JPH0460548U - - Google Patents
Info
- Publication number
- JPH0460548U JPH0460548U JP10110890U JP10110890U JPH0460548U JP H0460548 U JPH0460548 U JP H0460548U JP 10110890 U JP10110890 U JP 10110890U JP 10110890 U JP10110890 U JP 10110890U JP H0460548 U JPH0460548 U JP H0460548U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- film forming
- heating device
- cooling
- forming apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 4
- 230000007723 transport mechanism Effects 0.000 claims description 2
- 239000010408 film Substances 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
Description
第１図は本考案の一実施例による薄膜形成装置
の概略構成図、第２図は従来例における薄膜形成
装置の概略構成図である。
２……加熱装置、３……冷却装置、５……基板
搬送機構。
FIG. 1 is a schematic diagram of a thin film forming apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic diagram of a conventional thin film forming apparatus. 2...Heating device, 3...Cooling device, 5...Substrate transport mechanism.
Claims (1)
あつて、 成膜室内に設けられ、基板を加熱するための加
熱装置と、 前記成膜室内に前記加熱装置とは独立して設け
られ、基板を冷却するための冷却装置と、 前記基板を前記加熱装置と前記冷却装置の間で
搬送するための基板搬送機構と、 を備えた薄膜形成装置。[Claims for Utility Model Registration] A thin film forming apparatus that forms a film while heating a substrate, comprising: a heating device installed in a film forming chamber to heat the substrate; and a heating device in the film forming chamber. A thin film forming apparatus provided with: a cooling device for cooling a substrate; and a substrate transport mechanism for transporting the substrate between the heating device and the cooling device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10110890U JPH0460548U (en) | 1990-09-26 | 1990-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10110890U JPH0460548U (en) | 1990-09-26 | 1990-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0460548U true JPH0460548U (en) | 1992-05-25 |
Family
ID=31844282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10110890U Pending JPH0460548U (en) | 1990-09-26 | 1990-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0460548U (en) |
-
1990
- 1990-09-26 JP JP10110890U patent/JPH0460548U/ja active Pending
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