JPH0453217A - Film capacitor - Google Patents
Film capacitorInfo
- Publication number
- JPH0453217A JPH0453217A JP16310990A JP16310990A JPH0453217A JP H0453217 A JPH0453217 A JP H0453217A JP 16310990 A JP16310990 A JP 16310990A JP 16310990 A JP16310990 A JP 16310990A JP H0453217 A JPH0453217 A JP H0453217A
- Authority
- JP
- Japan
- Prior art keywords
- film
- capacitor
- protective layer
- pps
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 91
- 239000011241 protective layer Substances 0.000 claims abstract description 40
- 239000010410 layer Substances 0.000 claims abstract description 35
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 32
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 32
- 238000010030 laminating Methods 0.000 claims description 3
- 239000002985 plastic film Substances 0.000 claims description 2
- 229920006255 plastic film Polymers 0.000 claims description 2
- 238000004804 winding Methods 0.000 claims description 2
- -1 polyphenylene Polymers 0.000 abstract description 15
- 238000000034 method Methods 0.000 abstract description 8
- 230000001681 protective effect Effects 0.000 abstract description 8
- 229920000265 Polyparaphenylene Polymers 0.000 abstract description 7
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 abstract description 6
- 229920001721 polyimide Polymers 0.000 abstract description 6
- 239000011347 resin Substances 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 4
- 229920005989 resin Polymers 0.000 abstract description 4
- 229920006267 polyester film Polymers 0.000 abstract description 2
- 239000007767 bonding agent Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 137
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 11
- 238000011156 evaluation Methods 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 10
- 238000002425 crystallisation Methods 0.000 description 8
- 230000008025 crystallization Effects 0.000 description 8
- 229920006269 PPS film Polymers 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- XWUCFAJNVTZRLE-UHFFFAOYSA-N 7-thiabicyclo[2.2.1]hepta-1,3,5-triene Chemical compound C1=C(S2)C=CC2=C1 XWUCFAJNVTZRLE-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000011342 resin composition Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 3
- 229920013629 Torelina Polymers 0.000 description 3
- 239000004742 Torelina™ Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 3
- 229920002530 polyetherether ketone Polymers 0.000 description 3
- 239000011112 polyethylene naphthalate Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- ZSLUVFAKFWKJRC-IGMARMGPSA-N 232Th Chemical compound [232Th] ZSLUVFAKFWKJRC-IGMARMGPSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052776 Thorium Inorganic materials 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004455 differential thermal analysis Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000010512 thermal transition Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- SFKTYEXKZXBQRQ-UHFFFAOYSA-J thorium(4+);tetrahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[Th+4] SFKTYEXKZXBQRQ-UHFFFAOYSA-J 0.000 description 1
- YJIBHPVNTVUEPU-UHFFFAOYSA-N thorium(iv) sulfide Chemical compound S=[Th]=S YJIBHPVNTVUEPU-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明はフィルムコンデンサに関する。[Detailed description of the invention] [Industrial application field] The present invention relates to film capacitors.
［従来の技術］
昨今、電子機器の小型化に伴いコンデンサなどの電子部
品にも小型化の要求が強くなってきており、このためフ
ィルムコンデンサも面実装対応のいわゆるチップコンデ
ンサの開発が進められている。矩形に分割された誘電体
フィルムと蒸着膜などの電極が積層された構造の、いわ
ゆる積層コンデンサはとくに小型化に有利である。この
時、誘電体フィルムは通常、薄番手のフィルムを用いる
ため損傷し易いので容量発生部分の外側に厚手のフィル
ムあるいはシートを重ね合わせた保護層を設けることが
知られている。しかし、チップコンデンサは基板に直付
けされるため高いハンダ耐熱性が必要となるが、耐薬品
性が高く寸法精度に優れた保護層を形成する手段は得ら
れていない。[Conventional technology] In recent years, with the miniaturization of electronic devices, there has been a strong demand for smaller electronic components such as capacitors, and for this reason, the development of so-called chip capacitors, which are compatible with surface mounting of film capacitors, is progressing. There is. A so-called multilayer capacitor, which has a structure in which dielectric films divided into rectangles and electrodes such as vapor-deposited films are stacked, is particularly advantageous for miniaturization. At this time, since the dielectric film is usually a thin film and is easily damaged, it is known to provide a protective layer of thick films or sheets on the outside of the capacitance generating portion. However, since chip capacitors are directly attached to a substrate, they require high solder heat resistance, but a means for forming a protective layer with high chemical resistance and excellent dimensional accuracy has not been available.
［発明が解決しようとする課題］
耐熱性のある保護層を形成するためには、高い耐熱性を
持つ熱接着性ポリイミドフィルムや二軸延伸ポリフェニ
レンスルフィドフィルムなどを使用することが考えられ
るが、ポリイミドフィルムは高価である上、耐薬品性に
乏しい、高湿下での加水分解による劣化が速い、湿度に
対する寸法安定性が乏しいなどの欠点があり、その結果
コンデンサの使用環境が制限されることになる。また通
常の二軸延伸されたポリフェニレンスルフィドフィルム
だけでは本発明者らの検討によるとフィルム層間の接着
性が悪いため成形後、容易に剥離してしまい実用性のな
いものしか得られない。また、二軸延伸ポリフェニレン
スルフィドフィルムに接着剤を塗布したフィルムを用い
ることも考えられるが、二軸延伸ポリフェニレンスルフ
ィドフィルムが加熱時に僅かながら収縮してしまうため
に溶融ハンダにデイツプされた時などに形状の変化や剥
離が発生する欠点があり、いずれも実用性のあるものは
得られなかった。[Problems to be Solved by the Invention] In order to form a heat-resistant protective layer, it is possible to use a heat-adhesive polyimide film or a biaxially oriented polyphenylene sulfide film that has high heat resistance. In addition to being expensive, films have drawbacks such as poor chemical resistance, rapid deterioration due to hydrolysis under high humidity, and poor dimensional stability against humidity, which limits the environments in which capacitors can be used. Become. Further, according to studies conducted by the present inventors, if only ordinary biaxially stretched polyphenylene sulfide film is used, the adhesion between the film layers is poor and the film easily peels off after molding, resulting in a product that is of no practical use. It is also possible to use a biaxially oriented polyphenylene sulfide film coated with an adhesive, but since the biaxially oriented polyphenylene sulfide film shrinks slightly when heated, it may be difficult to shape the film when it is dipped in molten solder. However, there were drawbacks such as changes in color and peeling, and none of them could be of practical use.
よって本発明は十分なハンダ耐熱性を持ち耐薬品性が高
く寸法精度に優れた保護層が形成されたコンデンサを提
供することを目的とするものである。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a capacitor on which a protective layer is formed that has sufficient solder heat resistance, high chemical resistance, and excellent dimensional accuracy.
