JPH0475680B2 - - Google Patents
Info
- Publication number
- JPH0475680B2 JPH0475680B2 JP59004323A JP432384A JPH0475680B2 JP H0475680 B2 JPH0475680 B2 JP H0475680B2 JP 59004323 A JP59004323 A JP 59004323A JP 432384 A JP432384 A JP 432384A JP H0475680 B2 JPH0475680 B2 JP H0475680B2
- Authority
- JP
- Japan
- Prior art keywords
- defective
- leads
- lead
- mold
- ics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000002950 deficient Effects 0.000 claims description 47
- 239000004065 semiconductor Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 238000011179 visual inspection Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】
本発明は半導体装置の不良品判別除去方法に関
する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for identifying and removing defective products from semiconductor devices.
従来の半導体装置の製造工程及び従来の半導体
装置の不良品判別除去方法について説明する。 A conventional manufacturing process for a semiconductor device and a conventional method for identifying and removing defective products from a semiconductor device will be described.
従来から、半導体集積回路（以下ICまたは半
導体装置と呼ぶ）の製造工程中、半導体ウエハー
に集積回路を形成した後の組立工程においては、
ウエハーから個別に切り離したICを、金属リー
ドが形成された保持板であるベースリボン（リー
ドフレーム等とも呼ばれる）に位置合わせのうえ
マウントし、ワイヤーボンデイングして、樹脂に
よりモールド封入するが、このとき作業の効率化
のために複数個のICを一つのベースリボン上に
マウント、ボンデイング、モールド封入し、一体
として第２図に模式的に示す形状に形成する。そ
してその後の工程として、第４図に示すリード加
工機によつてICを個別に分離し、リード成形を
行つて、第１図に示す形状に加工する。 Conventionally, during the manufacturing process of semiconductor integrated circuits (hereinafter referred to as ICs or semiconductor devices), in the assembly process after forming the integrated circuit on a semiconductor wafer,
The ICs that are individually cut from the wafer are aligned and mounted on a base ribbon (also called a lead frame, etc.), which is a holding plate on which metal leads are formed, wire bonded, and then molded and encapsulated with resin. In order to improve work efficiency, a plurality of ICs are mounted, bonded, and molded onto a single base ribbon, and are integrally formed into the shape schematically shown in FIG. 2. As a subsequent process, the ICs are individually separated using a lead processing machine shown in FIG. 4, and lead molding is performed to form the shape shown in FIG.
以上の半導体装置の製造工程において、マウン
トからモールド封入までの各工程の中で一枚のベ
ースリボンの中に、不良品となるICが発生する。
例えばモールド封入工程ではボイドの発生、樹脂
の充填不足等の不良が生じる。しかしICはベー
スリボン状態で各工程間を流れるので、不良品の
みを取り出すことができず、従来の半導体装置の
不良品判別除去方法においては、モールド表面に
ダイヤモンドポイント等を利用して、×印を不良
マークとするなど、各工程に合つた不良マークを
モールド表面やベースリボンに付けておき、リー
ド加工後、個別になつたICの中から目視チエツ
クやセンサーチエツクにより不良マークのついた
ものを取り除き、次の工程に流している。 In the above semiconductor device manufacturing process, a defective IC is generated in one base ribbon during each process from mounting to mold encapsulation.
For example, in the mold encapsulation process, defects such as voids and insufficient resin filling occur. However, since ICs flow between each process in the form of a base ribbon, it is not possible to take out only defective products, so in the conventional method of identifying and removing defective products from semiconductor devices, diamond points etc. are used on the mold surface to mark the Defective marks suitable for each process are attached to the mold surface or base ribbon, and after lead processing, those with defective marks are checked by visual inspection or sensor check from among the individual ICs. It is removed and passed on to the next process.
