JPH048478A - Diamond abrasive film - Google Patents
Diamond abrasive filmInfo
- Publication number
- JPH048478A JPH048478A JP11036390A JP11036390A JPH048478A JP H048478 A JPH048478 A JP H048478A JP 11036390 A JP11036390 A JP 11036390A JP 11036390 A JP11036390 A JP 11036390A JP H048478 A JPH048478 A JP H048478A
- Authority
- JP
- Japan
- Prior art keywords
- diamond
- polishing
- film
- stiffness
- abrasive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010432 diamond Substances 0.000 title claims abstract description 30
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 30
- 238000005498 polishing Methods 0.000 claims abstract description 29
- 239000002245 particle Substances 0.000 claims description 6
- 239000004952 Polyamide Substances 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- -1 polyethylene terephthalate Polymers 0.000 claims description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 2
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 230000003746 surface roughness Effects 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 20
- 239000010409 thin film Substances 0.000 description 6
- 239000006061 abrasive grain Substances 0.000 description 5
- 230000002950 deficient Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔発明の分野〕
本発明はエレクトロニクス部品、薄１１Ｈａ気ヘッド基
板の如きセラミック材料の最終研磨に使用されるダイヤ
モンド研磨フィルムに関し、詳しくは本発明は、プラス
チック支持体上にダイヤモンド研磨層を形成したダイヤ
モンド研磨フィルムに関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to diamond polishing films used in the final polishing of ceramic materials such as electronic components, thin 11Ha gas head substrates, and more particularly, the present invention relates to diamond polishing films used in the final polishing of ceramic materials such as electronic components and thin 11Ha gas head substrates. The present invention relates to a diamond polishing film having a diamond polishing layer formed thereon.
［従来技術の説明］
情報記録容量の増大と高速化システム技術の進歩とに伴
い、フェライトヘッドと比較して高い透磁率を有し且つ
高い転送速度でも高電磁変換率を維持することの出来る
薄膜ヘッドに対する要求が高まっている。[Description of Prior Art] With the increase in information storage capacity and advances in high-speed system technology, thin films that have higher magnetic permeability than ferrite heads and can maintain a high electromagnetic conversion rate even at high transfer speeds have been developed. Demand for heads is increasing.
薄膜ヘッド化が進むにつれて各種セラミックス基板材料
が必要となってきている。ＳｉＣ、Ｚｒ０ｚ、Ａ１２０
１ 、Ａｌ２Ｏｍ−ＴｉＣ等のセラミックの研磨にはダ
イヤモンドのような超砥粒が使用される。特に薄膜ヘッ
ド用基板はその表面に薄膜パターンを形成するため、平
面度及び表面粗度も重要であるが、表面に被着される薄
膜の諸物性を維持向上するような加工法を用いる必要性
がある。即ち、微細なダイヤモンド砥粒を使用したダイ
ヤモンド研磨フィルムによる加工が必要となってくる。As the trend toward thin film heads progresses, various ceramic substrate materials are becoming necessary. SiC, Zr0z, A120
1. Superabrasive grains such as diamond are used to polish ceramics such as Al2Om-TiC. In particular, since a thin film pattern is formed on the surface of a thin film head substrate, flatness and surface roughness are also important, but it is necessary to use a processing method that maintains and improves the physical properties of the thin film deposited on the surface. There is. That is, processing using a diamond polishing film using fine diamond abrasive grains is required.
しかしながら、従来から使用されているダイヤモンドフ
ィルムでは研磨面粗度及び加工形状精度に与え得る効果
は共に不十分であり、またこうした加工法は量線仕上げ
工程であることから、粒度分布がブロードであったり或
は研粒が凝集している場合は加工表面にスクラッチ（正
常な研磨すじとは異なる深いすじ）等のダメージを与え
る恐れがあり、また研磨フィルムの腰が強過ぎる（一般
にＥＴ” ＝ ｌＸｌ０’ （ｕｍ ）”ｋｇ／ｍｍ２
以上）場合は、研磨フィルム及び被研磨物間の密着性が
悪化し加工面が不均一となるといった問題があった。However, the effect that conventionally used diamond films have on both polished surface roughness and machined shape accuracy is insufficient, and since this processing method is a linear finishing process, the particle size distribution is broad. If the abrasive particles are agglomerated, there is a risk of damage such as scratches (deep lines different from normal polishing lines) on the processed surface, and the abrasive film is too stiff (generally ET" = lXl0 '(um)"kg/mm2
In the above cases, there was a problem in that the adhesion between the polishing film and the object to be polished deteriorated, resulting in uneven processed surfaces.
〔発明の目的１
そこで本発明の主たる目的は、薄膜ヘッド基板研磨に於
て、被研磨物に損傷を与えることなく研磨面形状及び仕
上げ面粗さを正確に制御することの出来る精密ダイヤモ
ンドフィルムを提供することにある。[Objective of the Invention 1] Therefore, the main object of the present invention is to provide a precision diamond film that can accurately control the shape of the polished surface and the roughness of the finished surface in thin film head substrate polishing without damaging the polished object. It is about providing.
