JPH0446667A - Reflow device - Google Patents
Reflow deviceInfo
- Publication number
- JPH0446667A JPH0446667A JP15476190A JP15476190A JPH0446667A JP H0446667 A JPH0446667 A JP H0446667A JP 15476190 A JP15476190 A JP 15476190A JP 15476190 A JP15476190 A JP 15476190A JP H0446667 A JPH0446667 A JP H0446667A
- Authority
- JP
- Japan
- Prior art keywords
- heating chamber
- nitrogen gas
- substrate
- conveyor
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 39
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910001873 dinitrogen Inorganic materials 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 239000007789 gas Substances 0.000 claims abstract description 18
- 239000002904 solvent Substances 0.000 claims abstract description 18
- 229910000679 solder Inorganic materials 0.000 abstract description 22
- 239000006071 cream Substances 0.000 abstract description 18
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はリフロー装置に関し、詳しくは、密閉されたチ
ッソガス雰囲気中において、クリーム半田の加熱処理を
行うにあたり、クリーム半田から蒸発した溶剤ガスを吸
着除去しながら、クリーム半田の加熱処理を行うように
したものである。Detailed Description of the Invention (Industrial Field of Application) The present invention relates to a reflow apparatus, and more specifically, the present invention relates to a reflow apparatus that adsorbs solvent gas evaporated from cream solder during heat treatment of cream solder in a sealed nitrogen gas atmosphere. The cream solder is heated while being removed.
（従来の技術）
基板に電子部品を表面実装するにあたっては、基板に形
成された銅箔などの回路パターンの電極部にクリーム半
田を塗布し、このクリーム半田上に電子部品を接着した
後、この基板をリフロー装置へ送り、クリーム半田の加
熱処理が行われる。(Prior art) When surface mounting electronic components on a board, cream solder is applied to the electrodes of a circuit pattern such as copper foil formed on the board, and the electronic components are bonded onto the cream solder. The board is sent to a reflow machine, and the cream solder is heated.
従来、このような半田の加熱処理は、大気中で行われて
いたが、大気中にあっては、銅箔などから成る回路パタ
ーンやクリーム半田が加熱されて酸化しやすく、酸化す
ると半田のヌレ性が低下し、電子部品を基板に良好に接
着できなくなりやすい問題があった。Conventionally, such heat treatment of solder was performed in the atmosphere, but circuit patterns made of copper foil and cream solder are easily heated and oxidized in the atmosphere, and when oxidized, the solder becomes wet. There was a problem in that the adhesiveness of the electronic component deteriorated and the electronic component could not be properly bonded to the substrate.
その改善策として、回路パターンやクリーム半田が酸化
する虞れのないチッソガス雰囲気中において、加熱処理
を行うリフロー手段が提案されている。As an improvement measure, a reflow method has been proposed in which heat treatment is performed in a nitrogen gas atmosphere where there is no risk of oxidation of the circuit pattern or cream solder.
（発明が解決しようとする手段）
しかしながらチッソガス雰囲気中のリフローは、密室中
若しぐは略密室中で行われることから、リフローの進行
にともなって、クリーム半田から蒸発した溶剤ガスは加
熱室内に充満し、加熱室内の溶剤ガス濃度は次第に高く
なって飽和状態となり、その結果、クリーム半田中の溶
剤が蒸発しにくくなるとともに、ガスが液化して基板上
に凝集し、半田の品質劣化の要因になっていた。(Means to be Solved by the Invention) However, since reflow in a nitrogen gas atmosphere is performed in a closed room or a nearly closed room, as the reflow progresses, the solvent gas evaporated from the cream solder enters the heating chamber. The concentration of solvent gas in the heating chamber gradually increases until it becomes saturated, which makes it difficult for the solvent in the solder cream to evaporate, and the gas liquefies and aggregates on the board, causing deterioration of solder quality. It had become.
そこで本発明は、上記のような問題を解消できるリフロ
ー装置を提供することを目的とする。Therefore, an object of the present invention is to provide a reflow apparatus that can solve the above problems.