しかし、不良品を目視チエツクによつて良品の
中から取り除くには、マガジンケースより全ての
製品を取り出し、目視チエツクにより不良品を取
り除き、良品を再度マガジンケースに入れる作業
が必要となり、作業中、特にICをマガジンに出
し入れする際、マガジンの入り口にリードが当た
つたりすることによりリードを曲げてしまうこと
が多く、そのつど、ピンセツト等でのリードの修
正作業が必要で作業工数を多く要する。また、作
業者による目視チエツクのため、不良マークを見
落としてしまうと、不良品が次の工程に流れてし
まう可能性があり、次の工程は電気的チエツクし
か行つていないのでモールド外観チエツク等によ
る不良品に関しては、チエツクもれを生じてしま
い、不良品がそのまま出荷されてしまう場合が生
じる。 However, in order to visually check and remove defective products from good products, it is necessary to remove all the products from the magazine case, visually check to remove the defective products, and then put the non-defective products back into the magazine case. In particular, when inserting or removing an IC from a magazine, the leads often come into contact with the entrance of the magazine, causing the leads to bend.Each time this happens, the leads must be corrected using tweezers, which requires a large number of man-hours. In addition, because the worker performs a visual check, if a defective mark is overlooked, there is a possibility that the defective product will be sent to the next process, and since only electrical checks are performed in the next process, mold appearance checks, etc. When it comes to defective products, a check may be missed and the defective products may be shipped as they are.
また、従来の不良品判別除去方法においては、
前述したように、モールド封入前に不良品を検知
した時はまずベースリボンの縁端部に仮の不良マ
ークを付けるが、ベースリボンの縁端部はリード
加工後は破棄されるので、モールド封入後リード
加工前に、改めてベースリボン縁端部の仮の不良
マークを検知してモールド表面に不良マークを付
け直す作業が必要だつた。 In addition, in the conventional method of identifying and removing defective products,
As mentioned above, when a defective product is detected before being inserted into the mold, a temporary defective mark is first placed on the edge of the base ribbon, but since the edge of the base ribbon is discarded after lead processing, it is not necessary to insert it into the mold. Before post-lead processing, it was necessary to detect temporary defective marks on the edges of the base ribbon and reapply the defective marks on the mold surface.
そこで、不良マークをモールド表面ではなくリ
ードに付けるという方法も考えられる。しかしリ
ードは工程中に変形を受け易いため、センサーで
チエツクする際特定のリードを正確にセンサーに
位置合わせするのは難しく、リード自体を検出で
きず良品を不良品として廃棄してしまう等のチエ
ツクミスを生じ得る。 Therefore, a method of attaching defective marks to the leads instead of the mold surface may be considered. However, since leads are easily deformed during the process, it is difficult to accurately align a specific lead with the sensor when checking with a sensor, resulting in checking errors such as failing to detect the lead itself and discarding good products as defective. may occur.
尚ここで、従来方法で用いられていたリード加
工機の概略を第４図を用いて説明しておく。モー
ルド封入され第２図に模式的に示す形状に加工さ
れた後ベースリボン供給部１にセツトされたベー
スリボン２は、送りアーム３により金型４内に供
給される。金型４は上下方向に動作してベースリ
ボン２を切断してICを個別に分離し、さらにリ
ードを所定の形状にカツトし、折り曲げて、IC
を第１図に示す形状に加工する。そして個々の
ICは送りアーム３によつて突き出しロツト５の
正面に送られ、個別に突き出しロツト５により金
型４の外部に出されると同時に、挿入機構６によ
り収納部にセツトされた収納容器であるマガジン
７に収納される。 Here, the outline of the lead processing machine used in the conventional method will be explained using FIG. 4. The base ribbon 2, which has been sealed in a mold and processed into the shape schematically shown in FIG. The mold 4 moves vertically to cut the base ribbon 2 and separate the ICs into individual ICs, and then cuts the leads into a predetermined shape and bends them to form the ICs.
is processed into the shape shown in FIG. and individual
The ICs are sent to the front of the ejecting rod 5 by the feeding arm 3, and are individually taken out of the mold 4 by the ejecting rod 5. At the same time, the ICs are fed into the magazine 7, which is a storage container, set in the storage section by the insertion mechanism 6. is stored in.
