JPH0447739Y2 - - Google Patents
Info
- Publication number
- JPH0447739Y2 JPH0447739Y2 JP1986006698U JP669886U JPH0447739Y2 JP H0447739 Y2 JPH0447739 Y2 JP H0447739Y2 JP 1986006698 U JP1986006698 U JP 1986006698U JP 669886 U JP669886 U JP 669886U JP H0447739 Y2 JPH0447739 Y2 JP H0447739Y2
- Authority
- JP
- Japan
- Prior art keywords
- drive
- glass substrate
- liquid crystal
- crystal display
- conductive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 30
- 230000001070 adhesive effect Effects 0.000 claims description 30
- 239000011521 glass Substances 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 26
- 239000004973 liquid crystal related substance Substances 0.000 claims description 20
- 230000006866 deterioration Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Wire Bonding (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は液晶表示体のガラス基板上に駆動IC
を導電接着剤等によつてフエイスダウンボンデイ
ングして成る液晶表示装置の実装構造に関する。[Detailed explanation of the invention] [Industrial field of application] This invention is based on a driving IC mounted on a glass substrate of a liquid crystal display.
This invention relates to a mounting structure for a liquid crystal display device formed by face-down bonding using a conductive adhesive or the like.
近年、液晶表示装置の画像表示への応用が活発
に進められている。これに伴ない液晶表示体と駆
動回路との接続は微細化、多端子化の傾向が強ま
つており、効率が良く、信頼性が勝れ、小型かつ
安価な実装構造の開発が望まれている。
In recent years, the application of liquid crystal display devices to image display has been actively promoted. Along with this, there is a growing trend toward miniaturization and multi-terminal connections between liquid crystal displays and drive circuits, and there is a desire to develop a mounting structure that is efficient, reliable, compact, and inexpensive. There is.
この様な要求に対する１つの回答として、液晶
表示体のガラス基板面上に画素パターンの形成と
同一工程にて、駆動ICの電極群と対応したパタ
ーン電極群を薄膜形成し、該ガラス基板面上に形
成したパターン電極群と駆動ICの電極部にあら
かじめ形成された突起電極群とを導電性接着剤に
よつてフエイスダウンボンデイングし電気的、機
械的接続を成し、その後駆動ICを含むガラス基
板表面を樹脂封止して成る実装構造が提案されて
いる。
As one answer to these demands, a patterned electrode group corresponding to the electrode group of the drive IC is formed as a thin film on the glass substrate surface of the liquid crystal display in the same process as the formation of the pixel pattern. The patterned electrode group formed on the drive IC and the protrusion electrode group previously formed on the electrode part of the drive IC are face-down bonded using a conductive adhesive to form an electrical and mechanical connection, and then the glass substrate containing the drive IC is bonded. A mounting structure in which the surface is sealed with resin has been proposed.
上記の如き実装構造は、簡便な実装手段で高密
度多端子な接続が可能で、小型かつ廉価を達成す
る上で有効である。しかし液晶表示体に使用でき
る導電性接着剤は低温硬化型、或は光硬化型が好
ましいが、これらの導電性接着剤は接着力が弱く
実用上大きな問題となつていた。特に表面フラツ
トネスの優れているガラス基板との接着力が問題
であつた。具体的に述べると、駆動ICの突起電
極と液晶表示体のガラス基板を導電性接着剤で接
着した時の初期の接着力は金属面である突起電極
側とガラス基板側では大きな差はないが、80℃／
−20℃レベルの熱サイクルテストを行なうとガラ
ス基板側の接着力が劣化し、電気的接続不良に至
る危険があつた。
The above-mentioned mounting structure enables high-density multi-terminal connection with a simple mounting means, and is effective in achieving small size and low cost. However, conductive adhesives that can be used in liquid crystal displays are preferably low-temperature curing type or photo-curing type, but these conductive adhesives have weak adhesive strength, which poses a serious problem in practical use. In particular, the adhesive strength with glass substrates, which have excellent surface flatness, was a problem. Specifically, when the protruding electrodes of the drive IC and the glass substrate of the liquid crystal display are bonded together using a conductive adhesive, there is not much difference in the initial adhesion strength between the protruding electrode side (metallic surface) and the glass substrate side. ,80℃/
When subjected to a thermal cycle test at a temperature of -20°C, the adhesive strength on the glass substrate side deteriorated and there was a risk of electrical connection failure.
本考案はかかる点に着目しその目的とするとこ
ろは、導電性接着剤を用いて液晶表示体のガラス
基板と駆動ICをフエイスダウンボンデイングし
て成る液晶表示装置において、接着力の劣化の生
じない接続の信頼性の高い液晶表示装置を提供す
る事にある。 The present invention focuses on this point and aims to prevent deterioration of adhesive strength in a liquid crystal display device which is formed by face-down bonding the glass substrate of the liquid crystal display and the driving IC using a conductive adhesive. The purpose is to provide a liquid crystal display device with high connection reliability.