［課題を解決するための手段］
上記の目的を達成するため、以下の構成としたものであ
る。すなわち、本発明は、誘電体フィルムと電極が交互
に重ね合わせて巻回あるいは積層して得られる容量発生
部分と、その外側に設けられたプラスティックフィルム
を重ね合わせてなる保護層とを有するフィルムコンデン
サに於いて、該保護層の最外層が二軸延伸ポリフェニレ
ンスルフィドフィルムからなり、かつ該保護層の全厚み
に対して２０％以上の厚みが実質的に無延伸のポリフェ
ニレンスルフィドフィルムからなることをＲ１とするフ
ィルムコンデンサである。[Means for solving the problem] In order to achieve the above purpose, the following configuration is adopted. That is, the present invention provides a film capacitor having a capacitance generating portion obtained by alternately overlapping dielectric films and electrodes and winding or laminating them, and a protective layer formed by overlapping a plastic film provided on the outside of the capacitance generating portion. In R1, the outermost layer of the protective layer is made of a biaxially stretched polyphenylene sulfide film, and 20% or more of the total thickness of the protective layer is made of a substantially unstretched polyphenylene sulfide film. It is a film capacitor with
本発明のコンデンサの誘電体となるフィルムの種類は特
に問わない。例示するなら、ポリエチレンテレフタレー
ト、ポリエチレンナフタレートなどのポリエステル、ポ
リプロピレンなどのポリオレフィン、ポリスチレン、ポ
リカーボネー ト、ポリフェニレンスルフィド、ポリエ
ーテルエーテルケトン、ポリイミドなど周知のもののい
ずれでもよいが保護層フィルムが高い耐熱性と耐薬品性
を持つことから誘電体フィルムもポリエチレンテレフタ
レート、ポリエチレンナフタレート、ポリフェニレンス
ルフィド、ポリエーテルエーテルケトンなど連続使用可
能最高温度が１２０℃を超えるものである時に本発明の
効果が太きい。特にポリエチレンナフタレート、ポリフ
ェニレンスルフィド、ポリエーテルエーテルケトンなど
の連続使用可能最高温度が１５５℃を超えるものである
時に本発明の効果が極めて大きい。また、誘電体として
上記フィルムの他にコーティングなどの方法によって設
けられた層が複合誘電体として作用するコンデンサでも
良い。The type of film used as the dielectric of the capacitor of the present invention is not particularly limited. For example, any of the well-known materials such as polyesters such as polyethylene terephthalate and polyethylene naphthalate, polyolefins such as polypropylene, polystyrene, polycarbonate, polyphenylene sulfide, polyether ether ketone, and polyimide may be used. Since the dielectric film has chemical resistance, the effect of the present invention is most significant when the dielectric film has a maximum temperature at which continuous use exceeds 120°C, such as polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, or polyether ether ketone. In particular, the effect of the present invention is extremely large when the maximum temperature at which continuous use of polyethylene naphthalate, polyphenylene sulfide, polyether ether ketone, etc. can be exceeded is 155°C. Alternatively, a capacitor may be used in which a layer provided as a dielectric material by a method such as coating in addition to the above-mentioned film acts as a composite dielectric material.
また、本発明のコンデンサにおいて電極は誘電体上に真
空蒸着法などによって形成された金属薄膜であっても、
自己支持性を持つ金属箔であっても良い。Further, in the capacitor of the present invention, even if the electrode is a metal thin film formed on a dielectric material by vacuum evaporation method or the like,
A metal foil having self-supporting properties may also be used.
また、その構造も巻回型、積層型などいずれでモ良いが
、積層フィルムコンデンサである時に本発明の効果が大
きい。Further, although the structure may be either a wound type or a laminated type, the effect of the present invention is greatest when the capacitor is a laminated film capacitor.
本発明は、保護層の最外層が二軸延伸ポリフェニレンス
ルフィドフィルム（以下ＰＰ５−ＢＯフィルムと略称す
ることがある）からなることが必要である。しかし、最
外層直下の第２層は、ＰＰ５−ＢＯフィルム、実質的に
無延伸のポリフェニレンスルフィドフィルム（以下ＰＰ
５−ＮＯフィルムと略称することがある）、その他のフ
ィルム、繊維補強シートなどを用いることができるが、
これらのうちＰＰ５−ＢＯフィルムまたはＰＰ５ＮＯフ
イルムであることが好ましい。ここで、第２層もＰＰ５
−ＢＯフィルムであるときはＰＰ５−ＢＯフィルムの特
性を損なわない範囲、好ましくはＰＰ５−ＢＯフィルム
厚みに対して３０％以下の厚みであれば接着剤層などが
フィルム層間に存在することは差し支えない。この場合
、接着剤としては硬化後の軟化温度が２６０°Ｃ以」二
の熱硬化性、または熱可塑性樹脂を主成分とするもので
あることが好ましい。また、第２層がＰＰ５−ＮＯフィ
ルムであるときは実質的に接着剤等を介さずに積層され
ていることが好ましい。The present invention requires that the outermost layer of the protective layer be made of a biaxially oriented polyphenylene sulfide film (hereinafter sometimes abbreviated as PP5-BO film). However, the second layer immediately below the outermost layer is a PP5-BO film, a substantially unstretched polyphenylene sulfide film (hereinafter referred to as PP
(sometimes abbreviated as 5-NO film), other films, fiber reinforced sheets, etc. can be used, but
Among these, PP5-BO film or PP5NO film is preferred. Here, the second layer is also PP5
-When it is a BO film, there is no problem in the presence of an adhesive layer between the film layers as long as it does not impair the properties of the PP5-BO film, preferably with a thickness of 30% or less of the PP5-BO film thickness. . In this case, the adhesive is preferably a thermosetting adhesive having a softening temperature of 260° C. or higher after curing, or an adhesive containing a thermoplastic resin as a main component. Further, when the second layer is a PP5-NO film, it is preferable that the second layer is laminated substantially without using an adhesive or the like.
最外層部分にＰＰ５−Ｂ○フィルム層を配することによ
ってコンデンサ素子の強度を保つことができるとともに
コンデンサの耐熱性、耐湿性、耐薬品性を高い次元でバ
ランスさせることができる。By disposing the PP5-B○ film layer in the outermost layer, the strength of the capacitor element can be maintained, and the heat resistance, moisture resistance, and chemical resistance of the capacitor can be highly balanced.
第２層がＰＰ５−ＢＯフィルム以外のフィルムからなる
ときは最外層のＰＰ５−ＢＯフィルムの厚さ、また、最
外層を含めて連続して複数層のＰＰ５−ＢＯフィルムが
積層されるときはそれらＰＰ５−ＢＯフィルム層部分の
合計厚さは、それぞれ２５μｍ以上であるか、または保
護層の全厚みに対して３０％以上であることが素子保護
効果の点から好ましい。また、最外層以外にも二軸延伸
ポリフェニレンスルフィドフィルムが用いられることも
好ましく、特にＰＰ５−ＮｏフィルムとＰＰ５−ＢＯフ
ィルムが交互に配されたものが好ましい。When the second layer is made of a film other than PP5-BO film, the thickness of the outermost PP5-BO film, or when multiple layers of PP5-BO films are laminated consecutively including the outermost layer, The total thickness of the PP5-BO film layer portions is preferably 25 μm or more, or 30% or more of the total thickness of the protective layer, from the viewpoint of device protection effect. Moreover, it is also preferable to use a biaxially stretched polyphenylene sulfide film in addition to the outermost layer, and in particular, one in which PP5-No films and PP5-BO films are alternately arranged is preferable.
