JPH0468544U - - Google Patents
Info
- Publication number
- JPH0468544U JPH0468544U JP1990112446U JP11244690U JPH0468544U JP H0468544 U JPH0468544 U JP H0468544U JP 1990112446 U JP1990112446 U JP 1990112446U JP 11244690 U JP11244690 U JP 11244690U JP H0468544 U JPH0468544 U JP H0468544U
- Authority
- JP
- Japan
- Prior art keywords
- metal
- metal cap
- semiconductor device
- stem
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000003466 welding Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Casings For Electric Apparatus (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第1図は、本考案の第1の実施例の断面図、第
2図は本考案の第2の実施例の断面図、第3図は
従来の半導体装置の断面図である。 1……金属キヤツプ、2……半導体チツプ、3
……配線、4……端子、5……溶接部、6……金
属ステム、7……独立した空間、8……溶接屑、
9……間隙、10……凹部、11……テーパ部。
2図は本考案の第2の実施例の断面図、第3図は
従来の半導体装置の断面図である。 1……金属キヤツプ、2……半導体チツプ、3
……配線、4……端子、5……溶接部、6……金
属ステム、7……独立した空間、8……溶接屑、
9……間隙、10……凹部、11……テーパ部。
Claims (1)
- 金属ステム上に半導体チツプを搭載し、金属キ
ヤツプをかぶせて溶接し気密封止するキヤンケー
ス半導体装置において、金属キヤツプと金属ステ
ムの溶接部と半導体チツプの搭載部の間に独立し
た空間を設けたことを特徴とするキヤンケース半
導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990112446U JPH0468544U (ja) | 1990-10-25 | 1990-10-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990112446U JPH0468544U (ja) | 1990-10-25 | 1990-10-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0468544U true JPH0468544U (ja) | 1992-06-17 |
Family
ID=31859946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990112446U Pending JPH0468544U (ja) | 1990-10-25 | 1990-10-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0468544U (ja) |
-
1990
- 1990-10-25 JP JP1990112446U patent/JPH0468544U/ja active Pending