JPH046115A - Mold for forming optical element - Google Patents
Mold for forming optical elementInfo
- Publication number
- JPH046115A JPH046115A JP10949990A JP10949990A JPH046115A JP H046115 A JPH046115 A JP H046115A JP 10949990 A JP10949990 A JP 10949990A JP 10949990 A JP10949990 A JP 10949990A JP H046115 A JPH046115 A JP H046115A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- sintered body
- optical element
- molding
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims description 19
- 239000013078 crystal Substances 0.000 claims abstract description 11
- 238000005245 sintering Methods 0.000 claims abstract description 4
- 238000000465 moulding Methods 0.000 claims description 18
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 2
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 2
- 239000011521 glass Substances 0.000 abstract description 15
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 abstract 4
- 239000000155 melt Substances 0.000 abstract 1
- 239000011651 chromium Substances 0.000 description 11
- 239000000843 powder Substances 0.000 description 8
- 229910052760 oxygen Inorganic materials 0.000 description 7
- 230000004927 fusion Effects 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000635 electron micrograph Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B11/00—Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
- C03B11/06—Construction of plunger or mould
- C03B11/08—Construction of plunger or mould for making solid articles, e.g. lenses
- C03B11/084—Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2215/00—Press-moulding glass
- C03B2215/02—Press-mould materials
- C03B2215/05—Press-mould die materials
- C03B2215/07—Ceramic or cermets
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野］ 本発明は、光学素子成形用型に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a mold for molding an optical element.
一般に、加熱により軟化または溶融させたガラスを予め
所定形状に加工した成形面を有する成形用型で押圧成形
し、高精度の光学素子を得る方法が行われている。かか
る成形方法において使用される光学素子成形用型として
は、高精度の形状に加工できること、高温のガラスが接
触するために耐酸化性に優れていること、また高温強度
に優れていること、ガラスが融着しにくいこと等が要求
される。Generally, a method is used in which a highly accurate optical element is obtained by press-molding glass that has been softened or melted by heating using a mold having a molding surface that has been previously processed into a predetermined shape. The mold for molding optical elements used in this molding method must be able to be processed into a highly precise shape, have excellent oxidation resistance because it comes into contact with high-temperature glass, and have excellent high-temperature strength. It is required that the material is difficult to fuse.
従来、特開昭５１−４５６１３号公報には、ＳｉＣによ
り光学素子成形用型を形成したものが開示されている。Conventionally, Japanese Patent Laid-Open No. 51-45613 discloses a mold for molding an optical element made of SiC.
ＳｉＣは、加工に際して欠けなどが発生し易い材質では
あるが、研削、研摩法の工夫により、十分に実用できる
ものである。また、ＳｉＣは、高温においては表面に薄
いＳｉＯ□の被膜ができるために酸素が侵入しにくくな
り、良好な耐酸化性を示す。さらに、ＳｉＣは高温強度
に優れている。一般には、大気中で１５００°Ｃまでは
常温とほとんど変わらない強度を有している。Although SiC is a material that is prone to chipping during processing, it can be put to practical use by devising grinding and polishing methods. Furthermore, at high temperatures, SiC forms a thin film of SiO□ on its surface, making it difficult for oxygen to penetrate, and exhibits good oxidation resistance. Furthermore, SiC has excellent high temperature strength. In general, it has almost the same strength as room temperature up to 1500°C in the atmosphere.
しかし、ＳｉＣからなる光学素子成形用型は、ガラスが
融着し易いという問題があった。これは、炭化物として
のＳｉＣが、表面工矛ルギーが高いのでガラスが濡れ易
いことによるもので、たとえＳ ｉＯ２の被膜ができた
後でもこれがガラスの主成分と同じであるために融着し
易いものであった。However, a mold for molding an optical element made of SiC has a problem in that glass is easily fused. This is because SiC as a carbide has a high surface resistance and is easily wetted by glass, and even after a SiO2 film is formed, it is easy to fuse because it is the same as the main component of glass. It was something.
