JPH0478798A - Heat sink device in shuttle craft for space - Google Patents
Heat sink device in shuttle craft for spaceInfo
- Publication number
- JPH0478798A JPH0478798A JP19006790A JP19006790A JPH0478798A JP H0478798 A JPH0478798 A JP H0478798A JP 19006790 A JP19006790 A JP 19006790A JP 19006790 A JP19006790 A JP 19006790A JP H0478798 A JPH0478798 A JP H0478798A
- Authority
- JP
- Japan
- Prior art keywords
- heating medium
- cooling
- internal
- cooling cylinder
- external
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 101
- 238000001816 cooling Methods 0.000 claims abstract description 92
- 239000002826 coolant Substances 0.000 claims abstract description 64
- 239000003595 mist Substances 0.000 claims abstract description 52
- 239000007921 spray Substances 0.000 claims abstract description 16
- 230000001737 promoting effect Effects 0.000 claims abstract description 7
- 230000002093 peripheral effect Effects 0.000 claims description 17
- 239000011148 porous material Substances 0.000 claims description 17
- 238000011010 flushing procedure Methods 0.000 claims description 8
- 238000009834 vaporization Methods 0.000 abstract description 3
- 230000008016 vaporization Effects 0.000 abstract description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 26
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 17
- 238000001704 evaporation Methods 0.000 description 16
- 230000008020 evaporation Effects 0.000 description 16
- 229910021529 ammonia Inorganic materials 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 239000000919 ceramic Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000007710 freezing Methods 0.000 description 3
- 230000008014 freezing Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000009835 boiling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000008400 supply water Substances 0.000 description 1
Landscapes
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は宇宙往還機における熱シンク装置に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a heat sink device in a spacecraft.
[従来の技術]
近年、スペースシャトル等の宇宙往還機に対する研究開
発が進んでいる。[Background Art] In recent years, research and development on spacecraft such as the space shuttle has progressed.
該宇宙往還機には人間やコンピュータ等の電子機器等が
載せられるため、内部の温度を高い精度で制御する必要
がある。Since humans and electronic equipment such as computers are carried on the spacecraft, it is necessary to control the internal temperature with high precision.
そこで従来の宇宙往還機の熱制御系の一例を第13図に
より説明する。An example of a conventional thermal control system for a spacecraft will be explained with reference to FIG.
図示しない宇宙往還機内部に設けられた電子機器等の発
熱源aを直接通り、且つ燃料電池等の発熱源すに補助流
体ループCを介して接続された熱交換器dを通って循環
するように流体主ループ(以下フロン主ループという)
eを構成する。It passes directly through a heat generation source a such as electronic equipment installed inside the spacecraft (not shown), and circulates through a heat exchanger d connected to a heat generation source such as a fuel cell via an auxiliary fluid loop C. The main fluid loop (hereinafter referred to as the fluorocarbon main loop)
Configure e.
該フロン主ループeの途中に、ラジェータ「及び熱シン
ク装置9並にアンモニアボイラh5並にポンプlを配設
する。A radiator, a heat sink device 9, an ammonia boiler h5, and a pump l are disposed in the middle of the fluorocarbon main loop e.
前記ラジェータrは軌道上でのみ拡げることのできるパ
ネル状のものであり、前記熱シンク装置9は、例えば第
13.14図に示すように、燃料電池等の発熱源すで発
生した水jが補給されるようにした水タンクkからの水
(冷却媒体)jを配管!及びバルブ腸を介して導きノズ
ル0から噴射させて蒸発させる、宇宙往還機外部の気圧
と等しい圧力の蒸発室pに、該蒸発室pの外周を取り巻
くよう前記フロン主ループeの一部を配設した構成を有
するものである(熱シンク装置9にはこれ以外にも様々
な構造のものがあるが原理的には上記のものと略同様で
ある)。The radiator r is a panel-shaped thing that can be expanded only on orbit, and the heat sink device 9 is a heat sink device 9, as shown in FIG. Pipe water (cooling medium) j from water tank k to be replenished! A part of the main loop e of the fluorocarbon is arranged so as to surround the outer periphery of the evaporation chamber p, which has a pressure equal to the atmospheric pressure outside the spacecraft and is evaporated by being guided through the valve and injected from the nozzle 0. (The heat sink device 9 has various other structures, but the principle is substantially the same as that described above.)
9はジャケット、「はフロン入口、Sはフロン出口、t
は邪魔板、Uは冷却媒体の排出口、nはアンモニアタン
クを示す。9 is the jacket, `` is the Freon inlet, S is the Freon outlet, t
indicates a baffle plate, U indicates a cooling medium outlet, and n indicates an ammonia tank.
次に上記熱制御系による宇宙往還機の温度制御について
説明する。Next, temperature control of the spacecraft using the above thermal control system will be explained.
ポンプ1を作動してフロン主ループeを循環させること
により、発熱源a、bがフロン主ルブeで冷却される。By operating the pump 1 to circulate the main fluorocarbon loop e, the heat generating sources a and b are cooled by the main fluorocarbon loop e.
発熱源a、bを冷却したフロン主ループeは温度が上昇
するので、ラジェータ「、熱シンク装置fg、アンモニ
アボイラhのいずれかを用いて排熱が行われ、宇宙往還
機が温度制御される。As the temperature of the fluorocarbon main loop e that cools the heat sources a and b rises, heat is removed using either the radiator, the heat sink fg, or the ammonia boiler h, and the temperature of the spacecraft is controlled. .
