JPH0469533B2 - - Google Patents
Info
- Publication number
- JPH0469533B2 JPH0469533B2 JP61253192A JP25319286A JPH0469533B2 JP H0469533 B2 JPH0469533 B2 JP H0469533B2 JP 61253192 A JP61253192 A JP 61253192A JP 25319286 A JP25319286 A JP 25319286A JP H0469533 B2 JPH0469533 B2 JP H0469533B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- press
- molding
- pot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 18
- 238000000465 moulding Methods 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- 101100298225 Caenorhabditis elegans pot-2 gene Proteins 0.000 description 6
- 238000004891 communication Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
- B29C45/021—Plunger drives; Pressure equalizing means for a plurality of transfer plungers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置のマルチ成形方式による樹
脂封止金型に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resin sealing mold for semiconductor devices using a multi-molding method.
従来、半導体装置のマルチ成形方式に用いられ
る樹脂封止金型（以下マルチモールド金型と略
す）の機能部配置は、第３図に示す様に、各ポツ
ト２に対してそれぞれ数個の樹脂成形部１（以下
キヤビテイと略す。）を有しており、これらキヤ
ビテイ１は樹脂導入路３を介して各ポツト２と接
続させているが、各成形単位が各ポツト２毎に独
立していた。
Conventionally, the functional parts of a resin sealing mold (hereinafter referred to as a multi-mold mold) used in a multi-molding method for semiconductor devices are arranged as shown in FIG. It has molding parts 1 (hereinafter abbreviated as cavities), and these cavities 1 are connected to each pot 2 via a resin introduction path 3, but each molding unit is independent for each pot 2. .
上述した従来のマルチモールド金型では、各ポ
ツト２毎に投入される成形材料（以下タブレツト
と略す）の体積に差が存在すると、樹脂を各キヤ
ビテイ１へ完全に圧入完了した時に、各圧入プラ
ンジヤ５の位置が不均一となり、良好な成形結果
を得る事が難しい。この為、第４図に示す様な油
圧等を利用した等圧機構１０をマルチモールド金
型内、又は圧入機構部へ設けてこの差を吸収して
やる必要がある。この等圧機構は、各圧入プラン
ジヤ５がシリンダピストン７を介して等圧機構能
ブロツク１０に挿入され、この等圧機構をブロツ
ク１０には、圧油入口９から圧油が供給され、各
シリンダピストン７の入る圧油室は等圧油圧連絡
路１１で連結されている。そのため各機構部の複
雑化を招くと共に、等圧機構の良否が製品品質を
左右にするといつた欠点があつた。
In the conventional multi-mold mold described above, if there is a difference in the volume of the molding material (hereinafter referred to as tablet) introduced into each pot 2, when the resin is completely press-fitted into each cavity 1, each press-fitting plunger 5 becomes uneven, making it difficult to obtain good molding results. Therefore, it is necessary to absorb this difference by providing an equal pressure mechanism 10 using hydraulic pressure or the like as shown in FIG. 4 in the multi-mold mold or in the press-fitting mechanism. In this equal pressure mechanism, each press-fitting plunger 5 is inserted into an equal pressure mechanism functional block 10 via a cylinder piston 7, and pressure oil is supplied to the equal pressure mechanism block 10 from a pressure oil inlet 9, and each cylinder The pressure oil chambers into which the piston 7 enters are connected by an equal pressure hydraulic communication path 11. This resulted in the complexity of each mechanical part and the drawback that the quality of the product depended on the quality of the equal pressure mechanism.
本発明の目的は、これらの欠点を除き、下型の
ポツト間に樹脂流路を設けることにより、等圧機
構を不要とし、簡単な構造で製品品質も改善でき
てマルチ成型用樹脂封止金型を提供することにあ
る。 The purpose of the present invention is to eliminate these drawbacks, provide a resin flow path between the pots of the lower mold, eliminate the need for an equal pressure mechanism, and improve product quality with a simple structure. The purpose is to provide a model.
本発明の構成は、半導体装置のマルチ成型に用
いる樹脂封止金型において、各マルチポツト間を
連絡する樹脂流路を設けることにより、各樹脂成
形部内圧力を均一になるようにしたことを特徴と
する。
The structure of the present invention is characterized in that in a resin sealing mold used for multi-molding of semiconductor devices, the pressure inside each resin molding part is made uniform by providing a resin flow path that communicates between each multi-pot. do.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図、第２図は本発明の一実施例のマルチモ
ールド金型下型の平面図、およびその圧入機構を
部分断面で示した側面図である。本実施例の基本
的構造は、従来のマルチモールド金型と同一であ
るが、各ポツト２間に樹脂流路４を有することを
特徴とする。これら複数のポツト２へ投入された
タブレツトは、第２図に示す様に、等圧機構をも
たない圧入機構により、樹脂導入路３を経てキヤ
ビテイ１へ圧入される。この時、各タブレツトの
体積差を樹脂流路４を用いて吸収することによ
り、全キヤビテイ１の圧力を均一とし良好な成形
品を得る事が出来る。 FIGS. 1 and 2 are a plan view of a lower die of a multi-mold mold according to an embodiment of the present invention, and a side view showing a press-fitting mechanism thereof in partial cross section. The basic structure of this embodiment is the same as that of the conventional multi-mold mold, but is characterized by having a resin flow path 4 between each pot 2. As shown in FIG. 2, the tablets placed into the plurality of pots 2 are press-fitted into the cavity 1 through the resin introduction path 3 by a press-fitting mechanism having no equal pressure mechanism. At this time, by absorbing the volume difference between the tablets using the resin flow path 4, the pressure in all the cavities 1 can be made uniform and a good molded product can be obtained.
