JPH0461635A - Semiconductor element for optical disk - Google Patents
Semiconductor element for optical diskInfo
- Publication number
- JPH0461635A JPH0461635A JP2169118A JP16911890A JPH0461635A JP H0461635 A JPH0461635 A JP H0461635A JP 2169118 A JP2169118 A JP 2169118A JP 16911890 A JP16911890 A JP 16911890A JP H0461635 A JPH0461635 A JP H0461635A
- Authority
- JP
- Japan
- Prior art keywords
- light
- semiconductor laser
- silicon substrate
- shaped groove
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 31
- 230000003287 optical effect Effects 0.000 title claims description 36
- 239000000758 substrate Substances 0.000 claims abstract description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 17
- 239000010703 silicon Substances 0.000 claims abstract description 17
- 238000010586 diagram Methods 0.000 description 4
- 210000003128 head Anatomy 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000015654 memory Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 210000005252 bulbus oculi Anatomy 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Optical Head (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は光ディスク用光ヘッドに用いられる光半導体素
子に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an optical semiconductor element used in an optical head for an optical disk.
近年、大容量で安価なメモリとして光ディスクがＯＡ用
ラフアイルメモリ画像メモリとして実用され始めている
。しかしながら、光ディスクは従来の磁気ディスクと比
較して記憶容量では優っているものの、データの転送速
度やアクセス速度は遅い。そのため、光ディスクの高速
化を実現するための、光ディスクの高速回転や光ヘッド
の小型化の開発が行われている。In recent years, optical disks, which are large-capacity and inexpensive memories, have begun to be put into practical use as rough-fail image memories for office automation. However, although optical disks are superior in storage capacity to conventional magnetic disks, their data transfer and access speeds are slow. Therefore, in order to achieve higher speeds of optical discs, efforts are being made to rotate optical discs at higher speeds and to miniaturize optical heads.
光ヘッドの小型化に間しては、光集積型や分離型の開発
が行われているが、光集積型の光ヘッドは、半導体レー
ザ、レンズ及び光検出器を一体化した光ヘツド素子が提
案されている。しかしながら、効率のよい薄膜レンズの
実現が難しく、実用化はまだ先の技術として考えられて
いる。また、分離型の光ヘッドは、光ヘッドの眼球に相
当する対物レンズとアクチュエータとを移動し、光検出
系を固定したものである。こうすることによって、移動
部の軽量化が図られ、光ヘッドのアクセス時間の短縮化
が実現されている。しかし、光ビームを固定部から移動
部へ照射させるためには、移動部の精度が要求されるが
、従来の光ヘッドでは信頼性にも問題点があり、装置の
小型化は必ずしも実現されていない。In order to miniaturize optical heads, optical integrated and separated types are being developed, but integrated optical heads have an optical head element that integrates a semiconductor laser, a lens, and a photodetector. Proposed. However, it is difficult to realize an efficient thin film lens, and practical application is still considered to be a technology in the future. In addition, a separate type optical head has a moving objective lens and an actuator, which correspond to the eyeballs of the optical head, and a fixed photodetection system. By doing so, the weight of the moving section is reduced, and the access time of the optical head is shortened. However, in order to irradiate a light beam from a fixed part to a moving part, precision of the moving part is required, but conventional optical heads also have problems with reliability, and miniaturization of the device is not necessarily achieved. do not have.