先ず、宇宙往還機の打ち上げからしばらくの時間の間に
通過する区間(大気圏)はフロン主ループe自体の熱容
量により発熱源a、bから発生した熱をフロン主ループ
eで吸収させ、その後宇宙往還機が大気圏外に出てから
軌道に乗るまでの区間は熱シンク装置9を使用し、水タ
ンクh内の水を大気圏外の気圧と等しい極く低い圧力の
蒸発室p内へ供給することにより水を蒸発させ蒸発の潜
熱としてフロン主ループeの熱を排熱する。軌道上の区
間ではラジェータrを開くことができるので、ラジェー
タ「からフロン主ループeの熱を宇宙空間に排熱する。First, in the zone (atmosphere) that the spacecraft passes through for a while after its launch, the heat generated from the heat sources a and b is absorbed by the main fluorocarbon loop e due to the heat capacity of the main fluorocarbon loop e, and then the main loop e passes through the spacecraft. During the period from when the aircraft leaves the atmosphere until it enters orbit, a heat sink device 9 is used to supply water in the water tank h to the evaporation chamber p, which has an extremely low pressure equal to the pressure outside the atmosphere. The water is evaporated and the heat of the main fluorocarbon loop e is exhausted as latent heat of evaporation. Since the radiator r can be opened during the orbital section, the heat of the main fluorocarbon loop e is exhausted from the radiator into space.
宇宙往還機の帰還時には、例えば大気圏外の区間は前記
熱シンク装置9を用いてフロン主ループeの熱を排熱し
、大気圏内の区間ではアンモニアボイラhに切り換え、
アンモニアタンクnのアンモニアをアンモニアボイラh
の蒸発室(図示せず)に供給することにより、水よりも
沸点が低く水に近い蒸発熱を有するアンモニアを蒸発サ
セ、アンモニアの蒸発潜熱としてフロン主ループeの熱
を排熱する。When the spacecraft returns, for example, the heat sink device 9 is used to exhaust the heat from the fluorocarbon main loop e in the section outside the atmosphere, and the ammonia boiler h is switched to the ammonia boiler h in the section inside the atmosphere.
Transfer ammonia from ammonia tank n to ammonia boiler h
By supplying the ammonia to the evaporation chamber (not shown), ammonia having a boiling point lower than water and a heat of vaporization close to that of water is evaporated, and the heat of the main fluorocarbon loop e is exhausted as the latent heat of vaporization of ammonia.
[発明が解決しようとする課題]
しかし、上記従来の宇宙往還機の熱制御系に備えられる
熱シンク装置9は、水等の冷却媒体をフラッシュさせ、
その蒸発潜熱によってフロン主ループeのフロンを冷却
する方式であるため、冷却媒体が気化することなくミス
ト状のまま排出される水滴のキャリーオーバーが多く、
このために冷却効率が低下し、冷却媒体の使用量が増加
する問題があり、又熱シンク装置gは中央に広い空間の
蒸発室pを必要とするために装置が大型化して占有スペ
ースが増加する問題があり、更に前記冷却媒体が水の場
合には前記ミストによる水滴が宇宙往還機外に排出する
ための排出ダクト等に凍結してしまう恐れがある等、種
々の問題を有していた。[Problems to be Solved by the Invention] However, the heat sink device 9 provided in the heat control system of the conventional spacecraft described above flashes a cooling medium such as water,
Since this method uses the latent heat of evaporation to cool the fluorocarbons in the main fluorocarbon loop e, there is a large carryover of water droplets that are discharged as mist without the cooling medium being vaporized.
As a result, there is a problem that cooling efficiency decreases and the amount of cooling medium used increases.Also, since the heat sink device g requires a large evaporation chamber p in the center, the device becomes larger and occupies more space. Furthermore, when the cooling medium is water, there is a risk that water droplets from the mist may freeze in the exhaust duct for discharging outside the spacecraft. .
本発明は上述の実情に鑑みて成したもので、冷却媒体を
確実に気化せしめて排出し得るコンパクトな宇宙往還機
の熱シンク装置を提供することによって、上記種々の問
題を一度に解決することを目的としている。The present invention has been made in view of the above-mentioned circumstances, and aims to solve the various problems mentioned above at once by providing a compact heat sink device for a spacecraft that can reliably vaporize and discharge the cooling medium. It is an object.
[課題を解決するための手段]
本発明は外側に外部加熱媒体流路を有して円筒状に形成
され、頂部中央に冷却媒体をフラッシングするスプレー
ノズルを有すると共に底部中央に冷却媒体排出口を有し
、且つ、内周壁に溝によるミスト接触促進構造を形成し
た外部冷却筒と、該外部冷却筒の内部空間に配設され、
円筒状を有した内部加熱媒体流路の表面に溝によるミス
ト接触促進構造を形成した内部冷却筒とを備えたこと、
及び外側に外部加熱媒体流路ををして円筒状に形成され
、頂部中央に冷却媒体をフラッシングするスプレーノズ
ルを有すると共に底部中央に冷却媒体排出口を存し、且
つ、内周壁に溝によるミスト接触促進構造を形成した外
部冷却筒と、該外部冷却筒の内部空間に配設され、内部
加熱媒体流路の表面に溝によるミスト接触促進構造を形
成した複数の内部冷却管とを備えたこと、及び外側に外
部加熱媒体流路を有して円筒状に形成され、頂部中央に
冷却媒体をフラッシングするスプレーノズルを有すると
共に底部中央に冷却媒体排出口を有し、且つ、内周壁に
溝によるミスト接触促進構造を形成した外部冷却筒と、
該外部冷却筒の内部空間に配設され、ミスト接触促進構
造を構成する円筒状の多孔質材内に内部加熱媒体流路を
形成した内部冷却筒とを備えたこと、及び外側に外部加
熱媒体流路を有して円筒状に形成され、頂部中央に冷却
媒体をフラッシングするスプレーノズルを有すると共に
底部中央に冷却媒体排出口を有し、且つ、内周壁に溝に
よるミスト接触促進構造を形成した外部冷却筒と、該外
部冷却筒の内部空間に配設され、ミスト接触促進構造を
構成する多孔質材内に内部加熱媒体流路を形成した複数
の内部冷却管とを備えたことを特徴とする宇宙往還機に
おける熱シンク装置にかかるものである。[Means for Solving the Problems] The present invention has a cylindrical shape with an external heating medium flow path on the outside, a spray nozzle for flushing the cooling medium at the center of the top, and a cooling medium outlet at the center of the bottom. and an external cooling cylinder having a mist contact promotion structure formed by grooves on the inner peripheral wall, and disposed in the internal space of the external cooling cylinder,
an internal cooling cylinder having a mist contact promoting structure formed by grooves on the surface of the internal heating medium flow path having a cylindrical shape;
It is formed into a cylindrical shape with an external heating medium flow path on the outside, has a spray nozzle for flushing the cooling medium at the center of the top, has a cooling medium outlet at the center of the bottom, and has a groove in the inner circumferential wall for misting. An external cooling cylinder having a contact promotion structure formed therein, and a plurality of internal cooling pipes disposed in the internal space of the external cooling cylinder and having a mist contact promotion structure formed by grooves on the surface of the internal heating medium flow path. , and is formed in a cylindrical shape with an external heating medium flow path on the outside, has a spray nozzle for flushing the cooling medium at the center of the top, has a cooling medium outlet at the center of the bottom, and has a groove on the inner peripheral wall. An external cooling cylinder with a mist contact promotion structure,
an internal cooling cylinder disposed in the internal space of the external cooling cylinder and having an internal heating medium flow path formed in a cylindrical porous material constituting the mist contact promotion structure; It is formed into a cylindrical shape with a flow path, has a spray nozzle for flushing the cooling medium at the center of the top, has a cooling medium outlet at the center of the bottom, and has a mist contact promotion structure formed by grooves on the inner peripheral wall. It is characterized by comprising an external cooling cylinder and a plurality of internal cooling pipes arranged in the internal space of the external cooling cylinder and forming internal heating medium flow paths in a porous material constituting a mist contact promotion structure. This is related to the heat sink device in the spacecraft.
