JPH0476995A - Heat generating material cooler for electronic device or the like - Google Patents
Heat generating material cooler for electronic device or the likeInfo
- Publication number
- JPH0476995A JPH0476995A JP18943790A JP18943790A JPH0476995A JP H0476995 A JPH0476995 A JP H0476995A JP 18943790 A JP18943790 A JP 18943790A JP 18943790 A JP18943790 A JP 18943790A JP H0476995 A JPH0476995 A JP H0476995A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- pipe
- heat pipe
- wick
- heat generating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title abstract description 17
- 239000007788 liquid Substances 0.000 claims abstract description 18
- 239000003507 refrigerant Substances 0.000 claims abstract description 12
- 238000001816 cooling Methods 0.000 claims description 18
- 239000000126 substance Substances 0.000 claims description 10
- 238000010521 absorption reaction Methods 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 4
- 238000001704 evaporation Methods 0.000 abstract description 2
- 239000006096 absorbing agent Substances 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、発熱物の熱制御に供せられる電子機器等発熱
物冷却装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cooling device for a heat generating substance such as an electronic device, which is used to control the heat of a heat generating substance.
［従来の技術］
電子機器の小型化に伴い、小面積で発生する熱を効率よ
く排熱することが求められている。このような要求に対
して、従来ヒートパイプを使った冷却法が使われている
。ヒートパイプは液体か蒸発する時の潜熱を利用して冷
却するもので、熱抵抗の極めて低い特性が得られる。近
年、電子機器の一層の小型化に伴い、ヒートパイプの特
長を出来るだけ活かす為、発熱物と冷媒液とを直接接触
する構造が取られる場合がある。この具体的実現例とし
ては、例えば米国特許４，０４７，１９８号″Ｔｒａｎ
ｓｉｓｔｏｒ ｃｏｏｌｉｎｇ ｂｙ ｈｅａｔ ｐｉ
ｐｓｓ ｈａｖｉｎｇａ ｔｉｃｋ ｏｆ ｄｉｓｌｅ
ｃｔｒｉｃ ｐｏｗｓｒ″等が上げられる。[Prior Art] With the miniaturization of electronic devices, there is a need to efficiently exhaust heat generated in a small area. To meet these demands, conventional cooling methods using heat pipes have been used. Heat pipes use the latent heat generated when liquids evaporate to cool them, resulting in extremely low thermal resistance. In recent years, with the further miniaturization of electronic devices, in order to take advantage of the features of heat pipes as much as possible, a structure in which a heat generating substance and a refrigerant liquid are brought into direct contact is sometimes adopted. A specific example of this implementation is, for example, U.S. Pat. No. 4,047,198 "Tran
sister cooling by heat pi
pss havinga tick of disle
ctric powsr'' etc.
第２図は従来の方法の一例を説明する断面図であり、同
図中１は発熱物、２は内部に封入した冷媒液αを吸熱部
２ａまで帰還させるための周囲の外気と接触している筐
体形ヒートパイプ、３は該筐体形ビートパイプ２内に装
填したウィックである。FIG. 2 is a cross-sectional view illustrating an example of a conventional method, in which 1 is a heat-generating substance, 2 is a refrigerant liquid α sealed inside, which is brought into contact with the surrounding outside air in order to return it to the heat absorption part 2a. The casing-shaped heat pipe 3 is a wick loaded into the casing-shaped beat pipe 2.
それによると、発熱物１からの熱蓋は吸熱部２ａに接触
したウィック３内に含浸する冷媒液αが蒸発するときに
潜熱として蒸気に奪われる。そして、発熱物１より温度
が低い放熱冷却部２ｂまで蒸気が流れ、凝縮し液体に相
変化するときに凝縮熱として外部へ放熱される。なお、
冷媒液αはウィック３の毛細管圧力によって吸熱部２ａ
へ帰還する。According to this, when the refrigerant liquid α impregnated in the wick 3 that is in contact with the heat absorbing portion 2a evaporates, the thermal cover from the heat generating element 1 is taken away by steam as latent heat. Then, the steam flows to the heat dissipation cooling section 2b whose temperature is lower than that of the heating element 1, and when it condenses and undergoes a phase change to a liquid, it is dissipated to the outside as heat of condensation. In addition,
The refrigerant liquid α is absorbed into the heat absorption part 2a by the capillary pressure of the wick 3.
Return to.
