JPH0440823Y2 - - Google Patents
Info
- Publication number
- JPH0440823Y2 JPH0440823Y2 JP1985112204U JP11220485U JPH0440823Y2 JP H0440823 Y2 JPH0440823 Y2 JP H0440823Y2 JP 1985112204 U JP1985112204 U JP 1985112204U JP 11220485 U JP11220485 U JP 11220485U JP H0440823 Y2 JPH0440823 Y2 JP H0440823Y2
- Authority
- JP
- Japan
- Prior art keywords
- tank
- water
- purification circuit
- machining fluid
- water tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 94
- 238000003754 machining Methods 0.000 claims description 45
- 239000012530 fluid Substances 0.000 claims description 40
- 238000000746 purification Methods 0.000 claims description 37
- 239000013505 freshwater Substances 0.000 claims description 35
- 239000010865 sewage Substances 0.000 claims description 32
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 claims description 23
- 239000003456 ion exchange resin Substances 0.000 claims description 23
- 229920003303 ion-exchange polymer Polymers 0.000 claims description 23
- 238000005086 pumping Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 3
- 239000002351 wastewater Substances 0.000 description 3
- 239000003792 electrolyte Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009760 electrical discharge machining Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000008400 supply water Substances 0.000 description 1
- 238000009763 wire-cut EDM Methods 0.000 description 1
Landscapes
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Treatment Of Water By Ion Exchange (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は放電加工機による放電加工に必要な加
工液を供給するための加工液供給装置に関し、特
にワイヤカツト放電加工機に使用され、ワークの
材質や加工精度に応じた加工液を供給するのに利
用される。[Detailed description of the invention] (Field of industrial application) The present invention relates to a machining fluid supply device for supplying machining fluid necessary for electrical discharge machining by an electrical discharge machine, and is particularly used for a wire-cut electrical discharge machine, and is used for processing workpieces. It is used to supply machining fluid according to the material and machining accuracy.
（従来技術及びその問題点）
ワイヤカツト放電加工機においては、ワイヤと
ワークとの間で放電を起こさせるために、ワーク
近辺のワイヤを取り囲むようにして加工液を供給
する必要がある。加工液としては、所要の電気伝
導率を有した水が用いられ、このような水が加工
液供給装置から供給され、これが再び加工液供給
装置に戻るようになつている。(Prior Art and its Problems) In a wire-cut electrical discharge machine, in order to cause electrical discharge between the wire and the workpiece, it is necessary to supply machining fluid so as to surround the wire near the workpiece. Water having a required electrical conductivity is used as the machining fluid, and such water is supplied from a machining fluid supply device and returned to the machining fluid supply device again.
ところが、加工精度やワークの材質を変える場
合には、電気伝導率の異なる水を用いる必要があ
る。例えば、粗加工を行う場合には高伝導率の水
を用いることによつて加工速度を上げることがで
きるし、仕上げ加工を行う場合には低伝導率の水
を用いることによつて高精度な加工が行える。し
かし従来の加工液供給装置では、一種類の加工液
のみしか供給することができないため、上述のよ
うな電気伝導率の異なる加工液の要求に対して迅
速に対応できず、そのためにワイヤカツト放電加
工機の長所を充分に発揮できないという難点があ
つた。 However, when changing the machining accuracy or the material of the workpiece, it is necessary to use water with a different electrical conductivity. For example, when performing rough machining, machining speed can be increased by using water with high conductivity, and when performing finishing machining, high precision can be achieved by using water with low conductivity. Can be processed. However, conventional machining fluid supply devices can only supply one type of machining fluid, so they cannot quickly respond to the requirements for machining fluids with different electrical conductivities as described above, and for this reason wire cut electrical discharge machining The problem was that the machine's strengths could not be fully utilized.