上記目的を達成するため、本考案の要旨は、ガ
ラス基板側の導電性接着剤の接着面積を駆動IC
の突起電極の外形よりも大きくした事にある。
In order to achieve the above objective, the gist of this invention is to reduce the adhesive area of the conductive adhesive on the glass substrate side to the driving IC.
The reason is that the external shape of the protruding electrode is larger than that of the protruding electrode.
以下、本考案の実施例を図面によつて説明す
る。第１図は本考案に於ける液晶表示体への駆動
IC実装構造を示す平面図、第２図は第１図に於
ける駆動IC実装部の断面図、第３図、第４図は
要部平面図である。
Embodiments of the present invention will be described below with reference to the drawings. Figure 1 shows the drive to the liquid crystal display in this invention.
FIG. 2 is a sectional view of the drive IC mounting portion in FIG. 1, and FIGS. 3 and 4 are plan views of the main parts.
二枚以上のガラス基板の空隙に液晶を封入し、
シール材によつてシールして成る液晶表示体１の
ガラス基板２上にITO等の透明導電膜によつて画
素パターン３を形成すると同時に、駆動IC５の
電極に対応したパターン電極群４を形成し、該ガ
ラス基板２上のパターン電極群４に前記駆動IC
５の突起電極群６を導電性接着剤７を用いてフエ
イスダウンボンデイングし電気的機械的接続を成
し、しかる後、エポキシ樹脂８を用いて駆動IC
５搭載部及びガラス基板２上のパターン電極群４
を樹脂被覆し、液晶表示装置の駆動ICを実装す
るものである。この場合の導電接着剤７の接着力
は前述の如くガラス基板側での劣化がはげしい。
この原因の１つとしてガラス基板のフラツトネス
が突起電極の表面（形状、粗さ）に比べてすぐれ
ている点がある。突起電極はメツキ等で形成され
るためメツキ液、電流密度等によりその表面状態
が左右されるが、ガラス基板に比べて表面に凹凸
ははげしく、接着に寄与する実効表面積は外形に
比べて相当大きい。又、ガラス基板２がソーダガ
ラスの場合、導電接着剤７との接着力の劣化は駆
動IC５の中心側から始まる。これは駆動ICとガ
ラス基板の熱膨張係数の差のためと思われる。そ
こで、駆動IC５の突起電極６の平面方向の外形
面積S1に対して、導電接着剤７とガラス基板２と
の接着面積S2を種々かえて実験すると、S2の面積
が大きくなる程熱サイクル後の接着力の劣化が起
きにくくなつた。駆動ICのチツプサイズ、突起
電極６の大きさによつてもその度合は異なつてく
るが一般的な突起電極６の外形面積S1は0.005mm2
〜0.03mm2程度であるが、小さめの突起電極の場合
でも、第３図に示す如く駆動IC５の中心側の接
着面積S2を増す事によりおおよそS21.5S1とす
る事により安定した接着力を確保できる事がわか
つた。又多端子で微細隣接ピツチの突起電極を有
する駆動ICの場合でも第４図に示す如く、ガラ
ス基板と導電接着剤の接着面積S2を増す事により
接着力の安定した実装構造を提供できる。本考案
によれば突起電極６が小さくなつた場合、特に有
効である。 Liquid crystal is sealed in the gap between two or more glass substrates,
A pixel pattern 3 is formed using a transparent conductive film such as ITO on the glass substrate 2 of the liquid crystal display 1 which is sealed with a sealing material, and at the same time a pattern electrode group 4 corresponding to the electrodes of the driving IC 5 is formed. , the drive IC is placed on the patterned electrode group 4 on the glass substrate 2.
The protruding electrode group 6 of 5 is face-down bonded using a conductive adhesive 7 to form an electrical and mechanical connection, and then an epoxy resin 8 is used to bond the drive IC.
5 Pattern electrode group 4 on mounting section and glass substrate 2
The device is coated with resin and a driving IC for a liquid crystal display device is mounted on it. In this case, the adhesive strength of the conductive adhesive 7 deteriorates rapidly on the glass substrate side as described above.