本発明の他の目的は、研磨フィルムの被研磨物に対する
摺接面積を増大させ研磨効果を高めることである。Another object of the present invention is to increase the sliding contact area of the polishing film to the object to be polished, thereby enhancing the polishing effect.
［発明の概要及び作用効果］
本発明によれば、プラスチック支持体上にダイヤモンド
研磨層を形成して成る研磨フィルムに於て、該研磨フィ
ルムの全厚をＴとし、ヤング率をＥとして定義される研
磨フィルムの腰の強さの指標であるスティフネスＥＴ”
が、
ＥＴ” ＝Ｉ Ｘ １０’ （１ｔｍ ）”ｋｇ／ｍｍ
”±２００００を満足し、且つ使用されるダイヤモンド
粒子の平均粒子径が１ＬＬＩ１１以下であることを特徴
とするダイヤモンド研磨フィルムが提供される。プラス
チック支持体としては通常のベースとして使用される、
例えば、ポリエチレンテレフタレート、ポリアミド、ポ
リイミド、ポリエステル等によって作製したものを使用
し得る。[Summary and Effects of the Invention] According to the present invention, in a polishing film formed by forming a diamond polishing layer on a plastic support, the total thickness of the polishing film is defined as T, and the Young's modulus is defined as E. Stiffness ET is an indicator of the stiffness of the polishing film.
However, ET" = I x 10'(1tm)"kg/mm
Provided is a diamond abrasive film which satisfies the standard deviation of 20,000 and has an average particle diameter of 1LLI11 or less of the diamond particles used.
For example, those made of polyethylene terephthalate, polyamide, polyimide, polyester, etc. can be used.
本発明のダイヤモンド研磨フィルムは上記構成によって
前記目的を達成しそれにより前記従来技術の問題を解決
する作用効果を奏する。The diamond abrasive film of the present invention has the above-mentioned structure to achieve the above-mentioned object, thereby achieving the effects of solving the problems of the prior art.
［実施例の説明］
本発明の１実施例におけるダイヤモンド研磨フィルムは
、ダイヤモンド砥粒：ウレタン系樹脂：メチルエチルケ
トン／トルエンが１００：２０：１００である塗料組成
を使用して形成される。上記組成に於゛て、ダイヤモン
ド砥粒径は一般に１．０μｍ以下の範囲のものが好都合
に使用され得る。該範囲は、ダイヤモンド砥粒径を０〜
１．５μｍの範囲で５ｉＣ１ＺｒＯ□、Ａ１□０ｎ−Ｔ
ｉＣを被研削物として研削加工する予備検査を実施した
結果、１，０μｍを越える範囲に於ては加工面にスクラ
ッチが生じ易いこと及び１．０μｍ以下ではスクラッチ
の問題が無く、−様な研磨すじが生じることが判明した
こと、によって画定されたものである。[Description of Examples] A diamond abrasive film in one example of the present invention is formed using a coating composition of diamond abrasive grains: urethane resin: methyl ethyl ketone/toluene in a ratio of 100:20:100. In the above composition, diamond abrasive grains having a diameter of 1.0 μm or less can be conveniently used. This range includes diamond abrasive grain diameter of 0 to
5iC1ZrO□, A1□0n-T in the range of 1.5 μm
As a result of a preliminary inspection of grinding iC as an object to be ground, it was found that scratches tend to occur on the machined surface in the range exceeding 1.0 μm, and that there is no problem with scratches in the range of 1.0 μm or less. It was determined by the fact that streaks were found to occur.
本発明のダイヤモンド研磨フィルムは上記の如く１．０
μｍ以下のダイヤモンド砥粒径を使用し、更に、研磨フ
ィルムの全厚をＴ、ヤング率をＥとして定義される研磨
フィルムの腰の強さの指標であるスティフネス（ＥＴ”
）が、 ｌＸｌ０’（μＩＩｌ）１ｋｇ／ｍｍ”±２
００００を満足するものが使用される。The diamond polishing film of the present invention has a 1.0
A diamond abrasive grain size of µm or less is used, and the stiffness (ET), which is an index of the stiffness of the polishing film defined as the total thickness of the polishing film as T and the Young's modulus as E, is used.
) is lXl0'(μIIl)1kg/mm"±2
A value that satisfies 0000 is used.
