JPH0472666U - - Google Patents

Info

Publication number
JPH0472666U
JPH0472666U JP11631190U JP11631190U JPH0472666U JP H0472666 U JPH0472666 U JP H0472666U JP 11631190 U JP11631190 U JP 11631190U JP 11631190 U JP11631190 U JP 11631190U JP H0472666 U JPH0472666 U JP H0472666U
Authority
JP
Japan
Prior art keywords
lot number
wiring board
printed wiring
area film
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11631190U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11631190U priority Critical patent/JPH0472666U/ja
Publication of JPH0472666U publication Critical patent/JPH0472666U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例のプリント配線板の
平面図、第２図は従来のロツト番号のソルダーレ
ジストの逃げを示す平面図、第３図は本考案の他
の実施例の断面図、第４図は従来例のプリント配
線板の断面図である。 １１，２１……ソルダーレジスト、１２……文
字印刷によつて形成された白色のロツト番号捺印
エリア膜、１３，２３……ロツト番号、２４……
ソルダーレジストの逃げ、３１，４１……基材、
３２，４２……回路、４３……ソルダーレジスト
の塗膜、４５……文字印刷により形成された塗膜
、３５，４６……レーザ光線による炭化物。 Fig. 1 is a plan view of a printed wiring board according to an embodiment of the present invention, Fig. 2 is a plan view showing the escape of the solder resist of a conventional lot number, and Fig. 3 is a sectional view of another embodiment of the present invention. , FIG. 4 is a sectional view of a conventional printed wiring board. 11, 21... Solder resist, 12... White lot number stamping area film formed by character printing, 13, 23... Lot number, 24...
Escape of solder resist, 31, 41...Base material,
32, 42... Circuit, 43... Coating film of solder resist, 45... Coating film formed by letter printing, 35, 46... Carbide formed by laser beam.

Claims (1)

【実用新案登録請求の範囲】 (1) ソルダーレジストの塗膜上に、ロツト番号
捺印用エリア膜を設けることを特徴とするプリン
ト配線板。 (2) ロツト番号捺印用エリア膜が、白色系であ
る請求項(1)に記載のプリント配線板。 (3) ロツト番号捺印用エリア膜のロツト番号捺
印が、レーザ光線による炭化物である請求項(1)
に記載のプリント配線板。[Scope of Claim for Utility Model Registration] (1) A printed wiring board characterized in that an area film for marking a lot number is provided on a coating film of a solder resist. (2) The printed wiring board according to claim (1), wherein the lot number stamping area film is white. (3) Claim (1) wherein the lot number stamp on the lot number stamp area film is a carbide formed by laser beam.
Printed wiring board described in .
JP11631190U 1990-11-06 1990-11-06 Pending JPH0472666U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11631190U JPH0472666U (en) 1990-11-06 1990-11-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11631190U JPH0472666U (en) 1990-11-06 1990-11-06

Publications (1)

Publication Number Publication Date
JPH0472666U true JPH0472666U (en) 1992-06-26

Family

ID=31864126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11631190U Pending JPH0472666U (en) 1990-11-06 1990-11-06

Country Status (1)

Country Link
JP (1) JPH0472666U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001358414A (en) * 2000-06-16 2001-12-26 Ibiden Co Ltd Printed wiring board and method of manufacturing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01144695A (en) * 1987-11-30 1989-06-06 Toshiba Corp Discrimination of printed substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01144695A (en) * 1987-11-30 1989-06-06 Toshiba Corp Discrimination of printed substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001358414A (en) * 2000-06-16 2001-12-26 Ibiden Co Ltd Printed wiring board and method of manufacturing the same

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