［発明が解決しようとする課題］
第２図に示した従来の冷却方法では、筐体形ヒートパイ
プ２内部にウィック３を装填し筐体形ヒートパイプ２の
放熱冷却部２ｂの外面を利用して放熱させているため、
発熱物１の発熱量が大きくなると筐体形ヒートバイ１２
も同時に大きくしなければならず発熱物１のレイアウト
の制約を受けたり、所定の場所に発熱物１を多く搭載で
きなくなる。また、発熱物１がトランジスタ増幅器のよ
うな場合には電気的特性を得るためにトランジスタ以外
の回路をトランジスタの近傍に設置する必要がある場合
がある。しがし、これらの回路を筐体形ヒートパイプ２
に包括して囲繞設置しようとすると発熱物１および筐体
形ヒートパイプ２内全体に装填するウィック３の充填が
困難となり、装填の仕方によっては冷媒液αの偏りが生
じたり、筐体形ヒートパイプ２内で部分的な乾きか生じ
、冷媒液αの帰還も困難となることか起こりうる。[Problems to be Solved by the Invention] In the conventional cooling method shown in FIG. Because we are letting
When the calorific value of the heating element 1 becomes large, the housing type heat-by 12
At the same time, the heat generating elements 1 must be made larger, resulting in restrictions on the layout of the heat generating elements 1, and making it impossible to mount a large number of the heat generating elements 1 in a predetermined location. Furthermore, when the heat generating element 1 is a transistor amplifier, it may be necessary to install a circuit other than the transistor near the transistor in order to obtain electrical characteristics. However, these circuits are connected to the housing heat pipe 2.
If an attempt is made to install the heat generating element 1 and the wick 3 all over the inside of the heat pipe 2, it will be difficult to fill the heat generating element 1 and the heat pipe 2 with the wick 3. Partial drying may occur within the tank, making it difficult for the refrigerant liquid α to return.
このように、筐体形ヒートパイプ２を大きくできず、か
つ筐体形ヒートパイプ２に複雑な発熱物１を囲繞配置し
得なく、発熱物１を高密度実装化することが困難となる
ため、電気出力の大きい装置を実現できなかったという
欠点かあった。In this way, the heat pipe 2 cannot be enlarged, and the heat pipe 2 cannot be surrounded by a complex heat generating element 1, making it difficult to package the heat generating element 1 in high density. The drawback was that it was not possible to create a device with a large output.
こ１において、本発明は前記従来の冷却装置の課題に鑑
みてなされたもので、発熱物の匣体形ヒートパイプに熱
輸送し−トバイブか一体化となるように設けて、発熱物
からの熱量をこの熱輸送ヒートパイプを通して放熱冷却
部まで輸送し強制排熱することにより筐体形ヒートパイ
プの寸法を変えずに発熱物を熱制御できる電子機器等発
熱物冷却装置を提供することにある。In this case, the present invention has been made in view of the problems of the conventional cooling device, and is provided so as to transport heat to the box-shaped heat pipe of the heat generating material and to be integrated with the vibrator to reduce the amount of heat from the heat generating material. It is an object of the present invention to provide a device for cooling heat generating substances such as electronic devices, which can thermally control the heat generating substances without changing the dimensions of the housing-shaped heat pipe by transporting the heat generating substances through the heat transporting heat pipe to the radiation cooling part and forcibly discharging the heat.
［課題を解決するための手段］
前記課題の解決は、本発明か次の特徴的構成手段を採用
することにより達成される。[Means for Solving the Problems] The above problems can be achieved by employing the following characteristic configuration means of the present invention.
即ち、本発明の特徴は、発熱物を包容する吸熱部を有し
かつ内部にウィックを装填した筐体形ヒートパイプと、
当該筐体形ヒートパイプに接続され内部に当該筐体形ヒ
ートパイプの前記ウィックと連続するウィックか装填さ
れた熱輸送ヒートパイプと、当該熱輸送し−トパイブに
取付けた放熱冷却体から構成され、前記筐体形ヒートパ
イプおよび前記熱輸送ヒートパイプ内に冷ａ液を封入し
てなる電子機器等発熱物冷却装置である。That is, the features of the present invention include a housing-shaped heat pipe that has a heat absorbing part that encloses a heat generating material and has a wick loaded therein;
A heat transporting heat pipe connected to the casing-shaped heat pipe and loaded with a wick that is continuous with the wick of the casing-shaped heat pipe, and a heat dissipating cooling body attached to the heat transporting pipe. This is a device for cooling heat generating substances such as electronic devices, which includes a body-shaped heat pipe and a cold a liquid sealed in the heat transporting heat pipe.