（課題を解決するための手段）
このために本発明は、ヒータが配設された加熱室と、こ
の加熱室内に基板を搬送するコンベヤと、この加熱室に
チッソガスを供給するチッソガス供給部と、加熱室内の
チッソガスを循環させる循環路と、この循環路に設けら
れてチッソガス中に含まれる溶剤ガスを吸着除去するフ
ィルターとからリフロー装置を構成したものである。(Means for Solving the Problems) To this end, the present invention provides a heating chamber in which a heater is disposed, a conveyor for conveying a substrate into this heating chamber, a nitrogen gas supply unit that supplies nitrogen gas to this heating chamber, The reflow apparatus is composed of a circulation path for circulating nitrogen gas in a heating chamber, and a filter provided in this circulation path for adsorbing and removing solvent gas contained in the nitrogen gas.
（作用）
上記構成において、加熱処理中に、クリーム半田中の溶
剤は蒸発してガスになるが、この溶剤ガスは循環路中の
フィルターに吸着除去されることから、加熱室内のガス
濃度が異常に高（なるのは防止される。(Function) In the above configuration, during heat treatment, the solvent in the cream solder evaporates and becomes gas, but this solvent gas is adsorbed and removed by the filter in the circulation path, resulting in an abnormal gas concentration in the heating chamber. High (prevented from becoming high).
（実施例） 次に図面を参照しながら本発明の詳細な説明する。(Example) Next, the present invention will be described in detail with reference to the drawings.
第１図はリフロー装置の正面図であって、１は本体ボッ
クスであり、その内部に加熱室２が設けられている。こ
の加熱室２は、予熱ゾーン３、均熱ゾーン４、リフロー
ゾーン５に区画され、ている。また加熱室２の土壁には
、チッソガス供給部６が形成されており、このチッソガ
ス供給部６から加熱室２内にチッソガスが供給される。FIG. 1 is a front view of the reflow apparatus, with reference numeral 1 indicating a main body box, in which a heating chamber 2 is provided. This heating chamber 2 is divided into a preheating zone 3, a soaking zone 4, and a reflow zone 5. Further, a nitrogen gas supply section 6 is formed in the earthen wall of the heating chamber 2, and nitrogen gas is supplied into the heating chamber 2 from this nitrogen gas supply section 6.
７は加熱室２の内部に配設された基板８を搬送するコン
ベヤ、９はファン、１０はヒータ、１１は加熱室２の入
口部、１２は出口部である。基板８には、クリーム半田
により電子部品２７が接着されている。7 is a conveyor for conveying the substrate 8 disposed inside the heating chamber 2, 9 is a fan, 10 is a heater, 11 is an inlet of the heating chamber 2, and 12 is an outlet. An electronic component 27 is bonded to the board 8 using cream solder.
１３．１４は基板８をコンベヤ７に移送する搬送コンベ
ヤ、２８．２９はコンベヤ７から搬出する搬出コンベヤ
である。加熱室２の入口部１１と出口部１２には、シリ
ンダ（図示せず）にて駆動されて開閉するシャ・７ター
１５．１６゜１７．１８と、開閉を指示するセンサ１９
，２０．２１．２２が設けられている。センサとしては
、例えば光電管などが使用される。これらのシャ、ター
１５〜１８は、加熱室２内のチッソガスが流出するのを
防止する。13.14 is a transport conveyor that transfers the substrate 8 to the conveyor 7, and 28.29 is a carry-out conveyor that carries out the substrate 8 from the conveyor 7. At the inlet 11 and outlet 12 of the heating chamber 2, there are shutters 15.16° 17.18 that are driven by cylinders (not shown) to open and close, and sensors 19 that instruct opening and closing.
, 20.21.22 are provided. For example, a phototube is used as the sensor. These shutters 15 to 18 prevent the nitrogen gas in the heating chamber 2 from flowing out.
加熱室２内には、チッソガスの循環路２３が２カ所設け
られている。夫々の循環路２３にはファン２４と溶剤ガ
スを吸着除去するフィルター２５が設けられており、フ
ァン２４が回転すると、加熱室２内のチッソガスは循環
する。フィルターとしては、例えば活性炭、ゼオライト
等が使用される。Inside the heating chamber 2, two nitrogen gas circulation paths 23 are provided. Each circulation path 23 is provided with a fan 24 and a filter 25 for adsorbing and removing solvent gas, and when the fan 24 rotates, the nitrogen gas in the heating chamber 2 is circulated. As the filter, activated carbon, zeolite, etc. are used, for example.
