JPH0451437Y2 - - Google Patents
Info
- Publication number
- JPH0451437Y2 JPH0451437Y2 JP8886388U JP8886388U JPH0451437Y2 JP H0451437 Y2 JPH0451437 Y2 JP H0451437Y2 JP 8886388 U JP8886388 U JP 8886388U JP 8886388 U JP8886388 U JP 8886388U JP H0451437 Y2 JPH0451437 Y2 JP H0451437Y2
- Authority
- JP
- Japan
- Prior art keywords
- far
- infrared
- coating
- copper
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000576 coating method Methods 0.000 claims description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 30
- 229910052802 copper Inorganic materials 0.000 claims description 26
- 239000010949 copper Substances 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 22
- 238000010438 heat treatment Methods 0.000 claims description 21
- 230000006698 induction Effects 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 description 33
- 230000000694 effects Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 208000003656 Electric Burns Diseases 0.000 description 1
- 206010014357 Electric shock Diseases 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Description
【考案の詳細な説明】
＜産業上の利用分野＞
この考案は、面から効率良く遠赤外線を出す遠
赤外線発生装置に用いる遠赤外線発生パネルに関
する。[Detailed Description of the Invention] <Industrial Application Field> This invention relates to a far-infrared generation panel used in a far-infrared generation device that efficiently emits far-infrared rays from a surface.
＜従来の技術＞
従来の遠赤外線発生装置としては、夫々第３図
乃至第５図に示すようなものが知られている。第
３図のものは、高温時に遠赤外線を効率良く出す
遠赤外線物質で形成したパネル１の内部にヒータ
２を封入し背面に断熱板３を設けた構成である。
第４図のものは、ランプ状のもので、石英管４の
内部にヒータ５を配置し、石英管４の表面に遠赤
外線物質６を設けた構成である。第５図のもの
は、板状に形成した遠赤外線物質７の一方の面に
電子発熱回路８を設けたものであり、図中９は金
属コア、１０は通電用端子である。このほかに、
第３図のパネル１が金属板に遠赤外線物質を溶射
溶着したものとされ、その金属板側からヒータで
加熱するようにしたものもある。<Prior Art> As conventional far-infrared ray generators, those shown in FIGS. 3 to 5 are known. The one shown in FIG. 3 has a structure in which a heater 2 is enclosed inside a panel 1 made of a far-infrared material that efficiently emits far-infrared rays at high temperatures, and a heat insulating plate 3 is provided on the back surface.
The one in FIG. 4 is lamp-shaped, and has a configuration in which a heater 5 is placed inside a quartz tube 4 and a far-infrared material 6 is provided on the surface of the quartz tube 4. In the one shown in FIG. 5, an electronic heating circuit 8 is provided on one side of a far-infrared material 7 formed in a plate shape, and in the figure, 9 is a metal core, and 10 is a current-carrying terminal. In addition to this,
The panel 1 shown in FIG. 3 is made by thermally spraying and welding a far-infrared material to a metal plate, and some panels are heated from the metal plate side with a heater.
＜考案が解決しようとする課題＞
前記従来の遠赤外線発生装置は、いずれも遠赤
外線を放出する遠赤外線物質の表面積に較べてヒ
ータの発熱面積が小さいものであり、また間接加
熱であるから、ヒータ部分が高温となる割には遠
赤外線物質から遠赤外線の出る量が少ない問題が
ある。また、ヒータの電源も一般的に100V系又
は200V系が使用されているから、通電部に人が
接触すると危険がある問題もある。これらの問題
は、従来の遠赤外線発生装置を、暖房用あるいは
他の低温加熱用などに使用する場合に、高温部や
通電部に人体に対するガードが必要となる問題を
も含んでいる。<Problems to be solved by the invention> In all of the conventional far-infrared ray generators, the heating area of the heater is smaller than the surface area of the far-infrared material that emits far-infrared rays, and indirect heating is used. There is a problem in that the amount of far-infrared rays emitted from the far-infrared material is small even though the temperature of the heater portion is high. Furthermore, since the power supply for the heater is generally 100V or 200V, there is also the problem that it is dangerous for people to come into contact with the current-carrying parts. These problems include the problem that when using conventional far-infrared ray generators for space heating or other low-temperature heating applications, it is necessary to protect the human body from high-temperature parts and energized parts.
この考案の課題は、遠赤外線物質を効率良く加
熱することができて遠赤外線の発生効率のよい、
また安全性の高い遠赤外線発生パネルを提供する
ことにある。 The problem with this invention is to be able to efficiently heat far-infrared materials and to generate far-infrared rays with high efficiency.