[作 用]
スプレーノズルより外部冷却筒の内部空間ヘフラッシン
グされた冷却媒体は、前記外部冷却筒内周面、及び前記
内部空間に設けられた内部冷却筒(請求項1.3)ある
いは内部冷却管(請求項2.4)に構成された溝又は多
孔質材によるミスト接触促進構造により、冷却媒体中の
ミストの接触開度が増加されていることによってミスト
が効果的に捕捉され、よって加熱媒体より伝えられた熱
を効率よく奪って気化し加熱媒体を冷却する。[Function] The cooling medium flushed from the spray nozzle to the internal space of the external cooling cylinder is applied to the inner peripheral surface of the external cooling cylinder and the internal cooling cylinder provided in the internal space (Claim 1.3) or the internal cooling cylinder. The mist contact promotion structure made of grooves or porous material formed in the pipe (claim 2.4) increases the contact opening degree of the mist in the cooling medium, so that the mist is effectively captured, and thus the heating Heat transferred from the medium is efficiently removed and vaporized to cool the heating medium.
熱シンク装置から冷却媒体がミストの状態で排出される
ことが防止されることにより、排出ダクトでの凍結等が
防止される。By preventing the cooling medium from being discharged in the form of mist from the heat sink device, freezing in the discharge duct is prevented.
[実 施 例] 以下、本発明の実施例を図面を参照しつつ説明する。[Example] Embodiments of the present invention will be described below with reference to the drawings.
第1図〜第3図は本発明の請求項1における一実施例で
あり、熱シンク装置lは外部冷却筒2を該外部冷却筒2
の内部空間の蒸発室3内に配設された内部冷却筒4とに
より大略二重円筒状に形成されている。1 to 3 show an embodiment according to claim 1 of the present invention, in which the heat sink device l connects the external cooling cylinder 2 to the external cooling cylinder 2.
The internal cooling cylinder 4 is arranged in the evaporation chamber 3 in the internal space of the evaporation chamber 3 to form a substantially double cylindrical shape.
円筒状に形成された外部冷却筒2の内周壁5内面には所
要数の上下方向へ延びる細い溝フにより形成されたミス
ト接触促進構造8が形成さりており、内周壁5と外周壁
8との間には、外部加熱媒体流路9が形成されている。A mist contact promotion structure 8 formed by a required number of narrow grooves extending in the vertical direction is formed on the inner surface of the inner peripheral wall 5 of the external cooling cylinder 2 formed in a cylindrical shape, and the inner peripheral wall 5 and the outer peripheral wall 8 are An external heating medium flow path 9 is formed between them.
該外部加熱媒体流路9内には、熱交換面積を増大させる
ためのフィン10が挿入されている。Fins 10 are inserted into the external heating medium flow path 9 to increase the heat exchange area.
前記外部冷却筒2の頂部中央にはスプレーノズルitが
、底部中央には気化冷却媒体排出口12が設けられ、更
に前記外周壁6の上端所要位置には加熱媒体排出口13
が、下端所要位置には加熱媒体導入口I4が各々設けら
れている。A spray nozzle IT is provided at the center of the top of the external cooling cylinder 2, a vaporized cooling medium outlet 12 is provided at the center of the bottom, and a heating medium outlet 13 is provided at a required position at the upper end of the outer peripheral wall 6.
However, a heating medium inlet I4 is provided at a required position at the lower end.
又、内部加熱媒体導入管15が外部冷却筒2の底部所要
位置に、内部加熱媒体排出管16が前記外部冷却筒2の
頂部所要位置に各々接続している。Further, an internal heating medium inlet pipe 15 is connected to a desired position at the bottom of the external cooling cylinder 2, and an internal heating medium discharge pipe 16 is connected to a desired position at the top of the external cooling cylinder 2, respectively.
外部冷却筒2の内部空間である蒸発室3内には、上縁を
リング状の加熱媒体集合流路17に接続し、下縁をリン
グ状の加熱媒体供給流路18に接続した内部冷却筒4が
、前記加熱媒体集合流路17の所要位置に接続された前
記内部加熱媒体排出管16と、前記加熱媒体供給流路I
8の所要位置に接続された前記内部加熱媒体導入管15
とにより支持して設けられている。In the evaporation chamber 3, which is the internal space of the external cooling cylinder 2, there is an internal cooling cylinder whose upper edge is connected to a ring-shaped heating medium collection channel 17 and whose lower edge is connected to a ring-shaped heating medium supply channel 18. 4 is the internal heating medium discharge pipe 16 connected to a predetermined position of the heating medium collection channel 17, and the heating medium supply channel I.
The internal heating medium introduction pipe 15 is connected to a predetermined position of 8.
It is supported by.
