JPH0466679A - Etching method - Google Patents
Etching methodInfo
- Publication number
- JPH0466679A JPH0466679A JP17803790A JP17803790A JPH0466679A JP H0466679 A JPH0466679 A JP H0466679A JP 17803790 A JP17803790 A JP 17803790A JP 17803790 A JP17803790 A JP 17803790A JP H0466679 A JPH0466679 A JP H0466679A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- etching
- metal layer
- eddy current
- casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 title claims abstract description 55
- 238000000034 method Methods 0.000 title claims description 13
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 239000002184 metal Substances 0.000 claims abstract description 28
- 239000007921 spray Substances 0.000 claims description 4
- 238000005507 spraying Methods 0.000 abstract description 4
- 238000004090 dissolution Methods 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 14
- 230000000903 blocking effect Effects 0.000 description 8
- 238000005260 corrosion Methods 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- 230000001133 acceleration Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Weting (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、例えばプリント配線基板などのエツチングを
行なうエツチング方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an etching method for etching, for example, printed wiring boards.
（従来の技術）
従来、エツチング方法としては、腐食液に溶けないレジ
スト層を金属板上に設けて回路を形成した基板を、エツ
チングを行なう室内に搬入すると共に、金属を腐食させ
る腐食液を加熱し、この腐食液をスプレーなどによって
基板に吹き付けて基板に露出する金属表面を溶かしてエ
ツチングを行なう方法が知られている。そのほか、特開
昭５８−２７９８２号の公開特許公報には基板のエツチ
ングの進行状態を検出する装置が開示されている。(Prior art) Conventionally, in the etching method, a resist layer that does not dissolve in a corrosive liquid is provided on a metal plate to form a circuit, and a circuit board is carried into a chamber where etching is performed, and a corrosive liquid that corrodes the metal is heated. However, a method is known in which etching is performed by spraying this corrosive liquid onto the substrate to dissolve the metal surface exposed on the substrate. In addition, Japanese Unexamined Patent Publication No. 58-27982 discloses an apparatus for detecting the progress of etching of a substrate.
（発明が解決しようとする課題）
しかしながら、このような従来のエツチング装置では、
エツチング装置の構成手段により腐食液の温度が制限さ
れ、その温度管理が難しいために、エツチング装置の構
成手段が制限されるという問題がある。(Problem to be solved by the invention) However, in such a conventional etching device,
There is a problem in that the temperature of the etching solution is limited by the constituent means of the etching apparatus, and since temperature control is difficult, the constituent means of the etching apparatus are limited.
（課題を解決するための手段）
本発明にかかるエツチング方法は、上記課題を解決する
ために、金属を溶かすエツチング液を吹き付けるスプレ
ー槽の内部に、前記エツチング液に溶ける金属層を前記
エツチング液に溶けないレジスト層によって一部被覆し
た基板を搬入し、この基板に前記エツチング液を吹き付
けるとともに、前記基板の金属層に電流を発生させるこ
とを特徴とする特
（作 用）
本発明にかかるエツチング方法によれば、エツチング液
の吹き付は中に基板の金属層に電流を発生させるので、
基板の金属層自身が発熱し、エツチング液に接触する金
属層がエツチング液に溶けることが促進される。(Means for Solving the Problems) In order to solve the above-mentioned problems, the etching method according to the present invention etches a metal layer that is soluble in the etching liquid inside a spray tank in which an etching liquid that dissolves metal is sprayed. An etching method according to the present invention characterized in that a substrate partially covered with an insoluble resist layer is carried in, the etching solution is sprayed onto the substrate, and a current is generated in the metal layer of the substrate. According to
The metal layer of the substrate itself generates heat, and the metal layer that comes into contact with the etching solution is promoted to dissolve in the etching solution.
（実施例）
以下、本発明にかかるエツチング方法の実施例を図面に
基づいて説明する。(Example) Hereinafter, an example of the etching method according to the present invention will be described based on the drawings.
第１図は本発明の第１実施例にかかるエツチング方法に
用いる装置の概略構成を示したものであり、１はエツチ
ング装置である。FIG. 1 shows a schematic configuration of an apparatus used in an etching method according to a first embodiment of the present invention, and 1 is an etching apparatus.
