JPH0445281A - Production of electroless plated resin molded body - Google Patents
Production of electroless plated resin molded bodyInfo
- Publication number
- JPH0445281A JPH0445281A JP15172290A JP15172290A JPH0445281A JP H0445281 A JPH0445281 A JP H0445281A JP 15172290 A JP15172290 A JP 15172290A JP 15172290 A JP15172290 A JP 15172290A JP H0445281 A JPH0445281 A JP H0445281A
- Authority
- JP
- Japan
- Prior art keywords
- molded body
- resin molded
- electroless plating
- electroless
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 28
- 229920005989 resin Polymers 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000007772 electroless plating Methods 0.000 claims abstract description 24
- 238000004544 sputter deposition Methods 0.000 claims abstract description 11
- 238000005530 etching Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 abstract description 38
- 230000003213 activating effect Effects 0.000 abstract description 8
- 230000001235 sensitizing effect Effects 0.000 abstract description 8
- 238000011282 treatment Methods 0.000 abstract description 6
- 229910001385 heavy metal Inorganic materials 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 4
- 239000002699 waste material Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 description 17
- 239000011248 coating agent Substances 0.000 description 15
- 238000007747 plating Methods 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 239000004033 plastic Substances 0.000 description 7
- 229920003023 plastic Polymers 0.000 description 7
- 238000009713 electroplating Methods 0.000 description 6
- -1 polyethylene terephthalate Polymers 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- JVTAAEKCZFNVCJ-REOHCLBHSA-N L-lactic acid Chemical compound C[C@H](O)C(O)=O JVTAAEKCZFNVCJ-REOHCLBHSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L sodium carbonate Substances [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- PVGBHEUCHKGFQP-UHFFFAOYSA-N sodium;n-[5-amino-2-(4-aminophenyl)sulfonylphenyl]sulfonylacetamide Chemical compound [Na+].CC(=O)NS(=O)(=O)C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 PVGBHEUCHKGFQP-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、無電解めっき樹脂成形体の製造方法の改良に
関するものである。さらに詳しくいえば、本発明は、所
望の樹脂成形体の表面に高周波スパッタリングによりエ
ツチング処理を施すことにより、従来無電解めっきにお
いて必要とされていた、重金属を用いる煩雑な工程であ
るセンシタイジング工程やアクチベーティング工程を省
略して、無電解めっき樹脂成形体を生産性よく、経済的
に有利に製造する方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an improvement in a method for producing an electroless plated resin molded article. More specifically, the present invention etches the surface of a desired resin molded body by high-frequency sputtering, thereby eliminating the sensitizing process, which is a complicated process using heavy metals that was previously required in electroless plating. The present invention relates to a method for manufacturing an electroless plated resin molded article with good productivity and economically by omitting the activating step.
従来の技術
従来、グラスチック成形品を加飾する方法の１つとして
メタライズ加工が知られている。このメタライズ加工は
、プラスチック成形品に外観上金属感をもたらすととも
に、グラスチック自体の耐熱性や耐久性などを向上させ
る上、導電性を付与しうるなどの特徴を有することから
、装飾や工芸用途、さらにはＯＡ機器などの電磁波ンー
ルド用途などに広く用いられている。BACKGROUND ART Conventionally, metallization processing has been known as one of the methods for decorating glass molded products. This metallization process not only gives plastic molded products a metallic appearance, but also improves the heat resistance and durability of the plastic itself, as well as imparting electrical conductivity, making it useful for decoration and crafts. Furthermore, it is widely used in electromagnetic wave applications such as OA equipment.
このメタライズ加工法としては、例えば無電解めっき（
化学めっき）−電気めっき法、真空蒸着法、スパッタリ
ング法、イオンめっき法、ホットスタンピング法、金属
粉混合塗装法、成形材料への金属粉混合法などが挙げら
れるが、これらの中で無電解めっき一電気めっき法が多
用されている。For example, electroless plating (
Chemical plating) - Electroplating method, vacuum evaporation method, sputtering method, ion plating method, hot stamping method, metal powder mixed coating method, method of mixing metal powder into molding material, etc. Among these, electroless plating One electroplating method is frequently used.