（問題点を解決するための技術的手段）
本考案は、上述の事情に鑑み、電気伝導率の異
なる水を迅速に供給することができ、したがつて
ワークの材質や加工精度の変化に迅速に対応する
ことのできる加工液供給装置を提供するものであ
つて、その技術的手段は、放電加工機に加工液を
供給するための送出路２と、放電加工機からの戻
りの加工液を受け入れる受入路３と、該受入路３
に切換手段４，５を介して選択的に接続される第
１汚水槽６および第２汚水槽７と、第１汚水槽６
または第２汚水槽７に向けて加工液がそれぞれ溢
出可能な第１清水槽８および第２清水槽９と、第
１汚水槽６内の水をポンプ１０によりイオン交換
樹脂槽１１を介して第１清水槽８内へ流入させる
第１純水化回路１５と、第２汚水槽７内の水を第
２清水槽９内へ流入させる第２純水化回路であつ
て、前記第１純水化回路１５のポンプ１０および
イオン交換樹脂槽１１を共通の回路部分とした第
２純水化回路１９と、前記送出路２から加工液を
圧送するための圧送ポンプ２０と、第１清水槽８
または第２清水槽９内の加工液を前記送出路２に
選択的に接続するための切換手段２１，２２と、
を有し、前記第１純水化回路１５および第２純水
化回路１９には両回路１５，１９を切り換えるた
めの切換手段１２，１３および１６，１７を設け
て成ることを特徴とする。(Technical means for solving the problem) In view of the above-mentioned circumstances, the present invention can quickly supply water with different electrical conductivities, and therefore can quickly respond to changes in workpiece material and processing accuracy. The purpose of the present invention is to provide a machining fluid supply device capable of responding to the above, and its technical means include a delivery path 2 for supplying machining fluid to an electrical discharge machine, and a machining fluid returning from the electrical discharge machine. The reception route 3 and the reception route 3
A first sewage tank 6 and a second sewage tank 7 are selectively connected to the first sewage tank 6 and the second sewage tank 7 via switching means 4 and 5.
Alternatively, a first clear water tank 8 and a second clear water tank 9 are provided in which the machining fluid can overflow toward the second waste water tank 7, and the water in the first waste water tank 6 is pumped through an ion exchange resin tank 11 by a pump 10. a first water purification circuit 15 that causes water to flow into the first fresh water tank 8; and a second water purification circuit that causes the water in the second sewage tank 7 to flow into the second fresh water tank 9, the first pure water a second water purification circuit 19 in which the pump 10 of the purification circuit 15 and the ion exchange resin tank 11 are common circuit parts; a pressure pump 20 for pumping the processing liquid from the delivery path 2; and a first fresh water tank 8.
or switching means 21 and 22 for selectively connecting the machining fluid in the second fresh water tank 9 to the delivery path 2;
It is characterized in that the first water purification circuit 15 and the second water purification circuit 19 are provided with switching means 12, 13 and 16, 17 for switching both circuits 15, 19.
（実施例）
以下、本考案の実施例を図面に基づいて説明す
る。(Example) Hereinafter, an example of the present invention will be described based on the drawings.
第１図ないし第３図において、供給装置１は、
図示しないワイヤカツト放電加工機に加工液を供
給するための送出路２と、戻りの加工液を受け入
れる受入路３と、この受入路３にソレノイド弁よ
りなる切換弁４，５により選択的に接続される第
１汚水槽６および第２汚水槽７と、第１汚水槽６
または第２汚水槽７内に別個独立に設けられてお
り、これらそれぞれに向けて加工液が溢出可能な
第１清水槽８および第２清水槽９と、前記第１汚
水槽６内の水を循環ポンプ１０によりイオン交換
樹脂槽１１を介して第１清水槽８内へ流入させる
ための第１純水化回路１５と、前記第２汚水槽７
内の水を前記第２清水槽９内へ流入させるための
純水化回路であつて、前記第１純水化回路１５の
ポンプ１０およびイオン交換樹脂槽１１を共通の
回路部分とする第２純水化回路１９と、前記送出
路２から加工液を圧送するための圧送ポンプ２０
と、前記第１清水槽８または第２清水槽９内の加
工液を選択的に切換えて圧送ポンプ２０に接続す
るための切換弁２１，２２とを有しており、前記
第１純水化回路１５および第２純水化回路１９に
は、切換弁１２，１３および１６，１７、ならび
にフイルタ１４，１８が設けられている。 In FIGS. 1 to 3, the supply device 1 is
A delivery path 2 for supplying machining fluid to a wire-cut electrical discharge machine (not shown), a receiving path 3 for receiving the returning machining fluid, and selectively connected to the receiving path 3 by switching valves 4 and 5 made of solenoid valves. The first sewage tank 6 and the second sewage tank 7, and the first sewage tank 6
Alternatively, a first clear water tank 8 and a second clear water tank 9 are provided separately and independently in the second sewage tank 7, and into which the machining fluid can overflow, and the water in the first sewage tank 6 is A first purification circuit 15 for causing water to flow into the first fresh water tank 8 via the ion exchange resin tank 11 by the circulation pump 10, and the second sewage tank 7.