このエツチング装置１は、エツチング室を形成するケー
シング２を備え、ケーシング２の長手方向の両側壁に縦
方向に延びるスリット２ａ、 ２ａをそれぞれ形成し、
ケーシング２内に基板３が搬入、搬出されるように、搬
送手段を有している。この搬送手段としては、本実施例
では、スリット２ａ、 ２ａ間に耐腐食製のガイドレー
ル４を架設し、このガイドレール４に、基板３の支持溝
５ａを有する支柱５．５とスライダ６とを一体に形成し
た支持装置７を移動可能に装着し、支柱５．５にケーシ
ング２の外側から延びるケーブル８を連結し、ケーブル
８をプーリ９ａ、 ９ｂに巻回し、プーリ９ａ、 ９ｂ
をモータ１０ａ、Ｊｏｂにより駆動するようになってい
る。ケーシング２のスリット２ａ、 ２ａのそれぞれの
開口周縁部には、発光素子１１ａ、 ｌｌｂと受光素子
１２ａ、 １２ｂが対向配設され、発光素子１１ａ、１
１ｂからの光を受光素子１２ａ、 １２ｂで受光し、受
光素子１２ａ、１２１）は基板３が通過する時に検出信
号を制御装置１３に出力する。This etching apparatus 1 includes a casing 2 forming an etching chamber, and has longitudinally extending slits 2a, 2a formed in both longitudinal walls of the casing 2, respectively.
A conveying means is provided so that the substrate 3 can be carried into and out of the casing 2. In this embodiment, as this conveying means, a corrosion-resistant guide rail 4 is installed between the slits 2a, 2a, and a support 5.5 having a support groove 5a of the substrate 3 and a slider 6 are attached to the guide rail 4. A cable 8 extending from the outside of the casing 2 is connected to the strut 5.5, and the cable 8 is wound around pulleys 9a and 9b.
is driven by a motor 10a and Job. The light emitting elements 11a, llb and the light receiving elements 12a, 12b are disposed opposite to each other at the opening periphery of each of the slits 2a, 2a of the casing 2.
The light from 1b is received by the light receiving elements 12a, 12b, and the light receiving elements 12a, 121) output a detection signal to the control device 13 when the substrate 3 passes.
ケーシング２には、エツチング液を散布する一対のノズ
ル１４ａ、 １４ｂと、基板３の金属層に渦電流を発生
させる渦電流発生装置１５とが設けられている。The casing 2 is provided with a pair of nozzles 14a and 14b for spraying an etching solution, and an eddy current generator 15 for generating an eddy current in the metal layer of the substrate 3.
ノズル１４ａ、 １４ｂはケーシング２の長手方向の途
中まで配設され、後述する渦電流発生装置１５ａ、 １
５ｂとノズル１４ａ、１４ｂの間に基板３が位置し、基
板３の一面側にエツチング液を散布させるようになって
いる。The nozzles 14a and 14b are disposed halfway in the longitudinal direction of the casing 2, and are connected to eddy current generators 15a and 15, which will be described later.
The substrate 3 is located between the nozzle 5b and the nozzles 14a and 14b, and the etching solution is sprayed onto one side of the substrate 3.
ノズル１４ａから散布されるエツチング液の温度は所定
の温度となるようにエツチング液の加圧ポンプ１６から
供給される。渦電流発生装置１５ａ、 １５ｂは、電源
とコイルとを備えており、制御装置１３により電源の電
流が制御されてコイルが通電される。The etching liquid is supplied from the etching liquid pressure pump 16 so that the temperature of the etching liquid sprayed from the nozzle 14a is a predetermined temperature. The eddy current generators 15a and 15b are equipped with a power source and a coil, and the control device 13 controls the current of the power source to energize the coil.
制御装置１３は基板３がケーシング２に搬入された時に
受光素子１２ａからの検出信号に基づいて電源を駆動し
てコイルを通電させると共に、加圧ポンプ１６ａ、 １
６ｂを駆動し、ノズル１４がらエツチング液を散布する
。制御装置１３には、モータ１０ａ、 １０ｂと発光素
子１１ａ、 ｌｌｂと受光素子１２ａ、 １２ｂと加圧
ポンプ１５とが、接続され、モータ１０ａ、 １０ｂの
駆動を制御すると共に、発光素子１１ａ、 ｌｌｂを発
光させ、受光素子１２ａ、 １２ｂが基板３により遮光
された時に受光素子１２ａ、 １２ｂからの遮光信号に
より、ノズル１４ａ、 １４ｂにエツチング液を供給す
るエツチング液の加圧ポンプｌｅａ、 １６ｂを駆動す
る。When the board 3 is loaded into the casing 2, the control device 13 drives the power source to energize the coil based on the detection signal from the light receiving element 12a, and also controls the pressure pumps 16a, 1.
