JPH0481434U - - Google Patents
Info
- Publication number
- JPH0481434U JPH0481434U JP12577490U JP12577490U JPH0481434U JP H0481434 U JPH0481434 U JP H0481434U JP 12577490 U JP12577490 U JP 12577490U JP 12577490 U JP12577490 U JP 12577490U JP H0481434 U JPH0481434 U JP H0481434U
- Authority
- JP
- Japan
- Prior art keywords
- relay
- circuit board
- printed circuit
- relay device
- entire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011810 insulating material Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 2
Landscapes
- Casings For Electric Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の一実施例におけるリレー装置
の断面図、第２図は本考案の他の実施例における
リレー装置の断面図、第３図もまた本考案の他の
実施例におけるリレー装置の断面図、第４図は従
来のリレー装置の断面図である。
５ｂ……リレー本体、６ａ，６ｂ……外カバー
、１０……プリント基板、１２……絶縁材。
FIG. 1 is a cross-sectional view of a relay device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a relay device according to another embodiment of the present invention, and FIG. 3 is a cross-sectional view of a relay device according to another embodiment of the present invention. FIG. 4 is a cross-sectional view of a conventional relay device. 5b... Relay body, 6a, 6b... Outer cover, 10... Printed circuit board, 12... Insulating material.
Claims (1)
付けるとともに、前記、リレー本体及びプリント
基板全体の周囲全域を所定間隙を存して外カバー
で覆い、前記所定間隙全域を絶縁材で充填してな
るリレー装置。 (2) プリント基板にリレー制御用の電子回路を
実装した請求項１記載のリレー装置。 (3) 絶縁材をゲル状のものにした請求項１記載
のリレー装置。[Claims for Utility Model Registration] (1) At least the relay main body is attached to a printed circuit board, and the entire circumference of the relay main body and the entire printed circuit board is covered with an outer cover with a predetermined gap, and the entire predetermined gap is insulated. A relay device filled with material. (2) The relay device according to claim 1, wherein an electronic circuit for controlling the relay is mounted on the printed circuit board. (3) The relay device according to claim 1, wherein the insulating material is a gel-like material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12577490U JPH0481434U (en) | 1990-11-27 | 1990-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12577490U JPH0481434U (en) | 1990-11-27 | 1990-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0481434U true JPH0481434U (en) | 1992-07-15 |
Family
ID=31873360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12577490U Pending JPH0481434U (en) | 1990-11-27 | 1990-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0481434U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013232300A (en) * | 2012-04-27 | 2013-11-14 | Fujitsu Component Ltd | Electromagnetic relay |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01247840A (en) * | 1988-03-28 | 1989-10-03 | Cubic Eng Kk | Vibration absorbing device |
-
1990
- 1990-11-27 JP JP12577490U patent/JPH0481434U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01247840A (en) * | 1988-03-28 | 1989-10-03 | Cubic Eng Kk | Vibration absorbing device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013232300A (en) * | 2012-04-27 | 2013-11-14 | Fujitsu Component Ltd | Electromagnetic relay |