前記内部冷却筒4の内周壁19内面と外周壁20外面に
は、外部冷却筒2の内周壁5に形成されたと同様の溝2
1によるミスト接触促進構造22が設けられている。更
に内外周壁19,20間には、前記外部冷却筒2に設け
られたものと同様の構成を存するフィン23が挿入され
た内部加熱媒体流路24が形成されている。Grooves 2 similar to those formed in the inner peripheral wall 5 of the external cooling cylinder 2 are formed on the inner surface of the inner peripheral wall 19 and the outer surface of the outer peripheral wall 20 of the internal cooling cylinder 4.
A mist contact promotion structure 22 according to No. 1 is provided. Furthermore, between the inner and outer circumferential walls 19 and 20, an internal heating medium flow path 24 is formed, in which fins 23 having the same structure as that provided in the external cooling cylinder 2 are inserted.
尚、図中25は冷却媒体、26は加熱媒体を示す。In the figure, 25 indicates a cooling medium, and 26 indicates a heating medium.
熱シンク装置1内での加熱媒体26の流れ方は、外部冷
却筒2においては、加熱媒体導入口14より流入し、外
部加熱媒体流路9を通り、加熱媒体排出口13より流出
していく。The heating medium 26 flows in the heat sink device 1 in such a way that it flows into the external cooling cylinder 2 through the heating medium inlet 14, passes through the external heating medium channel 9, and flows out through the heating medium outlet 13. .
又、内部冷却筒4においては、内部加熱媒体導入管15
より加熱媒体供給流路18へ流入し、次いでフィン23
が挿入された内部加熱媒体流路24へ流入し、更に該内
部加熱媒体流路24より加熱媒体集合流路17へ流入し
、内部加熱媒体排出管16より熱シンク装Wl外へと流
出していく。In addition, in the internal cooling cylinder 4, an internal heating medium introduction pipe 15
The heating medium flows into the heating medium supply flow path 18, and then flows into the fin 23.
The internal heating medium flows into the internal heating medium flow path 24 into which it is inserted, further flows from the internal heating medium flow path 24 into the heating medium collecting flow path 17, and flows out from the internal heating medium discharge pipe 16 to the outside of the heat sink device Wl. go.
上述した構成の熱シンク装置1による加熱媒体26の冷
却を行うには、まず図示しない冷却媒体タンクから水や
アンモニア等の冷却媒体25をスプレーノズル11へ導
出し、該スプレーノズル11で蒸発室3内へ前記冷却媒
体25を噴射、フラッシングする。In order to cool the heating medium 26 by the heat sink device 1 having the above-described configuration, first, a cooling medium 25 such as water or ammonia is led out from a cooling medium tank (not shown) to the spray nozzle 11, and the spray nozzle 11 cools the evaporation chamber 3. The cooling medium 25 is injected and flushed inside.
フラッシングされた冷却媒体25は熱シンク装置l内の
熱を奪って気化し、気化冷却媒体排出口12から排出さ
れるが、一部には気化されずにミストのまま、外部冷却
筒2の内周壁5及び内部冷却筒4の内外周壁19.20
に形成された溝7゜21によるミスト接触促進構造8.
22へ付着する。The flushed cooling medium 25 absorbs the heat inside the heat sink device l, vaporizes, and is discharged from the vaporized cooling medium discharge port 12. However, some of the coolant 25 is not vaporized and remains as a mist inside the external cooling cylinder 2. Peripheral wall 5 and inner and outer peripheral walls 19.20 of internal cooling cylinder 4
Mist contact promotion structure by grooves 7°21 formed in 8.
It attaches to 22.
ミスト接触促進構造8.22へ付着したミストは、溝7
.21の毛管現象により液膜状に均一に拡散され、且つ
、溝7.21によるミスト接触促進構造8゜22により
、熱交換面積が増大されているので、ミスト接触促進構
造8.22に付着した冷却媒体25は、外部加熱媒体流
路9及び内部加熱媒体流路24を流れるフロンガス等の
加熱媒体26から、効率良く熱を奪って、該加熱媒体2
6を冷却し、自身は完全に気化して気化冷却媒体排出口
12から排出される。The mist adhering to the mist contact promotion structure 8.22 is removed from the groove 7.
.. It is uniformly diffused into a liquid film due to the capillary action of 21, and the heat exchange area is increased by the mist contact promotion structure 8.22 formed by the grooves 7.21, so that the mist adheres to the mist contact promotion structure 8. The cooling medium 25 efficiently removes heat from a heating medium 26 such as fluorocarbon gas flowing through the external heating medium flow path 9 and the internal heating medium flow path 24, and cools the heating medium 26.
6 is completely vaporized and is discharged from the vaporized cooling medium outlet 12.
上述したように冷却媒体25は効率良く熱の吸収に利用
されることになるので、気化することなくミストの状態
で気化冷却媒体排出口12より排出されることがほとん
どなくなり、図示しない排出ダクトでの凍結等を防止す
ることができる。As described above, since the cooling medium 25 is efficiently used for absorbing heat, it is almost never discharged from the vaporized cooling medium discharge port 12 in the form of mist without being vaporized, and the cooling medium 25 is almost never discharged from the vaporized cooling medium discharge port 12 through the discharge duct (not shown). Freezing, etc. can be prevented.
更に、気化することなくミストの状態で排出される冷却
媒体25のキャリーオーバーが減少するので、冷却媒体
25の無駄な使用が防止される。Furthermore, carryover of the cooling medium 25, which is discharged in a mist state without being vaporized, is reduced, so wasteful use of the cooling medium 25 is prevented.
第4図〜第6図は本発明の請求項2における一実施例で
ある。4 to 6 show an embodiment of claim 2 of the present invention.
熱シンク装置27の外部冷却筒28は、本発明の請求項
1における実施例中の熱シンク装置1の外部冷却筒2と
全く同様の構成となっている。The external cooling cylinder 28 of the heat sink device 27 has exactly the same structure as the external cooling cylinder 2 of the heat sink device 1 in the embodiment according to claim 1 of the present invention.