そこで、近年では、ガラスが融着しにくいように、Ｓｉ
ｎ、以外の酸化物の焼結体により光学素子成形用型を形
成することが行われている。これは、酸化物が熱力学的
に安定であって表面エネルギーが低く、ガラスが濡れに
くいという性質を有するからである。中でも、酸化クロ
ム（ＣｒｚＯ３）は、耐熱性も十分であり、光学素子成
形用型の材料として最適と考えられていた。Therefore, in recent years, Si
A mold for molding an optical element has been formed using a sintered body of an oxide other than n. This is because oxides are thermodynamically stable and have low surface energy, making glass difficult to wet. Among them, chromium oxide (CrzO3) has sufficient heat resistance and was thought to be optimal as a material for molds for molding optical elements.
しかし、ＣｒｚＯ，の粉末を焼結した焼結体により形成
した従来の光学素子成形用型では、ガラスの融着や再結
晶化による表面荒れ等は発生しないものの、成形面のエ
ッヂ部分での欠けが全周に発生してしまい、成形を継続
することができなくなってしまった。However, with conventional molds for molding optical elements made from sintered bodies of CrzO powder, although surface roughness due to glass fusion and recrystallization does not occur, chipping occurs at the edges of the molding surface. This occurred all around the circumference, making it impossible to continue molding.
このような欠は易さを表す物性値は、破壊靭性である。A physical property value representing such fragility is fracture toughness.
ＳｉＣ焼結体とＣｒｚＯ＝焼結体との靭性を比較すると
、ＳｉＣの焼結体が５．６ＭＰａ−ｍ−’であるのに対
し、Ｃｒ ｚ Ｏｚ焼結体は約３ＭＰａ−ｍ−’と低い
。すなわち、ＣｒｚＯ３焼結体からなる成形用型では、
この靭性の低さのために、強度の最も弱くなるエッヂ部
分から欠けを生したのであった。Comparing the toughness of the SiC sintered body and the CrzO=sintered body, the toughness of the SiC sintered body is 5.6 MPa-m-', while the toughness of the CrzOz sintered body is approximately 3 MPa-m-'. low. That is, in a mold made of a CrzO3 sintered body,
This low toughness caused chipping to occur at the edges where the strength was weakest.
本発明は、かかる従来の問題点に鑑みてなされたもので
、ガラスの融着かなく、しかも強度に優れたＣｒｚＯコ
焼結体による光学素子成形用型を捉供することを目的と
する。The present invention has been made in view of such conventional problems, and an object of the present invention is to provide a mold for molding an optical element made of a CrzO co-sintered body that does not cause glass fusion and has excellent strength.
〔課題を解決するための手段および作用］上記目的を達
成するために、本発明は、ひげ状のＣｒ、Ｏ，結晶体を
焼結した焼結体により、光学素子成形用型を形成した。[Means and Effects for Solving the Problems] In order to achieve the above object, the present invention forms a mold for molding an optical element using a sintered body obtained by sintering whisker-like Cr, O, and crystal bodies.
ひげ状Ｃｒｚ０３結晶体のひげの長さは、３〜２００μ
ｍが好ましい。The length of the whiskers of whisker-like Crz03 crystals is 3 to 200μ
m is preferred.
第１図及び第２図はそれぞれ本発明に係る焼結体及び通
常のＣｒｚＯ，焼結体の各電子顕微鏡写真である。FIGS. 1 and 2 are electron micrographs of a sintered body according to the present invention and a normal CrzO sintered body, respectively.
第１図から判るように、本発明による焼結体は１つ１つ
の粒がひげ状であるために相互にからみ合った形になっ
ている。従って、粒同志が強固に結合しており、結果と
して大きな靭性が得られるのである。また、表面物質が
熱力学的に安定なＣｒ ２０ ｓであるために、ガラス
が濡れにくく、結果として融着が生しない。As can be seen from FIG. 1, each grain of the sintered body according to the present invention has a whisker-like shape, so that the grains are intertwined with each other. Therefore, the grains are strongly bonded together, resulting in great toughness. Furthermore, since the surface substance is thermodynamically stable Cr 20 s, the glass is difficult to wet, and as a result, no fusion occurs.