プラスチック成形品へのめっきは、通常プラスチック自
体はとんど導電性を有していないので、まず無電解めっ
きにより、表面に銅やニッケルなどの被覆を設けたのち
、この下地を電極として電気めっきを施し、各種金属の
被覆を設けるといっｔ；方法が用いられている。When plating plastic molded products, the plastic itself is usually not very conductive, so first a coating of copper or nickel is applied to the surface using electroless plating, and then electroplating is performed using this base as an electrode. Methods such as applying coatings and coating with various metals are used.
従来、プラスチック成形品の表面に無電解めっきを施す
には（１）センシタイジング（ケミカルエツチング）工
程、（２）アクチベーティング（活性化処理）工程及び
（３）無電解めっき工程の３種の工程を基本とし、さら
にその中間に洗浄や乾燥などの工程が入っていることか
ら、通常１０工程以上が必要とされている。Conventionally, there are three types of electroless plating processes to apply electroless plating to the surface of plastic molded products: (1) sensitizing (chemical etching) process, (2) activating process, and (3) electroless plating process. Generally, 10 or more steps are required, as the process is based on the following steps, and there are additional steps such as washing and drying in between.
前記（１）及び（２）の工程は、無電解めっきの開始と
進行に必要なりロム、スズ、パラジウムなどの重金属種
を成形品表面に付着させるための必須工程であって、そ
の廃液処理などの工程を伴う。The steps (1) and (2) above are necessary for the start and progress of electroless plating, and are essential steps for attaching heavy metal species such as ROM, tin, and palladium to the surface of the molded product, and include waste liquid treatment, etc. It involves the process of
このようなことから、従来のプラスチック成形品の無電
解めっきは、技術を有する専門メーカーに委託するのが
一般的で、誰もが容易に行えるというものではなく、さ
らに適用できる樹脂も制限されるのを免れなかった。For this reason, conventional electroless plating of plastic molded products is generally outsourced to specialized manufacturers who have the technology, and not everyone can do it easily, and there are also restrictions on the resins that can be applied. I couldn't escape it.
発明が解決しようとする課題
本発明は、このような事情のもとで、センシタイジング
工程やアクチベーティング工程及びそれらに伴う廃液処
理工程も必要とせず、熟練者以外でも容易に行いうる上
、任意の樹脂成形体に適用可能な生産性に優れた無電解
めっき樹脂成形体の製造方法を提供することを目的とし
てなされたものである。Problems to be Solved by the Invention Under these circumstances, the present invention does not require a sensitizing process, an activating process, or a waste liquid treatment process associated with them, and can be easily performed even by non-experts. The purpose of the present invention is to provide a method for producing an electroless plated resin molded body with excellent productivity and which can be applied to any resin molded body.
課題を解決するための手段
本発明者らは、前記目的を達成するために鋭意研究を重
ねた結果、樹脂成形体の表面を高周波スパッタリングに
よりエツチング処理することにより、センシタイジング
工程及びアクチベーティング工程を必要とせず、直接無
電解めっきを施すことができ、その目的を達成しうろこ
とを見い出し、この知見に基づいて本発明を完成するに
至った。Means for Solving the Problems In order to achieve the above object, the inventors of the present invention have conducted intensive research and found that the sensitizing process and the activating process can be improved by etching the surface of a resin molded body by high frequency sputtering. It was discovered that electroless plating can be performed directly without the need for any process, and that the objective can be achieved, and the present invention was completed based on this knowledge.
すなわち、本発明は、樹脂成形体の表面を高周波スパッ
タリングによりエツチング処理したのち、該表面に直接
無電解めっきを施すことを特徴とする無電解めっき樹脂
成形体の製造方法を提供するものである。That is, the present invention provides a method for producing an electroless plated resin molded body, which comprises etching the surface of the resin molded body by high-frequency sputtering, and then directly applying electroless plating to the surface.
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
本発明方法が適用される樹脂成形体の種類や形状につい
ては特に制限はなく、任意の形状を有する任意の種類の
樹脂から成る成形体に対して、本発明方法を適用するこ
とができる。There are no particular restrictions on the type or shape of the resin molded article to which the method of the present invention is applied, and the method of the present invention can be applied to molded articles having any shape and made of any type of resin.