本発明の光ディスク用半導体素子は、光検出器の基板上
に半導体レーザをハイブリッドに集積したものであって
、７字形状の溝をもつシリコン基板上に半導体レーザを
発光面が前記Ｖ渭の縁に平行になるように設置し、前記
半導体レーザの後方出射光を受光する第１の受光素子と
、複数の外部光を受光する第２の受光素子とを前記シリ
コン基板上に形成して構成される。The semiconductor element for an optical disk of the present invention is one in which a semiconductor laser is integrated on a substrate of a photodetector in a hybrid manner. A first light-receiving element that receives the rear emitted light of the semiconductor laser and a second light-receiving element that receives a plurality of external lights are formed on the silicon substrate so as to be parallel to each other. Ru.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例を示す図である。第１図にお
いて、Ｖ字型溝２をもつシリコン基板１上にモニタ受光
素子４．信号受光素子５が形成されている。半導体レー
ザ３は、このシリコン基板１上に、例えば、半田融着に
よって、固定且つ配線されている。半導体レーザ３は出
射光前面がＶ字型溝２に平行になるように取り付けられ
るので、前面からの出射光はシリコン基板１に防げられ
ることなく出射され、■字型溝２の斜面に反射して基板
面に垂直の方向に進行する。半導体レーザ３の後面から
の出射光はモニタ受光素子４に入力し、半導体レーザ３
の光量がモニタされる。また、光ヘッドではディスク媒
体からの反射光を検出することにより情報信号及びサー
ボ信号の読出しが行われ、この反射光を検出する信号受
光素子５がシリコン基板１上に形成されている。この信
号受光素子５は情報信号、サーボ信号の両信号を受光す
るために複数に分割された受光素子である。半導体レー
ザ３への給電、及びこれら各受光素子４，５からの検出
信号出力は電極を介して行われる。FIG. 1 is a diagram showing an embodiment of the present invention. In FIG. 1, a monitor light receiving element 4. is mounted on a silicon substrate 1 having a V-shaped groove 2. A signal light receiving element 5 is formed. The semiconductor laser 3 is fixed and wired on the silicon substrate 1 by, for example, solder fusion. Since the semiconductor laser 3 is mounted so that the front surface of the emitted light is parallel to the V-shaped groove 2, the light emitted from the front surface is not blocked by the silicon substrate 1 and is reflected on the slope of the V-shaped groove 2. and moves in a direction perpendicular to the substrate surface. The light emitted from the rear surface of the semiconductor laser 3 is input to the monitor light receiving element 4, and the light emitted from the rear surface of the semiconductor laser 3 is
The amount of light is monitored. Further, in the optical head, information signals and servo signals are read by detecting reflected light from the disk medium, and a signal light receiving element 5 for detecting this reflected light is formed on the silicon substrate 1. This signal light receiving element 5 is a light receiving element divided into a plurality of parts to receive both information signals and servo signals. Power is supplied to the semiconductor laser 3 and detection signals are output from each of the light receiving elements 4 and 5 through electrodes.
シリコン基板１にＶ字型溝２を形成するには、反応性エ
ツチングにより、シリコン基板の４５゜エツチング容易
軸方向を選択すればよい。また、マイクロ的に機械的加
工を行うことも可能である。各受光素子４，５は通常の
拡散プロセスによってシリコン受光素子を形成すればよ
い。更に、半導体レーザ３は、装着部分のシリコン基板
１上に電極６を構成し、低融点半田を用いて各素子を固
着できる。半導体レーザ３と各受光素子４．５間の位置
合わせは上記の方向によってミクロンオーダの精度で可
能である。In order to form the V-shaped groove 2 in the silicon substrate 1, it is sufficient to select a 45° etching easy axis direction of the silicon substrate by reactive etching. It is also possible to perform micro mechanical processing. Each of the light receiving elements 4 and 5 may be formed as a silicon light receiving element by a normal diffusion process. Further, in the semiconductor laser 3, an electrode 6 is formed on the silicon substrate 1 at the mounting portion, and each element can be fixed using low melting point solder. The alignment between the semiconductor laser 3 and each light receiving element 4.5 can be performed with accuracy on the order of microns by the above-mentioned directions.