Another objective is to provide a highly safe far-infrared ray generating panel.
＜課題を解決するための手段＞
この考案の手段は、インダクシヨンプラズマを
熱源に利用したインダクシヨンプラズマコーテイ
ング法によつて断熱性基板面に銅粉末を皮膜に形
成し、その被膜表面に遠赤外線材料をコーテイン
グし、前記銅被膜を通電加熱又は誘電加熱される
加熱部とするものである。<Means for solving the problem> The means of this invention is to form a film of copper powder on the surface of a heat-insulating substrate by an induction plasma coating method that uses induction plasma as a heat source, and to apply far infrared rays to the surface of the film. The copper film is coated with a material and serves as a heating part that is electrically heated or dielectrically heated.
＜作用＞
前記手段によれば、加熱部がインダクシヨンプ
ラズマを熱源に利用して銅粉末をコーテイングし
た、つまり溶射した銅被膜である。その銅被膜
は、従来のガスプラズマ溶射被膜とは異なり、銅
粉末の吹きつけ速度が小さいことから粉末粒子が
外接した状態で互いに結合したような多孔質膜と
なつている。この多孔質銅被膜は、緻密である従
来のガスプラズマ溶射銅被膜に較べると抵抗値が
相当に大きい点に特徴がある。例えば、膜厚
200μmのもので、単位面積当りの実行抵抗値が、
従来のそれは1.2×10-4Ωであるのに対してこの
考案のそれは9.1×10-4Ωである。この値の差は、
加熱部を同じ膜厚及び面積として同じ電源部で発
熱させる場合に実効抵抗値の大きい方が大きい発
熱量が得られることになる。なお、多孔質銅被膜
は特願昭63−95214号のインダクシヨンプラズマ
装置により形成できる。<Function> According to the above means, the heating portion is coated with copper powder using induction plasma as a heat source, that is, is a thermally sprayed copper coating. Unlike conventional gas plasma sprayed coatings, the copper coating is a porous film in which the powder particles are bonded to each other in a circumscribed state because the spraying speed of the copper powder is low. This porous copper coating is characterized by a significantly higher resistance value than the denser conventional gas plasma sprayed copper coating. For example, film thickness
For 200 μm, the effective resistance value per unit area is
The conventional value is 1.2×10 −4 Ω, while the value of this invention is 9.1×10 −4 Ω. The difference between these values is
When the heating parts have the same thickness and area and the same power supply part generates heat, the larger the effective resistance value, the greater the amount of heat generated. Incidentally, the porous copper coating can be formed using an induction plasma apparatus disclosed in Japanese Patent Application No. 63-95214.
また、加熱部の銅被膜が多孔質であることは、
断熱材と銅と遠赤外線材料（金属の酸化物）との
熱膨張係数の差により温度変化に基く相互間の剥
離作用力を軽減する作用もある。これは銅被膜の
空隙が熱による伸縮時の歪を吸収する作用がある
からである。 In addition, the fact that the copper coating in the heating part is porous means that
The difference in thermal expansion coefficient between the heat insulating material, copper, and far-infrared material (metal oxide) also has the effect of reducing the mutual peeling force caused by temperature changes. This is because the voids in the copper coating have the effect of absorbing strain caused by expansion and contraction due to heat.
また、加熱部である銅被膜が発熱して直接銅被
膜にコーテイングしてある遠赤外線材料を加熱す
るようになつているから、加熱効率がよく、従つ
て遠赤外線の発生効率がよい。 Furthermore, since the copper coating, which is the heating part, generates heat and directly heats the far-infrared material coated on the copper coating, the heating efficiency is high, and therefore the far-infrared ray generation efficiency is high.
また、断熱性基板面に銅被膜をインダクシヨン
プラズマ法によりコーテイングし、その上に遠赤
外線材料をコーテイングした構成は、製作上必ず
しも大きさに制限がなく、大きく形成して比較的
低温で大量の遠赤外線を出すようにすることがで
き、従つて用途によつては、銅被膜を通電加熱す
るものとし、低電圧の電力を供給して必要な量の
遠赤外線を発生させしかも遠赤外線発生パネルが
あまり高温とならないようにすることができる。 In addition, with a configuration in which a copper film is coated on the surface of a heat-insulating substrate using an induction plasma method, and a far-infrared material is coated on top of the copper film, there are no restrictions on the size in terms of manufacturing, and it can be formed large and produced in large quantities at a relatively low temperature. It can be made to emit far-infrared rays, and therefore, depending on the application, the copper coating may be heated by electricity, and low-voltage power can be supplied to generate the necessary amount of far-infrared rays. It is possible to prevent the temperature from becoming too high.
