JPH0465046A - Chip-type fuse resistor - Google Patents
Chip-type fuse resistorInfo
- Publication number
- JPH0465046A JPH0465046A JP17557490A JP17557490A JPH0465046A JP H0465046 A JPH0465046 A JP H0465046A JP 17557490 A JP17557490 A JP 17557490A JP 17557490 A JP17557490 A JP 17557490A JP H0465046 A JPH0465046 A JP H0465046A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- fuse resistor
- chip
- electrodes
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 239000000919 ceramic Substances 0.000 claims abstract description 18
- 239000011521 glass Substances 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000007747 plating Methods 0.000 abstract description 4
- 238000007639 printing Methods 0.000 abstract description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 29
- 230000000694 effects Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000011195 cermet Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Landscapes
- Fuses (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、プリント基板やセラミック印刷配線基板への
自動実装に適するど共に、低電圧・低電流の過電流に対
（−で高速で溶断し、組み込んだ回路の正常動作時は低
抵抗の抵抗体として機能する安価なチップ形ヒユーズ抵
抗器に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention is suitable for automatic mounting on printed circuit boards and ceramic printed wiring boards, and is also suitable for high-speed melting at low voltage and low current overcurrents (-). The present invention also relates to an inexpensive chip-type fuse resistor that functions as a low-resistance resistor during normal operation of an incorporated circuit.
一般に電子回路においては、過電流による部品自体の性
能劣化や損傷を防止するためにヒユーズを設けている。Generally, electronic circuits are provided with fuses to prevent performance deterioration or damage to the components themselves due to overcurrent.
このヒユーズに関し、近年プリント基板やセラミック印
刷配線基板などに表面実装するため、チップ形のものが
開発されている。In recent years, chip-type fuses have been developed for surface mounting on printed circuit boards, ceramic printed wiring boards, and the like.
従来のチップ形ヒユーズとしては、絶縁基板上に一対の
電極を形成し、両電極間にφ５０μｍ以下のＡｕやＡｕ
線をワイヤーボンディングした後、絶縁基板上に樹脂を
盛りこの細線を封止（−てなるものが知られている（特
公昭６０−１４３５４４号公報）。また絶縁基板両端に
電極を形成し、両電極間を金属薄膜よりなる導電部で電
気的に接続すると共に、その導電部を絶縁基板の下面に
設けられている凹部内に形成したものが知られている（
実公昭６１−１１８８１号公報）。また絶縁基板両端に
電極を形成し、両電極間を金属薄膜よりなる導電部で電
気的に接続し、導電部をシリコン樹脂で被覆するものも
知られている（特公昭６３−１４１２３３号公報）０
〔発明が解決しようとする課題〕
前記の従来技術におけるチップ形ヒユーズは、電極間を
ワイヤーボンディングする加工が必要であったり、絶縁
基板下面に凹部を形成するなど、製造コストが上昇する
と共に自動実装に適当でないという欠点がある。また、
従来のチップ形ヒユーズはオーバーコートにシリコン樹
脂を用いているため、端面電極をサーメットの焼き付は
電極とすることができず、端子強度が劣るという欠点が
あり、さらに、ヒユーズ抵抗パターンが方形波状に屈曲
する帯状のため、低電圧・低電流の過電流に対する高速
溶断特性を決定する要因である低い抵抗値が得られにく
いという欠点もあった。Conventional chip-type fuses are made by forming a pair of electrodes on an insulating substrate, and using Au or Au with a diameter of 50 μm or less between the two electrodes.
After wire-bonding the wires, resin is placed on the insulating substrate to seal the thin wires (-). It is known that the electrodes are electrically connected by a conductive part made of a thin metal film, and the conductive part is formed in a recess provided on the lower surface of an insulating substrate (
Utility Model Publication No. 61-11881). It is also known to form electrodes on both ends of an insulating substrate, electrically connect the two electrodes with a conductive part made of a metal thin film, and cover the conductive part with silicone resin (Japanese Patent Publication No. 141233/1983). 0 [Problems to be Solved by the Invention] The chip-type fuses in the prior art described above require wire bonding between electrodes, form recesses on the bottom surface of the insulating substrate, etc., and increase manufacturing costs. The drawback is that it is not suitable for implementation. Also,
Conventional chip-type fuses use silicone resin for the overcoat, so the end face electrode cannot be baked into cermet and has the disadvantage of poor terminal strength.Furthermore, the fuse resistance pattern has a square wave shape. Because of the band-like shape, it was difficult to obtain a low resistance value, which is a factor that determines high-speed fusing characteristics against low-voltage and low-current overcurrents.