外部冷却筒28の内部空間である蒸発室3内には、上端
にリング状の加熱媒体集合流路33が接続され下端にリ
ング状の加熱媒体供給流路34が接続されて環状に一体
に形成された所要数の内部冷却管29が、前記加熱媒体
集合流路33の所要位置に接続した内部加熱媒体排出管
35と、前記加熱媒体供給流路34の所要位置に接続し
た内部加熱媒体導入管36とによって保持されている。Inside the evaporation chamber 3, which is the internal space of the external cooling cylinder 28, a ring-shaped heating medium collection channel 33 is connected to the upper end, and a ring-shaped heating medium supply channel 34 is connected to the lower end, forming an integral annular structure. The required number of internal cooling pipes 29 are connected to an internal heating medium discharge pipe 35 connected to a predetermined position of the heating medium collection flow path 33, and an internal heating medium introduction pipe connected to a predetermined position of the heating medium supply flow path 34. It is held by 36.
前記内部冷却管29の表面には、上下方向へ延びる細い
溝30によるミスト接触促進構造31が形成されており
、管内は内部加熱媒体流路32となっている。A mist contact promotion structure 31 is formed on the surface of the internal cooling pipe 29 by a narrow groove 30 extending in the vertical direction, and the inside of the pipe is an internal heating medium flow path 32.
熱シンク装置27内での加熱媒体26の流れは、外部冷
却筒28においては請求項1の場合と全く同様である。The flow of the heating medium 26 within the heat sink device 27 is exactly the same as in claim 1 in the external cooling cylinder 28.
又、内部冷却管29においては内部加熱媒体導入管36
より加熱媒体供給流路34へ流入し、次いで各々の内部
冷却管29へ流入する。該内部冷却管29より加熱媒体
集合流路33へ流入し、内部加熱媒体排出管35より前
記熱シンク装置27へと流出していく。Further, in the internal cooling pipe 29, the internal heating medium introduction pipe 36
It flows into the heating medium supply flow path 34 and then into each internal cooling pipe 29. It flows into the heating medium collection channel 33 from the internal cooling pipe 29 and flows out from the internal heating medium discharge pipe 35 to the heat sink device 27 .
上述した構成の熱シンク装置27によれば、フラッシン
グされた冷却媒体25は、熱シンク装置27内の熱を奪
って気化し、気化冷却媒体排出口12から排出されるが
、一部気化されずにミストの状態で外部冷却筒28の内
周壁5及び内部冷却管29の表面に形成された溝7,3
0によるミスト接触促進構造8.31へ付着し、請求項
1の場合と全く同様に拡散、気化される。According to the heat sink device 27 having the above-described configuration, the flushed coolant 25 absorbs the heat inside the heat sink device 27 and vaporizes, and is discharged from the vaporized coolant outlet 12, but a portion of the coolant is not vaporized. Grooves 7 and 3 formed on the inner circumferential wall 5 of the external cooling cylinder 28 and the surface of the internal cooling pipe 29 in a mist state
It adheres to the mist contact promotion structure 8.31 by 0, and is diffused and vaporized in exactly the same manner as in the case of claim 1.
第7図〜第9図は本発明の請求項3における一実施例で
ある。7 to 9 show an embodiment according to claim 3 of the present invention.
熱シンク装置37の外部冷却筒38は、本発明の請求項
1における実施例中の熱シンク装置1の外部冷却筒2と
全く同様の構成となっている。The external cooling cylinder 38 of the heat sink device 37 has exactly the same configuration as the external cooling cylinder 2 of the heat sink device 1 in the embodiment according to claim 1 of the present invention.
外部冷却筒38の内部空間である蒸発室3内には、多孔
質材42によりミスト接触促進構造5Bを構成した内部
冷却筒39が、加熱媒体供給流路46及び内部加熱媒体
導入管40と、加熱媒体集合流路45及び内部加熱媒体
排出管41とを介して支持されている。In the evaporation chamber 3, which is the internal space of the external cooling cylinder 38, there is an internal cooling cylinder 39 which constitutes a mist contact promotion structure 5B using a porous material 42, a heating medium supply channel 46, an internal heating medium introduction pipe 40, It is supported via a heating medium collection channel 45 and an internal heating medium discharge pipe 41 .
前記内部冷却筒39はセラミックスや焼結金属等の多孔
質材42により円筒状に形成されており、該多孔質材4
2内には、上下方向へ延びて前記加熱媒体供給流路46
及び加熱媒体集合流路45に接続されて内部加熱媒体流
路43を形成する管44が所要数挿通されている。The internal cooling cylinder 39 is formed into a cylindrical shape by a porous material 42 such as ceramics or sintered metal.
2, the heating medium supply channel 46 extends in the vertical direction.
A required number of pipes 44 that are connected to the heating medium collective flow path 45 and form the internal heating medium flow path 43 are inserted therethrough.
熱シンク装置37内での加熱媒体26の流れは、外部冷
却筒38においては請求項1の場合と全く同様である。The flow of the heating medium 26 in the heat sink device 37 is exactly the same as in claim 1 in the external cooling cylinder 38.
又、内部冷却筒39においては内部加熱媒体導入管40
より加熱媒体供給流路46へ流入し、次いて多孔質材4
2内の各々の内部加熱媒体流路43へ流入する。更に該
内部加熱媒体流路43より加熱媒体集合流路45へ流入
し、内部加熱媒体排出管41より熱シンク装置37外へ
と流出していく。In addition, in the internal cooling cylinder 39, an internal heating medium introduction pipe 40
The heating medium flows into the heating medium supply channel 46, and then the porous material 4
The heating medium flows into each internal heating medium flow path 43 in 2. Further, it flows from the internal heating medium flow path 43 into the heating medium collection flow path 45 and flows out from the internal heating medium discharge pipe 41 to the outside of the heat sink device 37 .
上述した構成の熱シンク装置37による加熱媒体26の
冷却を行うには、まず図示しない冷却媒体タンクから水
やアンモニア等の冷却媒体25をスプレーノズル11へ
導出し、該スプレーノズル11で蒸発室3内へ前記冷却
媒体25を噴射、フラッシングする。In order to cool the heating medium 26 by the heat sink device 37 having the above-described configuration, first, the cooling medium 25 such as water or ammonia is led out from a cooling medium tank (not shown) to the spray nozzle 11, and the spray nozzle 11 cools the evaporation chamber 3. The cooling medium 25 is injected and flushed inside.