詳しくは、本件出願人は４．０から１０．０μｍの範囲
の全厚を有するダイヤモンド研磨フィルムをその耐久性
及び研磨面の均一性に関して評価する実験を実施し、そ
の結果、以下の４つの全厚のものが何れも前記耐久性及
び研磨面の均一性に於て共に優れていると総合評価し得
ることを見出した。Specifically, the applicant conducted experiments to evaluate diamond polishing films having a total thickness in the range of 4.0 to 10.0 μm with respect to their durability and polishing surface uniformity, and as a result, the following four overall results were obtained: It has been found that all thicknesses can be comprehensively evaluated as being excellent in both the durability and the uniformity of the polished surface.
そしてこれらの全厚を有するダイヤモンド研磨フィルム
は何れも前記スティフネス値を満足することが確認され
た。It was confirmed that all diamond polishing films having these total thicknesses satisfied the above stiffness value.
全厚（μｍ）
７．９
８．２
８．５
スティフネス（ＥＴ” ）
１．０１ ＸＩＯ’
９．４５ ＸＩＯ’
１．００ ＸＩＯ＠
１．０１ ＸＩＯ’
また、比較例としてその他全厚値及びスティフネスの場
合の耐久性及び研磨面の均一性の評価結果を示す。Total thickness (μm) 7.9 8.2 8.5 Stiffness (ET'') 1.01 XIO' 9.45 XIO' 1.00 The evaluation results of durability and uniformity of the polished surface are shown below.
全厚 スティフネス 耐久性 研磨面の均一性
４、 Ｏ２，７４Ｘ １０’ 不良５．８ ３
．３６ｘ １０’ 不良６．０ ３．９５ｘ
１０’ 不良６．９ ６．６０Ｘ １０’
不良７、０ ６．７５Ｘ １０’ 不良８．
７ １．２５Ｘ １０’ 良好 不良９．
２ １．４６ｘｌＯ’ 良好 不良１０、
０ ２．０１ ｘ １０’ 良好 不良以
上のように、前記スティフネス値１×１０５（μｒｎ
）”ｋｇ／ｍｍ”±２００’ＯＯを満足しない全厚を有
するものは、耐久性が不良であるか若しくは、耐久性が
良好であっても研磨面の均一性が不良であるという結果
が得られた。Total thickness Stiffness Durability Polished surface uniformity 4, O2,74X 10' Defective 5.8 3
．． 36x 10' Defective 6.0 3.95x
10' Defective 6.9 6.60X 10'
Defective 7, 0 6.75X 10' Defective 8.
7 1.25X 10' Good Bad9.
2 1.46xlO' Good Bad 10,
0 2.01 x 10' Good As above, the stiffness value 1 x 105 (μrn
) If the total thickness does not satisfy ±200'OO in kg/mm, the durability will be poor, or even if the durability is good, the uniformity of the polished surface will be poor. It was done.
Claims (1)
して成る研磨フィルムに於て、該研磨フィルムの全厚を
Ｔ、ヤング率をＥとして定義される、研磨フィルムの腰
の強さの指標であるスティフネスＥＴ＾３が、ＥＴ＾３
＝１×１０＾５（μｍ）＾３ｋｇ／ｍｍ＾２±２０００
０を満足し、使用されるダイヤモンド粒子の平均粒子径
が１μｍ以下であることを特徴とするダイヤモンド研磨
フィルム。 ２、ポリエチレンテレフタレート、ポリアミド、ポリイ
ミド、ポリエステル等の支持体上にダイヤモンド研磨層
を形成して成る特許請求の範囲第１項記載のダイヤモン
ド研磨フィルム。[Claims] 1. In a polishing film formed by forming a diamond polishing layer on a plastic support, the total thickness of the polishing film is defined as T, and the Young's modulus is defined as E. Stiffness ET^3, which is an index of strength, is ET^3
=1×10^5 (μm)^3kg/mm^2±2000
1. A diamond polishing film which satisfies the condition 0 and wherein the average particle diameter of the diamond particles used is 1 μm or less. 2. The diamond polishing film according to claim 1, comprising a diamond polishing layer formed on a support such as polyethylene terephthalate, polyamide, polyimide, polyester, or the like.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2110363A JP3045396B2 (en) | 1990-04-27 | 1990-04-27 | Diamond polishing film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2110363A JP3045396B2 (en) | 1990-04-27 | 1990-04-27 | Diamond polishing film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH048478A true JPH048478A (en) | 1992-01-13 |
| JP3045396B2 JP3045396B2 (en) | 2000-05-29 |
Family
ID=14533892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2110363A Expired - Lifetime JP3045396B2 (en) | 1990-04-27 | 1990-04-27 | Diamond polishing film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3045396B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100357342C (en) * | 2002-06-14 | 2007-12-26 | 北京国瑞升科技有限公司 | Ultraprecise polished film and method for manufacturing the same |
-
1990
- 1990-04-27 JP JP2110363A patent/JP3045396B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100357342C (en) * | 2002-06-14 | 2007-12-26 | 北京国瑞升科技有限公司 | Ultraprecise polished film and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3045396B2 (en) | 2000-05-29 |
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