This is a water purification circuit for causing the water in the water to flow into the second fresh water tank 9, and the second water purification circuit has the pump 10 of the first water purification circuit 15 and the ion exchange resin tank 11 as a common circuit part. A water purification circuit 19 and a pressure pump 20 for pumping the processing fluid from the delivery path 2
and switching valves 21 and 22 for selectively switching the machining liquid in the first fresh water tank 8 or the second fresh water tank 9 and connecting it to the pressure pump 20, and The circuit 15 and the second water purification circuit 19 are provided with switching valves 12, 13 and 16, 17, and filters 14, 18.
そして、前記循環ポンプ１０とイオン交換樹脂
槽１１との接続部分には、第１清水槽８、第２清
水槽９に直通するバイパス路２５，２６が分岐し
て設けられていると共に、これらのバイパス路２
５，２６をそれぞれ開通または閉鎖状態に切換え
る切換弁２３，２４が設けられている。また、前
記送出路２には、ここを流通する加工液（水）の
電気伝導率を検出するためのセンサー２７が設け
られており、また、第１清水槽８および第２清水
槽９内にも、これらの各槽内の加工液（水）の電
気伝導率を検出するためのセンサー２８，２９が
設けられており、これらのリード線は各切換弁や
モーター１０ａ，２０ａのリード線とともに制御
盤３０に接続されている。なお、１５ａ，１９ａ
は圧力計である。 At the connection between the circulation pump 10 and the ion-exchange resin tank 11, bypass passages 25 and 26 are provided which connect directly to the first fresh water tank 8 and the second fresh water tank 9. Bypass path 2
Switching valves 23 and 24 are provided to switch the valves 5 and 26 into an open or closed state, respectively. Further, a sensor 27 for detecting the electrical conductivity of the machining fluid (water) flowing therethrough is provided in the delivery path 2, and a sensor 27 is provided in the first fresh water tank 8 and the second fresh water tank 9. Also, sensors 28 and 29 are provided to detect the electrical conductivity of the machining fluid (water) in each of these tanks, and these lead wires are controlled together with the lead wires of each switching valve and motor 10a, 20a. It is connected to the panel 30. In addition, 15a, 19a
is a pressure gauge.
前記第１汚水槽６と第２汚水槽７とは、これら
の間に配管用のスペース３１を有して一体的に形
成されて本体１ａを構成しており、この本体１ａ
の側面に循環ポンプ１０、圧送ポンプ２０および
イオン交換樹脂槽１１などの機器とこれらをおお
うカバー３２が取付けられ、また底部には４箇の
キヤスター３３……が取付けられており、上述の
ように構成された供給装置１が一体的に床面上を
移動可能になつている。また、第１汚水槽６、第
２汚水槽７、第１清水槽８および第２清水槽９内
には適量の水が入つている。 The first sewage tank 6 and the second sewage tank 7 are integrally formed with a space 31 for piping between them to constitute a main body 1a.
Equipment such as the circulation pump 10, pressure pump 20, and ion exchange resin tank 11 and a cover 32 covering these are attached to the side of the unit, and four casters 33 are attached to the bottom of the unit, as described above. The configured supply device 1 can be moved integrally on the floor. Further, the first sewage tank 6, the second sewage tank 7, the first fresh water tank 8, and the second fresh water tank 9 contain appropriate amounts of water.
