JPH0457910U - - Google Patents
Info
- Publication number
- JPH0457910U JPH0457910U JP12973690U JP12973690U JPH0457910U JP H0457910 U JPH0457910 U JP H0457910U JP 12973690 U JP12973690 U JP 12973690U JP 12973690 U JP12973690 U JP 12973690U JP H0457910 U JPH0457910 U JP H0457910U
- Authority
- JP
- Japan
- Prior art keywords
- oscillator
- frequency device
- circuit board
- device including
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 2
- 230000010355 oscillation Effects 0.000 claims 4
- 238000009434 installation Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図および第２図はそれぞれ本考案の一実施
例の斜視図および側面図である。第３図は本考案
の一例のゴム状クツシヨン材を固着する方法を示
す要部断面図である。第４図および第５図は本考
案の第２の実施例の分解斜視図、および組立側面
図である。第６図は本考案の第３の実施例の分解
斜視図である。第７図および第８図は本考案の第
４の実施例の斜視図および側面図である。第９図
、第１０図および第１１図はそれぞれ従来の斜視
図、平面図および側面図である。
１，１１，１１ａ，４１……シールドケース、
１５，１５ａ……シリコンゴム、１６，４６……
プリント基板、１８……本体シールドカバー、２
５……ゲル状シリコン、３２ａ〜３２ｄ，４３…
…スプリング、３５……高周波機器の構体、４２
……貫通コンデンサ。
1 and 2 are a perspective view and a side view, respectively, of an embodiment of the present invention. FIG. 3 is a sectional view of a main part showing a method of fixing a rubber cushion material according to an example of the present invention. 4 and 5 are an exploded perspective view and an assembled side view of a second embodiment of the present invention. FIG. 6 is an exploded perspective view of a third embodiment of the present invention. 7 and 8 are a perspective view and a side view of a fourth embodiment of the present invention. FIG. 9, FIG. 10, and FIG. 11 are a conventional perspective view, plan view, and side view, respectively. 1, 11, 11a, 41...shield case,
15, 15a... Silicone rubber, 16, 46...
Printed circuit board, 18...Body shield cover, 2
5... Gel silicon, 32a to 32d, 43...
... Spring, 35 ... Structure of high frequency equipment, 42
...Feedthrough capacitor.
Claims (1)
した発振器を含む高周波機器において、前記発振
器の上下にゴム状クツシヨン材を配し、プリント
基板と本体シールドカバーとで挟持し、前記クツ
シヨン材は前記発振器または前記プリント基板ま
たは本体シールドカバーの一方にのみ固着されて
いることを特徴とする発振器の取付構造。 (2) 発振器の上下各面に上記ゴム状クツシヨン
材が固着されていることを特徴とする請求項１の
発振器の取付構造。 (3) 独立した発振回路をシールドケースに収納
した発振器を含む高周波機器において、前記発振
器の上下にゲル状樹脂を配し、プリント基板と本
体シールドカバーとで挟持したことを特徴とする
発振器の取付構造。 (4) 独立した発振回路をシールドケースに収納
した発振器を含む高周波機器において、前記発振
器をスプリングを用いてつりさげ状に取付けて前
記高周波機器の構体内に浮かせたことを特徴とす
る発振器の取付構造。 (5) 独立した発振回路をシールドケースに収納
した発振器を含む高周波機器において、前記発振
器に複数の貫通コンデンサを分散配置してスプリ
ングの一端を接続し、前記スプリングの他端はプ
リント基板上の導電ランドに接続し、前記複数の
スプリングを発振器の保持手段とすることを特徴
とする発振器の取付構造。[Claims for Utility Model Registration] (1) A high-frequency device including an oscillator with an independent oscillation circuit housed in a shield case, in which rubber-like cushioning material is placed above and below the oscillator, and the oscillator is sandwiched between a printed circuit board and a main body shield cover. The oscillator mounting structure is characterized in that the cushion material is fixed to only one of the oscillator, the printed circuit board, or the main body shield cover. (2) The oscillator mounting structure according to claim 1, wherein the rubber cushion material is fixed to each of the upper and lower surfaces of the oscillator. (3) Installation of an oscillator in a high-frequency device including an oscillator with an independent oscillation circuit housed in a shield case, characterized in that gel-like resin is placed above and below the oscillator, and the oscillator is sandwiched between a printed circuit board and a main body shield cover. structure. (4) Mounting of the oscillator in a high-frequency device including an oscillator with an independent oscillation circuit housed in a shield case, characterized in that the oscillator is mounted in a hanging shape using a spring and floats within the structure of the high-frequency device. structure. (5) In a high-frequency device including an oscillator with an independent oscillation circuit housed in a shielded case, a plurality of feedthrough capacitors are distributed in the oscillator and one end of the spring is connected to the oscillator, and the other end of the spring is connected to a conductive capacitor on a printed circuit board. An oscillator mounting structure, characterized in that the plurality of springs are connected to a land and serve as holding means for the oscillator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12973690U JPH0457910U (en) | 1989-12-29 | 1990-11-30 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15100689 | 1989-12-29 | ||
| JP5206990 | 1990-05-17 | ||
| JP12973690U JPH0457910U (en) | 1989-12-29 | 1990-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0457910U true JPH0457910U (en) | 1992-05-19 |
Family
ID=31950369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12973690U Pending JPH0457910U (en) | 1989-12-29 | 1990-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0457910U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006066410A (en) * | 2004-08-24 | 2006-03-09 | Sharp Corp | Drop shock buffer structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5639265U (en) * | 1979-09-04 | 1981-04-13 | ||
| JPS6365197B2 (en) * | 1981-09-10 | 1988-12-14 | ||
| JPS643140B2 (en) * | 1985-01-16 | 1989-01-19 | Kinki Koka Koora Botoringu Kk |
-
1990
- 1990-11-30 JP JP12973690U patent/JPH0457910U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5639265U (en) * | 1979-09-04 | 1981-04-13 | ||
| JPS6365197B2 (en) * | 1981-09-10 | 1988-12-14 | ||
| JPS643140B2 (en) * | 1985-01-16 | 1989-01-19 | Kinki Koka Koora Botoringu Kk |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006066410A (en) * | 2004-08-24 | 2006-03-09 | Sharp Corp | Drop shock buffer structure |
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