10 | 2002-02-21 | Sony Chemicals Corp. | Flexible wiring board for front-back connection |
-
1990
- 1990-11-30 JP JP12903190U patent/JPH0487673U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002015652A1 (en) * | 2000-08-10 | 2002-02-21 | Sony Chemicals Corp. | Flexible wiring board for front-back connection |