そこで本発明は前記事情に基づいてなされたものであり
、製造コストを低く押さえたままで量産化出来ると共に
、自動実装に最適であり、低電圧・低電流の過電流に対
して高速溶断するチップ形ヒユーズ抵抗器を提供するこ
とを目的とする。The present invention has been made based on the above circumstances, and is a chip type that can be mass-produced while keeping manufacturing costs low, is ideal for automatic mounting, and has high-speed fusing in response to low voltage and low current overcurrents. The purpose is to provide a fuse resistor.
〔課題を解決するための手段及び作用〕上記目的を達成
するため、本発明によるチップ形ヒユーズ抵抗器は絶縁
性セラミック基板と基板上に形成される一対の厚膜電極
とこの厚膜電極間を接続する矩形状の厚膜ヒユーズ抵抗
体、ならびに厚膜ヒユーズ抵抗体の上下に形成される二
層の厚膜ガラス層から構成するものである。[Means and operations for solving the problems] In order to achieve the above object, the chip type fuse resistor according to the present invention includes an insulating ceramic substrate, a pair of thick film electrodes formed on the substrate, and a connection between the thick film electrodes. It consists of a connected rectangular thick film fuse resistor and two thick film glass layers formed above and below the thick film fuse resistor.
従って、本発明のチップ形ヒユーズ抵抗器は、電極、ガ
ラス、ヒユーズ各構成部を厚膜印刷により容易に行なう
ことができ、量産性に富んだ製造コストの低い製品とな
る。Therefore, in the chip type fuse resistor of the present invention, the electrodes, glass, and fuse components can be easily formed by thick film printing, resulting in a product with high mass productivity and low manufacturing cost.
また、ヒユーズ抵抗体がパターン幅・膜厚のバラツキの
小さな矩形状としであるため、しかも上下二層の厚膜ガ
ラス層で覆い蓄熱効果を高めであるため、低電圧・低電
流の過電流に対して高速溶断特性を有する製品となる。In addition, since the fuse resistor has a rectangular shape with small variations in pattern width and film thickness, and is covered with two thick glass layers (upper and lower) to increase heat storage effect, it is resistant to overcurrents at low voltages and low currents. In contrast, the product has high-speed fusing characteristics.
さらに本発明チップ形ヒユーズ抵抗器は、従来の面実装
チップ部品と同様に取り扱うことができるので目動実装
が容易に行なえる。Furthermore, since the chip type fuse resistor of the present invention can be handled in the same manner as conventional surface-mounted chip components, it can be easily mounted by moving the chip.
以下、本発明によるチップ形ヒユーズ抵抗器について図
面を参照しつつ具体的に説明する。Hereinafter, the chip type fuse resistor according to the present invention will be specifically explained with reference to the drawings.
第１図は本発明によるチップ形ヒユーズ抵抗器の平面図
、第２図はそのＡ−Ａ断面図である。尚、第１図におい
ては、後述のオーバーコート厚膜ガラス層５、二次電極
６、三次電極９を省略しである。本発明チップ形ヒユー
ズ抵抗器は、絶縁性セラミック基板１と、絶縁性セラミ
ック基板１上に形成される一対の厚膜電極３，３と、こ
の厚膜電極３，３間を接続する矩形状の厚膜ヒユーズ抵
抗体４、ならびに厚膜ヒユーズ抵抗体４の上下に形成さ
れる二層の厚膜ガラス層２，５から構成されるものであ
る。FIG. 1 is a plan view of a chip type fuse resistor according to the present invention, and FIG. 2 is a sectional view taken along line A-A. In addition, in FIG. 1, an overcoat thick film glass layer 5, a secondary electrode 6, and a tertiary electrode 9, which will be described later, are omitted. The chip type fuse resistor of the present invention comprises an insulating ceramic substrate 1, a pair of thick film electrodes 3, 3 formed on the insulating ceramic substrate 1, and a rectangular shape connecting between the thick film electrodes 3, 3. It is composed of a thick film fuse resistor 4 and two thick film glass layers 2 and 5 formed above and below the thick film fuse resistor 4.