フラッシングされた冷却媒体25は熱シンク装置37内
の熱を奪って気化し、気化冷却媒体排出口より排出され
るが、一部気化されずにミストの状態で外部冷却筒38
の内周壁5に形成された満7によるミスト接触促進構造
8及び、焼結金属やセラミックス等による多孔質材42
により形成した内部冷却筒39の内外周面に付着する。The flushed cooling medium 25 absorbs the heat in the heat sink device 37 and vaporizes, and is discharged from the vaporized cooling medium outlet, but some of it is not vaporized and is left in the external cooling cylinder 38 in a mist state.
A mist contact promotion structure 8 formed on the inner circumferential wall 5 of the structure 8 and a porous material 42 made of sintered metal, ceramics, etc.
It adheres to the inner and outer circumferential surfaces of the internal cooling cylinder 39 formed by.
このとき外部冷却筒38のミスト接触促進構造8では、
溝7の毛管現象によりフラッシングされた冷却媒体25
の液膜を均一に保持することができ、且つ、溝7による
ミスト接触促進構造8により、熱交換面積を増大するこ
とができる。At this time, in the mist contact promotion structure 8 of the external cooling cylinder 38,
Cooling medium 25 flushed by capillary action in groove 7
The liquid film can be maintained uniformly, and the heat exchange area can be increased by the mist contact promotion structure 8 formed by the grooves 7.
従って、ミスト接触促進構造8に付着した冷却媒体25
は外部加熱媒体流路9を流れるフロンガス等の加熱媒体
26より、効率良く熱を奪って気化し、該加熱媒体26
を冷却する。Therefore, the cooling medium 25 attached to the mist contact promotion structure 8
efficiently removes heat from the heating medium 26 such as fluorocarbon gas flowing through the external heating medium flow path 9 and vaporizes the heating medium 26.
to cool down.
内部冷却筒39においては、多孔質材42の毛管現象に
よりミスト状の冷却媒体25は前記内部冷却筒39に均
一に付着滲透し、多孔質材42内に管44によって形成
された内部加熱媒体流路43を流れるフロンガス等の加
熱媒体26から効率良く熱を奪い、該加熱媒体26を冷
却し、自身は完全に気化して気化冷却媒体排出口12か
ら排出される。In the internal cooling cylinder 39 , the mist-like cooling medium 25 uniformly adheres to and permeates through the internal cooling cylinder 39 due to the capillarity of the porous material 42 , and the internal heating medium flow formed by the pipe 44 inside the porous material 42 . Heat is efficiently removed from the heating medium 26 such as fluorocarbon gas flowing through the passage 43, the heating medium 26 is cooled, and the heating medium 26 is completely vaporized and discharged from the vaporized cooling medium outlet 12.
第1O図〜第12図は本発明の請求項4における一実施
例である。FIGS. 1O to 12 show an embodiment of claim 4 of the present invention.
熱シンク装置47の外部冷却筒48は、本発明の請求項
1における実施例中の熱シンク装置lの外部冷却筒2と
全く同様の構成となっている。The external cooling cylinder 48 of the heat sink device 47 has exactly the same structure as the external cooling cylinder 2 of the heat sink device 1 in the embodiment according to claim 1 of the present invention.
外部冷却筒48の内部空間である蒸発室3内には、上端
にリング状の加熱媒体集合流路52が接続され下端にリ
ング状の加熱媒体供給流路53が接続されて環状に一体
に形成された所要数の内部冷却管49が、前記加熱媒体
集合流路52の所要位置に接続した内部加熱媒体排出管
54と前記加熱媒体供給流路53の所要位置に接続した
加熱媒体導入管55とによって保持されている。Inside the evaporation chamber 3, which is the internal space of the external cooling cylinder 48, a ring-shaped heating medium collection channel 52 is connected to the upper end, and a ring-shaped heating medium supply channel 53 is connected to the lower end, forming an integral annular structure. The required number of internal cooling pipes 49 are connected to an internal heating medium discharge pipe 54 connected to a predetermined position of the heating medium collection flow path 52 and a heating medium introduction pipe 55 connected to a predetermined position of the heating medium supply flow path 53. is held by.
前記内部冷却管49の表面には、セラミックスや焼結金
属等の多孔質材50が被覆されてミスト接触促進構造5
7が構成されており、内部は内部加熱媒体流路51とな
っている。The surface of the internal cooling pipe 49 is coated with a porous material 50 such as ceramics or sintered metal to form a mist contact promoting structure 5.
7, and the inside thereof is an internal heating medium flow path 51.
熱シンク装置47内での加熱媒体26の流れは、外部冷
却筒48においては請求項1の場合と全く同様であり、
又、内部冷却管49においては請求項2の場合と全く同
様である。The flow of the heating medium 26 in the heat sink device 47 is exactly the same as in claim 1 in the external cooling cylinder 48,
Further, the internal cooling pipe 49 is exactly the same as in the second aspect.
上述した構成の熱シンク装置47によれば、フラッシン
グされた後の気化しないミストの状態の冷却媒体25は
、外部冷却筒48の内周壁5に形成された溝7によるミ
スト接触促進構造8及び、焼結金属やセラミックス等に
よる多孔質材50により形成した内部冷却管49の表面
に付着する。According to the heat sink device 47 having the above-described configuration, the cooling medium 25 in a non-vaporized mist state after being flushed passes through the mist contact promotion structure 8 formed by the groove 7 formed in the inner circumferential wall 5 of the external cooling cylinder 48; It adheres to the surface of the internal cooling pipe 49 formed of a porous material 50 made of sintered metal, ceramics, or the like.
このとき外部冷却筒48に付着したミストは、ミスト接
触促進構造8の溝7の毛管現象により拡散、気化される
。At this time, the mist adhering to the external cooling cylinder 48 is diffused and vaporized by the capillary action of the grooves 7 of the mist contact promotion structure 8.
