JPH0468538U - - Google Patents
Info
- Publication number
- JPH0468538U JPH0468538U JP11229890U JP11229890U JPH0468538U JP H0468538 U JPH0468538 U JP H0468538U JP 11229890 U JP11229890 U JP 11229890U JP 11229890 U JP11229890 U JP 11229890U JP H0468538 U JPH0468538 U JP H0468538U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- transfer arm
- wafer transfer
- heat insulating
- pin insertion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Description
第１図ａ，ｂは本考案にかかるウエハー搬送ア
ームの平面図と側面図、第２図はホツトプレート
の斜視図、第３図ａ，ｂは従来のウエハー搬送ア
ームの平面図と側面図、第４図は従来の問題点を
説明する図、である。
図において、１はアームリング、２はホールド
部、３は断熱プレート、１０はウエハー搬送アー
ム、１１は搬送路、１２はホツトプレート、１３
はクーリングプレート、２１はリフトピン、３０
はピン挿入溝、Ｗはウエハー、を示している。
1A and 1B are a plan view and a side view of a wafer transfer arm according to the present invention, FIG. 2 is a perspective view of a hot plate, and FIGS. 3A and 3B are a plan view and a side view of a conventional wafer transfer arm. FIG. 4 is a diagram explaining the conventional problems. In the figure, 1 is an arm ring, 2 is a holding part, 3 is a heat insulating plate, 10 is a wafer transfer arm, 11 is a transfer path, 12 is a hot plate, 13
is the cooling plate, 21 is the lift pin, 30
indicates a pin insertion groove, and W indicates a wafer.
Claims (1)
エハー搬送アームの裏面に、該ウエハーの搭載・
除去が可能なピン挿入部を設けた断熱プレートを
備えてなることを特徴とするウエハー搬送アーム
。 The wafer is mounted and mounted on the back side of a flat wafer transfer arm that holds and transfers the wafer at several points.
A wafer transfer arm comprising a heat insulating plate with a removable pin insertion portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990112298U JP2519577Y2 (en) | 1990-10-26 | 1990-10-26 | Wafer transfer arm |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990112298U JP2519577Y2 (en) | 1990-10-26 | 1990-10-26 | Wafer transfer arm |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0468538U true JPH0468538U (en) | 1992-06-17 |
| JP2519577Y2 JP2519577Y2 (en) | 1996-12-04 |
Family
ID=31859796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990112298U Expired - Lifetime JP2519577Y2 (en) | 1990-10-26 | 1990-10-26 | Wafer transfer arm |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2519577Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010253670A (en) * | 2009-03-31 | 2010-11-11 | Sharp Corp | Suction device and conveying device |
-
1990
- 1990-10-26 JP JP1990112298U patent/JP2519577Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010253670A (en) * | 2009-03-31 | 2010-11-11 | Sharp Corp | Suction device and conveying device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2519577Y2 (en) | 1996-12-04 |