JPH0468550U - - Google Patents
Info
- Publication number
- JPH0468550U JPH0468550U JP1990111622U JP11162290U JPH0468550U JP H0468550 U JPH0468550 U JP H0468550U JP 1990111622 U JP1990111622 U JP 1990111622U JP 11162290 U JP11162290 U JP 11162290U JP H0468550 U JPH0468550 U JP H0468550U
- Authority
- JP
- Japan
- Prior art keywords
- board
- jig
- vacuum
- flange
- support plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990111622U JP2505200Y2 (ja) | 1990-10-26 | 1990-10-26 | 基板リ―ク試験用治具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990111622U JP2505200Y2 (ja) | 1990-10-26 | 1990-10-26 | 基板リ―ク試験用治具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0468550U true JPH0468550U (fr) | 1992-06-17 |
JP2505200Y2 JP2505200Y2 (ja) | 1996-07-24 |
Family
ID=31859090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990111622U Expired - Lifetime JP2505200Y2 (ja) | 1990-10-26 | 1990-10-26 | 基板リ―ク試験用治具 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2505200Y2 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101380429B1 (ko) * | 2012-12-17 | 2014-04-01 | 한국항공우주연구원 | 포트플레이트 기밀시험용 치구 및 포트플레이트 기밀시험방법 |
-
1990
- 1990-10-26 JP JP1990111622U patent/JP2505200Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2505200Y2 (ja) | 1996-07-24 |
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