このリフロー装置は上記のような構成より成り、次に動
作を説明する。This reflow apparatus has the above-mentioned configuration, and its operation will be explained next.
コンベヤ１３上の基板８をセンサ１９が検出すると、シ
ャッター１５は開き、基板８はコンベヤ１４へ移送され
る。次いでセンサ２０が基板８を検出するとシャッター
１６は開き、基板８はコンベヤ７へ移送される。基板８
が通過すると、こられのシャッター１５．１６は閉じて
、加熱室２内のチッソガスが入口部１１から流出するの
を防止する。When the sensor 19 detects the substrate 8 on the conveyor 13, the shutter 15 is opened and the substrate 8 is transferred to the conveyor 14. Next, when the sensor 20 detects the substrate 8, the shutter 16 is opened and the substrate 8 is transferred to the conveyor 7. Board 8
, these shutters 15 and 16 close to prevent the nitrogen gas in the heating chamber 2 from flowing out from the inlet 11.
基板８はコンベヤ７により搬送されながら、徐々に加熱
され、クリーム半田は溶融する。クリーム半田が加熱さ
れると、このクリーム半田に含まれる溶剤はガス化して
蒸発するが、この溶剤ガスは循環路２３を循環し、フィ
ルター２５に吸着除去される。したがって加熱室２内の
溶剤ガス濃度が異常に高くなって、クリーム半田中の溶
剤が蒸発しにくくなったり、ガスが基板８上に凝集する
ことはない。次いでセンサ２１が基板８を検出すると、
シャッター１７は開いて、基板８はコンベヤ２８へ移送
され、次いでセンサ２２が基板８を検出すると、シャッ
ター１８は開き、基板８はコンベヤ２９に搬出され、ま
た基板８が通過すると、これらのシャツター１７．１８
は閉じる。The substrate 8 is gradually heated while being conveyed by the conveyor 7, and the cream solder is melted. When the cream solder is heated, the solvent contained in the cream solder gasifies and evaporates, but this solvent gas circulates through the circulation path 23 and is adsorbed and removed by the filter 25. Therefore, the concentration of the solvent gas in the heating chamber 2 will not become abnormally high, and the solvent in the cream solder will not evaporate easily, and the gas will not aggregate on the substrate 8. Next, when the sensor 21 detects the board 8,
The shutter 17 is opened and the substrate 8 is transferred to the conveyor 28, and then when the sensor 22 detects the substrate 8, the shutter 18 is opened and the substrate 8 is transferred to the conveyor 29, and as the substrate 8 passes, these shutters 17 .18
closes.
（発明の効果）−
以上説明したように本発明は、ヒータが配設された加熱
室と、この加熱室２内に基板を搬送するコンベヤと、こ
の加熱室にチッソガスを供給するチッソガス供給部と、
加熱室内のチッソガスを循環させる循環路と、この循環
路に設けられて、チッソガス中に含まれる溶剤ガスを吸
着除去するフィルターとからリフロー装置を構成してい
るので、加熱室内の溶剤ガス濃度が異常に高くなるのは
防止され、チッソガス雰囲気中において、クリーム半田
を良好に加熱処理することができる。(Effects of the Invention) - As explained above, the present invention includes a heating chamber in which a heater is disposed, a conveyor that conveys a substrate into this heating chamber 2, and a nitrogen gas supply section that supplies nitrogen gas to this heating chamber. ,
The reflow device consists of a circulation path that circulates nitrogen gas in the heating chamber, and a filter installed in this circulation path that adsorbs and removes the solvent gas contained in the nitrogen gas, so there is no abnormal concentration of solvent gas in the heating chamber. This prevents the solder from becoming too high, and the cream solder can be satisfactorily heat-treated in a nitrogen gas atmosphere.
