JPH046443A - Flow cell device and manufacture thereof - Google Patents

Flow cell device and manufacture thereof

Info

Publication number
JPH046443A
JPH046443A JP10759390A JP10759390A JPH046443A JP H046443 A JPH046443 A JP H046443A JP 10759390 A JP10759390 A JP 10759390A JP 10759390 A JP10759390 A JP 10759390A JP H046443 A JPH046443 A JP H046443A
Authority
JP
Japan
Prior art keywords
plated
corrosion resistance
plating
flow cell
cell device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10759390A
Other languages
Japanese (ja)
Inventor
Masatsugu Arai
雅嗣 荒井
Kazuaki Yokoi
和明 横井
Akiomi Kono
顕臣 河野
Hiroshi Oki
博 大木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10759390A priority Critical patent/JPH046443A/en
Publication of JPH046443A publication Critical patent/JPH046443A/en
Pending legal-status Critical Current

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  • Investigating Or Analysing Biological Materials (AREA)
  • Optical Measuring Cells (AREA)

Abstract

PURPOSE:To make it possible to improve reliability and mass productivity by using the thin plates of iron-group alloy, bonding the plates with Ni-P plated layers, and forming a plated fused layer on the surface of a flow path. CONSTITUTION:Flow paths 6 are formed in plates 1 - 5 of SUS 304 having the thickness of 0.1 mm. Thereafter, Ni-P having 11% P is uniformly plated on the surface of the metal by electroless plating in response to the surface roughness of the SUS304. The plated pieces of the SUS304 are laminated. Thereafter, the Ni-P having the composition of the P of 11 wt.% is compressed with the pressure of 9.8 X 10<5> Pa at 950 deg. which is the temperature higher than the melting point 880 deg. of Ni-P by 70 deg. in a vacuum of about 10<-3> Pa, and brazing is performed. Namely, the Ni-P plating material is a brazing filler metal for bonding iron-group metal which has excellent corrosion resistance. When this material is used, each laminating plate is rigidly bonded. Since the plated fused layer is also formed on the surface of a flow path, corrosion resistance is improved, and reliability and mass productivity are strikingly improved.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は臨床用細胞分析装置におけるフローセル装置で
、信頼性、耐食性、量産性にすぐれたフローセル装置及
びその製法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a flow cell device for a clinical cell analyzer, and relates to a flow cell device with excellent reliability, corrosion resistance, and mass productivity, and a manufacturing method thereof.

〔従来の技術〕[Conventional technology]

従来の装置は、特開平1−26125号公報に記載のよ
うに、複数のガラス板とポリイミドのような合成樹脂板
を交互に積層後接着して製法していた。
Conventional apparatuses have been manufactured by alternately laminating and bonding a plurality of glass plates and synthetic resin plates such as polyimide, as described in JP-A-1-26125.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上記従来技術のフローセル装置では、ガラス板とポリイ
ミドフィルムを交互に積層後、接着していたため、耐食
性、信頼性、量産性等について考慮されておらず、その
ため、ポリイミドフィルムの経年劣化による信頼性の低
下や接着強度が小さく、また、シース液に対して充分な
耐食性をもっておらず、さらに、ガラス製なので信頼性
の問題があった。
In the conventional flow cell device described above, glass plates and polyimide films were laminated alternately and then bonded together, so corrosion resistance, reliability, mass production, etc. were not considered, and reliability was affected due to age-related deterioration of the polyimide film. The bonding strength was small, and it did not have sufficient corrosion resistance against the sheath liquid.Furthermore, since it was made of glass, there were problems with reliability.

本発明の目的は耐食性、信頼性、量産性にすぐれたフロ
ーセル装置を提供することにある。
An object of the present invention is to provide a flow cell device with excellent corrosion resistance, reliability, and mass productivity.

〔課題を解決するための手段〕[Means to solve the problem]

上記目的を達成するために、本発明は加工性。 In order to achieve the above object, the present invention improves processability.