ひげ状ＣｒｚＯ＝結晶体の作成は非常に困難であったが
、鋭意検討した結果、次のような製法により作成できる
ことが判明した。It was very difficult to create a whisker-like CrzO=crystal, but after intensive study, it was found that it could be created by the following manufacturing method.
まず、金属Ｃｒ粉末を酸素雰囲気中、３００〜４００
’Ｃで１時間加熱することにより、表面がＣｒ、Ｏ，膜
でおおわれた金属Ｃｒ粉末を得る。この際の元の粉末は
、１〜１００μｍの粒径が適当である。次に、得られた
粉末を酸素雰囲気中、６００〜７００°Ｃで２〜５時間
加熱する。粉末表面のＣｒ、Ｏｓ被膜は粉末中のＣｒを
雰囲気中に放出しにくく、また雰囲気からの酸素を侵入
しにくくする働きをする。従って、Ｃｒはゆっくり結晶
成長しながら酸化されていくのである。この際、エネル
ギー的にも最も安全なＣ軸方向に優先的に結晶成長する
ためにひげ状という形態をとるのである。First, metal Cr powder is heated to 300-400% in an oxygen atmosphere.
By heating with C for 1 hour, a metal Cr powder whose surface is covered with Cr, O, and a film is obtained. The particle size of the original powder at this time is suitably 1 to 100 μm. Next, the obtained powder is heated at 600 to 700°C for 2 to 5 hours in an oxygen atmosphere. The Cr and Os coatings on the powder surface serve to prevent Cr in the powder from being released into the atmosphere and to prevent oxygen from entering from the atmosphere. Therefore, Cr is oxidized while slowly growing its crystals. At this time, crystals grow preferentially in the C-axis direction, which is the safest in terms of energy, so they take the form of whiskers.
以上のようにして、３〜２００μｍのひげ状Ｃｒ、Ｏ，
結晶体が得られる。寸法の制限は、３μｍ未満では靭性
を向上させるのに有効でなく、２００μｍを越えると実
際の型加工の際に高精度な面を作れないという理由によ
る。As described above, whisker-like Cr, O,
A crystal is obtained. The size limitation is due to the fact that if it is less than 3 μm, it is not effective in improving toughness, and if it exceeds 200 μm, a highly accurate surface cannot be created during actual mold processing.
なお、これ以後の加工工程は通常の粉末の場合と同様で
ある。Note that the subsequent processing steps are the same as in the case of ordinary powder.
（第１〜第５実施例） 次表に第１〜第５実施例の結果をまとめて示した。 (1st to 5th examples) The following table summarizes the results of the first to fifth examples.
ひげ状結晶体の長さを種々変えたときに、成形面の面精
度、破壊靭性、成長による評価がどうなるか調べた。成
形面の面精度は、成形された光学素子の表面粗さが０．
０５μｍ以下でかつ所定の形状からのずれが０．３μｍ
以下のときＯｌそれ以外は程度により△、×とした。破
壊靭性は、ＳｉＣ焼結体の値を基準としてそれ以上を○
、それ以下を×とした。成形は約１００００シヨツト、
ＢＫ系のガラスを用いて行い、その際にガラスの融着、
欠けなどの問題が生じないか評価した。We investigated how the surface precision, fracture toughness, and growth of the molded surface would be evaluated when the length of the whisker-like crystals was varied. The surface accuracy of the molded surface is determined when the surface roughness of the molded optical element is 0.
0.5μm or less and deviation from the specified shape is 0.3μm
The following cases were rated as △ and × depending on the grade. Fracture toughness is ○ if it is higher than the value of SiC sintered body.
, and those below were marked as ×. Approximately 10,000 shots are molded.
This is done using BK glass, and at that time the glass is fused,
It was evaluated to see if any problems such as chipping would occur.
なお、比較のため、ひげ状結晶体のひげの長さが３〜２
００μｍ以外のものについても同様の評価を行い、その
結果を同表中に併記した。For comparison, the length of the whiskers of the whisker-like crystals is 3 to 2.
Similar evaluations were made for samples other than 00 μm, and the results are also listed in the same table.