図は本発明の実施例を示すものであって、第１図はリフ
ロー装置の正面図である。
２・・・加熱室
６・・・チッソガス供給部
７・・・コンベヤ
８・・・基板
１０・・・ヒータ
２３・・・循環路
２５・ ・ ・フィルターThe drawings show an embodiment of the present invention, and FIG. 1 is a front view of a reflow apparatus. 2...Heating chamber 6...Nitrogen gas supply section 7...Conveyor 8...Substrate 10...Heater 23...Circulation path 25...Filter
Claims (1)
搬送するコンベヤと、この加熱室にチッソガスを供給す
るチッソガス供給部と、加熱室内のチッソガスを循環さ
せる循環路と、この循環路に設けられて、チッソガス中
に含まれる溶剤ガスを吸着除去するフィルターとから成
ることを特徴とするリフロー装置。A heating chamber in which a heater is installed, a conveyor for conveying a substrate into this heating chamber, a nitrogen gas supply section for supplying nitrogen gas to this heating chamber, a circulation path for circulating nitrogen gas in the heating chamber, and a and a filter that adsorbs and removes solvent gas contained in nitrogen gas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15476190A JPH0446667A (en) | 1990-06-13 | 1990-06-13 | Reflow device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15476190A JPH0446667A (en) | 1990-06-13 | 1990-06-13 | Reflow device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0446667A true JPH0446667A (en) | 1992-02-17 |
Family
ID=15591319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15476190A Pending JPH0446667A (en) | 1990-06-13 | 1990-06-13 | Reflow device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0446667A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997043884A1 (en) * | 1996-05-15 | 1997-11-20 | Matsushita Electric Industrial Co., Ltd. | Reflow soldering device |
| US6501051B1 (en) * | 1999-08-23 | 2002-12-31 | Radient Technology Corp. | Continuous-conduction wafer bump reflow system |
| WO2008047639A1 (en) * | 2006-10-11 | 2008-04-24 | Nikki-Universal Co., Ltd. | Purifying catalyst for gas within reflow furnace, method for preventing contamination of reflow furnace, and reflow furnace |
| US7478540B2 (en) | 2001-10-26 | 2009-01-20 | Brooks Automation, Inc. | Methods of freezeout prevention and temperature control for very low temperature mixed refrigerant systems |
| US7914595B2 (en) | 2005-02-07 | 2011-03-29 | Senju Metal Industry Co., Ltd. | Fume removal method for a reflow furnace and a reflow furnace |
| US9335070B2 (en) | 2008-09-10 | 2016-05-10 | Panasonic Healthcare Holdings Co., Ltd. | Refrigerating apparatus |
-
1990
- 1990-06-13 JP JP15476190A patent/JPH0446667A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997043884A1 (en) * | 1996-05-15 | 1997-11-20 | Matsushita Electric Industrial Co., Ltd. | Reflow soldering device |
| US6120585A (en) * | 1996-05-15 | 2000-09-19 | Matsushita Electric Industrial Co., Ltd. | Reflow soldering device |
| US6501051B1 (en) * | 1999-08-23 | 2002-12-31 | Radient Technology Corp. | Continuous-conduction wafer bump reflow system |
| US7478540B2 (en) | 2001-10-26 | 2009-01-20 | Brooks Automation, Inc. | Methods of freezeout prevention and temperature control for very low temperature mixed refrigerant systems |
| US7914595B2 (en) | 2005-02-07 | 2011-03-29 | Senju Metal Industry Co., Ltd. | Fume removal method for a reflow furnace and a reflow furnace |
| WO2008047639A1 (en) * | 2006-10-11 | 2008-04-24 | Nikki-Universal Co., Ltd. | Purifying catalyst for gas within reflow furnace, method for preventing contamination of reflow furnace, and reflow furnace |
| JP5330831B2 (en) * | 2006-10-11 | 2013-10-30 | 日揮ユニバーサル株式会社 | Reflow furnace gas purification catalyst, reflow furnace contamination prevention method, and reflow furnace |
| US8883667B2 (en) | 2006-10-11 | 2014-11-11 | Nikki-Universal Co., Ltd. | Purification catalyst for reflow furnace gas, method for preventing contamination of reflow furnace, and reflow furnace |
| US9335070B2 (en) | 2008-09-10 | 2016-05-10 | Panasonic Healthcare Holdings Co., Ltd. | Refrigerating apparatus |
| US9360238B2 (en) | 2008-09-10 | 2016-06-07 | Panasonic Healthcare Holdings Co., Ltd. | Refrigerating apparatus |
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