本発明においては、前記樹脂成形体の表面に無電解めっ
きを施すに当り、あらかじめ該成形体の表面を高周波ス
パッタリングによりエツチング処理することが必要であ
る。このエツチング処理においては、例えば平行平板を
装置を用い、高周波（１３，５６ＭＨｚ）による放電に
よって、ガスをイオン化加速し、生成したイオン種によ
り、該成形体表面が物理的にエツチングされる。この際
の条件としては、通常圧力は数清ｍＴｏｒｒないし数十
ｍｍＴｏｒｒの範囲で選ばれ、出力は数十Ｗないし数百
Ｗの範囲で選ばれる。また、処理時間は樹脂成形体の形
態（フィルム、シート、構造物など）や耐熱性などに左
右され、−概に定めることができないが、通常数分ない
し数十分程度である。さらにガスの種類については、高
周波による放電でイオン化可能なものであればよく、特
に制限はないが、通常アルゴンやヘリウムなどの不活性
ガスが好ましく用いられる。In the present invention, before applying electroless plating to the surface of the resin molded body, it is necessary to etching the surface of the molded body by high frequency sputtering in advance. In this etching process, for example, a parallel plate device is used to accelerate ionization of gas by high frequency (13.56 MHz) discharge, and the surface of the molded body is physically etched by the generated ion species. As conditions at this time, the pressure is usually selected in the range of several tens of mTorr to several tens of mmTorr, and the output is selected in the range of several tens of W to several hundred W. Further, the processing time depends on the form of the resin molded article (film, sheet, structure, etc.), heat resistance, etc., and cannot be determined generally, but it is usually about several minutes to several tens of minutes. Furthermore, the type of gas is not particularly limited as long as it can be ionized by high-frequency discharge, but inert gases such as argon and helium are usually preferably used.
なお、特開昭５９−１１３３６号公報記載の方法は、プ
ラズマエツチングの条件下、反応性ガス（酸素など）で
樹脂表面を化学反応（０□＋Ｃ−ＣＯ２など）によりエ
ツチングする方法であって、本発明方法とは根本的に異
なる。Note that the method described in JP-A-59-11336 is a method in which the resin surface is etched by a chemical reaction (0□+C-CO2, etc.) with a reactive gas (oxygen, etc.) under plasma etching conditions. This method is fundamentally different from the method of the present invention.
このようにして、プラスチック成形体表面を高周波スパ
ッタリングによりエツチング処理することにより、該表
面は深く（通常０．１μｍ以上）エツチングされ、通常
の無電解めっき工程で必要なセンシタイジング及びアク
チベーティング処理を施さなくとも、直接無電解めっき
を行うことができる。In this way, by etching the surface of the plastic molded body by high-frequency sputtering, the surface is etched deeply (usually 0.1 μm or more) and undergoes the sensitizing and activating treatments required in the normal electroless plating process. Electroless plating can be performed directly without applying.
この無電解めっきの方法については、特に制限はなく、
従来の無電解めっきにおいて慣用されている方法を用い
ることができる。例えば、化学銅めっき液や化学ニッケ
ルめっき液などの被覆となる金属を含む化学めっき液中
に、前記のようにしてエツチング処理された樹脂成形体
を、通常２０〜５０℃の温度にて５分ないし６０分間人
工浸せきすることにより、該成形体の表面に強固５こ密
着した金属被覆が形成される。There are no particular restrictions on this electroless plating method.
A method commonly used in conventional electroless plating can be used. For example, the resin molded body that has been etched as described above is placed in a chemical plating solution containing a metal to be coated, such as a chemical copper plating solution or a chemical nickel plating solution, for 5 minutes at a temperature of usually 20 to 50°C. By performing artificial immersion for 60 minutes, a metal coating is formed that tightly adheres to the surface of the molded product.
