JPH0442916A - Electron beam aligner - Google Patents

Electron beam aligner

Info

Publication number
JPH0442916A
JPH0442916A JP14784290A JP14784290A JPH0442916A JP H0442916 A JPH0442916 A JP H0442916A JP 14784290 A JP14784290 A JP 14784290A JP 14784290 A JP14784290 A JP 14784290A JP H0442916 A JPH0442916 A JP H0442916A
Authority
JP
Japan
Prior art keywords
shaping
electron beam
shaping aperture
lens
dry plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14784290A
Other languages
Japanese (ja)
Inventor
Tadashi Imoriya
廉 射守矢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP14784290A priority Critical patent/JPH0442916A/en
Publication of JPH0442916A publication Critical patent/JPH0442916A/en
Pending legal-status Critical Current

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  • Electron Beam Exposure (AREA)

Abstract

PURPOSE:To remarkably shorten a time required for regulating the angles of shaping apertures and improve an operation rate by automatically pivoting the shaping apertures so that the current density distribution of an electron beam may be uniform. CONSTITUTION:An electron gun 1, an irradiation lens 2, a first shaping aperture 3, a shaping deflector 4, a shaping lens 5, a second shaping aperture 6, a reduction lens 7, a projection lens 8, and a positioning deflector 9 are arranged in that order from the incidence side and a beam shape inspector 10 and a mask dry plate 11 are arranged thereunder. An electron beam 12 passed through the optical system forms an image on the mask dry plate 11. The shaping aperture 3 and motors 13 are used for pivoting with a neutral value, which is determined when designed, used as a central value. A motor controlling circuit 14 compares current densities 16 and 17 at 0.1 mum inner from the outer beam diameter 15 with each other and pivots the motors 13 so as to minimize the difference. The angles of the shaping apertures are thus regulated and mask pattern is drawn on the mask dry plate and observed for final regulation of the angles.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、半導体集積回路のフォトマスクを製造するた
めに用いられる可変整形ビーム形電子ビーム露光装置に
関する。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a variable shaped beam electron beam exposure apparatus used for manufacturing photomasks for semiconductor integrated circuits.

従来の技術 近年、フォトマスクの製造に電子ビーム冨光装置が広く
用いられるようになってきた。
BACKGROUND OF THE INVENTION In recent years, electron beam enrichment devices have come to be widely used in the production of photomasks.

電子ビーム露光装置には、電子銃より発せられた電子ビ
ームをレンズにて集束し、マスク乾板に照射するスポッ
トビーム形と、レンズにて集束lまた電子ビームを整形
アパーチャと呼ばれるスリットを通過させることにより
、希望の大きさの矩形に電子ビームを整形することので
きる可変整形ビーム形とがある。マスクパターンの微細
化か進むにつれ、調整の容易な可変整形ビーム形電子ビ
ーム露光装置が有利になるものと予想される。
Electron beam exposure equipment has a spot beam type in which the electron beam emitted from an electron gun is focused by a lens and irradiated onto a mask dry plate, and a type in which the electron beam is focused by a lens and passed through a slit called a shaping aperture. There is a variable shaping beam shape that can shape an electron beam into a rectangular shape of a desired size. As mask patterns become finer, it is expected that a variable shaped beam type electron beam exposure apparatus that can be easily adjusted will become advantageous.