内部冷却管49においては、多孔質材50の毛管現象に
より冷却媒体25は前記内部冷却管49に均一に付着滲
透し、前記多孔質材50内に浸入して、該多孔質材50
内の内部加熱媒体流路51を流れるフロンガス等の加熱
媒体2Bから効率よく熱を奪い、該加熱媒体26を冷却
し、自身は完全に気化して気化冷却媒体排出口12から
排出される。In the internal cooling pipe 49, the cooling medium 25 uniformly adheres to and penetrates the internal cooling pipe 49 due to the capillarity of the porous material 50, penetrates into the porous material 50, and cools the porous material 50.
Heat is efficiently removed from the heating medium 2B such as fluorocarbon gas flowing through the internal heating medium flow path 51, cooling the heating medium 26, and the heating medium 26 is completely vaporized and discharged from the vaporized cooling medium outlet 12.
尚、本発明の宇宙往還機における熱シンク装置は、上述
の実施例にのみ限定されるものではなく、蒸発室内に設
けられる装置の保持方法は他の保持構造を用いて行って
もよいこと、その池水発明の要旨を逸脱しない範囲内に
おいて種々変更を加え得ることは勿論である。It should be noted that the heat sink device in the spacecraft of the present invention is not limited to the above-mentioned embodiments, and the method of holding the device provided in the evaporation chamber may be performed using other holding structures. Of course, various changes can be made without departing from the gist of the invention.
[発明の効果]
以上説明したように、本発明の宇宙往還機における熱シ
ンク装置によれば、下記の如き種々の優れた効果を奏し
得る。[Effects of the Invention] As explained above, according to the heat sink device in the spacecraft of the present invention, various excellent effects as described below can be achieved.
(D 冷却媒体が気化することなくミスト状のまま排出
される冷却媒体のキャリーオーバーを防止し、冷却効率
を向上させると共に、冷却媒体の無駄な使用を防止でき
る。(D) Carryover of the coolant, which is discharged as a mist without being vaporized, can be prevented, cooling efficiency can be improved, and wasteful use of the coolant can be prevented.
(ID 冷却媒体が気化することなくミストの状態の
まま排出されるのを防止できるので、液が排出ダクト等
に凍結するのを防止できる。(ID) Since the cooling medium can be prevented from being discharged in a mist state without being vaporized, it is possible to prevent the liquid from freezing in the discharge duct, etc.
[相] 従来は冷却効率を向上するためには広い空間の
蒸発室を必要とし、装置が大型化し、占有スペースが増
加する問題があったが、本発明によるとコンパクトな熱
シンク装置を提供し、限られたスペースを有効に活用で
きる。[Phase] Conventionally, in order to improve cooling efficiency, a large evaporation chamber was required, which resulted in the equipment becoming larger and occupying more space.However, according to the present invention, a compact heat sink equipment is provided. , limited space can be used effectively.
第1図は本発明の請求項1における一実施例の概略縦断
側面図、第2図は第1図の■−■概略断面図、第3図は
第2図の■部分拡大詳細図、第4図は本発明の請求項2
における一実施例の概略縦断側面図、第5図は第4図の
■−■概略断面図、第6図は第5図の■部分拡大詳細図
、第7図は本発明の請求項3における一実施例の概略縦
断側面図、第8図は第7図の■−■概略断面図、第9図
は第8図の■部分拡大詳細図、第1O図は本発明の請求
項4における一実施例の概略縦断側面図、第11図は第
10図のxr −x+概略断面図、第12図は第11図
のη部分拡大詳細図、第13図は宇宙往還機の熱制御系
の流体回路図、第14図は従来の熱シンク装置の一例を
示す縦断側面図である。
図中1.27.37.47は熱シンク装置、2.2B、
38.48は外部冷却筒、4,39は内部冷却筒、5は
内周壁、7.21.30は溝、8.22.31.56.
57はミスト接触促進構造、9は外部加熱媒体流路、1
1はスプレーノズル、12は気化冷却媒体排出口、24
,32.43゜51は内部加熱媒体流路、29.49は
内部冷却管、42.50は多孔質材を示す。FIG. 1 is a schematic longitudinal sectional side view of one embodiment of claim 1 of the present invention, FIG. Figure 4 shows claim 2 of the present invention.
5 is a schematic vertical sectional view of one embodiment of FIG. 4, FIG. 6 is a partially enlarged detailed view of FIG. 8 is a schematic vertical sectional view of one embodiment, FIG. 8 is a schematic sectional view taken along the line 7 in FIG. 7, FIG. 9 is a partially enlarged detail view of FIG. 8, and FIG. A schematic vertical side view of the embodiment, FIG. 11 is a schematic cross-sectional view of xr −x + in FIG. The circuit diagram and FIG. 14 are vertical sectional side views showing an example of a conventional heat sink device. In the figure, 1.27.37.47 is a heat sink device, 2.2B,
38.48 is an external cooling cylinder, 4 and 39 are internal cooling cylinders, 5 is an inner peripheral wall, 7.21.30 is a groove, 8.22.31.56.
57 is a mist contact promotion structure, 9 is an external heating medium flow path, 1
1 is a spray nozzle, 12 is a vaporized cooling medium outlet, 24
, 32.43° 51 is an internal heating medium flow path, 29.49 is an internal cooling pipe, and 42.50 is a porous material.
