JPH0476767U - - Google Patents
Info
- Publication number
- JPH0476767U JPH0476767U JP12103390U JP12103390U JPH0476767U JP H0476767 U JPH0476767 U JP H0476767U JP 12103390 U JP12103390 U JP 12103390U JP 12103390 U JP12103390 U JP 12103390U JP H0476767 U JPH0476767 U JP H0476767U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- hole
- light
- forming substrate
- image sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 8
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Facsimile Heads (AREA)
Description
第１図は本考案の一実施例による密着型イメー
ジセンサーの断面図、第２図は本実施例による密
着型イメージセンサーのＩＣ取り付け部の拡大斜
視図、第３図はＩＣ搭載基板の斜視図、第４図は
従来例による密着型イメージセンサーの断面図で
ある。
１……受光素子形成基板、２′……ＩＣ基板、
３……ハウジング、５……ＩＣ、１２……孔部。
Fig. 1 is a sectional view of a contact type image sensor according to an embodiment of the present invention, Fig. 2 is an enlarged perspective view of an IC mounting part of the contact type image sensor according to the present embodiment, and Fig. 3 is a perspective view of an IC mounting board. , FIG. 4 is a sectional view of a conventional contact type image sensor. 1... Light-receiving element forming substrate, 2'... IC substrate,
3... Housing, 5... IC, 12... Hole.
Claims (1)
反射光を受光する受光素子形成基板と、ＩＣ基板
とを備え、前記受光素子形成基板と前記ＩＣ基板
とを並置してなる密着型イメージセンサーにおい
て、 前記ＩＣ基板に孔部を設け、該孔部内にＩＣを
埋設してなることを特徴とする密着型イメージセ
ンサー。 ２ 前記受光素子形成基板と前記ＩＣ基板とをハ
ウジング上に並置するとともに、前記ＩＣ基板に
貫通孔部を設け、該貫通孔部を介して前記ＩＣを
前記ハウジング上に直接載置してなることを特徴
とする実用新案登録請求の範囲第１項に記載の密
着型イメージセンサー。[Claims for Utility Model Registration] 1. A device comprising a light emitting element for illuminating a document, a light receiving device forming substrate for receiving reflected light from the document, and an IC substrate, the light receiving device forming substrate and the IC substrate being juxtaposed. A contact type image sensor comprising: a hole provided in the IC substrate, and an IC embedded in the hole. 2. The light-receiving element forming substrate and the IC board are arranged side by side on a housing, a through hole is provided in the IC board, and the IC is placed directly on the housing through the through hole. A contact image sensor according to claim 1 of the utility model registration claim, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12103390U JPH0476767U (en) | 1990-11-19 | 1990-11-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12103390U JPH0476767U (en) | 1990-11-19 | 1990-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0476767U true JPH0476767U (en) | 1992-07-03 |
Family
ID=31868911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12103390U Pending JPH0476767U (en) | 1990-11-19 | 1990-11-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0476767U (en) |
-
1990
- 1990-11-19 JP JP12103390U patent/JPH0476767U/ja active Pending