第4図に、この可変整形型電子ビーム露光装置の電子光
学系の構成を示す。第4図に示すように、入射側から電
子銃1.照射レンズ2.第一整形アパーチャ3.整形偏
向器4.整形レンズ5.第2整形アパーチヤ6、縮小レ
ンズ7、投影レンズ8、位置決め偏向器9の順に配置さ
れ、その下方にビーム形状測定器10.マスク乾板]1
か配置される。電子ビーム12は上記光学系の中を通っ
てマスク乾板]1に結像する。電子銃】から放出した電
子線を照射レンズ2で集束し、第一整形アパーチャ3に
照射する。ここで矩形電子ビームが形成され、これを整
形偏向器4と整形レンズ5により第二整形アパーチャ6
上の任意の位置に結像させる。この結像位置を変えるこ
とで任意の太きさの矩形ビームを得ることができる。こ
の後、縮小レンズ7、投影レンズ8によりマスク乾板1
1上に結像される。また位置決め偏向器9により電子ビ
ーム12をビーム形状測定器上に結像させ、ビームの形
状を測定することができる。
FIG. 4 shows the configuration of the electron optical system of this variable shaping type electron beam exposure apparatus. As shown in FIG. 4, the electron gun 1. Irradiation lens 2. First shaping aperture 3. Shaping deflector 4. Orthopedic lenses5. A second shaping aperture 6, a reduction lens 7, a projection lens 8, and a positioning deflector 9 are arranged in this order, and a beam shape measuring device 10. Mask dry plate] 1
or placed. The electron beam 12 passes through the optical system and forms an image on the mask dry plate 1. An electron beam emitted from an electron gun is focused by an irradiation lens 2 and irradiated onto a first shaping aperture 3. Here, a rectangular electron beam is formed, which is transmitted to a second shaping aperture 6 by a shaping deflector 4 and a shaping lens 5.
Focus the image on any position above. By changing this imaging position, a rectangular beam of arbitrary thickness can be obtained. After that, the mask dry plate 1 is
The image is formed on 1. Further, the electron beam 12 is imaged on a beam shape measuring device by the positioning deflector 9, and the shape of the beam can be measured.

発明が解決しようとする課題 一般に可変整形ビーム形電子ビーム露光装置の場合、矩
形ビームの各辺は、それぞれマスク乾板上にマスクパタ
ーンを描画する際に設定される座標軸に平行である必要
がある。通常、整形アパーチャは手動またはモータによ
り回動し、矩形電子ビームの各辺が座標軸に平行になる
ようになっている。
Problems to be Solved by the Invention Generally, in the case of a variable shaped beam type electron beam exposure apparatus, each side of the rectangular beam needs to be parallel to the coordinate axes set when drawing a mask pattern on a mask dry plate. Typically, the shaping aperture is rotated manually or by a motor so that each side of the rectangular electron beam is parallel to the coordinate axes.

従来の電子ビーム露光装置では、この整形アパーチャの
角度の調整は、マスク乾板にマスクパターンを描画し、
それを観察した上で行なっていた。
In conventional electron beam exposure equipment, this adjustment of the shaping aperture angle involves drawing a mask pattern on a mask dry plate,
I did it after observing it.

このような方法では、整形アパーチャの角度の調整のた
めに、テストパターンを描画し、それを現像し顕微鏡に
て観察するという作業を何度も繰り返す必要があり、時
間がかかり電子ビーム露光装置の稼働率が低下するとい
う問題点があった。
In this method, in order to adjust the angle of the shaping aperture, it is necessary to draw a test pattern, develop it, and observe it under a microscope, which is a process that is repeated many times, which is time consuming and slows down the electron beam exposure equipment. There was a problem that the operating rate decreased.

本発明は、このような問題点を解決するもので、整形ア
パーチャの角度調整に要する時間を短縮し、稼働率の高
い電子ビーム露光装置を提供することを目的とするもの
である。
The present invention is intended to solve these problems, and aims to provide an electron beam exposure apparatus that reduces the time required to adjust the angle of a shaping aperture and has a high operating rate.

課題を解決するための手段 この目的を達成するために、本発明の電子ビーム露光装
置は、電子ビームの電流密度を最も平均化するように、
ビーム形状測定器の出力信号により作動するモータによ
り整形アパーチャを自動的に回動させ、短時間に電子ビ
ーム形状のツ整を行ない、装置の稼働率を高めるように
したものである。
Means for Solving the Problems In order to achieve this object, the electron beam exposure apparatus of the present invention has the following features:
The shaping aperture is automatically rotated by a motor activated by the output signal of the beam shape measuring device, and the shape of the electron beam can be adjusted in a short time, thereby increasing the operating rate of the device.

作用 この構成によって、整形アパーチャの角度調節を自動的
に行ない角度調節に要する時間を大幅に短縮でき、電子
ビーム露光装置の稼働率を向上させることができる。
Effect: With this configuration, the angle of the shaping aperture can be automatically adjusted, the time required for the angle adjustment can be significantly shortened, and the operating rate of the electron beam exposure apparatus can be improved.

実施例 以下に、本発明の一実施例について図面を参照しながら
説明する。
EXAMPLE An example of the present invention will be described below with reference to the drawings.