絶縁性セラミック基板１はアルミナなどの絶縁性セラミ
ックスからなり、既製の角チツプ抵抗器と同じように直
方体形状とし、例えば外形寸法は３．２Ｘ１．６ｍｍ２
とする。セラミック基板１の上面には、まずガラスペー
スト（例えばＥＳＬ社のＥＳＬ−４９０１）によりアン
ダーコート厚膜ガラス層２を形成する。次に、アンダー
コート厚膜ガラス層２の上にＡｇ厚膜ペースト（例えば
ノリタケカンパニイー社のＮＰ−３６１０）により一対
の厚膜電極（−次電極）３，３を形成する。The insulating ceramic substrate 1 is made of insulating ceramic such as alumina, and has a rectangular parallelepiped shape like a ready-made square chip resistor, and has external dimensions of, for example, 3.2 x 1.6 mm2.
shall be. First, an undercoat thick film glass layer 2 is formed on the upper surface of the ceramic substrate 1 using a glass paste (for example, ESL-4901 manufactured by ESL). Next, a pair of thick film electrodes (minus electrodes) 3, 3 are formed on the undercoat thick film glass layer 2 using Ag thick film paste (for example, NP-3610 manufactured by Noritake Company).
次に、この−次電極３，３間を接続するようにヒユーズ
抵抗体４を形成する。７ヒユ一ズ抵抗体４には、例えば
ノリタケカンパニイー社のＮＰ−４１０６Ａを用いる。Next, a fuse resistor 4 is formed so as to connect the secondary electrodes 3, 3. For example, NP-4106A manufactured by Noritake Company is used as the 7-cell resistor 4.
ヒユーズ抵抗体４は、厚膜電極３．３との幅広の接合部
４ｂ、４ｂ間に、所定のパターン幅を有する幅狭で矩形
の機能部４ａを有し、そのパターン幅を５０Ｉｌｒｎ〜
３００μｍ、膜厚を５μｍ〜３０μｍに、また抵抗値を
２０ ｒｎΩ〜５０ｒｎΩに設定することが望ましい。The fuse resistor 4 has a narrow rectangular functional part 4a having a predetermined pattern width between the wide joint parts 4b, 4b with the thick film electrode 3.3, and the pattern width is 50Ilrn~.
It is desirable to set the film thickness to 300 μm, the film thickness to 5 μm to 30 μm, and the resistance value to 20 rnΩ to 50 rnΩ.
パターン幅と膜厚については、上記の範囲内であれば安
定した特性を得られるからである。また、抵抗値を２０
ｒｎΩ〜５０ｍΩとするのはＯΩ抵抗器と１７で用いる
ためである。セラミック基板１−の両端面部分には、−
次電極３と接続されてセラミック基板１の下面にまで至
る二次電極６と三次電極９が形成される。二次電極６は
一次電極３とセラミック基板１に直接接するＡｇ厚膜電
極であり、また三次電極９はそのＡｇ厚膜電極６にメツ
キにより被覆されるＮｉ層７とＰ ｂ ／ Ｓ ｎハン
ダ層８とからなる。セラミック基板１の最上部にはオー
バーコート厚膜ガラス層５が形成される。この厚膜ガラ
ス層５は保護外装膜としてヒユーズ抵抗体４を完全に被
覆し２ている。This is because stable characteristics can be obtained as long as the pattern width and film thickness are within the above ranges. Also, increase the resistance value to 20
The reason why it is set to rnΩ to 50 mΩ is because it is used in the OΩ resistor 17. On both end surfaces of the ceramic substrate 1-, -
A secondary electrode 6 and a tertiary electrode 9 are formed which are connected to the secondary electrode 3 and reach the lower surface of the ceramic substrate 1. The secondary electrode 6 is an Ag thick film electrode that is in direct contact with the primary electrode 3 and the ceramic substrate 1, and the tertiary electrode 9 is a Ni layer 7 and a Pb/Sn solder layer coated on the Ag thick film electrode 6 by plating. It consists of 8. An overcoat thick film glass layer 5 is formed on top of the ceramic substrate 1 . This thick glass layer 5 completely covers the fuse resistor 4 as a protective outer coating.
