JPH0460653U - - Google Patents

Info

Publication number
JPH0460653U
JPH0460653U JP10239690U JP10239690U JPH0460653U JP H0460653 U JPH0460653 U JP H0460653U JP 10239690 U JP10239690 U JP 10239690U JP 10239690 U JP10239690 U JP 10239690U JP H0460653 U JPH0460653 U JP H0460653U
Authority
JP
Japan
Prior art keywords
surface plate
polishing
piezoelectric body
plate
piezoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10239690U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10239690U priority Critical patent/JPH0460653U/ja
Publication of JPH0460653U publication Critical patent/JPH0460653U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】
第１図は本考案の一実施例の研磨盤を示す平面
図、第２図は上記実施例の研磨盤を示す側断面図
、第３図は本考案の他の実施例の研磨盤の平面図
、第４図は遊星歯車方式の研磨装置の一例を示す
斜視図である。 １０……研磨盤、１１……下定盤、１２……上
定盤、１３……キヤリア、１４……圧電体。

Claims (1)

  1. 【実用新案登録請求の範囲】 相対面して配置され対面する研磨面間にラツピ
    ングスラリを供給されるとともにキヤリアに保持
    した圧電体を挟持して回転駆動され該圧電体を平
    行研磨する上定盤および下定盤を有する研磨装置
    において、 上記上定盤および下定盤の少なくとも一方の研
    磨面は複数に分割した部材を平板状に一体に結合
    したことを特徴とする圧電片の研磨装置。
JP10239690U 1990-09-29 1990-09-29 Pending JPH0460653U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10239690U JPH0460653U (ja) 1990-09-29 1990-09-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10239690U JPH0460653U (ja) 1990-09-29 1990-09-29

Publications (1)

Publication Number Publication Date
JPH0460653U true JPH0460653U (ja) 1992-05-25

Family

ID=31846617

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10239690U Pending JPH0460653U (ja) 1990-09-29 1990-09-29

Country Status (1)

Country Link
JP (1) JPH0460653U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009194631A (ja) * 2008-02-14 2009-08-27 Seiko Instruments Inc ウエハ、ウエハ研磨装置、ウエハ研磨方法、圧電振動子の製造方法、圧電振動子、発振器、電子機器及び電波時計

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01140960A (ja) * 1987-11-27 1989-06-02 Speedfam Co Ltd 平面研磨装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01140960A (ja) * 1987-11-27 1989-06-02 Speedfam Co Ltd 平面研磨装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009194631A (ja) * 2008-02-14 2009-08-27 Seiko Instruments Inc ウエハ、ウエハ研磨装置、ウエハ研磨方法、圧電振動子の製造方法、圧電振動子、発振器、電子機器及び電波時計

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