ここで二軸延伸ポリフェニレンスルフィドフィルム（Ｐ
ＰＳ−ＢＯフィルム）とは、ポリーｐフェニレンスルフ
ィドを主成分とする樹脂組成物の二軸延伸フィルムであ
る。該フィルムの厚さは、５μｍ〜１−００μｍの範囲
が好ましい。また、該フィルムの２３０℃に於ける１０
分間の熱収縮率は、得られるコンデンサの寸法安定性か
らフィルムの長手方向でＯ％〜＋１．２％、長手方向に
直交する方向で一５％〜＋５％であることが好ましい。Here, biaxially oriented polyphenylene sulfide film (P
PS-BO film) is a biaxially stretched film of a resin composition containing poly p-phenylene sulfide as a main component. The thickness of the film is preferably in the range of 5 μm to 1-00 μm. In addition, the temperature of the film at 230°C
The heat shrinkage rate per minute is preferably 0% to +1.2% in the longitudinal direction of the film, and 15% to +5% in the direction orthogonal to the longitudinal direction, in view of the dimensional stability of the obtained capacitor.
ここで、ポリ−ｐ−フェニレンスルフィドを主成分とす
る樹脂組成物（以下ＰＰＳ樹脂組成物と略称することが
ある）とは、ポリ−ｐ−フェニレンスルフィドを７０重
量％以上、好ましくは８５重量％以上含む組成物をいう
。ポリ−ｐ−フェニレンスルフィドの含有量が７０重量
％未満では、該組成物からなるフィルムの特長である耐
熱性、周波数特性、温度特性等を損なう。Here, a resin composition containing poly-p-phenylene sulfide as a main component (hereinafter sometimes abbreviated as PPS resin composition) refers to a resin composition containing poly-p-phenylene sulfide in an amount of 70% by weight or more, preferably 85% by weight. A composition containing the above. If the content of poly-p-phenylene sulfide is less than 70% by weight, the characteristics of the film made of the composition, such as heat resistance, frequency characteristics, and temperature characteristics, will be impaired.
ざらにここで、ポリ−ｐ−フェニレンスルフィド（以下
Ｐ Ｐ Ｓと略称することがある）とは、繰り返し単位
の７０モル％以上（好ましくは８５モル％以上）が構造
式÷＋Ｓ＋で示される構成単位からなる重合体をいう。Generally speaking, poly-p-phenylene sulfide (hereinafter sometimes abbreviated as PPS) is a structure in which 70 mol% or more (preferably 85 mol% or more) of repeating units are represented by the structural formula ÷+S+ A polymer consisting of units.
係る成分が７０モル％未満ではポリマの結晶性、熱転移
温度等が低（なりＰＰＳを主成分とする樹脂組成物から
なるフィルムの特長である耐熱性、寸法安定性、機械的
特性等を損なう。ＰＰＳの溶融粘度は、３００℃、ぜん
断速度２００ｓｅｃ−’のもとで５００〜１５０００ポ
イズの範囲が好ましい。If the content of such components is less than 70 mol%, the crystallinity, thermal transition temperature, etc. of the polymer will be low (this will impair the heat resistance, dimensional stability, mechanical properties, etc. that are the characteristics of a film made of a resin composition mainly composed of PPS). The melt viscosity of PPS is preferably in the range of 500 to 15,000 poise at 300°C and a shear rate of 200 sec-'.
また本発明は、保護層の全厚みに対して２０％以上、好
ましくは２０％以」ニア０％以下、さらに好ましくは４
０％以上７０％以下が実質的に無延伸のポリフェニレン
スルフィドフィルム（ＰＰＳ−Ｎｏフィルム）からなる
ことが必要である。このＰＰ５−Ｎｏフィルム層が存在
することによって各層間の接着性が確保され、さらにＰ
Ｐ５−ＢＯフィルムのハンダデイツプ時などに於ける寸
法変化をＰＰ５−Ｎｏフィルム層が吸収して保護層の剥
離、誘電体層の破壊を防ぐことができる。In addition, the present invention provides at least 20% of the total thickness of the protective layer, preferably at least 20%, at most 0%, and more preferably at most 4% of the total thickness of the protective layer.
It is necessary that 0% or more and 70% or less of the film be made of substantially unstretched polyphenylene sulfide film (PPS-No film). The presence of this PP5-No film layer ensures adhesion between each layer, and also
The PP5-No film layer absorbs the dimensional change of the P5-BO film during solder dipping, thereby preventing peeling off of the protective layer and destruction of the dielectric layer.
ここで、実質的に無延伸のポリフェニレンスルフィドフ
ィルム（ＰＰＳ−Ｎｏフィルム）に於いても上記二軸延
伸ポリフェニレンスルフィドフィルムと同様のＰＰＳ樹
脂組成物あるいはＰＰＳが好ましく用いられる。該Ｐ
Ｐ ５−Ｎｏフィルムの厚さは１５μｍ〜２００μｍの
範囲が好ましい。Here, also in the substantially unstretched polyphenylene sulfide film (PPS-No film), the same PPS resin composition or PPS as the above-mentioned biaxially oriented polyphenylene sulfide film is preferably used. The P
The thickness of the P5-No film is preferably in the range of 15 μm to 200 μm.
本発明で、実質的に無延伸とはＴｈｒｏｕｇｈ 、 Ｅ
ｄｇｅ。In the present invention, "substantially no stretching" means Through, E
dge.
Ｅｎｄの３方向から測定した配向度がいずれも０゜７０
以上であるものをいう。ここである方向から測定した配
向度とは求める方向からのＸ線プレト写真を撮影しＰ
Ｐ Ｓ結晶の［２，Ｏ，Ｏ］回折リングをマイクロデン
シトメーターで赤道線上を半径方向に走査した時の黒化
度（Ｉ［φ・０°１）と同じく３０°方向での黒化度（
Ｉ［φ・３０°１）との比（Ｉ［φ・３０°１／■［φ
・０°］）によって定義される。すなわち配向度は、０
から１．の範囲にあるものであり、この値が１．に近い
ほど測定方向に垂直な面内での等方性が高く、３方向と
も１−に近いことは実質的に無配向であることを表わす
。The degree of orientation measured from the three directions of the end is 0°70.
This refers to things that are more than that. Here, the degree of orientation measured from a certain direction refers to the degree of orientation measured by taking an X-ray plate photograph from the desired direction.
The blackening degree in the 30° direction is the same as the degree of blackening (I[φ・0°1) when scanning the [2,O,O] diffraction ring of the PS crystal in the radial direction on the equator with a microdensitometer. Every time(
The ratio to I[φ・30°1) (I[φ・30°1/■[φ
・0°]). In other words, the degree of orientation is 0
From 1. This value is within the range of 1. The closer to , the higher the isotropy in the plane perpendicular to the measurement direction, and the closer to 1- in all three directions means that there is substantially no orientation.
また、フィルムが実質的に非晶状態にありＰＰＳ結晶の
［２，Ｏ，Ｏ］回折リングが明確に観測されない場合は
、フィルムを定長状態に固定し、２ｏｏ’ｃに加熱され
たオーブン中で１分間熱処理を施してＰＰＳ結晶を生成
ぜしめてから測定する。If the film is substantially in an amorphous state and the [2,O,O] diffraction ring of the PPS crystal is not clearly observed, fix the film in a constant length state and place it in an oven heated to 2oo'C. Heat treatment is performed for 1 minute to complete the formation of PPS crystals, and then measurement is performed.
尚、この値はコンデンサとなった後でも変わらない。Note that this value does not change even after it becomes a capacitor.