One of the reasons for this is that the flatness of the glass substrate is superior to that of the surface (shape, roughness) of the protruding electrode. Since protruding electrodes are formed by plating, etc., the surface condition is affected by the plating liquid, current density, etc., but the surface is more uneven than a glass substrate, and the effective surface area that contributes to adhesion is considerably larger than the external shape. . Further, when the glass substrate 2 is made of soda glass, the adhesive force with the conductive adhesive 7 starts to deteriorate from the center side of the drive IC 5. This seems to be due to the difference in thermal expansion coefficient between the drive IC and the glass substrate. Therefore, an experiment was conducted by varying the adhesion area S 2 between the conductive adhesive 7 and the glass substrate 2 with respect to the external area S 1 in the planar direction of the protruding electrode 6 of the drive IC 5. As the area of S 2 becomes larger, the heat increases. Deterioration of adhesive strength after cycling is less likely to occur. The degree of this will vary depending on the chip size of the drive IC and the size of the protruding electrode 6, but the general external area S 1 of the protruding electrode 6 is 0.005 mm 2
~0.03mm 2 , but even in the case of a smaller protruding electrode, stable adhesion can be achieved by increasing the adhesion area S 2 on the center side of the drive IC 5 to approximately S 2 1.5S 1 as shown in Figure 3. I realized that I could secure power. Even in the case of a multi-terminal drive IC having protruding electrodes with minute adjacent pitches, a mounting structure with stable adhesive force can be provided by increasing the bonding area S2 between the glass substrate and the conductive adhesive, as shown in FIG. The present invention is particularly effective when the protruding electrode 6 becomes small.
尚、本考案を実施するには転写印刷法等により
ガラス基板２上にあらかじめ所定の面積の導電接
着剤を形成しておき、後に突起電極付駆動ICを
フエイスダウンボンデイングすればよい。 In order to carry out the present invention, a conductive adhesive having a predetermined area may be formed on the glass substrate 2 in advance by a transfer printing method or the like, and then the drive IC with protruding electrodes may be face-down bonded.
以上詳述した如く、本考案によれば、導電接着
剤を用いて駆動ICを液晶表示体のガラス基板上
に直接実装する場合の問題点であつた接着力の劣
化をなくす事ができる事、微細ピツチの突起電極
を有する駆動ICにも有効である事等、導電性接
着剤の改良無に実用化できる事等実用上多大の効
果を有する。
As detailed above, according to the present invention, it is possible to eliminate the deterioration of adhesive strength, which was a problem when directly mounting a drive IC on a glass substrate of a liquid crystal display using a conductive adhesive. It has many practical effects, such as being effective for drive ICs with finely pitched protruding electrodes and being able to be put into practical use without any modification of the conductive adhesive.
第１図は本考案の実施例を示す平面図、第２図
は第１図の要部断面図、第３図は第１図の要部平
面図、第４図は他の実施例の要部平面図である。
１……液晶表示体、２……ガラス基板、４……
パターン電極群、５……駆動IC、６……駆動IC
の突起電極、７……導電接着剤、８……エポシキ
樹脂。
Fig. 1 is a plan view showing an embodiment of the present invention, Fig. 2 is a sectional view of the main part of Fig. 1, Fig. 3 is a plan view of the main part of Fig. 1, and Fig. 4 is a main part of another embodiment. FIG. 1...Liquid crystal display body, 2...Glass substrate, 4...
Pattern electrode group, 5...drive IC, 6...drive IC
protruding electrode, 7... conductive adhesive, 8... epoxy resin.
Claims (1)
群を有する駆動ICとを備え、駆動ICをガラス基
板に導電性接着剤を用いてフエイスダウンボンデ
イングを行う液晶表示装置において、 導電性接着剤は駆動ICの外側より中心側の広
がり面積を大きくし、導電性接着剤とガラス基板
との接着面積S2は突起電極の外形面積S1の約1.5
倍以上とすることを特徴とする液晶表示装置の駆
動IC実装構造。[Claims for Utility Model Registration] A liquid crystal display device comprising a glass substrate constituting a liquid crystal display body and a drive IC having a group of protruding electrodes, and in which the drive IC is face-down bonded to the glass substrate using a conductive adhesive. In this case, the conductive adhesive has a larger spread area on the center side than on the outside of the drive IC, and the adhesive area S2 between the conductive adhesive and the glass substrate is approximately 1.5 of the external area S1 of the protruding electrode.
A drive IC mounting structure for a liquid crystal display device characterized by having a drive IC mounting structure of a liquid crystal display device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986006698U JPH0447739Y2 (en) | 1986-01-21 | 1986-01-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986006698U JPH0447739Y2 (en) | 1986-01-21 | 1986-01-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62118266U JPS62118266U (en) | 1987-07-27 |
| JPH0447739Y2 true JPH0447739Y2 (en) | 1992-11-11 |
Family
ID=30789455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986006698U Expired JPH0447739Y2 (en) | 1986-01-21 | 1986-01-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0447739Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2574369B2 (en) * | 1988-03-07 | 1997-01-22 | 松下電器産業株式会社 | Semiconductor chip mounted body and mounting method thereof |
| JP2826049B2 (en) * | 1992-11-18 | 1998-11-18 | 松下電子工業株式会社 | Semiconductor device and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59189626U (en) * | 1984-03-15 | 1984-12-15 | セイコーエプソン株式会社 | LCD display device for wristwatches |
-
1986
- 1986-01-21 JP JP1986006698U patent/JPH0447739Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62118266U (en) | 1987-07-27 |
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