上記表に示すように、第１〜第５実施例では、ガラスの
融着はもちろん、欠けなどの問題点も発生せず、良好な
光学素子を成形し続けることができた。一方、比較例１
〜３では、ガラスの融着はないものの、欠は等の問題点
が発生してしまった。As shown in the above table, in Examples 1 to 5, problems such as glass fusion and chipping did not occur, and good optical elements could be continuously molded. On the other hand, comparative example 1
In samples 3 to 3, although there was no glass fusion, problems such as cracks occurred.
〔発明の効果］
以上のように、本発明の光学素子成形用型によれば、表
面物質がＣｒｚ（Ｌであるためにガラスの融着が発生せ
ず、かつひげ状結晶体の焼結体であるために、靭性に優
れている。よって、長期に亘って光学素子成形用型とし
て使用することができる。[Effects of the Invention] As described above, according to the mold for molding an optical element of the present invention, since the surface substance is Crz(L), glass fusion does not occur, and a sintered body of whisker-like crystals is formed. Therefore, it has excellent toughness.Therefore, it can be used as a mold for molding optical elements for a long period of time.
第１図及び第２図はそれぞれ本発明に係るひげ状Ｃｒ
ｚ ０２焼結体及び通常のＣｒ ｚ Ｏ３焼結体を示す
電子顕微鏡写真である。
特許出願人 オリンパス光学工業株式会社手続補正書
（方式）
％式％
事件の表示
事件との関係 特許出願人
住 所 東京都渋谷区幡ケ谷２丁目４３番２号名 称
（０３７１オリンパス光学工業株式会社代表者下山敏部
４代理人
住 所 東京都港区浜松町２丁目２番１５号５、補正命
令の日付
（発送臼）
６補正の対象
明細書の「図面の簡単な説明」の欄。
７補正の内容
明細書の第８頁第１５行目の記載を下記の通り補正する
。
「状Ｃｒ２Ｏ３焼結体及び通常のＣｒｚＬ焼結体の結晶
構造を示す」FIG. 1 and FIG. 2 show whisker-like Cr according to the present invention, respectively.
1 is an electron micrograph showing a z 02 sintered body and a normal Cr z O3 sintered body. Patent Applicant Olympus Optical Industry Co., Ltd. Procedural Amendment (Method) % Formula % Relationship with the indicated case Patent Applicant Address 2-43-2 Hatagaya, Shibuya-ku, Tokyo Name Title
(0371 Olympus Optical Industry Co., Ltd. Representative Toshibe Shimoyama 4 Agent address 2-2-15-5 Hamamatsucho, Minato-ku, Tokyo Date of amendment order (dispatch) 6. 7. The statement on page 8, line 15 of the detailed description of the 7th amendment is amended as follows.
Claims (2)
り形成したことを特徴とする光学素子成形用型。(1) A mold for molding an optical element, characterized in that it is formed from a sintered body obtained by sintering whisker-like chromium oxide crystals.
する請求項１記載の光学素子成形用型。(2) The mold for molding an optical element according to claim 1, wherein the length of the whiskers is 3 to 200 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10949990A JPH046115A (en) | 1990-04-25 | 1990-04-25 | Mold for forming optical element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10949990A JPH046115A (en) | 1990-04-25 | 1990-04-25 | Mold for forming optical element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH046115A true JPH046115A (en) | 1992-01-10 |
Family
ID=14511808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10949990A Pending JPH046115A (en) | 1990-04-25 | 1990-04-25 | Mold for forming optical element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH046115A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8877242B2 (en) | 2008-07-14 | 2014-11-04 | Polypid Ltd. | Sustained-release drug carrier composition |
| US9616032B2 (en) | 2010-01-19 | 2017-04-11 | Polypid Ltd. | Sustained-release nucleic acid matrix compositions |
-
1990
- 1990-04-25 JP JP10949990A patent/JPH046115A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8877242B2 (en) | 2008-07-14 | 2014-11-04 | Polypid Ltd. | Sustained-release drug carrier composition |
| US10682412B2 (en) | 2008-07-14 | 2020-06-16 | Polypid Ltd. | Sustained-release drug carrier composition |
| US9616032B2 (en) | 2010-01-19 | 2017-04-11 | Polypid Ltd. | Sustained-release nucleic acid matrix compositions |
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