6b is driven to spray the etching liquid through the nozzle 14. The control device 13 is connected to the motors 10a, 10b, the light emitting elements 11a, llb, the light receiving elements 12a, 12b, and the pressure pump 15, and controls the driving of the motors 10a, 10b, and also controls the light emitting elements 11a, llb. When light is emitted and the light receiving elements 12a and 12b are shielded from light by the substrate 3, a light shielding signal from the light receiving elements 12a and 12b drives etching liquid pressure pumps lea and 16b that supply etching liquid to the nozzles 14a and 14b.
即ち、ケーシング２内に基板３が搬入されると、受光素
子１２ａからの遮光信号に基づいて加圧ポンプｌｅａが
駆動され、ノズル１４からエツチング液が噴出する。受
光素子１２ａからの遮光信号は同時に渦電流発生装置１
５ａの電源のスイッチをオンさせ、コイルを通電する。That is, when the substrate 3 is carried into the casing 2, the pressure pump lea is driven based on the light blocking signal from the light receiving element 12a, and the etching liquid is ejected from the nozzle 14. The light blocking signal from the light receiving element 12a is simultaneously transmitted to the eddy current generator 1.
Turn on the power switch 5a to energize the coil.
コイルは基板３の移動領域近傍に配設されているので、
コイルの近傍を基板３が移動するときに基板３の金属層
に渦電流が発生する。これによって、コイルの通電によ
り移動する基板２の金属層に誘導電流が生じて金属層が
発熱し、エツチング液に接触する金属層の腐食が促進さ
れる。基板３の搬送速度はこのときの腐食の促進状況に
より決められるが、エツチング液の温度との関連させる
ために、ケーシング２内に温度センサを設けるとともに
、所定温度における腐食に必要な時間を腐食促進データ
として制御装置１３に記憶させておき、温度センサから
の温度に間するデータを制御装置１３の腐食促進データ
と比較演算してモータ１０ａ、１０ｂの搬送速度を制御
しても良い。Since the coil is placed near the moving area of the board 3,
When the substrate 3 moves near the coil, eddy currents are generated in the metal layer of the substrate 3. As a result, an induced current is generated in the metal layer of the substrate 2 that moves due to the energization of the coil, the metal layer generates heat, and corrosion of the metal layer that comes into contact with the etching solution is accelerated. The conveyance speed of the substrate 3 is determined by the state of acceleration of corrosion at this time, but in order to correlate it with the temperature of the etching solution, a temperature sensor is provided inside the casing 2, and the time required for corrosion at a predetermined temperature is set to accelerate corrosion. The transfer speed of the motors 10a and 10b may be controlled by storing the data in the control device 13 and comparing the temperature data from the temperature sensor with the corrosion acceleration data of the control device 13.
本実施例では、左右のノズル１４ａ、 １４ｂの境部に
加圧ポンプ１６ａ、 １６ｂ及びと渦電流発生装置１５
ａ、 １５ｂとの駆動を切り換える発光素子１７ａと受
光素子１７ｂが配設されている０発光素子１７ａは受光
素子１２ａの遮光信号に基づいて発光し、受光素子１７
ｂは基板３の通過時に遮光信号を制卸装置１３に送信し
て加圧ポンプ１６ａと渦電流発生装置１５ａの駆動を停
止させると共に、渦電流発生装置１５ｂと加圧ポンプ１
６ｂを駆動する。渦電流発生装置１５ｂと加圧ポンプ１
６ｂとによって基板３の裏面側がエツチングされたら、
基板３はケーシング２の外側に排出される。基板３がケ
ーシング２の外側にでたら、受光素子１２ｂが遮光され
、受光素子１２ｂから遮光信号が制御装置１３に出力さ
れるが、遮光信号の受信から基板３が完全にケーシング
２の外側に位置するまでの所定時間だけ渦電流発生装置
１５ｂと加圧ポンプ１６ｂの駆動が行なわれる。In this embodiment, pressure pumps 16a, 16b and an eddy current generator 15 are installed at the boundary between the left and right nozzles 14a, 14b.