＜実施例＞
第１実施例を第１図に示す。図において、１１
は遠赤外線発生パネルであり、１２は断熱材から
なる基板、１３はインダクシヨンプラズマコーテ
イング法による銅被膜、１４は遠赤外線物質の被
膜である。この実施例は通電によつて銅被膜１３
に発熱させ、遠赤外線物質の被膜１４を加熱して
遠赤外線を出すようにしたものであり、銅被膜１
３が基板１２の一方の面に帯状に屈曲して形成さ
れており、その寸法によつて抵抗値を所望の値に
調節してある。図中１５，１５は通電用端子であ
る。<Example> A first example is shown in FIG. In the figure, 11
1 is a far-infrared generating panel, 12 is a substrate made of a heat insulating material, 13 is a copper coating formed by induction plasma coating, and 14 is a far-infrared material coating. In this embodiment, the copper coating 13 is
The copper coating 1 is heated to emit far infrared rays by heating the far infrared material coating 14.
3 is bent into a band shape on one surface of the substrate 12, and its resistance value is adjusted to a desired value depending on its dimensions. In the figure, numerals 15 and 15 are terminals for power supply.
この遠赤外線発生パネル１１は、例えば端子１
５，１５に通常の交流電源から入力し、インバー
タ、インバータトランスを介して20V以下の電圧
として電力を供給するようにして使用する。そし
てインバータには遠赤外線物質の被膜１４の適所
に温度センサを設けて温度コントローラにより設
定された温度になるように自動的に温度コントロ
ールを行うようにするのがよい。 This far-infrared generating panel 11 includes, for example, a terminal 1
5 and 15 from a normal AC power supply, and the power is supplied as a voltage of 20V or less via an inverter and an inverter transformer. It is preferable that the inverter is provided with a temperature sensor at a suitable location on the coating 14 of far-infrared material so that the temperature is automatically controlled to a temperature set by a temperature controller.
この遠赤外線発生パネル１１は、通電により銅
被膜の加熱部が発生し、その熱により遠赤外線物
質の被膜１４が直接的に加熱され、表面から遠赤
外線を発する。この実施例の場合、通電電圧が
20V以下であるから、通電部に人が触れても危険
はなく、また被膜１４があまり高温にならないよ
うに制御して短時間触れた程度では人体に危険が
ないようにすれば、発熱部が通電部に対するガー
ドを設けなくともよいのもとなる。これは暖房用
として適切なものである。また別に、遠赤外線物
質の被膜１４が相当に高温となるような用途であ
つても、従来の被膜による加熱のように間接加熱
のではないから、比較的低い温度であつても必要
な量の遠赤外線を発生するようにできる。その場
合に銅被膜が多孔質であることから、基板１２と
被膜１３，１４との間に剥離が生じ難く、寿命が
長い。 In this far-infrared ray generating panel 11, a heating portion of the copper coating is generated when electricity is applied, and the coating 14 of the far-infrared material is directly heated by the heat, and far-infrared rays are emitted from the surface. In this example, the energizing voltage is
Since the voltage is 20V or less, there is no danger even if a person touches the current-carrying part, and if the coating 14 is controlled so that it does not become too hot so that touching it for a short time does not pose a danger to the human body, the heat-generating part can be removed. This eliminates the need to provide a guard for the current-carrying part. This is suitable for heating purposes. Separately, even if the far-infrared material coating 14 is used for applications where the temperature is considerably high, the required amount can be heated even at a relatively low temperature because indirect heating is not used as in conventional coating heating. It can be made to generate far infrared rays. In this case, since the copper coating is porous, peeling between the substrate 12 and the coatings 13 and 14 is less likely to occur, resulting in a long life.
第２実施例を第２図に示す。図において、２１
は遠赤外線発生パネル、２２は断熱性基板、２３
はインダクシヨンプラズマコーテイング法によつ
て形成された銅被膜、２４はその銅被膜２３の表
面にコーテイングされた遠赤外線材料の被膜であ
る。 A second embodiment is shown in FIG. In the figure, 21
is a far-infrared generating panel, 22 is a heat insulating substrate, 23
24 is a copper film formed by an induction plasma coating method, and 24 is a film of far-infrared material coated on the surface of the copper film 23.
この遠赤外線発生パネル２１は、断熱性基板２
２の側に誘電加熱コイル２５を設けて銅被膜２３
に発熱させると、被膜２４が加熱されて遠赤外線
を出す。この場合も第１実施例と同様に温度制御
部を設ける。 This far infrared ray generating panel 21 has a heat insulating substrate 2
A dielectric heating coil 25 is provided on the side of the copper coating 23.