このようにして樹脂成形体は、その表面に金属被覆が設
けられ、導電性が付与されるので、該金属被覆の上に容
易に電気めっきを施すことができる。この電気めっきに
より、単層金属被覆や多層金属被覆が設けられるが、該
金属被覆の構成は用途に応じて適宜選ぶことができ、例
えば意匠上の加飾を目的とする場合には、通常鋼めっき
、ニッケルめっき及びクロムめっきの順に電気めっきが
施され、多層金属被覆が設けられる。In this way, the resin molded body is provided with a metal coating on its surface and is imparted with electrical conductivity, so that electroplating can be easily performed on the metal coating. This electroplating provides a single-layer metal coating or a multi-layer metal coating, but the structure of the metal coating can be selected as appropriate depending on the application. Electroplating is performed in the order of plating, nickel plating and chrome plating to provide a multilayer metal coating.
発明の効果
本発明によると、樹脂成形体の表面を高周波スパッタリ
ングによりエツチング処理することにより、従来無電解
めっきにおいて必要とされていた重金属を用いる煩雑な
工程であるセンシタイジング工程やアクチベーティング
工程、及びそれらに伴う廃液処理工程を必要とせず、直
接無電解めっきを行いうるので、樹脂の種類に関係なく
、かつ誰でも容易に無電解めっき樹脂成形体を極めて生
産性よく製造することができる。Effects of the Invention According to the present invention, by etching the surface of a resin molded body by high-frequency sputtering, the sensitizing process and the activating process, which are complicated processes using heavy metals that were conventionally required in electroless plating, can be eliminated. Since electroless plating can be performed directly without the need for , or the accompanying waste liquid treatment process, anyone can easily produce electroless plated resin molded objects with extremely high productivity, regardless of the type of resin. .
本発明方法で得られた無電解めっき樹脂成形体は、その
ままでも高い導電性を有するので電磁波シールド材分野
に用いることができるが、これに、さらに電気めっきを
施したものは、例えば装飾・工芸分野、電気・電子材料
分野などに好適に用いられる。The electroless plated resin molded body obtained by the method of the present invention has high conductivity as it is, so it can be used in the field of electromagnetic shielding materials, but it can be further electroplated, for example, for decoration and crafts. It is suitably used in the fields of electrical and electronic materials, etc.
実施例
次に、実施例により本発明をさらに詳細に説明するが、
本発明はこれらの例によってなんら限定されるものでは
ない。Examples Next, the present invention will be explained in more detail with reference to examples.
The present invention is not limited in any way by these examples.
実施例１
平行平板電極の高周波スパッタリング装置を用い、圧力
２ｍｍＴｏｒｒ、出力５００Ｗの条件で、１３．５６Ｍ
Ｈｚの高周波によりアルゴンガスをイオン化させ、膜厚
５０μ亀のポリエチレンテレフタレートフィルムの表面
を１５分間エツチング処理した。処理フィルムは薄い茶
色を呈しているが、外観は未処理のものとほとんど変わ
らなかった。Example 1 Using a high frequency sputtering device with parallel plate electrodes, under the conditions of a pressure of 2 mm Torr and an output of 500 W, 13.56 M
Argon gas was ionized using high frequency waves of Hz, and the surface of a polyethylene terephthalate film having a thickness of 50 μm was etched for 15 minutes. Although the treated film had a light brown color, its appearance was almost the same as that of the untreated film.
次いで、このエツチング処理ポリエチレンテレフタレー
トフィルムを、無電解銅めっき浴（組成二ロッセル塩３
４ｇ／ Ｑ、水酸化ナトリウムｌｈ／Ｑ。Next, this etched polyethylene terephthalate film was coated in an electroless copper plating bath (composition: 2 Rossell's salt, 3
4g/Q, sodium hydroxide lh/Q.
硫酸銅７９／４、炭酸ナトリウム６ ｙ／ Ｑ、ホルマ
リン５０ｍ１２／１１）に浸せきし、３０−４０℃で３
０分間無電解銅めっきを行った。穏やかに反応が進行し
、膜面は薄い黒ずんだ色から、徐々ｌこ赤銅色を呈する
ようになっｔ：。３０分後、引き上げ、水洗、乾燥した
ところ、被覆は均質で銅色を呈し、密着強度はセロテー
プの剥離テストに耐えるほどで堅固であった。形成され
た銅の膜厚は約０．２μｍであっＩ；。Soak in copper sulfate 79/4, sodium carbonate 6 y/Q, formalin 50 m 12/11) and heat at 30-40℃ for 3
Electroless copper plating was performed for 0 minutes. The reaction progressed slowly, and the film surface gradually changed from a pale dark color to a coppery red color. After 30 minutes, the coating was pulled up, washed with water, and dried. The coating was homogeneous and had a copper color, and the adhesion strength was strong enough to withstand a Sellotape peel test. The thickness of the copper film formed was approximately 0.2 μm.