The light emitting element 17a, in which the light emitting element 17a and the light receiving element 17b are arranged, which switches the driving between the light emitting element 17a and the light receiving element 15b, emits light based on the light blocking signal of the light receiving element 12a.
b sends a light blocking signal to the control device 13 when the substrate 3 passes to stop the driving of the pressure pump 16a and the eddy current generator 15a, and also stops the driving of the eddy current generator 15b and the pressure pump 1.
6b. Eddy current generator 15b and pressure pump 1
6b is etched on the back side of the substrate 3,
The substrate 3 is discharged to the outside of the casing 2. When the board 3 comes out to the outside of the casing 2, the light receiving element 12b is blocked from light, and a light blocking signal is output from the light receiving element 12b to the control device 13, but the board 3 is completely positioned outside the casing 2 after receiving the light blocking signal. The eddy current generator 15b and the pressurizing pump 16b are driven for a predetermined period of time.
即ち、ケーシング２から基板３が完全に排出されるのは
、基板３の排出側の受光素子１２ｂからの遮光信号の次
の受光信号によって検出される。この排出側の受光素子
１２ｂからの遮光信号後の受光信号の立ち上がり信号に
基づいて、制御装置１３はエツチング液の加圧ポンプ１
６ｂと渦電流発生装置１５ａを停止させ、モータ１０ａ
、 １０ｂを逆転させて支持装置７をケーシング２の基
板搬入側に移動させてからモータ１０ａ、 １０ｂを停
止させる。That is, complete ejection of the board 3 from the casing 2 is detected by the light reception signal following the light blocking signal from the light receiving element 12b on the ejection side of the board 3. Based on the rising signal of the light receiving signal after the light blocking signal from the light receiving element 12b on the discharge side, the control device 13 controls the etching liquid pressurizing pump 1.
6b and the eddy current generator 15a are stopped, and the motor 10a is stopped.
, 10b is reversed to move the support device 7 to the substrate loading side of the casing 2, and then the motors 10a and 10b are stopped.
第２図は、本発明の第２実施例にかかるエツチング方法
にもちいる装置を示したものであり、二の実施例では基
板３の金属層に電流を発生させる電流手段は、第１実施
例の場合のコイル８と異なり接触式通電装置２０ａ、
２０ｂとされている。この接触式通電装置２０ａ、 ２
０ｂは基板３に通電させるためのブラシ２１．２１を備
えており、ブラシ２１．２１を基板３の金属露出部位に
接触させることにより基板３の金属層に通電させるよう
になっている。そのほかの構成及び接触式通電装置２０
ａ、 ２０ｂの動作は第１実施例のエツチング装置と同
様であるので、その説明を援用する。FIG. 2 shows an apparatus used in the etching method according to the second embodiment of the present invention. Unlike the coil 8 in the case of the contact type energizing device 20a,
It is said to be 20b. This contact type energizing device 20a, 2
0b is equipped with a brush 21.21 for energizing the substrate 3, and by bringing the brush 21.21 into contact with an exposed metal portion of the substrate 3, the metal layer of the substrate 3 is energized. Other configurations and contact type energizing device 20
Since the operations of a and 20b are similar to those of the etching apparatus of the first embodiment, their explanations will be used here.
（発明の効果）
本発明のエツチング方法によれば、エツチング液の吹き
付は中に基板の金属層に電流を発生させるので、基板の
金属層が発熱し、エツチング液に接触する金属層がエツ
チング液に溶けてエツチングが促進される。(Effects of the Invention) According to the etching method of the present invention, the spraying of the etching solution generates a current in the metal layer of the substrate, so the metal layer of the substrate generates heat and the metal layer that comes into contact with the etching solution is etched. Dissolves in liquid and accelerates etching.