第２図は本発明による光半導体素子を用いた光ヘッドの
原理を説明する図である。第２図において、光ヘッドは
へラドキャップ１３内に光半導体素子１０．ホログラム
素子１２及び対物レンズ１１を納め、ヘッドキャップ１
３全体を支持筐体１５で保持する構成になっている。光
半導体素子１０から出射された光は、ホログラム素子１
２及び対物レンズ１１を経てディスク１６上に集光され
る。ディスク１６からの反射光は再び対物レンズ１１を
透過し、ホログラム素子１２で回折され、光半導体素子
１０に戻る。この回折光は、第１図に示す信号受光素子
５に入射し、ディスク反射光に含まれる情報信号及びサ
ーボ信号が検出される。ヘッドキャップ１３全体は、ア
クチュエータ１４でディスク方向く矢印Ａ方向〉に移動
してフォーカシング制御が行われ、更に、支持筐体１５
をこれと垂直方向（矢印Ｂ方向）に移動することによっ
てトラッキング制御が行われる。FIG. 2 is a diagram illustrating the principle of an optical head using an optical semiconductor element according to the present invention. In FIG. 2, the optical head includes an optical semiconductor element 10. The hologram element 12 and objective lens 11 are housed in the head cap 1.
3 is entirely supported by a support casing 15. The light emitted from the optical semiconductor element 10 is transmitted to the hologram element 1
2 and an objective lens 11, the light is focused onto a disk 16. The reflected light from the disk 16 passes through the objective lens 11 again, is diffracted by the hologram element 12, and returns to the optical semiconductor element 10. This diffracted light enters the signal light receiving element 5 shown in FIG. 1, and the information signal and servo signal contained in the disk reflected light are detected. The entire head cap 13 is moved in the direction of the disk (in the direction of arrow A) by an actuator 14 to perform focusing control.
Tracking control is performed by moving in a direction perpendicular to this (in the direction of arrow B).
第３図は本発明による光半導体素子を用いた光ヘッドの
動作原理を説明する図である。第３図において、半導体
レーザ３からの出射光がホログラム素子１２及び対物レ
ンズ１１を経てディスク１６に集光し、この反射光は再
び対物レンズ１１を経てホログラム素子１２に入射する
。ホログラム素子１２からの回折光は、信号受光素子５
に入射し、その光量が検出される。ホログラム素子１２
は、例えば、第３図に示すように、Ｈ，、Ｈ２Ｈ３及び
Ｈ４に４分割されている。また、受光素子５は、例えば
、ｓ、、ｓ２．ＳＳ、ｓ、、Ｓ。FIG. 3 is a diagram illustrating the operating principle of an optical head using an optical semiconductor element according to the present invention. In FIG. 3, the emitted light from the semiconductor laser 3 passes through the hologram element 12 and the objective lens 11 and is focused on the disk 16, and this reflected light passes through the objective lens 11 again and enters the hologram element 12. The diffracted light from the hologram element 12 is transmitted to the signal light receiving element 5.
The amount of light is detected. Hologram element 12
For example, as shown in FIG. 3, it is divided into four parts: H, , H2H3, and H4. Further, the light receiving element 5 includes, for example, s, s2. SS,s,,S.
及びＳ６に６分割された素子が用いられている。and S6, an element divided into six is used.
そして、ホログラム素子１２に光が入射すると、領域Ｈ
１からの回折光は受光素子Ｓ、、Ｓ２に、領域Ｈ２から
の回折光は受講素子Ｓ３．Ｓ４に、領域Ｈ３からの回折
光はＳ６に、領域Ｈ４からの回折光はＳＳにそれぞれ集
光する。ここで、フ才−カスエラー信号は、領域Ｈ１と
Ｈ２とがナイフェツジと同様の役割を果たすので、受光
素子Ｓ１．Ｓ２及びＳ、、Ｓ４のそれぞれの差信号とし
て得られる。また、トラックエラー信号は、領域Ｈ３，
Ｈ４の光量強度の差（プッシュプル信号）として得られ
るので、受光素子Ｓ５．ｓ６の差信号を求めればよい。Then, when light enters the hologram element 12, the area H
The diffracted light from area H2 is transmitted to the receiving elements S3, . At S4, the diffracted light from the area H3 is focused at S6, and the diffracted light from the area H4 is focused at SS. Here, since the regions H1 and H2 play the same role as a knife, the focus error signal is generated by the light receiving element S1. It is obtained as a difference signal between S2, S, and S4. Also, the track error signal is in the area H3,
Since it is obtained as a difference in light amount intensity (push-pull signal) of light receiving element S5.H4. What is necessary is to find the difference signal of s6.