Claims (1)
、頂部中央に冷却媒体をフラッシングするスプレーノズ
ルを有すると共に底部中央に冷却媒体排出口を有し、且
つ、内周壁に溝によるミスト接触促進構造を形成した外
部冷却筒と、該外部冷却筒の内部空間に配設され、円筒
状を有した内部加熱媒体流路の表面に溝によるミスト接
触促進構造を形成した内部冷却筒とを備えたことを特徴
とする宇宙往還機における熱シンク装置。 2)外側に外部加熱媒体流路を有して円筒状に形成され
、頂部中央に冷却媒体をフラッシングするスプレーノズ
ルを有すると共に底部中央に冷却媒体排出口を有し、且
つ、内周壁に溝によるミスト接触促進構造を形成した外
部冷却筒と、該外部冷却筒の内部空間に配設され、内部
加熱媒体流路の表面に溝によるミスト接触促進構造を形
成した複数の内部冷却管とを備えたことを特徴とする宇
宙往還機における熱シンク装置。 3)外側に外部加熱媒体流路を有して円筒状に形成され
、頂部中央に冷却媒体をフラッシングするスプレーノズ
ルを有すると共に底部中央に冷却媒体排出口を有し、且
つ、内周壁に溝によるミスト接触促進構造を形成した外
部冷却筒と、該外部冷却筒の内部空間に配設され、ミス
ト接触促進構造を構成する円筒状の多孔質材内に内部加
熱媒体流路を形成した内部冷却筒とを備えたことを特徴
とする宇宙往還機における熱シンク装置。 4)外側に外部加熱媒体流路を有して円筒状に形成され
、頂部中央に冷却媒体をフラッシングするスプレーノズ
ルを有すると共に底部中央に冷却媒体排出口を有し、且
つ、内周壁に溝によるミスト接触促進構造を形成した外
部冷却筒と、該外部冷却筒の内部空間に配設され、ミス
ト接触促進構造を構成する多孔質材内に内部加熱媒体流
路を形成した複数の内部冷却管とを備えたことを特徴と
する宇宙往還機における熱シンク装置。[Claims] 1) It is formed into a cylindrical shape with an external heating medium flow path on the outside, has a spray nozzle for flushing the cooling medium at the center of the top, and has a cooling medium outlet at the center of the bottom, and , an external cooling cylinder having a groove-based mist contact promoting structure formed on the inner circumferential wall; and a cylindrical internal heating medium flow path disposed in the internal space of the external cooling cylinder, and having a groove-based mist contact promoting structure on the surface thereof. A heat sink device for a spacecraft, characterized by comprising a formed internal cooling cylinder. 2) It is formed into a cylindrical shape with an external heating medium flow path on the outside, has a spray nozzle for flushing the cooling medium at the center of the top, has a cooling medium outlet at the center of the bottom, and has a groove on the inner peripheral wall. An external cooling cylinder formed with a mist contact promoting structure, and a plurality of internal cooling pipes arranged in the internal space of the external cooling cylinder and having a mist contact promoting structure formed by grooves on the surface of the internal heating medium flow path. A heat sink device for a spacecraft, which is characterized by: 3) It is formed in a cylindrical shape with an external heating medium flow path on the outside, has a spray nozzle for flushing the cooling medium at the center of the top, has a cooling medium outlet at the center of the bottom, and has a groove on the inner peripheral wall. An external cooling cylinder with a mist contact promotion structure formed therein, and an internal cooling cylinder arranged in the internal space of the external cooling cylinder with an internal heating medium flow path formed in a cylindrical porous material constituting the mist contact promotion structure. A heat sink device for a spacecraft, characterized by comprising: 4) It is formed into a cylindrical shape with an external heating medium flow path on the outside, has a spray nozzle for flushing the cooling medium at the center of the top, has a cooling medium outlet at the center of the bottom, and has a groove on the inner peripheral wall. an external cooling cylinder forming a mist contact promotion structure; and a plurality of internal cooling pipes disposed in the internal space of the external cooling cylinder and forming internal heating medium flow paths in a porous material constituting the mist contact promotion structure. A heat sink device for a spacecraft, characterized by being equipped with.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19006790A JP2855811B2 (en) | 1990-07-18 | 1990-07-18 | Heat sink device for spacecraft |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19006790A JP2855811B2 (en) | 1990-07-18 | 1990-07-18 | Heat sink device for spacecraft |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0478798A true JPH0478798A (en) | 1992-03-12 |
JP2855811B2 JP2855811B2 (en) | 1999-02-10 |
Family
ID=16251803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19006790A Expired - Fee Related JP2855811B2 (en) | 1990-07-18 | 1990-07-18 | Heat sink device for spacecraft |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2855811B2 (en) |
-
1990
- 1990-07-18 JP JP19006790A patent/JP2855811B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2855811B2 (en) | 1999-02-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4007601A (en) | Tubular sublimator/evaporator heat sink | |
US10365047B2 (en) | Electronics cooling with multi-phase heat exchange and heat spreader | |
US4934160A (en) | Evaporator, especially for discharging waste heat | |
US5161610A (en) | Evaporation heat exchanger, especially for a spacecraft | |
US4352392A (en) | Mechanically assisted evaporator surface | |
US6615912B2 (en) | Porous vapor valve for improved loop thermosiphon performance | |
JPH01193591A (en) | Heat pipe system | |
JPH0314800A (en) | Space suit cooling device | |
US20210218090A1 (en) | Phase-change cooling module and battery pack using same | |
JPH0221166A (en) | Absorption cycle heat pump | |
US20090008063A1 (en) | System and Method for Passive Cooling Using a Non-Metallic Wick | |
KR20160104654A (en) | A fluid handling device and a method of heating or cooling a fluid flow | |
JPH0478798A (en) | Heat sink device in shuttle craft for space | |
US4637456A (en) | Heat exchanger | |
Tongue et al. | The porous plate sublimator as the X-38/CRV (Crew Return Vehicle) orbital heat sink | |
JPH02258500A (en) | Evaporative heat exchanger | |
JP2867662B2 (en) | Evaporator for exhaust heat of spacecraft | |
JPH04108097A (en) | Heat control system heat discharging evaporator for space shuttle | |
KR20110122240A (en) | Heat-exchange apparatus with micro-channels | |
RU2177551C2 (en) | Heat protection structure (design versions) | |
JPS63207994A (en) | Heat circulating device | |
JPH0726239Y2 (en) | Flash evaporator for exhaust heat of heat control system of space shuttle | |
JPH0313770A (en) | Refrigerant cooling device and vaporization type heat exchanger for space shuttle | |
JPH0612367Y2 (en) | Two-phase flow heat absorber | |
RU2088495C1 (en) | Skin panel suffering considerable thermal loads due to aerodynamic heating |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20071127 Year of fee payment: 9 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20071127 Year of fee payment: 9 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081127 Year of fee payment: 10 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091127 Year of fee payment: 11 |
|
LAPS | Cancellation because of no payment of annual fees |