本発明に使用されるＩ） Ｉ） Ｓ−Ｎ Ｏフィルムは
相対結晶化指数か３．０以下の実質的に非晶状態にある
ものを用いることがフィルムの取り扱い性やシート同志
の接着性の点から好ましい。ここで相対結晶化指数とは
シートのＸ線による広角回折プロファイル中のＰＰＳ結
晶の［２，Ｏ，Ｏ］回折ピークの最大強度（Ｉ ２００
）と２θ＝２５°での強度（Ｔ ２５）の比１２００
／ Ｉ ２５を以て定義される。I) I) The S-N O film used in the present invention should be in a substantially amorphous state with a relative crystallization index of 3.0 or less, in order to improve the handling properties of the film and the adhesion between sheets. Preferable from this point of view. Here, the relative crystallization index is the maximum intensity of the [2,O,O] diffraction peak (I 200
) and the intensity at 2θ=25° (T 25) 1200
/ I 25.
また実質的に非晶状態にあるポリフェニＩノンスルフィ
ドからなるフィルムをＰＰ５−ＮｏフィルムまたはＰＰ
５−ＢＯフィルムと実質的に接着剤を介在させないで重
ね合わせる時は１００℃以上ポリフェニレンスルフィド
の融点以下の温度、１ｋｇ ／ ｃｍ ２以上の圧力で
シートの厚さ方向に加圧してシート層間を密着さぜるこ
とか好ましい。In addition, a film consisting of polyphenylene nonsulfide in a substantially amorphous state is used as a PP5-No film or a PP5-No film.
When stacking with 5-BO film without substantially intervening adhesive, apply pressure in the thickness direction of the sheet at a temperature of 100℃ or higher and lower than the melting point of polyphenylene sulfide and a pressure of 1kg/cm2 or higher to adhere the sheet layers. It is preferable to stir it.
また、本発明に使用されるＰＰ５−Ｎｏフィルムの昇温
時結晶化温度は１３０°Ｃ以上であることが加工のし易
さの点から好ましい。ここで昇温時結晶化温度とは示差
熱分析によって室温から２０℃／分の割合で昇温した時
にＰＰＳの結晶化の進行によって１−００°Ｃ〜１５０
℃の範囲に現われるピークの極大を与える温度のことを
言う。Further, it is preferable that the crystallization temperature of the PP5-No film used in the present invention during heating is 130° C. or higher from the viewpoint of ease of processing. Here, the crystallization temperature during heating is 1-00°C to 150°C depending on the progress of crystallization of PPS when the temperature is raised from room temperature at a rate of 20°C/min according to differential thermal analysis.
It refers to the temperature that gives the maximum of the peak that appears in the range of ℃.
本発明のコンデンサは上記の構成とすることにより十分
な効果があるが保護層を形成した後、熱処理を施し、Ｐ
Ｐ５−Ｎｏフィルム部分を、好ましくは密度にして］、
、 ３３０ ｇ／ｃｍ３以上さらに好ましくは１．
３５０ ｇ／ｃｍ”以上になるまで結晶化せしめると
さらに耐熱性が向上し好ましい。The capacitor of the present invention has a sufficient effect by having the above structure, but after forming the protective layer, heat treatment is performed and P
P5-No film portion, preferably with density],
, 330 g/cm3 or more, more preferably 1.
It is preferable to crystallize until the crystallinity reaches 350 g/cm" or more because the heat resistance is further improved.
本発明は保護層にＰＰ５−ＢＯフィルムとＰ １）Ｓ−
Ｎｏフィルムを併用することによって優れたコンデンサ
を得るものであるが、保護層すべてが上記二軸延伸ポリ
フェニレンスルフィドフィルム部分と無延伸のポリフェ
ニレンスルフィドフィルムから構成されている必要はな
く、特性を損なわない範囲、好ましくは保護層の全厚み
に対して２０％以下であればポリニスデルフィルム、ポ
リイミドフィルムなどの他のシート、フィルムあるいは
樹脂、接着剤層等が二軸延伸および実質的に無延伸のポ
リフェニレンスルフィドフィルムとともに使われること
は差し支えない。保護層の構成として外側よりＰＰ５−
ＢＯフィルム／ＰＰ５−Ｎｏフィルム、ＰＰ５−ＢＯフ
ィルム／ＰＰ５−ＮＯフィルム／ＰＰＳ−１３０フイル
ム、ＰＰ５−ＢＯフィルム／ＰＰ５−Ｎｏフィルム／Ｐ
Ｐ、Ｓ−Ｂ」 ２
Ｏフィルム／ＰＰ５−Ｎｏフィルム、さらに多くの層が
積層されたもの、およびそれらの層間に他樹脂、シート
、フィルムが介在するものなどが考えられ、いずれの構
成でも差し支えない。The present invention uses a PP5-BO film and a P1)S-
Although an excellent capacitor can be obtained by using the No film in combination, the entire protective layer does not need to be composed of the above-mentioned biaxially oriented polyphenylene sulfide film portion and the unstretched polyphenylene sulfide film, and may be within the range that does not impair the characteristics. , preferably 20% or less of the total thickness of the protective layer, other sheets or films such as polynisder film or polyimide film, or resin, adhesive layer, etc. are biaxially stretched and substantially unstretched polyphenylene. May be used with sulfide film. As the structure of the protective layer, PP5-
BO film/PP5-No film, PP5-BO film/PP5-NO film/PPS-130 film, PP5-BO film/PP5-No film/P
P, S-B" 2 O film/PP5-No film, one in which more layers are laminated, and one in which other resin, sheet, or film is interposed between these layers, etc., and any structure is acceptable. do not have.
次に本発明のコンデンサの製造方法を説明する。Next, a method for manufacturing a capacitor according to the present invention will be explained.
本発明のコンデンサは特に従来の製造方法を変更するこ
となく得ることができる。すなわち誘電体フィルムと電
極となる金属箔や蒸着膜などを得る手段と、該誘電体フ
ィルムと該電極を静電容量を発生するように重ね合わせ
る手段と、得られた容量発生部分に保護層を設ける手段
を兼ね備えていれば従来知られているいずれの方法も適
用することができる。また、新規の方法であっても良い
。In particular, the capacitor of the invention can be obtained without changing conventional manufacturing methods. That is, there is a means for obtaining a dielectric film and a metal foil or a vapor deposited film that will become an electrode, a means for overlapping the dielectric film and the electrode so as to generate capacitance, and a protective layer for the obtained capacitance-generating portion. Any conventionally known method can be applied as long as it has the means for providing it. Moreover, a new method may be used.
保護層を形成する方法は、ＰＰ５−Ｎｏフィルムを含む
保護層材料を設けた後、最外層にＰＰ５−ＢＯフィルム
を積層する方法、ＰＰ５−ＢＯフィルムが外側にくるよ
うにＰＰ５−ＮｏフィルムとＰＰ５−ＢＯフィルムを重
ね合わせて保護層を形成する方法、あらかじめＰＰ５−
ＮｏフィルムとＰＰ５−ＢＯフィルムを積層した複合フ
ィルムを準備したのちＰＰ５−ＢＯフィルム部分が外側
にくるように保護層を形成する方法などがある。なお、
本発明のコンデンサは上記保護層がコンデンサの最外層
部分に露出している必要はなく、保護層を持つコンデン
サ素子の周囲に樹脂などによるコーティングなど、いわ
ゆるコンデンサの外装が施されることは差し支えない。The method for forming the protective layer is to provide a protective layer material containing a PP5-No film and then laminate a PP5-BO film as the outermost layer, or to stack a PP5-No film and a PP5 film so that the PP5-BO film is on the outside. - Method of overlapping BO films to form a protective layer, pre-PP5-
There is a method of preparing a composite film in which a No film and a PP5-BO film are laminated, and then forming a protective layer so that the PP5-BO film portion is on the outside. In addition,
In the capacitor of the present invention, the above-mentioned protective layer does not need to be exposed at the outermost layer of the capacitor, and a so-called capacitor exterior such as coating with resin or the like may be applied around the capacitor element having the protective layer. .