取扱い性のすぐれた鉄基合金薄板を用い、かつ、耐食性
のすぐれたNi−Pメッキ層で接合すると共に、このメ
ッキ溶融層を流路表面に形成して信頼性、量産性を向上
させたものである。
This product uses iron-based alloy thin plates with excellent handling properties and is joined with a Ni-P plating layer with excellent corrosion resistance, and this molten plating layer is formed on the flow path surface to improve reliability and mass production. It is.

〔作用〕[Effect]

Ni−Pメッキは、耐食性にすぐれている鉄基金属接合
用ろう材であり、このろう材を用いることによって各積
層板は強固に接合されると共に流路面にもメッキ溶融層
が形成されるため、従来法で問題となついた耐食性は向
上し、信頼性及び量産性が著しく向上する。
Ni-P plating is a brazing material for joining iron-based metals that has excellent corrosion resistance. By using this brazing material, each laminate is firmly joined, and a molten plating layer is also formed on the flow path surface. Corrosion resistance, which was a problem with conventional methods, is improved, and reliability and mass productivity are significantly improved.

〔実施例〕〔Example〕

以下、本発明の一実施例を図により説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

[実施例1] 第1図は本発明のフローセル装置の構造を示す。[Example 1] FIG. 1 shows the structure of the flow cell device of the present invention.

厚さ0 、1 m (7) S U S 3041〜5
 Lニー流路6を形成したのち5US304の表面粗さ
に応じて、金属表面を均一にpH%のNi−P無電解メ
ッキをする。たとえば、表面粗さが1μmの場合はメッ
キ厚さ1μm、表面粗さが5μmの場合は、メッキ厚さ
5μmのメッキをする。このメッキされた5US304
を積層後、10−”P a程度の真空中でpHwt%組
成のNi−P融点880’Cがら70℃高い温度である
950℃で9.8X105Paの圧力で加圧しろう付す
る。この製法により得られたフローセル装置でろう付部
強度について試験をした結果、ろう付部強度は380 
M P aの強度が得られた。この強度は、ガラス板を
ポリイミドフィルムで接着させた場合の30 M P 
aよりはるかに高い。さらに、耐食性について0.9%
生理食塩水、アクリジンオレンジ溶液中に30日浸漬し
た結果、現状の医療機器で使用している5US304よ
り耐食性にすぐれている5US316と同様の耐食性を
示した。
Thickness 0, 1 m (7) SUS 3041-5
After forming the L knee channel 6, the metal surface is uniformly electrolessly plated with Ni--P at pH% depending on the surface roughness of the 5US304. For example, if the surface roughness is 1 μm, the plating thickness is 1 μm, and if the surface roughness is 5 μm, the plating thickness is 5 μm. This plated 5US304
After laminating, they are brazed under a pressure of 9.8 x 105 Pa at 950°C, which is 70°C higher than the Ni-P melting point of 880'C with a pH wt% composition in a vacuum of about 10-''Pa.By this manufacturing method, As a result of testing the strength of the brazed part using the obtained flow cell device, the strength of the brazed part was 380.
An intensity of M Pa was obtained. This strength is 30 MP when glass plates are bonded with polyimide film.
much higher than a. Furthermore, 0.9% for corrosion resistance
As a result of immersion in physiological saline and acridine orange solution for 30 days, it showed corrosion resistance similar to that of 5US316, which has better corrosion resistance than 5US304 currently used in medical devices.

[実施例2] 流路6を形成した厚さ0.1mのコバール1〜5表面に
、厚さ10ILmの無電解Ni−Pめつきをする。この
コバールを積層後、1O−3Paの真空中でろう付温度
1000℃,圧力9.8 X 105Paでろう付した
。このフローセル装置でメッキ厚さと表面粗さによるボ
イド発生の状況について検討した。その結果を第3図に
示す。図かられかるように表面粗さ以下のメッキ厚さで
は、接合界面にボイドが発生して流路中の液体が外周に
しみ出す。しかし、表面粗さ以上のメッキ厚さならボイ
ドを発生することなくろう付することができる。
[Example 2] Electroless Ni-P plating with a thickness of 10 ILm is applied to the surface of Kovar 1 to 5 with a thickness of 0.1 m on which the flow path 6 is formed. After laminating this Kovar, brazing was performed in a vacuum of 10-3 Pa at a brazing temperature of 1000° C. and a pressure of 9.8×10 5 Pa. Using this flow cell device, we investigated the occurrence of voids due to plating thickness and surface roughness. The results are shown in FIG. As can be seen from the figure, if the plating thickness is less than the surface roughness, voids will occur at the bonding interface and the liquid in the flow path will seep out to the outer periphery. However, if the plating thickness is greater than the surface roughness, brazing can be performed without generating voids.