［作 用］
本発明は前記手段を講じ、発熱物を包容した吸熱部を形
成した筐体形ヒートパイプとこれに空間的に結合した熱
輸送し一ドパイブ内の全域に亙りウィックを装填し、当
該熱輸送ヒートパイプを放熱冷却体と接続して、包容し
た発熱物の熱を前記吸熱部内冷媒液の蒸発潜熱によって
奪い、その蒸気を途中熱輸送ヒートパイプを介して送ら
れた放熱冷却体で強制凝縮し、液体に相変化するときに
凝縮熱として外部に排熱される。その後、冷媒液αはウ
ィックの毛細管圧力によって熱輸送ヒートパイプを通り
筐体形ビートパイプの吸熱部に帰還する。[Function] The present invention takes the above-mentioned measures, and includes a housing-shaped heat pipe in which a heat absorbing portion containing a heat generating material is formed, a heat transporting device spatially connected to the housing-shaped heat pipe, and a wick is loaded over the entire area inside the pipe. The heat transport heat pipe is connected to a heat dissipation cooler, and the heat of the contained heat generating material is taken away by the latent heat of evaporation of the refrigerant liquid in the heat absorption section, and the vapor is forced by the heat dissipation cooler sent through the heat transport heat pipe. When it condenses and changes its phase to liquid, it is exhausted to the outside as heat of condensation. Thereafter, the refrigerant liquid α passes through the heat transport heat pipe due to the capillary pressure of the wick and returns to the heat absorption part of the housing-shaped beat pipe.
［実施例〕 本発明の実施例を図面について説明する。[Example〕 Embodiments of the present invention will be described with reference to the drawings.
第１図はヒートパイプの断面図であり、図中１は発熱物
、４は発熱物Ｉを包容する吸熱部４ａを形成した筐体形
ヒートパイプ、５は筐体形ヒートパイプ４に一体結合す
る並行熱輸送し−トバイブ、６は筐体形ヒートパイプ４
と熱輸送ヒートパイプ５内に連続装填したウィック、７
は熱輸送ヒートパイプ終端部に取付けた放熱冷却体であ
る。FIG. 1 is a cross-sectional view of a heat pipe. In the figure, 1 is a heat generating element, 4 is a housing-shaped heat pipe that has a heat absorbing part 4a that encloses the heating element I, and 5 is a parallel body that is integrally connected to the housing-shaped heat pipe 4. Heat transport - Tovibe, 6 is a housing-shaped heat pipe 4
and a wick continuously loaded into the heat transport heat pipe 5, 7
is a heat dissipation cooling body attached to the end of the heat transport heat pipe.
本実施例は前記のような仕様実態なので発熱物１からの
熱は吸熱部４ａ内のウィック６に含まれる冷媒液αに伝
わり、冷媒液αが蒸気になるとき蒸発潜熱として取り込
まれ、そして潜熱を含んだ蒸気は熱輸送ヒートパイプ５
を通り放熱冷却体７へ移動し、外部へ蒸気の凝縮潜熱を
強制放熱する。Since this embodiment has the above-mentioned actual specifications, the heat from the heating element 1 is transmitted to the refrigerant liquid α contained in the wick 6 in the heat absorption part 4a, and when the refrigerant liquid α becomes vapor, it is taken in as latent heat of vaporization, and the latent heat is absorbed. The steam containing
The latent heat of condensation of the steam is forcibly radiated to the outside.
このとき凝縮された冷媒液αはウィンクロの毛細管圧力
によって筐体形ヒートパイプ４の吸熱部４ａに帰還する
。At this time, the condensed refrigerant liquid α returns to the heat absorbing portion 4a of the housing-shaped heat pipe 4 due to the capillary pressure of the winkrow.
筐体形ヒートパイプ４と熱輸送し−トバイブ６を一体化
することにより、発熱物１からの発熱量を放熱冷却体７
まで熱輸送することによって発熱物１を包容する筐体形
ヒートパイプ４の寸法を変えず熱制御可能となる。By integrating the housing-shaped heat pipe 4 and the heat-transporting vibrator 6, the amount of heat generated from the heating element 1 is transferred to the heat dissipation cooler 7.
By transporting heat up to the point where the heat generating material 1 is contained, heat can be controlled without changing the dimensions of the housing-shaped heat pipe 4 that encloses the heat generating material 1.