しかし、本発明の効果が最も発揮されるのは実質的に無
外装の積層フィルムチップコンデンサである。However, the effect of the present invention is best exhibited in a multilayer film chip capacitor that is substantially without exterior packaging.
［発明の効果］
従来、特に高耐熱コンデンサに於いて問題となっていた
保護層材質の寸法安定性不良および接着性不良による層
間剥離の問題等を解消し、ハンダ耐熱性、耐湿度劣化性
、耐薬品性が高く寸法精度に優れた保護層が形成された
コンデンサとなる。[Effects of the invention] Problems such as interlayer peeling due to poor dimensional stability and poor adhesion of the protective layer material, which have conventionally been a problem particularly in high heat resistant capacitors, are resolved, and the present invention improves solder heat resistance, moisture deterioration resistance, and The capacitor is formed with a protective layer that has high chemical resistance and excellent dimensional accuracy.
［特性の評価法］ 本発明における各特性の評価方法は以下の通りである。[Evaluation method of characteristics] The evaluation method for each characteristic in the present invention is as follows.
（１）コンデンサの耐ハンダ性試験
コンデンサを２６０°Ｃの溶融状態にあるハンダ浴に１
０秒間浸漬し、外観を目視で検査する。判定の基準は以
下の通りである。(1) Solder resistance test of capacitor A capacitor is placed in a molten solder bath at 260°C.
Immerse for 0 seconds and visually inspect the appearance. The criteria for judgment are as follows.
○：保護フィルム部分にやや変色が見られるが実用上問
題ない。○: Slight discoloration is observed in the protective film portion, but there is no practical problem.
×：保護フィルム部分が軟化したり、大きく変形または
剥離し、実用上問題がある。×: The protective film portion was softened, significantly deformed, or peeled off, causing a practical problem.
（２）保護層の耐熱剛性試験
コンデンサを２６０’Ｃの溶融状態にあるハンダ浴に浸
漬する。１−０秒間経過した後、ハンダ浴に入れたまま
ピンセット等で挟むなどして保護層の軟化程度を見る。(2) Heat resistance rigidity test of protective layer The capacitor is immersed in a molten solder bath at 260'C. After 1-0 seconds have elapsed, the degree of softening of the protective layer is checked by pinching it with tweezers or the like while leaving it in the solder bath.
判定の基準は以下の通りである。The criteria for judgment are as follows.
○：保護フィルム部分は全く損傷がない。○: The protective film part is not damaged at all.
×：保護フィルム部分にピンセットの跡が付くなど保護
層が軟化した形跡があり、実用上問題がある。×: There is evidence that the protective layer has softened, such as traces of tweezers on the protective film portion, which poses a practical problem.
（３）コンデンサの耐湿度劣化性試験
コンデンサを水を入れた加圧容器に封入し、１−５５℃
に加熱したオーブンで２時間エージングする。コンデン
サを取り出し、目視等によって検査する。判定の基準は
以下の通りである。(3) Humidity deterioration resistance test of capacitors The capacitors were sealed in a pressurized container containing water at 1-55℃.
Age in a preheated oven for 2 hours. Take out the capacitor and visually inspect it. The criteria for judgment are as follows.
○：外観上全く変化がなく、強度も十分である。○: There is no change in appearance at all, and the strength is sufficient.
×：外観上は変化ないが、簡単に剥離したり脆弱である
。×: There is no change in appearance, but it peels off easily or is brittle.
［実施例］ ゛
実施例を挙げて本発明の詳細な説明するが本発明はこれ
らに限定されるものではない。[Examples] The present invention will be described in detail with reference to Examples, but the present invention is not limited thereto.
実施例１゜
（」、）無延伸ポリフェニレンスルフィドシートの調製
オートクレーブに、硫化すトリウム３２．６ｋｇ（２５
０モル、結晶水４０ｗ１％を含む）、水酸化すトリウム
１００ ｇ、 、安息香酸すトリウム３６゜１−ｋｌ！
（２５０モル）、及びＮ−メチル−２−ピロリドン（以
下ＮＭＰと略称することがある）７９゜２ｋｇを仕込み
２０５℃で脱水したのち、１９，４ジクロルベンゼン（
ｐ−ＤＣＢと略称する）３７゜５ｋｇ（２５５モル）、
及びＮＭＰ２０．Ｏｋｇを加え、２６５°Ｃで４時間反
応させた。反応生成物を水洗、乾燥して、ｐ−フェニレ
ンスルフィド１００モル％からなり、溶融粘度３１．０
０ポイズのポ１）＝−１）−フェニレンスルフィド２１
． １ ｋｇ （収率７８％）を得た。Example 1 Preparation of unstretched polyphenylene sulfide sheet 32.6 kg (25 kg) of thorium sulfide was placed in an autoclave.
0 mol, containing 40w1% of water of crystallization), 100 g of thorium hydroxide, , 36°1-kl of thorium benzoate!
(250 mol) and 79°2 kg of N-methyl-2-pyrrolidone (sometimes abbreviated as NMP) were charged and dehydrated at 205°C, followed by 19,4 dichlorobenzene (
(abbreviated as p-DCB) 37°5 kg (255 mol),
and NMP20. Okg was added and the mixture was reacted at 265°C for 4 hours. The reaction product was washed with water and dried to obtain a product consisting of 100 mol% of p-phenylene sulfide with a melt viscosity of 31.0.
0 Poise Po1)=-1)-Phenylene Sulfide 21
．． 1 kg (yield 78%) was obtained.
この組成物にステアリン酸カルシウム０．０５Ｗ【％を
添加し、４０ｍｍ径のエクストルーダによって３１０℃
で溶融し、金属繊維を用いた９５％カット孔径１０μｍ
のフィルタでろ過したのち長さ４００ ｍｍ、間隙］−
，５ｍｍの直線状リップを有するＴダイから押し出し、
表面を２５℃に保った金属ドラム上にキャストして冷却
固化し、厚さ約２５μｍの無延伸ポリフェニレンスルフ
ィドシートを得た。これをＰＰ５−Ｎｏ−１とする。Ｐ
Ｐ５−Ｎ Ｏ−１の配向度はＴｈｒｏｕｇｈ ＝ ０．
８９、Ｆ、ｄｇｅ＝０．９４、Ｅｎｄ ＝０． ９１
であり実質的に無延伸であった。尚、このシートの相対
結晶化指数は１−１２、昇温時結晶化温度は１．３５℃
であった。Calcium stearate 0.05W[%] was added to this composition, and the mixture was heated to 310°C using a 40mm diameter extruder.