次に制御盤３０の構成を、供給装置１の作用と
ともに説明する。制御盤３０には、図示は省略し
たが、第１清水槽８および第２清水槽９内の電気
伝導率をそれぞれ設定するための第１設定器およ
び第２設定器、送出路２から圧送される加工液の
電気伝導率を選択するために切換弁４，２１また
は切換弁５，２２を切換える選択スイツチなどが
設けられている。 Next, the configuration of the control panel 30 will be explained together with the operation of the supply device 1. Although not shown, the control panel 30 includes a first setting device and a second setting device for setting the electrical conductivity in the first fresh water tank 8 and the second fresh water tank 9, respectively, and water pumped from the delivery path 2. In order to select the electrical conductivity of the machining fluid to be used, a selection switch for switching the switching valves 4 and 21 or the switching valves 5 and 22 is provided.
例えば第１設定器を所要の値に設定すると、モ
ータ１０ａの回転によりポンプ１０が作動し、切
換弁１２，１３が開いて第１純水化回路１５が形
成され、第１汚水槽６内の水はフイルタ１４によ
つてごみや微粒子などが除去され、イオン交換樹
脂槽１１によつて電解質が除去され純水化されて
第１清水槽８内に流入し、溢れた水は第１汚水槽
６内へ流入する。したがつて第１清水槽８内の水
は次第に電気伝導率が低下して純水に近づくが、
センサー２８により検出した電気伝導率が第１設
定器の設定値に一致すると、切換弁１３が閉じ、
切換弁２３が開いて、水がバイパス路２５から第
１清水槽８内へ流入するか、または切換弁１２，
１３が閉じ、第１清水槽８の水の流れが停止し
て、第１清水槽８の水は一定の電気伝導率に保た
れる。また、第２設定器によつて所要の値を設定
した場合も、上述した第１設定器の場合と同様で
ある。 For example, when the first setting device is set to a required value, the pump 10 is operated by the rotation of the motor 10a, the switching valves 12 and 13 are opened, the first water purification circuit 15 is formed, and the water in the first sewage tank 6 is Dust and fine particles are removed from the water by the filter 14, electrolyte is removed by the ion exchange resin tank 11, the water is purified and flows into the first clean water tank 8, and the overflowing water is transferred to the first sewage tank. It flows into 6. Therefore, the electrical conductivity of the water in the first fresh water tank 8 gradually decreases and approaches pure water, but
When the electrical conductivity detected by the sensor 28 matches the setting value of the first setting device, the switching valve 13 closes.
Either the switching valve 23 is opened and water flows into the first fresh water tank 8 from the bypass path 25, or the switching valve 12,
13 is closed, the flow of water in the first fresh water tank 8 is stopped, and the water in the first fresh water tank 8 is maintained at a constant electrical conductivity. Further, the case where a required value is set by the second setting device is similar to the case of the first setting device described above.
選択スイツチによつて例えば切換弁４，２１が
開となりモーター２０ａが回転して圧送ポンプ２
０が作動すると、所定の電気伝導率に調製された
第１清水槽８内の加工液（水）が送出路２から圧
送され、ワイヤカツト放電加工機に供給されるこ
ととなり、使用済みの汚水が受入路３を経て第１
汚水槽６へ回収されることとなる。そして、この
間においては、第１清水槽８内の電気伝導率を設
定値に維持すべく第１純水化回路１５が優先的に
形成される。 For example, the selection switch opens the switching valves 4 and 21, and the motor 20a rotates, causing the pressure pump 2 to open.
0 is activated, the machining fluid (water) in the first clean water tank 8 adjusted to a predetermined electrical conductivity is pumped out from the delivery path 2 and supplied to the wire cut electric discharge machine, and the used waste water is removed. 1st via intake road 3
It will be collected into the sewage tank 6. During this period, the first water purification circuit 15 is preferentially formed in order to maintain the electrical conductivity in the first fresh water tank 8 at the set value.