以上説明したように、本発明の光ディスク用光半導体素
子は、■字形状の溝をもつシリコン基板上に半導体レー
ザとモニタ受光素子及び信号検出受光素子をハイブリッ
ド化することによって、これらの素子を一体化した光半
導体素子が実現できる８本発明の素子を用いることによ
って、小形、且つ軽量な光ヘッドが構成でき、光ディス
クの高速化を実現することができる。As explained above, the optical semiconductor device for optical disks of the present invention is made by hybridizing a semiconductor laser, a monitor light-receiving element, and a signal detection light-receiving element on a silicon substrate having a ■-shaped groove, thereby integrating these elements. By using the element of the present invention, a small and lightweight optical head can be constructed, and the speed of the optical disc can be increased.
説明する図、第３図は本発明の光半導体素子を用いた光
ヘッドの動作原理を説明する図である。FIG. 3 is a diagram illustrating the operating principle of an optical head using the optical semiconductor element of the present invention.
ｌ・・・シリコン基板、２・・・Ｖ字型溝、３・・・半
導体レーザ、４，５・・・受光素子、６・・・電極、１
ｏ・・・光半導体素子、１１・・・レンズ、１２・・・
ホログラム素子、１３・・・ヘッドキャップ、１４・・
・アクチュエータ。1... Silicon substrate, 2... V-shaped groove, 3... Semiconductor laser, 4, 5... Light receiving element, 6... Electrode, 1
o... Optical semiconductor element, 11... Lens, 12...
Hologram element, 13... Head cap, 14...
・Actuator.
Claims (1)
発光面が前記Ｖ溝の縁に平行になるように設置し、前記
半導体レーザの後方出射光を受光する第１の受光素子と
、複数の外部光を受光する第２の受光素子とを前記シリ
コン基板上に形成したことを特徴とする光ディスク用光
半導体素子。A semiconductor laser is installed on a silicon substrate having a V-shaped groove so that its light emitting surface is parallel to the edge of the V-shaped groove, a first light receiving element that receives rear emitted light from the semiconductor laser, and a plurality of An optical semiconductor device for an optical disk, characterized in that a second light receiving element for receiving external light is formed on the silicon substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2169118A JPH0461635A (en) | 1990-06-27 | 1990-06-27 | Semiconductor element for optical disk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2169118A JPH0461635A (en) | 1990-06-27 | 1990-06-27 | Semiconductor element for optical disk |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0461635A true JPH0461635A (en) | 1992-02-27 |
Family
ID=15880631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2169118A Pending JPH0461635A (en) | 1990-06-27 | 1990-06-27 | Semiconductor element for optical disk |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0461635A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997050158A1 (en) * | 1996-06-24 | 1997-12-31 | Matsushita Electric Industrial Co., Ltd. | Semiconductor laser |
| US5882246A (en) * | 1995-06-06 | 1999-03-16 | Kotobuki Eng. & Mfg. Co., Ltd. | Wet agitating ball mill and method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6446243A (en) * | 1987-08-13 | 1989-02-20 | Sony Corp | Optical pickup device |
| JPH01150244A (en) * | 1987-12-07 | 1989-06-13 | Matsushita Electric Ind Co Ltd | Optical head device |
-
1990
- 1990-06-27 JP JP2169118A patent/JPH0461635A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6446243A (en) * | 1987-08-13 | 1989-02-20 | Sony Corp | Optical pickup device |
| JPH01150244A (en) * | 1987-12-07 | 1989-06-13 | Matsushita Electric Ind Co Ltd | Optical head device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5882246A (en) * | 1995-06-06 | 1999-03-16 | Kotobuki Eng. & Mfg. Co., Ltd. | Wet agitating ball mill and method |
| WO1997050158A1 (en) * | 1996-06-24 | 1997-12-31 | Matsushita Electric Industrial Co., Ltd. | Semiconductor laser |
| US6185237B1 (en) | 1996-06-24 | 2001-02-06 | Matsushita Electric Industrial Co., Ltd. | Semiconductor laser |
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