95% cut hole diameter 10 μm using metal fiber
After filtering with a filter of 400 mm in length, gap]-
, extruded from a T-die with a 5 mm linear lip,
It was cast on a metal drum whose surface was kept at 25° C. and solidified by cooling to obtain an unstretched polyphenylene sulfide sheet with a thickness of about 25 μm. This is designated as PP5-No-1. P
The degree of orientation of P5-N O-1 is Through = 0.
89, F, dge=0.94, End=0. 91
There was virtually no stretching. The relative crystallization index of this sheet is 1-12, and the crystallization temperature when heated is 1.35°C.
Met.
（２）コンデンサの製造
二軸延伸ＰＰＳフィルム（東し■製“トレリナ”、公称
厚み２５μｍ）の片面にエポキシ系接着剤を理論値で厚
さ３μＩｎに塗布した接着剤イ」き二軸延伸ＰＰＳフィ
ルム（これをＰＰ５−ＢＯ−１とする）を幅４．．７ｍ
ｍにスリットし、接着剤層が外側にくるように６００ｍ
ｍ径のドラムに５夕・−ン巻き付け、その上にＰ Ｐ
Ｓ −Ｎ Ｏ−１を幅４゜７ｍｍにスリットシ、６００
ｍｍ径のドラムに５ターン巻きイ」けた。さらに、その
上にコンデンサ用アルミニウム蒸着二軸延伸Ｐ Ｐ’
Ｓフィルム（東し■製“ＭＣｌ−レリナ”、公称厚み２
．５μｍ１フイルム幅４．５ｍｍ、ｖ−ジン０．５ｍｍ
）の左マージンおよび右マージンのもの各１枚づつを０
．２ｍｍのずらしを持たせて重ね合わせ、１０００ター
ン巻回し、さらにその上に再びｌ） Ｐ ５ＮＯ−１−
を５ターン、接着剤付きＰＰ５−ＢＯ−１フイルムを内
側に接着剤層がくるように５ターン巻き付けた。この大
径巻回体の外側から、被せるようにしてヒーターを持つ
円筒状のリングを締め付け、フィルム厚さ方向に３ｋｇ
／ｃｍ２の圧力がかかるように締めると同時にリングを
１−８０°Ｃに加熱して、５分間加熱成形した。さらに
両端面にメタリコンを溶射して外部電極を形成してから
りングをはずし、対向する２ケ所で切断して半円状のコ
ンデンサ母素子を得た。(2) Manufacture of capacitors Biaxially oriented PPS film (“Torelina” manufactured by Toshi ■, nominal thickness 25 μm) with an epoxy adhesive applied to one side to a theoretical thickness of 3 μm. The film (this is called PP5-BO-1) has a width of 4. ．． 7m
Slit 600m so that the adhesive layer is on the outside.
Wrap it around a drum with a diameter of 5 mm, and then
Slit S-N O-1 to a width of 4°7mm, 600
Five turns were wound on a mm diameter drum. Furthermore, on top of that, aluminum evaporation for capacitors is made of biaxially stretched P P'
S film (“MCl-Relina” manufactured by Toshi ■, nominal thickness 2
．． 5 μm 1 film width 4.5 mm, v-gin 0.5 mm
) in the left margin and right margin, respectively, to 0.
．． Layer them with a 2mm shift, wind them 1000 turns, and then wrap them again l) P 5NO-1-
was wound for 5 turns, and a PP5-BO-1 film with adhesive was wound for 5 turns so that the adhesive layer was on the inside. Tighten the cylindrical ring with the heater over it from the outside of this large-diameter wound body, and tighten the cylindrical ring holding the heater to 3 kg in the film thickness direction.
While tightening to a pressure of /cm2, the ring was heated to 1-80°C and heat-molded for 5 minutes. Further, external electrodes were formed by spraying metallicon on both end faces, the ring was removed, and the capacitor was cut at two opposing locations to obtain a semicircular capacitor mother element.
得られたコンデンサ母素子を、容量が０．１μＦになる
ような長さに切断してコンデンサ素子を得た。素子の切
断面をエポキシ樹脂を塗布して保護した後、２００°Ｃ
に加熱したオーブンに入れ２時間熱処理し、メタリコン
部分表面を研磨して積層チップ状コンデンサを得た。こ
れをコンデンサ八とする。コンデンサＡの評価結果を表
１．に示ず。The obtained capacitor mother element was cut into lengths having a capacitance of 0.1 μF to obtain capacitor elements. After coating the cut surface of the element with epoxy resin to protect it, it was heated to 200°C.
The capacitor was placed in a heated oven for 2 hours, and the surface of the metallicon portion was polished to obtain a multilayer chip capacitor. This is called capacitor 8. Table 1 shows the evaluation results of capacitor A. Not shown.
実施例２
長さ３２０ｍｍ、幅３０ｍｍの平板状のマンドレルにコ
ンデンサ用アルミニウム蒸着二軸延伸ＰＰＳフィルム（
東し■製“ＭＣｌ−レリナ“、公称厚み２．５μｍ１フ
イルム幅４．５ｍｍ、マージンＱ、５ｍｍ）の左マージ
ンおよび右マージンのもの各１１枚づつをＱ、 ２ｍ
ｍのずらしを持たぜて重ね合わせ、１．０００ターン巻
回し、巻回体の上下から、１８０ ’Ｃに加熱された平
行平板加熱プレス機によってフィルム厚さ方向に３０ｋ
ｇ／ｃｍ２の圧力をかけながら５分間プレスした。プＩ
ノス後、両端面にメタリコンを溶射して外部電極を形成
してから、対向する２ケ所で切断して棒状のコンデンサ
母素子を得た。Example 2 An aluminum vapor-deposited biaxially stretched PPS film for capacitors (
"MCl-Rerina" manufactured by Toshi ■, nominal thickness 2.5 μm, 1 film width 4.5 mm, margin Q, 5 mm), 11 sheets each with left margin and right margin, Q, 2 m
The film is stacked with a shift of m, and then wound for 1,000 turns.The film is then rolled for 30k in the film thickness direction from the top and bottom using a parallel plate heating press heated to 180'C.
It was pressed for 5 minutes while applying a pressure of g/cm2. Pu I
After nosing, metallicon was sprayed on both end faces to form external electrodes, and then cut at two opposing locations to obtain a rod-shaped capacitor mother element.
得られたコンデンサ母素子を、容量が０． １−μＦに
なるような長さに切断してコンデンサ素子を得た。The obtained capacitor mother element has a capacitance of 0. A capacitor element was obtained by cutting it into a length of 1-μF.
実施例１．で得たＰＰ５−ＮＣ）−１−を幅４．７ｍｍ
にスリットし、得られたコンデンサ素子の外周（メタリ
コンがされた面を除く４面）に５周巻き付け、さらに実
施例１で得た接着剤付きＰＰ５ＢＯ−１を２周巻きイ」
けてから巻終わり部分を粘着テープで仮り止めしてから
再び２００°Ｃに加熱された平行平板加熱プレス機によ
って誘電体フィルムの厚さ方向に３０ ｋｇ ／ ａｍ
２の圧力をかけながら１時間プレス成型した後、メタ
リコン部分表面を研磨して積層チップ状コンデンサを得
た。これをコンデンサＢとする。コンデンサＢの評価結
果を表１に示す。Example 1. PP5-NC)-1- obtained in 4.7 mm in width
The PP5BO-1 with adhesive obtained in Example 1 was wrapped around the outer periphery of the obtained capacitor element (four sides excluding the metallized surface) five times, and then the adhesive-coated PP5BO-1 obtained in Example 1 was wrapped twice.