When heat is generated, the coating 24 is heated and emits far infrared rays. In this case as well, a temperature control section is provided as in the first embodiment.
第１及び第２実施例に示した遠赤外線発生パネ
ル１１，２１は、暖房用のほかに工業用として加
熱や乾燥などの熱源として用いることができ、さ
らにサウナ風呂のように人体を暖める用途にも用
いることができる。 The far-infrared generating panels 11 and 21 shown in the first and second embodiments can be used not only for heating but also as a heat source for industrial purposes such as heating and drying, and can also be used for warming the human body such as in sauna baths. can also be used.
＜考案の効果＞
この考案によれば、遠赤外線物質の被膜を従来
よりも効率よく加熱できるようになつているか
ら、従来よりも効率よく電気エネルギーを遠赤外
線に変換できる。また、電力を低電圧で供給する
ようにして、遠赤外線物質の被膜の温度をある程
度低くしても表面積の大きさで所望の発熱量を確
保する構成が容易であるから、感電、やけど、発
火などの危険のない暖房装置を提供できる。ま
た、遠赤外線物質の被膜が比較的高温となる用途
であつても、銅被膜が多孔質であることから、被
膜が剥離し難いものであるから、長期間の使用に
耐え得る。<Effects of the invention> According to this invention, the far-infrared material coating can be heated more efficiently than before, so electrical energy can be converted into far-infrared rays more efficiently than before. In addition, by supplying power at a low voltage, it is easy to create a configuration that ensures the desired amount of heat due to the surface area even if the temperature of the far-infrared material coating is lowered to a certain extent, so there is no risk of electric shock, burns, or ignition. We can provide a heating system that is free from dangers such as: Further, even in applications where the far-infrared material coating is exposed to relatively high temperatures, since the copper coating is porous, the coating is difficult to peel off and can withstand long-term use.
第１図はこの考案の第１実施例を示しａは正面
図、ｂはａにおけるＡ−Ａ断面図、第２図は第２
実施例を示しａは正面図、ｂはａにおけるＢ−Ｂ
断面部分拡大図、第３図は従来の遠赤外線発生装
置の１例を示す断面図、第４図は従来の他の遠赤
外線発生装置を示す断面図、第５図はさらに他の
遠赤外線発生装置を示しａは正面図、ｂはａにお
けるＣ−Ｃ断面図である。
１１，２２……遠赤外線発生パネル、１２，２
２……断熱性基板、１３，２３……インダクシヨ
ンプラズマコーテイングによる銅被膜、１４，２
４……遠赤外線物質の被膜。
Fig. 1 shows the first embodiment of this invention, a is a front view, b is a sectional view taken along line A-A at a, and Fig. 2 is a second embodiment of the invention.
Showing examples, a is a front view, and b is B-B at a.
3 is a sectional view showing an example of a conventional far-infrared ray generator, FIG. 4 is a sectional view showing another conventional far-infrared ray generator, and FIG. 5 is a further sectional view showing another far-infrared ray generator. The device is shown, and a is a front view, and b is a cross-sectional view taken along line C-C at a. 11, 22... Far infrared generation panel, 12, 2
2...Insulating substrate, 13,23...Copper coating by induction plasma coating, 14,2
4...A coating of far-infrared material.
Claims (1)
ダクシヨンプラズマコーテイング法によつて断熱
性基板面に銅粉末を皮膜に形成し、その銅被膜表
面に遠赤外線材料をコーテイングし、前記銅被膜
を通電加熱又は誘電加熱される加熱部とする遠赤
外線発生パネル。 Copper powder is formed into a film on a heat insulating substrate surface by an induction plasma coating method using induction plasma as a heat source, a far-infrared material is coated on the surface of the copper film, and the copper film is electrically heated or dielectrically heated. A far-infrared ray generating panel that serves as a heating section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8886388U JPH0451437Y2 (en) | 1988-07-04 | 1988-07-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8886388U JPH0451437Y2 (en) | 1988-07-04 | 1988-07-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0212190U JPH0212190U (en) | 1990-01-25 |
| JPH0451437Y2 true JPH0451437Y2 (en) | 1992-12-03 |
Family
ID=31313420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8886388U Expired JPH0451437Y2 (en) | 1988-07-04 | 1988-07-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0451437Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101636005B (en) * | 2008-07-25 | 2012-07-18 | 清华大学 | Plane heat source |
-
1988
- 1988-07-04 JP JP8886388U patent/JPH0451437Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0212190U (en) | 1990-01-25 |
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