比較例１
基材として、エツチング処理していないポリエチレンテ
レフタレートフィルムを用いて、実施例１の条件で直接
無電解めっきを試みたところ、銅被覆は全く形成されな
かった。Comparative Example 1 Direct electroless plating was attempted under the conditions of Example 1 using an unetched polyethylene terephthalate film as a base material, but no copper coating was formed.
実施例２
実施例１において、無電解銅めっき浴の代りに、無電解
ニッケルアルカリめっき浴（組成：硫酸ニッケル１５ｅ
／Ｌク工ン酸ナトリウム４５ｇ／Ｌ次亜リン酸ナトリウ
ムｌＯｙ／Ｌ乳酸３ｍ＋２／（＋）を用い、かつｐＨ８
、温度５０°Ｃの条件で３０分間無電解めっきを行った
以外は、実施例１と同様な操作を行った。Example 2 In Example 1, an electroless nickel alkaline plating bath (composition: nickel sulfate 15e) was used instead of the electroless copper plating bath.
/L sodium citrate 45g/L sodium hypophosphite lOy/L lactic acid 3m+2/(+), and pH 8
The same operation as in Example 1 was performed except that electroless plating was performed for 30 minutes at a temperature of 50°C.
形成された被覆は均質で、通常の金属ニッケルの光沢を
呈し、膜厚は０．３μｍであった。The coating formed was homogeneous, had the usual metallic nickel luster, and had a film thickness of 0.3 μm.
比較例２
基材として、エツチング処理していないポリエチレンテ
レフタレートフィルムを用いた以外は、実施例２と同様
な操作を行ったところ、ニッケル被覆は全く形成されな
かった。Comparative Example 2 The same operation as in Example 2 was performed, except that a non-etched polyethylene terephthalate film was used as the base material, but no nickel coating was formed.
実施例３
実施例１において、ポリエチレンテレフタレートフィル
ムの代りに、輻２ｃｒｔｒ、長さ１ＯｃＩ１１、厚さ５
１のポリプロピレンの射出成形品を用いた以外は、実施
例１と同様な操作を行ったところ、膜厚０．２５μｍの
均質な銅被覆が形成されていた。Example 3 In Example 1, instead of the polyethylene terephthalate film, a diameter of 2crtr, a length of 1OcI11, and a thickness of 5 was used.
When the same operation as in Example 1 was performed except that the polypropylene injection molded product No. 1 was used, a homogeneous copper coating with a thickness of 0.25 μm was formed.
Claims (1)
ッチング処理したのち、該表面に直接無電解めっきを施
すことを特徴とする無電解めっき樹脂成形体の製造方法
。1. A method for producing an electroless plated resin molded body, which comprises etching the surface of the resin molded body by high-frequency sputtering, and then directly applying electroless plating to the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15172290A JPH0445281A (en) | 1990-06-12 | 1990-06-12 | Production of electroless plated resin molded body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15172290A JPH0445281A (en) | 1990-06-12 | 1990-06-12 | Production of electroless plated resin molded body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0445281A true JPH0445281A (en) | 1992-02-14 |
Family
ID=15524857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15172290A Pending JPH0445281A (en) | 1990-06-12 | 1990-06-12 | Production of electroless plated resin molded body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0445281A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6265075B1 (en) | 1999-07-20 | 2001-07-24 | International Business Machines Corporation | Circuitized semiconductor structure and method for producing such |
-
1990
- 1990-06-12 JP JP15172290A patent/JPH0445281A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6265075B1 (en) | 1999-07-20 | 2001-07-24 | International Business Machines Corporation | Circuitized semiconductor structure and method for producing such |
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