第1図に、本発明の一実施例の電子ビーム露光装置の電
子光学系の構成を示す。第2図に示すように、入射側か
ら電子銃1.照射レンズ2.第一整形アパーチャ3.整
形偏向器4.整形レンズ5、第二整形アパーチャ6、縮
小レンズ7、投影レンズ81位置決め偏向器9の順に配
置され、その下方にビーム形状測定器10.マスク乾板
11が配置される。電子ビーム12は上記光学系の中を
通って、マスク乾板11上に結像する。これらの構成は
従来の電子ビーム露光装置と同じであるが、整形アパー
チャ回動用モータ13とモータ制御回路部14が付加さ
れている。以上のように構成された電子ビーム露光装置
について、以下にその動作を説明する。
FIG. 1 shows the configuration of an electron optical system of an electron beam exposure apparatus according to an embodiment of the present invention. As shown in FIG. 2, the electron gun 1. Irradiation lens 2. First shaping aperture 3. Shaping deflector 4. A shaping lens 5, a second shaping aperture 6, a reduction lens 7, a projection lens 81 and a positioning deflector 9 are arranged in this order, and a beam shape measuring device 10. A mask dry plate 11 is arranged. The electron beam 12 passes through the optical system and forms an image on the mask drying plate 11. These configurations are the same as those of the conventional electron beam exposure apparatus, but a shaping aperture rotation motor 13 and a motor control circuit section 14 are added. The operation of the electron beam exposure apparatus configured as described above will be described below.

第2図は、ビーム形状測定器10により測定された電子
ビームの電流密度分布波形を示す。この測定には電子ビ
ーム露光装置において通常に用いられる、ナイフェツジ
法を用いた。第2図(A)は、整形アパーチャの角度が
正しく調整されている場合、第2図(B)は正しく調整
されていない場合を示す。整形アパーチャの角度が調整
不足の場合、第2図(B)のように電流密度分布が不均
一であるかのように測定される。整形アパーチャ3およ
びモータ13により、その設計上の中立値を中心に8°
だけ回動できるようになっている。モータ制御用回路部
14はビーム径15よりも0.1μmだけビームの内側
の部分の電流密度16および17を比較しその差が最も
小さくなるようにモータ13を回動させる。このように
して整形アパーチャの角度を調整した後、マスク乾板上
にマスクパターンを描画し、観察することにより角度の
最終調整を行なう。第3図は、整形アパーチャを電子ビ
ーム露光装置にセットしてから、角度の調整が終了する
までに要した時間を示した図で、第3図(A)は、従来
の電子ビーム露光装置の場合、第3図CB)は、本発明
の一実施例の電子ビーム露光装置の場合である。第3図
から明らかなように、本発明による電子ビーム露光装置
は、整形アパーチャの角度m整に要する時間を約ノー/
2に短縮することが可能である。
FIG. 2 shows the current density distribution waveform of the electron beam measured by the beam shape measuring device 10. For this measurement, the Knifezi method, which is commonly used in electron beam exposure equipment, was used. FIG. 2(A) shows a case where the angle of the shaping aperture is adjusted correctly, and FIG. 2(B) shows a case where it is not adjusted correctly. If the angle of the shaping aperture is insufficiently adjusted, the current density distribution will be measured as if it were non-uniform, as shown in FIG. 2(B). By shaping aperture 3 and motor 13, the angle of 8° is centered around its designed neutral value.
It is now possible to rotate only. The motor control circuit section 14 compares the current densities 16 and 17 at a portion inside the beam by 0.1 μm from the beam diameter 15, and rotates the motor 13 so that the difference is minimized. After adjusting the angle of the shaping aperture in this way, the final adjustment of the angle is performed by drawing a mask pattern on a mask dry plate and observing it. Figure 3 is a diagram showing the time required from setting the shaping aperture in the electron beam exposure apparatus to completing the angle adjustment. In this case, FIG. 3 CB) is the case of an electron beam exposure apparatus according to an embodiment of the present invention. As is clear from FIG. 3, the electron beam exposure apparatus according to the present invention takes approximately no.
It is possible to shorten it to 2.