本発明は従来問題となつていた点を是正すべく
発明されたものであり、本発明によれば、
モールド部より多数のリードを導出させた半導
体装置の不良品判別除去方法において、前記多数
のリードのうちたがいに隣り合う所定の複数のリ
ードの先端にそれぞれ対応させて複数のセンサー
を位置させ、前記半導体装置のうち不良品の前記
所定の複数のリードの全てのリード先端を切断し
ておき、これにより前記各センサーにより前記所
定の複数のリードの全てにおいてその先端が存在
しないと検知したときに不良品であることを判別
し、この判別により前記不良品の半導体装置を取
り除くようにしたことを特徴とする半導体装置の
不良品判別除去方法を得る。 The present invention was invented in order to correct the conventional problems.According to the present invention, in a method for identifying and removing defective products of a semiconductor device in which a large number of leads are led out from a mold part, A plurality of sensors are positioned corresponding to the tips of a predetermined plurality of leads that are adjacent to each other among the leads, and all lead tips of the predetermined plurality of leads of the defective product of the semiconductor device are cut off. Accordingly, when each of the sensors detects that the tips of all of the predetermined leads are not present, it is determined that the semiconductor device is defective, and based on this determination, the defective semiconductor device is removed. A method for identifying and removing defective products from semiconductor devices is provided.
以下に本発明の実施例を図面を参照して説明す
る。 Embodiments of the present invention will be described below with reference to the drawings.
本実施例における半導体装置の製造工程は、従
来の半導体装置の製造工程として説明したものと
同様である。即ち、半導体ウエハーから切り出し
たICをベースリボン上にマウントした後、ワイ
ヤーボンデイング、モールド封入の各工程を経て
リード加工機により個々のICに分離する。 The manufacturing process of the semiconductor device in this embodiment is similar to that described as the manufacturing process of the conventional semiconductor device. That is, after mounting an IC cut out from a semiconductor wafer on a base ribbon, it is separated into individual ICs by a lead processing machine after going through the steps of wire bonding and mold encapsulation.
この間に不良品を検知したときはベースリボン
の加工状態にかかわらず、第３図に示す位置のリ
ード先端部を３ケ所とも切断する。そして、第５
図に示すリード加工機により個々のICに分離し
た後、センサーによる不良品チエツク及び除去を
行う。 If a defective product is detected during this time, the lead tips are cut at all three locations shown in FIG. 3, regardless of the processing state of the base ribbon. And the fifth
After separating into individual ICs using the lead processing machine shown in the figure, defective products are checked and removed using a sensor.
以下第５図に示すリード加工機について簡単に
説明する。モールド封入されて第２図に示す形状
に加工され、かつ不良品の所定のリード先端部が
切断された状態で、ベースリボン供給部１にセツ
トされたベースリボン２は、送りアーム３により
金型４に供給される。金型４は上下方向に動作
し、ベースリボン２はこの金型４内でベースリボ
ン２の状態から個々のICに分離される。さらに
リードが所定の形状にカツトされ折り曲げられて
個々のICは、良品は第１図、不良品は第３図に
それぞれ示す形状に加工される。こうして、個別
に分離されたICは送りアーム３によつて突き出
しロツト５の正面に送られ、突き出しロツト５に
より金型４の外部に移され、センサー１０に供給
されリードの有無が検知される。 The lead processing machine shown in FIG. 5 will be briefly described below. The base ribbon 2, which has been molded and processed into the shape shown in FIG. 2 and has been set in the base ribbon supply unit 1 with the predetermined lead tips of defective products cut off, is transferred to the mold by the feed arm 3. 4. The mold 4 moves in the vertical direction, and the base ribbon 2 is separated from the base ribbon 2 into individual ICs within the mold 4. Further, the leads are cut into a predetermined shape and bent, and the individual ICs are processed into the shapes shown in FIG. 1 for non-defective products and FIG. 3 for defective products. In this way, the individually separated ICs are sent to the front of the ejection rod 5 by the feed arm 3, transferred to the outside of the mold 4 by the ejection rod 5, and supplied to the sensor 10, where the presence or absence of leads is detected.