以上説明したように、本発明のマルチモールド
金型は、各ポツト２間に樹脂流路４を有すること
により、各ポツト２毎のタブレツト体積の差を吸
収して良好な成形結果を得ることが出来る。この
ため、他に等圧機構を有する必要がなく、圧入機
構の簡単化が可能となり、そのため製品品質も向
上するといつた効果がある。
As explained above, since the multi-mold mold of the present invention has the resin flow path 4 between each pot 2, it is possible to absorb the difference in tablet volume between each pot 2 and obtain a good molding result. I can do it. Therefore, there is no need to provide any other equal pressure mechanism, and the press-fitting mechanism can be simplified, which has the effect of improving product quality.
第１図、第２図は、本発明の一実施例を示すマ
ルチモールド金型下型の平面図およびこのマルチ
モールド金型の圧入機構の部分断面側面図、第３
図、第４図は、従来のマルチモールド金型下型の
平面図およびこのマルチモールド金型用の等圧機
構を内蔵した圧入機構の側面図である。
１……キヤビテイ、２……ポツト、３……樹脂
導入路、４……樹脂流路、５……圧入用プランジ
ヤ、６……圧入用油圧シリンダー、７……シリン
ダーピストン、８……ベント、９……圧油入口、
１０……等圧機構ブロツク、１１……等圧油圧連
絡路。
1 and 2 are a plan view of a lower die of a multi-mold mold showing an embodiment of the present invention, a partially sectional side view of a press-fitting mechanism of this multi-mold mold, and a third
4 are a plan view of a conventional multi-mold mold lower die and a side view of a press-fitting mechanism incorporating an equal pressure mechanism for this multi-mold mold. 1... Cavity, 2... Pot, 3... Resin introduction path, 4... Resin flow path, 5... Plunger for press fitting, 6... Hydraulic cylinder for press fitting, 7... Cylinder piston, 8... Vent, 9...Pressure oil inlet,
10... Equal pressure mechanism block, 11... Equal pressure hydraulic communication path.
Claims (1)
型において、各マルチポツト間を連絡する樹脂流
路を設けることにより、各樹脂成形部内圧力を均
一になるようにしたことを特徴とするマルチ成形
用樹脂封止金型。1. A resin for multi-molding, which is characterized in that, in a resin sealing mold used for multi-molding of semiconductor devices, the pressure inside each resin molding part is made uniform by providing a resin flow path that communicates between each multi-pot. Sealing mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25319286A JPS63107530A (en) | 1986-10-23 | 1986-10-23 | Resin sealing mold for multi-molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25319286A JPS63107530A (en) | 1986-10-23 | 1986-10-23 | Resin sealing mold for multi-molding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63107530A JPS63107530A (en) | 1988-05-12 |
| JPH0469533B2 true JPH0469533B2 (en) | 1992-11-06 |
Family
ID=17247829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25319286A Granted JPS63107530A (en) | 1986-10-23 | 1986-10-23 | Resin sealing mold for multi-molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63107530A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6923502B2 (en) * | 2018-11-21 | 2021-08-18 | Ｔｏｗａ株式会社 | Transfer drive mechanism, resin molding device and manufacturing method of resin molded products |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6038717B2 (en) * | 1973-01-24 | 1985-09-02 | ロッキ−ド エア−クラフト コ−ポレ−ション | sound absorbing panel |
| JPS6339054U (en) * | 1986-08-30 | 1988-03-14 | ||
| JPH0340579U (en) * | 1989-08-31 | 1991-04-18 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5623059Y2 (en) * | 1977-10-21 | 1981-05-29 | ||
| JPS6038717U (en) * | 1983-08-25 | 1985-03-18 | ロ−ム株式会社 | Multi-type transfer molding equipment |
-
1986
- 1986-10-23 JP JP25319286A patent/JPS63107530A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6038717B2 (en) * | 1973-01-24 | 1985-09-02 | ロッキ−ド エア−クラフト コ−ポレ−ション | sound absorbing panel |
| JPS6339054U (en) * | 1986-08-30 | 1988-03-14 | ||
| JPH0340579U (en) * | 1989-08-31 | 1991-04-18 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63107530A (en) | 1988-05-12 |
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