発明の効果 本発明によれば、電子ビームの電流密度分布が最も均一
となるように、整形アパーチャを自動的に回動させるこ
J二により、整形アパーチャの角度調整に要する時間を
大幅に短縮でき、稼働率の高い電子ビーム露光装置を実
現できる。
Effects of the Invention According to the present invention, by automatically rotating the shaping aperture so that the current density distribution of the electron beam becomes most uniform, the time required for adjusting the angle of the shaping aperture can be significantly reduced. , it is possible to realize an electron beam exposure apparatus with high availability.

【図面の簡単な説明】[Brief explanation of the drawing]

第】図は本発明の一実施例の電子ビーム鉦光装置の電子
光学系の構成図、第2図(A)はビーム形状測定器によ
り測定された整形アパーチャの角度が正しくm整されて
いる場合の電子ビームの電流密度分布を示すグラフ、第
2図(B)は同整形アパーチャの角度が正しく調整され
ていない場合の電子ビームの電流密度分布を示すグラフ
、第3図(A)は従来の整形アパーチャの角度調整に要
j−た時間分布を示すグラフ、第3図(B)は本発明の
一実施例の調整アパーチャの角度調整に要した時間分布
を示すグラフ、第4図は従来の電子ビーム露光装置の構
成図である。 3・・・・・・第一整形アパーチャ、4・・・・・・整
形偏向器、5・・・・・・整形1ノンズ、6・・・・・
・第2整形アバ−チャ、JO・・・・・・ビーム形状測
定器、〕、2・・・・・・電子ビーム、コ3・・・・・
・整形アパーチャ回動用モータ、〕−4・・・・・・モ
ーフ制御回路部、15・・・・・・電子ビーム径、16
.18・・・・・・電子ビーム径より0、l 7Jm内
側の電流密度。 代理人の氏名 弁理士 粟野重孝 はか]名り08胃ワ
  斃 任 嗜が禦知受
Figure 2 is a configuration diagram of an electron optical system of an electron beam chromatography device according to an embodiment of the present invention, and Figure 2 (A) shows that the angle of the shaping aperture measured by a beam shape measuring device is adjusted correctly. Figure 2 (B) is a graph showing the current density distribution of the electron beam when the angle of the shaping aperture is not adjusted correctly. Figure 3 (A) is the graph showing the current density distribution of the electron beam when the angle of the shaping aperture is not adjusted correctly. FIG. 3(B) is a graph showing the time distribution required for adjusting the angle of the adjusting aperture according to an embodiment of the present invention, and FIG. 1 is a configuration diagram of an electron beam exposure apparatus of FIG. 3... First shaping aperture, 4... Shaping deflector, 5... Shaping 1 nons, 6...
・Second shaping aperture, JO...beam shape measuring device, ], 2...electron beam, ko3...
・Motor for rotating the shaping aperture, ]-4... Morph control circuit section, 15... Electron beam diameter, 16
.. 18...Current density 0, l 7Jm inside the electron beam diameter. Name of agent: Patent attorney Shigetaka Awano

Claims (1)

【特許請求の範囲】[Claims]  整形アパーチャと、整形偏向器と、整形レンズと、整
形アパーチャ回動用モータと、ビーム形状測定器を備え
、ビーム形状測定器の出力信号により整形アパーチャ回
動用モータを作動させ、整形アパーチャを回動させる電
子ビーム露光装置。
It is equipped with a shaping aperture, a shaping deflector, a shaping lens, a shaping aperture rotation motor, and a beam shape measuring device, and the shaping aperture rotation motor is operated by the output signal of the beam shape measuring device to rotate the shaping aperture. Electron beam exposure equipment.
JP14784290A 1990-06-06 1990-06-06 Electron beam aligner Pending JPH0442916A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14784290A JPH0442916A (en) 1990-06-06 1990-06-06 Electron beam aligner

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14784290A JPH0442916A (en) 1990-06-06 1990-06-06 Electron beam aligner

Publications (1)

Publication Number Publication Date
JPH0442916A true JPH0442916A (en) 1992-02-13

Family

ID=15439489

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14784290A Pending JPH0442916A (en) 1990-06-06 1990-06-06 Electron beam aligner

Country Status (1)

Country Link
JP (1) JPH0442916A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9482358B2 (en) 2013-10-23 2016-11-01 Johnson Electric S.A. Solenoid valve

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9482358B2 (en) 2013-10-23 2016-11-01 Johnson Electric S.A. Solenoid valve

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