しかし、フローセルを切断し断面をtR察したところメ
ッキ厚さが15μmでは、第2図に示すような形状でろ
う7が流路壁面にはみ出す。これにより流路を流れる溶
液に乱流が発生し、安定なシースフローが得られなかっ
た。
However, when the flow cell was cut and the cross section was observed at tR, when the plating thickness was 15 μm, the wax 7 protruded from the flow channel wall surface in a shape as shown in FIG. This caused turbulence in the solution flowing through the channel, making it impossible to obtain a stable sheath flow.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、耐食性のNi−Pメッキでろう付けす
るので、融溶したNi−Pが流路を形成することにより
耐食性にすぐれたフローセル装置が得られる。
According to the present invention, since brazing is performed using corrosion-resistant Ni-P plating, a flow cell device with excellent corrosion resistance can be obtained because the molten Ni-P forms a flow path.

また、ハンドリングの簡単であるメッキなので量産性が
あり、さらに、メッキを溶融しろう付することにより信
頼性のあるフローセル装置が得られる。
Furthermore, since the plating is easy to handle, it can be mass-produced, and by melting and brazing the plating, a reliable flow cell device can be obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本発明の一実施例のフローセルの斜視図、第
2図は、フローセルの断面図、第3図は、素材粗さとメ
ッキ厚さの関係にょるボイド発生状況説明図である。 1〜5・・5US304.6・・・流路。
FIG. 1 is a perspective view of a flow cell according to an embodiment of the present invention, FIG. 2 is a sectional view of the flow cell, and FIG. 3 is an explanatory diagram of void occurrence depending on the relationship between material roughness and plating thickness. 1-5...5US304.6...Flow path.

Claims (1)

【特許請求の範囲】 1、Ni−Pメッキした鉄基合金薄板を積層ろう付して
なることを特徴とするフローセル装置。 2、請求項1において、前記Ni−Pメッキが1〜10
μmの厚さでメッキされろう付してなるフローセル装置
。 3、請求項1において、前記Ni−Pメッキは、P10
〜12%、残部Niから成り、このメッキの融点直上か
ら、融点より100℃高い温度の範囲でろう付けするフ
ローセル装置の製法。
[Claims] 1. A flow cell device characterized in that it is formed by laminating and brazing Ni--P plated iron-based alloy thin plates. 2. In claim 1, the Ni-P plating is 1 to 10
A flow cell device plated and brazed to a thickness of μm. 3. In claim 1, the Ni-P plating is P10
~12%, the balance being Ni, and brazing at a temperature ranging from just above the melting point of this plating to 100°C higher than the melting point.
JP10759390A 1990-04-25 1990-04-25 Flow cell device and manufacture thereof Pending JPH046443A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10759390A JPH046443A (en) 1990-04-25 1990-04-25 Flow cell device and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10759390A JPH046443A (en) 1990-04-25 1990-04-25 Flow cell device and manufacture thereof

Publications (1)

Publication Number Publication Date
JPH046443A true JPH046443A (en) 1992-01-10

Family

ID=14463092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10759390A Pending JPH046443A (en) 1990-04-25 1990-04-25 Flow cell device and manufacture thereof

Country Status (1)

Country Link
JP (1) JPH046443A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05312717A (en) * 1992-05-07 1993-11-22 Jasco Corp Optical cell
JPH05318640A (en) * 1992-05-19 1993-12-03 Sumitomo Bakelite Co Ltd Laminated sheet

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05312717A (en) * 1992-05-07 1993-11-22 Jasco Corp Optical cell
JPH05318640A (en) * 1992-05-19 1993-12-03 Sumitomo Bakelite Co Ltd Laminated sheet

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