良品と判断されたICは挿入機構６によりマガ
ジン７に収納され、不良と判断されたICは挿入
機構６によつて移動される途中、シユート８がシ
リンダー９により引き下げられ、これにより落下
し、排除される。 ICs judged to be good are stored in the magazine 7 by the insertion mechanism 6, while ICs judged to be defective are moved by the insertion mechanism 6, when the chute 8 is pulled down by the cylinder 9, which causes them to fall and be removed. be done.
尚、本実施例では、第３図に示すように不良マ
ークとして切断される隣り合う所定の複数のリー
ドは３本となつており、第６図，第７図に示すよ
うに３対のセンサー１０を使用してリード１１の
検知を行つている。第６図はICとセンサー１０
とが位置合わせされた状態の正面図であり、第７
図はICのリード１１とセンサー１０との位置関
係を示す平面図である。尚、ａはリード１１の中
心とセンサー１０の中心との距離である。本実施
例においては、３組みのセンサー１０がすべてリ
ード１１を検出しなかつたときに初めてそのIC
を不良品と判定するので良品を誤つて不良品と判
断することがない。 In this embodiment, as shown in FIG. 3, the number of predetermined adjacent leads to be cut as defective marks is three, and as shown in FIGS. 6 and 7, there are three pairs of sensors. 10 is used to detect the lead 11. Figure 6 shows IC and sensor 10
FIG. 7 is a front view of a state in which the
The figure is a plan view showing the positional relationship between the IC lead 11 and the sensor 10. Note that a is the distance between the center of the lead 11 and the center of the sensor 10. In this embodiment, it is not until all three sets of sensors 10 detect the lead 11 that the IC
Since the product is determined to be a defective product, there is no possibility of erroneously determining a good product as a defective product.
即ち、第８図に示すようにリード曲がりが生じ
ていたりICの位置決め精度が悪くても、良品の
場合、必ず少なくとも一つのリード１１をセンサ
ー１０で検知でき、３本のリードのうちどれを検
知しても良品として判断することにより、良品が
不良品として排出されないようになつている。 In other words, as shown in Fig. 8, even if the leads are bent or the positioning accuracy of the IC is poor, if the product is good, at least one lead 11 can be detected by the sensor 10, and it is difficult to detect which of the three leads. By determining that even if the product is defective, it is determined to be a good product, so that a non-defective product is not rejected as a defective product.
このような本発明により目視作業が必要無くな
るため工数低減が計れ、かつ、目視作業のミスに
よる不良品が次の工程に流れることがなくなる等
の効果がある。 The present invention eliminates the need for visual inspection, thereby reducing the number of man-hours, and also prevents defective products from being passed on to the next process due to errors in visual inspection.
またマガジンケースからの製品の出し入れ回数
が減る為ICのリード曲がりが少なくなり、品質
の向上を計ることができる等のメリツトがある。 Additionally, since the number of times products are taken in and out of the magazine case is reduced, there is less bending of IC leads, which improves quality.
また、不良マークをリードの先端部の切断とい
う形態としているため、製造工程の段階に応じて
不良マークをベースリボンからモールド表面へと
付け替える等の作業が不要になり、製造工程の効
率化を計ることができる。 In addition, since the defect mark is made by cutting the tip of the lead, there is no need to change the defect mark from the base ribbon to the mold surface depending on the stage of the manufacturing process, which improves the efficiency of the manufacturing process. be able to.
さらに、不良マークの付加位置を予め定めた複
数の隣り合うリードの先端としているため、たと
え良品のICのリードが変形していたとしてもそ
の良品を誤つて不良品と判断してしまうことがな
く、全く体の歩留まりを向上させることができ
る。 Furthermore, since the defect marks are added at the predetermined tips of multiple adjacent leads, even if the leads of a good IC are deformed, the good product will not be mistakenly judged as defective. , can totally improve the body yield.