本発明チップ形ヒユーズ抵抗器は、その製造に際し、セ
ラミック基板１に各構成部２．３．４゜５、６．７．８
を所定の順序で厚肉印刷及びメツキの手法により形成す
るもので、大量生産に適した構造となっている。またチ
ップ抵抗器やチップコンデンサーなどと同じ直方体形状
になっているため、製品をテーピング包装すれば、容易
に自動実装することができ、実装コストの低減がはかれ
る。また、チップ形ヒユーズ抵抗器の両端面部分がハン
ダ付は信頼性の高い二次電極６・三次電極９になってい
るため、リフロー法やフロー法など多様なハンダ付は方
法を行なうことができる。適宜回路に組み込まれたチッ
プ形ヒユーズ抵抗器に過電流が流れると、ヒユーズ抵抗
体４の機能部４ａが溶断して回路が遮断される。ここで
、ヒユーズ抵抗体４を厚膜ガラス層５で被覆しているた
めに金属蒸気が外部に飛散することがなく、またこの厚
膜ガラス層５を透明なものにすればヒユーズ抵抗体４の
断線状態を目視で確認できる。また、ヒユーズ抵抗体４
が上下の厚膜ガラス層２，５で覆われているため、ヒユ
ーズ抵抗体４から発する熱が放散１７にくい蓄熱効果を
生ずる。このため、ヒユーズ抵抗体４は小さな過電流で
も高速で溶断するｌ２、しかも、ヒユ−ズ抵抗体４が一
定の抵抗値に設定し易い矩形であることとも相俟って、
溶断特性のバラツキが小さいという特徴を備えている。When manufacturing the chip type fuse resistor of the present invention, each component part 2.3.4°5, 6.7.8° is placed on a ceramic substrate 1.
are formed in a predetermined order by thick printing and plating, and the structure is suitable for mass production. In addition, since it has the same rectangular parallelepiped shape as chip resistors and chip capacitors, it can be easily and automatically mounted by wrapping the product with tape, reducing mounting costs. In addition, since both end faces of the chip type fuse resistor are soldered as highly reliable secondary electrodes 6 and tertiary electrodes 9, various soldering methods such as reflow and flow methods can be used. . When an overcurrent flows through a chip type fuse resistor that is appropriately incorporated into a circuit, the functional portion 4a of the fuse resistor 4 is fused and the circuit is interrupted. Here, since the fuse resistor 4 is covered with a thick film glass layer 5, metal vapor does not scatter to the outside, and if the thick film glass layer 5 is made transparent, the fuse resistor 4 can be covered with a transparent material. You can visually check the disconnection status. In addition, the fuse resistor 4
Since the fuse resistor 4 is covered with the upper and lower thick film glass layers 2 and 5, the heat generated from the fuse resistor 4 creates a heat accumulation effect that makes it difficult to dissipate. For this reason, the fuse resistor 4 melts at a high speed even with a small overcurrent, and in combination with the fact that the fuse resistor 4 is rectangular so that it is easy to set a constant resistance value,
It is characterized by small variations in fusing characteristics.
以上説明してきたように、本発明のチップ形ヒユーズ抵
抗器は製造コストを低く押さえたまま大量生産できる構
造を有１７、またチップ抵抗器やチップコンデンサーな
どと同様、凹凸の少ないチップ形状であるため、自動実
装に適する利点を有している。さらにヒユーズ抵抗体が
矩形でパターン幅や膜厚のバラツキが小さく且つ上下二
層の厚膜ガラス層で挾まれているため、ヒユーズ抵抗体
が小さな過電流で高速で溶断する優れた特性をも有して
いる。As explained above, the chip-type fuse resistor of the present invention has a structure that allows mass production while keeping manufacturing costs low17, and like chip resistors and chip capacitors, it has a chip shape with few irregularities. , has the advantage of being suitable for automatic implementation. Furthermore, since the fuse resistor is rectangular and has small variations in pattern width and film thickness, and is sandwiched between two thick glass layers (upper and lower layers), the fuse resistor has the excellent property of blowing out at high speed with a small overcurrent. are doing.