After that, the end of the roll was temporarily fixed with adhesive tape, and then the dielectric film was heated to 30 kg/am in the thickness direction using a parallel plate heating press heated to 200°C.
After press molding for 1 hour while applying a pressure of 2, the surface of the metallicon portion was polished to obtain a multilayer chip capacitor. This is called capacitor B. Table 1 shows the evaluation results for Capacitor B.
実施例３ 実施例」と同様の方法でＰＰ５−ＮＯフィルムを得た。Example 3 A PP5-NO film was obtained in the same manner as in Example.
ただし、このときキャスト速度を１／２にして厚さ５０
μｍとした。これをＰＰ５−ＮＯ−２とする。However, at this time, the casting speed is halved and the thickness is 50 mm.
It was set as μm. This is designated as PP5-NO-2.
これとは別に二軸延伸ＰＰＳフィルム（東し■製“トレ
リナ”、公称厚み５０μｍ）を用意した。Separately, a biaxially stretched PPS film ("Torelina" manufactured by Toshi ■, nominal thickness 50 μm) was prepared.
これを、ＰＰ５−ＢＯ−２とする。This is designated as PP5-BO-2.
ＰＰ５−ＢＯ−２およびＰＰ５−Ｎｏ−２を共に４．７
ｍ、ｍ幅にスリットし、まずＰＰ５−ＢＯ−２が内側に
くるように重ね合わせて６００ｍｍ径のドラムに２ター
ン巻き付けた。さらに、その上にコンデンサ用アルミニ
ウム蒸着二軸延伸ＰＰＳフィルム（東し■製“ＭＣｌ−
レリナ”、公称厚み２．５μｍ１フイルム幅４．５ｍｍ
、マージン０．５ｍｍ）の左マージンおよび右マージン
のもの各′１枚づつを０．２ｍｍのずらしを持たせて重
ね合わせ、１０００ターン巻回し、さらにその上に再び
ＰＰ１ＢＣ）−２が外側にくるようにしてＰ Ｉ） Ｓ
−Ｂ Ｏ−２とＰＰ５−ＮＯ−２を重ね合わせて２ター
ン巻き付けた。この大径巻回体の外側から、被せるよう
にしてヒーターを持つ円筒状のリングを締め付け、フィ
ルム厚さ方向に３ ｋｇ ／ ａｍ２の圧力がかかるよ
うに締めると同時にリングを１８０℃に加熱して、５分
間加熱成形した。さらに両端面にメタリコンを溶射して
外部電極を形成してからリングをはずし、対向する２ケ
所で切断して半円状のコンデンサ母素子を得た。Both PP5-BO-2 and PP5-No-2 are 4.7
The slits were slit into m and m widths, and first, the PP5-BO-2 was stacked on top of each other so that it was on the inside, and then wound around a drum with a diameter of 600 mm for 2 turns. Furthermore, on top of that, an aluminum vapor-deposited biaxially stretched PPS film for capacitors (“MCI-
Rerina”, nominal thickness 2.5 μm 1 film width 4.5 mm
, PP1BC)-2 is placed on the outside again on top of the left and right margins (with a margin of 0.5mm), stacked with a 0.2mm shift and wound 1000 turns. In this way, P I) S
-BO-2 and PP5-NO-2 were overlapped and wound for 2 turns. Tighten a cylindrical ring with a heater over it from the outside of this large-diameter wound body, tighten it so that a pressure of 3 kg/am2 is applied in the direction of the film thickness, and at the same time heat the ring to 180°C. , heat molded for 5 minutes. Furthermore, external electrodes were formed by spraying metallicon on both end faces, and then the ring was removed and cut at two opposing locations to obtain a semicircular capacitor mother element.
得られたコンデンサ母素子を、容量が０．１−μＦにな
るような長さに切断してコンデンサ素子を得た。素子の
切断面をエポキシ粉体塗装によって保護した後、２００
’Ｃに加熱したオーブンに入れ２時間熱処理し、メタリ
コン部分表面を研磨して積層チップ状コンデンサを得た
。これをコンデンサＣとする。コンデンサＣの評価結果
を表１に示す。The obtained capacitor mother element was cut into lengths having a capacitance of 0.1-μF to obtain capacitor elements. After protecting the cut surface of the element with epoxy powder coating,
The capacitor was placed in an oven heated to 'C and heat treated for 2 hours, and the surface of the metallicon portion was polished to obtain a multilayer chip capacitor. This is called capacitor C. Table 1 shows the evaluation results for Capacitor C.
実施例４
実施例３で得たＰＰ５−ＮＣ）−２フイルム（厚さ５０
μｍ）の両面に、二軸延伸ＰＰＳフィルム（東し■製“
トレリナ“、公称厚み２５μｍ）を熱ラミネートシ、Ｐ
Ｐ５−ＢＯ／ＰＰ５−ＮＯ／ＰＰ５−ＢＯ構成の積層フ
ィルムを得た。Example 4 PP5-NC)-2 film obtained in Example 3 (thickness 50
μm) on both sides of the biaxially stretched PPS film (manufactured by Toshi ■).
Heat laminated "Torelina" (nominal thickness 25 μm), P
A laminated film having a P5-BO/PP5-NO/PP5-BO configuration was obtained.
この積層フィルムの片面にエポキシ系接着剤を理論値で
厚さ３１１ｍに塗布し、接着剤層き積層フィルムを得た
。An epoxy adhesive was applied to one side of this laminated film to a theoretical thickness of 311 m to obtain an adhesive-layered laminated film.
この接着剤付き積層フィルムを４．７ｍｍ幅にスリット
し、６００ｍｍ径のドラムに接着剤層が外側にくるよう
に５ターン巻き付けた。さらに、その上にコンデンサ用
アルミニウム蒸着二軸延伸ＰＰＳフィルム（東し■製“
ＭＣ）レリナ”、公称厚み２．５μｍ１フイルム幅４．
５ｍｍ、マージン０．５ｍｍ）の左マージンおよび右マ
ージンのもの各１枚づつを０．２ｍｍのすらしを持たせ
て重ね合わせ、１０００ターン巻回し、さらにその」二
に接着剤付き積層フィルムを接着剤層が内側にくるよう
に５ターン巻き付けた。This adhesive-coated laminated film was slit to a width of 4.7 mm, and wound around a 600 mm diameter drum for 5 turns with the adhesive layer on the outside. Furthermore, on top of that, an aluminum vapor-deposited biaxially stretched PPS film for capacitors (manufactured by Toshi ■
MC) Rerina”, nominal thickness 2.5 μm 1 film width 4.
5mm, margin 0.5mm), one each from the left margin and the right margin were overlapped with a 0.2mm smoothness, wound 1000 turns, and then glued a laminated film with adhesive to the second layer. It was wound 5 turns so that the agent layer was on the inside.