第１図はICの概略図、第２図はベースリボン
の概略図、第３図は実施例において不良として排
出されるICの概略図、第４図は従来方法による
装置の概略図、第５図は実施例における装置の概
略図、第６図，第７図，第８図は実施例において
不良マークを検知するセンサーの配置を示す図で
ある。
尚、図において、１……ベースリボン供給部、
２……ベースリボン、３……送りアーム、４……
金型、５……突き出しロツト、６……挿入機構、
７……マガジン、８……シユート、９……シリン
ダー、１０はセンサー、１１はリード、である。
Fig. 1 is a schematic diagram of an IC, Fig. 2 is a schematic diagram of a base ribbon, Fig. 3 is a schematic diagram of an IC that is discharged as defective in the example, Fig. 4 is a schematic diagram of a device according to a conventional method, and Fig. 5 The figure is a schematic diagram of the apparatus in the embodiment, and FIGS. 6, 7, and 8 are diagrams showing the arrangement of sensors for detecting defective marks in the embodiment. In the figure, 1... base ribbon supply section,
2... Base ribbon, 3... Feeding arm, 4...
Mold, 5... Ejection rod, 6... Insertion mechanism,
7...magazine, 8...chute, 9...cylinder, 10 sensor, 11 lead.
Claims (1)
導体装置の不良品判別除去方法において、前記多
数のリードのうちたがいに隣り合う所定の複数の
リードの先端にそれぞれ対応させて複数のセンサ
ーを位置させ、前記半導体装置のうち不良品の前
記所定の複数のリードの全てのリード先端を切断
しておき、これにより前記各センサーにより前記
所定の複数のリードの全てにおいてその先端が存
在しないと検知したときに不良品であることを判
別し、この判別により前記不良品の半導体装置を
取り除くようにしたことを特徴とする半導体装置
の不良品判別除去方法。1. In a method for identifying and removing defective products from a semiconductor device in which a large number of leads are led out from a mold part, a plurality of sensors are positioned corresponding to the tips of a predetermined plurality of leads adjacent to each other among the plurality of leads, All the lead tips of the predetermined plurality of leads of the defective semiconductor device are cut off, and when each of the sensors detects that the tip does not exist in all of the predetermined plurality of leads. 1. A method for identifying and removing defective semiconductor devices, characterized in that the semiconductor device is determined to be defective, and based on this determination, the defective semiconductor device is removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59004323A JPS60148196A (en) | 1984-01-13 | 1984-01-13 | Apparatus for producing semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59004323A JPS60148196A (en) | 1984-01-13 | 1984-01-13 | Apparatus for producing semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60148196A JPS60148196A (en) | 1985-08-05 |
| JPH0475680B2 true JPH0475680B2 (en) | 1992-12-01 |
Family
ID=11581241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59004323A Granted JPS60148196A (en) | 1984-01-13 | 1984-01-13 | Apparatus for producing semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60148196A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0770879B2 (en) * | 1986-10-17 | 1995-07-31 | 三菱電機株式会社 | Electronic component inspection device |
| JPH0770864B2 (en) * | 1986-10-23 | 1995-07-31 | 三菱電機株式会社 | Electronic component automatic mounting machine |
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| JPS58168247A (en) * | 1982-03-30 | 1983-10-04 | Toshiba Corp | Sorting chute device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54108959U (en) * | 1978-01-19 | 1979-07-31 | ||
| JPS5923423Y2 (en) * | 1980-05-23 | 1984-07-12 | 株式会社日立国際電気 | Detection and exclusion device for IC with bent leads |
-
1984
- 1984-01-13 JP JP59004323A patent/JPS60148196A/en active Granted
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5031622A (en) * | 1973-07-23 | 1975-03-28 | ||
| JPS52143478A (en) * | 1976-05-25 | 1977-11-30 | Nippon Electric Co | Method of examining and processing electronic parts |
| JPS5448073A (en) * | 1977-09-26 | 1979-04-16 | Tanaka Kemikaru Kk | Printed board selection device |
| JPS5723297A (en) * | 1980-07-16 | 1982-02-06 | Mitsubishi Electric Corp | Method of producing hybrid integrated circuit |
| JPS57159048A (en) * | 1981-03-26 | 1982-10-01 | Nec Kyushu Ltd | Handling device |
| JPS58168247A (en) * | 1982-03-30 | 1983-10-04 | Toshiba Corp | Sorting chute device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60148196A (en) | 1985-08-05 |
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