第１図は本発明の第１実施例のエツチング方法に用いる
装置の概略構成図である。
第２図は本発明の第２実施例のエツチング方法に用いる
装置の概略構成図である。
１・・・エツチング装置
３・・・基板
１３・・・制御装置
１５ａ、１５ｂ・・・渦電流発生装置FIG. 1 is a schematic diagram of an apparatus used in the etching method according to the first embodiment of the present invention. FIG. 2 is a schematic diagram of an apparatus used in the etching method according to the second embodiment of the present invention. 1... Etching device 3... Substrate 13... Control device 15a, 15b... Eddy current generator
Claims (1)
内部に、前記エッチング液に溶ける金属層を前記エッチ
ング液に溶けないレジスト層によって一部被覆した基板
を搬入し、この基板に前記エッチング液を吹き付けると
ともに、前記基板の金属層に電流を発生させることを特
徴とするエッチング方法。A substrate in which a metal layer that dissolves in the etching solution is partially covered with a resist layer that does not dissolve in the etching solution is carried into a spray tank that sprays an etching solution that dissolves metal, and the etching solution is sprayed onto this substrate. An etching method characterized by generating an electric current in a metal layer of a substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2178037A JP2987889B2 (en) | 1990-07-04 | 1990-07-04 | Etching method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2178037A JP2987889B2 (en) | 1990-07-04 | 1990-07-04 | Etching method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0466679A true JPH0466679A (en) | 1992-03-03 |
| JP2987889B2 JP2987889B2 (en) | 1999-12-06 |
Family
ID=16041486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2178037A Expired - Lifetime JP2987889B2 (en) | 1990-07-04 | 1990-07-04 | Etching method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2987889B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007027907A3 (en) * | 2005-09-02 | 2009-05-07 | Univ Columbia | A system and method for obtaining anisotropic etching of patterned substrates |
| US8308929B2 (en) | 2006-12-06 | 2012-11-13 | The Trustees Of Columbia University In The City Of New York | Microfluidic systems and methods for screening plating and etching bath compositions |
| JP2013041633A (en) * | 2011-08-11 | 2013-02-28 | Dainippon Printing Co Ltd | Substrate for suspension, suspension, suspension with element, hard disk drive, and method for manufacturing substrate for suspension |
| US8475642B2 (en) | 2005-04-08 | 2013-07-02 | The Trustees Of Columbia University In The City Of New York | Systems and methods for monitoring plating and etching baths |
| US8496799B2 (en) | 2005-02-08 | 2013-07-30 | The Trustees Of Columbia University In The City Of New York | Systems and methods for in situ annealing of electro- and electroless platings during deposition |
| US8529738B2 (en) | 2005-02-08 | 2013-09-10 | The Trustees Of Columbia University In The City Of New York | In situ plating and etching of materials covered with a surface film |
| US8985050B2 (en) | 2009-11-05 | 2015-03-24 | The Trustees Of Columbia University In The City Of New York | Substrate laser oxide removal process followed by electro or immersion plating |
-
1990
- 1990-07-04 JP JP2178037A patent/JP2987889B2/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8496799B2 (en) | 2005-02-08 | 2013-07-30 | The Trustees Of Columbia University In The City Of New York | Systems and methods for in situ annealing of electro- and electroless platings during deposition |
| US8529738B2 (en) | 2005-02-08 | 2013-09-10 | The Trustees Of Columbia University In The City Of New York | In situ plating and etching of materials covered with a surface film |
| US8475642B2 (en) | 2005-04-08 | 2013-07-02 | The Trustees Of Columbia University In The City Of New York | Systems and methods for monitoring plating and etching baths |
| WO2007027907A3 (en) * | 2005-09-02 | 2009-05-07 | Univ Columbia | A system and method for obtaining anisotropic etching of patterned substrates |
| US8308929B2 (en) | 2006-12-06 | 2012-11-13 | The Trustees Of Columbia University In The City Of New York | Microfluidic systems and methods for screening plating and etching bath compositions |
| US8985050B2 (en) | 2009-11-05 | 2015-03-24 | The Trustees Of Columbia University In The City Of New York | Substrate laser oxide removal process followed by electro or immersion plating |
| JP2013041633A (en) * | 2011-08-11 | 2013-02-28 | Dainippon Printing Co Ltd | Substrate for suspension, suspension, suspension with element, hard disk drive, and method for manufacturing substrate for suspension |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2987889B2 (en) | 1999-12-06 |
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