［発明の効果コ
かくして、本発明によれば、筐体形ヒートパイプと熱輸
送ヒートパイプとを一体化し、熱輸送し−トバイグに放
熱冷却体を取り付けることにより、発熱物からの熱量を
発熱物から離れた放熱冷却体まで多量に運ぶことができ
、高発熱の発熱物の熱制御か可能になるという効果があ
る。かつ、熱輸送ヒートパイプによって筐体形ヒートパ
イプと放熱冷却体をつなぐことによって複数の発熱物を
同時に熱制御できるようになり、所定の場所へ搭載でき
る発熱物の台数を増加させることができる。[Effects of the Invention] Thus, according to the present invention, by integrating the housing-shaped heat pipe and the heat transporting heat pipe and attaching the heat dissipating cooling body to the heat pipe, the amount of heat from the heat generating material is transferred from the heat generating material. It has the effect of being able to transport a large amount of heat to a distant heat dissipating cooling body, and making it possible to control the heat of high-heat generating materials. In addition, by connecting the casing-shaped heat pipe and the radiation cooling body using the heat transport heat pipe, it becomes possible to simultaneously control the heat of a plurality of heat generating elements, and it is possible to increase the number of heat generating elements that can be mounted at a predetermined location.
第１図は本発明の実施例を示す側断面図、第２図は従来
の冷却方法を示す側断面図である。
１・・・発熱物
２．４・・・筐体形ヒートパイプ
３．６・・・ウィック
５・・・熱輸送し−トパイブ
７・・・放熱冷却体FIG. 1 is a side sectional view showing an embodiment of the present invention, and FIG. 2 is a side sectional view showing a conventional cooling method. 1... Heating material 2.4... Housing-shaped heat pipe 3.6... Wick 5... Heat transporting tube 7... Radiation cooling body
Claims (1)
を装填した筐体形ヒートパイプと、当該筐体形ヒートパ
イプに接続され内部に当該筐体形ヒートパイプの前記ウ
イックと連続するウイックが装填された熱輸送ヒートパ
イプと、当該熱輸送ヒートパイプに取付けた放熱冷却体
から構成され、前記筐体形ヒートパイプおよび熱輸送ヒ
ートパイプ内に冷媒液を封入したことを特徴とする電子
機器等発熱物冷却装置1. A casing-shaped heat pipe that has a heat absorption part that encloses a heat generating substance and is loaded with a wick inside, and a wick that is connected to the casing-shaped heat pipe and is continuous with the wick of the casing-shaped heat pipe. A device for cooling heat generating substances such as electronic devices, comprising a transport heat pipe and a heat radiation cooling body attached to the heat transport heat pipe, and characterized in that a refrigerant liquid is sealed in the housing-shaped heat pipe and the heat transport heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18943790A JPH0476995A (en) | 1990-07-19 | 1990-07-19 | Heat generating material cooler for electronic device or the like |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18943790A JPH0476995A (en) | 1990-07-19 | 1990-07-19 | Heat generating material cooler for electronic device or the like |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0476995A true JPH0476995A (en) | 1992-03-11 |
Family
ID=16241236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18943790A Pending JPH0476995A (en) | 1990-07-19 | 1990-07-19 | Heat generating material cooler for electronic device or the like |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0476995A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002037917A1 (en) * | 2000-11-02 | 2002-05-10 | Thermosys Co., Ltd | Parts cooling apparatus for electric/electronic equipments |
| JP2008208704A (en) * | 2007-02-23 | 2008-09-11 | Sharp Corp | Wall assembly, hot water supply system and building |
| GB2581795A (en) * | 2019-02-26 | 2020-09-02 | Bae Systems Plc | Thermal management system |
| US11306976B2 (en) | 2019-02-26 | 2022-04-19 | Bae Systems Plc | Thermal management system |
-
1990
- 1990-07-19 JP JP18943790A patent/JPH0476995A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002037917A1 (en) * | 2000-11-02 | 2002-05-10 | Thermosys Co., Ltd | Parts cooling apparatus for electric/electronic equipments |
| JP2008208704A (en) * | 2007-02-23 | 2008-09-11 | Sharp Corp | Wall assembly, hot water supply system and building |
| JP4597197B2 (en) * | 2007-02-23 | 2010-12-15 | シャープ株式会社 | Wall materials and hot water systems and buildings |
| GB2581795A (en) * | 2019-02-26 | 2020-09-02 | Bae Systems Plc | Thermal management system |
| US11306976B2 (en) | 2019-02-26 | 2022-04-19 | Bae Systems Plc | Thermal management system |
| GB2581795B (en) * | 2019-02-26 | 2022-11-02 | Bae Systems Plc | Thermal management system |
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