得られたフィルム巻回体をドラムに巻き（＝Ｊけたまま
１８０°Ｃの熱風オーブンで１４時間熱処理し、さらに
巻回体の端面部分にメタリコンを施しと後、ドラムの対
向する２ケ所で巻回体を切断し半円状のコンデンザ母素
子を得た。The obtained film roll was wound around a drum (=J heat treated in a hot air oven at 180°C for 14 hours, and after applying metallicon to the end face of the roll, the drum was wound at two opposing points. The rotating body was cut to obtain a semicircular capacitor mother element.
得られたコンデンザ母素子を、容量がＯ，］−μＦにな
るような長さに切断してコンデンサ素子を得た。素子の
切断面をエポキシ粉体塗装によって保護した後、２００
℃に加熱したオーブンに入れ２時間熱処理し、メタリコ
ン部分表面を研磨して積層チップ状コンデンサを得た。The obtained capacitor mother element was cut into lengths such that the capacitance was O,]-μF to obtain a capacitor element. After protecting the cut surface of the element with epoxy powder coating,
It was placed in an oven heated to .degree. C. and heat-treated for 2 hours, and the surface of the metallicon portion was polished to obtain a multilayer chip capacitor.
これをコンデンサＤとする。コンデンサＤの評価結果を
表１に示す。This is called capacitor D. Table 1 shows the evaluation results for capacitor D.
比較例１
保護フィルム部分をＰ Ｉ） Ｓ−Ｎ Ｏを用いること
なく接着剤イマ１き二軸延伸ＰＰＳフィルム（ＰＰＳ−
ＢＯ−１）のみとして実施例］−と同様の方法でコンデ
ンサを作成した。ただし、ＰＰ５−ＢＯｌは保護層部分
の厚みを揃えるため１−０ターン巻きイ」けた。これを
コンデンサＥとする。コンデンサＥの評価結果を表１−
に示す。Comparative Example 1 A biaxially stretched PPS film (PPS-
A capacitor was produced in the same manner as in Example]- except for BO-1). However, PP5-BOl was wound 1-0 turns in order to make the thickness of the protective layer portion uniform. This is called capacitor E. Table 1 shows the evaluation results of capacitor E.
Shown below.
比較例２
保護フィルム部分をＰＰ５−ＮＯ−１のみとして実施例
１−と同様の方法でコンデンサを作成した。Comparative Example 2 A capacitor was produced in the same manner as in Example 1 except that the protective film portion was made of PP5-NO-1 only.
ただし、ＰＰ５−Ｎｏ−１は保護層部分の厚みを揃える
ため１０ターン巻き付けた。これをコンデンサＦとする
。コンデンサＦの評価結果を表１に示す。However, PP5-No-1 was wound 10 turns in order to equalize the thickness of the protective layer portion. This is called capacitor F. Table 1 shows the evaluation results for capacitor F.
比較例３
保護フィルムを熱接着性ポリイミドフィルム（東し・デ
ュポン■製“カプトン”Ｆタイプ、フィルム厚さ２５μ
ｍ）として比較例１と同様の方法でコンデンサを作成し
た。これをコンデンサＧとする。コンデンサＧの評価結
果を表１に示す。Comparative Example 3 The protective film was a heat-adhesive polyimide film (“Kapton” F type manufactured by Azuma DuPont, film thickness 25 μm).
As m), a capacitor was produced in the same manner as in Comparative Example 1. This is called capacitor G. Table 1 shows the evaluation results for capacitor G.
比較例４
保護フィルムをポリエステルフィルム（東し■製“ルミ
ラー 、フィルム厚さ２５μｍ）として比較例１．と同
様の方法でコンデンサを作成した。Comparative Example 4 A capacitor was prepared in the same manner as in Comparative Example 1, using a polyester film (Lumirror manufactured by Toshi ■, film thickness 25 μm) as the protective film.
これをコンデンサＨとする。コンデンサＨの評価結果を
表１に示す。This is called capacitor H. Table 1 shows the evaluation results for Capacitor H.
以上の結果から本発明のコンデンサは優れた耐ハンダ性
と耐湿度劣化性をあわせもったコンデンサであることが
わかる。From the above results, it can be seen that the capacitor of the present invention has both excellent solder resistance and humidity deterioration resistance.
第１−図は本発明の実施例１によって得られたコンデン
ザ素子の構造を模式的に説明する斜視図を示す。
１；接着剤イＮ１きＩ） Ｐ Ｓ −Ｔ３０フイルムか
らなる保護層（外層）
２：ＰＰ５−Ｎｏフィルムからなる保護層（内層）
３：容量発生部分
４：外部電極（メタリコン）FIG. 1 shows a perspective view schematically illustrating the structure of a capacitor element obtained according to Example 1 of the present invention. 1: Protective layer (outer layer) made of PS-T30 film 2: Protective layer (inner layer) made of PP5-No film 3: Capacitance generating portion 4: External electrode (metallicon)
Claims (2)
あるいは積層して得られる容量発生部分と、その外側に
設けられたプラスティックフィルムを重ね合わせてなる
保護層とを有するフィルムコンデンサに於いて、該保護
層の最外層が二軸延伸ポリフェニレンスルフィドフィル
ムからなり、かつ該保護層の全厚みに対して２０％以上
の厚みが実質的に無延伸のポリフェニレンスルフィドフ
ィルムからなることを特徴とするフィルムコンデンサ。(1) In a film capacitor that has a capacitance generating portion obtained by winding or laminating dielectric films and electrodes in an alternating manner, and a protective layer formed by laminating a plastic film provided on the outside of the capacitance generating portion. , the outermost layer of the protective layer is made of a biaxially stretched polyphenylene sulfide film, and 20% or more of the total thickness of the protective layer is made of a substantially unstretched polyphenylene sulfide film. capacitor.
項（１）に記載のフィルムコンデンサ。(2) The film capacitor according to claim (1), wherein the capacitor is a laminated film capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16310990A JP2870133B2 (en) | 1990-06-21 | 1990-06-21 | Film capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16310990A JP2870133B2 (en) | 1990-06-21 | 1990-06-21 | Film capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0453217A true JPH0453217A (en) | 1992-02-20 |
| JP2870133B2 JP2870133B2 (en) | 1999-03-10 |
Family
ID=15767339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16310990A Expired - Fee Related JP2870133B2 (en) | 1990-06-21 | 1990-06-21 | Film capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2870133B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6577493B2 (en) | 1997-11-18 | 2003-06-10 | Matsushita Electric Industrial Co., Ltd. | Layered product and capacitor |
-
1990
- 1990-06-21 JP JP16310990A patent/JP2870133B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6577493B2 (en) | 1997-11-18 | 2003-06-10 | Matsushita Electric Industrial Co., Ltd. | Layered product and capacitor |
| US6611420B2 (en) | 1997-11-18 | 2003-08-26 | Matsushita Electric Industrial Co., Ltd. | Layered product and capacitor |
| US6704190B2 (en) | 1997-11-18 | 2004-03-09 | Matsushita Electric Industrial Co., Ltd. | Layered product and capacitor |
| US6710997B2 (en) | 1997-11-18 | 2004-03-23 | Matsushita Electric Industrial Co., Ltd. | Layered product and capacitor |
| US6879481B2 (en) | 1997-11-18 | 2005-04-12 | Matsushita Electric Industrial Co., Ltd. | Layered product and capacitor |
| CN100419925C (en) * | 1997-11-18 | 2008-09-17 | 松下电器产业株式会社 | Layered product and capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2870133B2 (en) | 1999-03-10 |
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