【図面の簡単な説明】
第１図は本発明によるチップ形ヒユーズ抵抗器の平面図
、第２図は第１図Ａ−Ａ線断面図である。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view of a chip type fuse resistor according to the present invention, and FIG. 2 is a sectional view taken along the line A--A in FIG.
Claims (1)
に形成される一対の厚膜電極（３、３）と、この厚膜電
極（３、３）間を接続する厚膜ヒューズ抵抗体（４）、
ならびに前記厚膜ヒューズ抵抗体（４）の上下に形成さ
れる二層の厚膜ガラス層（２、５）からなることを特徴
とするチップ形ヒューズ抵抗器 ２、厚膜ヒューズ抵抗体（４）によって得られる抵抗値
が２０ｍΩ〜５０ｍΩの低抵抗値であることを特徴とす
る請求項１記載のチップ形ヒューズ抵抗器 ３、厚膜ヒューズ抵抗体（４）はパターン巾が５０μｍ
〜３００μｍで厚みが５μｍ〜３０μｍの矩形状である
ことを特徴とする請求項１又は２記載のチップ形ヒュー
ズ抵抗器[Claims] 1. An insulating ceramic substrate (1), a pair of thick film electrodes (3, 3) formed on this substrate (1), and a connection between the thick film electrodes (3, 3). Thick film fuse resistor to connect (4),
A chip type fuse resistor 2 and a thick film fuse resistor (4) characterized by comprising two thick film glass layers (2, 5) formed above and below the thick film fuse resistor (4). The chip type fuse resistor 3 and thick film fuse resistor (4) according to claim 1, characterized in that the resistance value obtained by the above method is a low resistance value of 20 mΩ to 50 mΩ.
The chip-type fuse resistor according to claim 1 or 2, characterized in that it has a rectangular shape of ~300 μm and a thickness of 5 μm to 30 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17557490A JPH0465046A (en) | 1990-07-02 | 1990-07-02 | Chip-type fuse resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17557490A JPH0465046A (en) | 1990-07-02 | 1990-07-02 | Chip-type fuse resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0465046A true JPH0465046A (en) | 1992-03-02 |
Family
ID=15998464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17557490A Pending JPH0465046A (en) | 1990-07-02 | 1990-07-02 | Chip-type fuse resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0465046A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06150802A (en) * | 1992-11-12 | 1994-05-31 | Kamaya Denki Kk | Chip type fuse resistor |
| AU715850B2 (en) * | 1995-03-07 | 2000-02-10 | Caddock Electronics, Inc. | Fault current fusing resistor and method |
| US6040754A (en) * | 1998-06-11 | 2000-03-21 | Uchihashi Estec Co., Ltd. | Thin type thermal fuse and manufacturing method thereof |
| JP2008052989A (en) * | 2006-08-23 | 2008-03-06 | Koa Corp | Chip type circuit protection element |
| US7477130B2 (en) | 2005-01-28 | 2009-01-13 | Littelfuse, Inc. | Dual fuse link thin film fuse |
| US20150371804A1 (en) * | 2014-06-19 | 2015-12-24 | Koa Corporation | Chip type fuse |
-
1990
- 1990-07-02 JP JP17557490A patent/JPH0465046A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06150802A (en) * | 1992-11-12 | 1994-05-31 | Kamaya Denki Kk | Chip type fuse resistor |
| AU715850B2 (en) * | 1995-03-07 | 2000-02-10 | Caddock Electronics, Inc. | Fault current fusing resistor and method |
| US6040754A (en) * | 1998-06-11 | 2000-03-21 | Uchihashi Estec Co., Ltd. | Thin type thermal fuse and manufacturing method thereof |
| US7477130B2 (en) | 2005-01-28 | 2009-01-13 | Littelfuse, Inc. | Dual fuse link thin film fuse |
| JP2008052989A (en) * | 2006-08-23 | 2008-03-06 | Koa Corp | Chip type circuit protection element |
| JP4693001B2 (en) * | 2006-08-23 | 2011-06-01 | コーア株式会社 | Chip-type circuit protection element |
| US20150371804A1 (en) * | 2014-06-19 | 2015-12-24 | Koa Corporation | Chip type fuse |
| US9779904B2 (en) * | 2014-06-19 | 2017-10-03 | Koa Corporation | Chip type fuse |
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