ワークの交換や加工精度を変更するために電気
伝導率の異なる加工液が必要な場合は、選択スイ
ツチを切換え、あらかじめ第２設定器によつて設
定して調整された第２清水槽９内の加工液を送出
路２を介して圧送することにより、即座に所要の
加工液が供給されることとなり、これが供給され
ている間は第２純水化回路１９が優先的に形成さ
れて所望の電気伝導率が維持される。センサー２
７によつて、ワイヤカツト放電加工機に実際に供
給されている加工液が所定の電気伝導率を有して
いるかをモニターする。 If a machining fluid with a different electrical conductivity is required to replace the workpiece or change the machining accuracy, change the selection switch and add the machining fluid in the second clean water tank 9 that has been set and adjusted in advance with the second setting device. By force-feeding the machining fluid through the delivery path 2, the required machining fluid is immediately supplied, and while this is being supplied, the second water purification circuit 19 is preferentially formed to produce the desired water. Electrical conductivity is maintained. sensor 2
7, it is monitored whether the machining fluid actually supplied to the wire-cut electric discharge machine has a predetermined electrical conductivity.
上述の供給装置１によると、電気伝導率の異な
る２種類の加工液を切換えて供給することができ
るから、ワークの材質や加工精度の変更に応じて
所望の電気伝導率の加工液を即座に供給すること
ができ、作業能率が非常に向上する。また、この
装置１によると、第１純水化回路１５において第
１汚水槽６内の水を第１清水槽８内に圧送するポ
ンプおよびその水を純粋化するイオン交換樹脂槽
と、第２純粋化回路１９において第２汚水槽７内
の水を第２清水槽９内に圧送するポンプおよびそ
の水を純粋化するイオン交換樹脂槽とを、それぞ
れ１つのポンプ１０およびイオン交換樹脂槽１１
により共用するようにしていることから、これら
ポンプ１０およびイオン交換樹脂槽１１を、第１
純水化回路１５と第２純水化回路１９においてそ
れぞれ別個に設ける場合に較べ、配管を簡略化で
きて製作を容易に行えるとともに、装置の小型化
および軽量化を図ることができ、しかも高価なイ
オン交換樹脂槽が１個ですむためコストの大幅な
低廉化を図ることができる。 According to the above-mentioned supply device 1, since it is possible to switch between and supply two types of machining fluids with different electrical conductivities, it is possible to immediately supply a machining fluid with a desired electrical conductivity in response to changes in the workpiece material or machining accuracy. This greatly improves work efficiency. According to this device 1, the first water purification circuit 15 includes a pump that pumps the water in the first sewage tank 6 into the first clean water tank 8, an ion exchange resin tank that purifies the water, and a second water purification circuit 15. In the purification circuit 19, a pump for pumping the water in the second sewage tank 7 into the second fresh water tank 9 and an ion exchange resin tank for purifying the water are each connected to one pump 10 and one ion exchange resin tank 11.
Since the pump 10 and the ion exchange resin tank 11 are shared by the
Compared to the case where the water purification circuit 15 and the second water purification circuit 19 are provided separately, the piping can be simplified and manufacturing is easier, and the device can be made smaller and lighter, and it is also less expensive. Since only one ion exchange resin tank is required, the cost can be significantly reduced.
また、この供給装置１によると、第１純水化回
路１５および第２純水化回路１９にそれぞれ、イ
オン交換樹脂槽１１の手前側から分岐して第１清
水槽８、第２清水槽９にそれぞれ直通するバイパ
ス路２５，２６が設けられていると共に、各バイ
パス路を開閉する切換弁２３，２４が設けられて
いるため、通常時はこの切換弁２３，２４を閉弁
して、第１汚水槽６または第２汚水槽７からフイ
ルター１４，１８を通過した水を前記バイパス路
側に分流することなくそのままイオン交換樹脂槽
１１へ流し電解質を除去することによつて、急速
に純水化処理を行うことができ、そして第１清水
槽８または第２清水槽９内の水が所定の電気伝導
率を有するようになつた時点で前記切換弁を開弁
して、前記フイルター１４，１８を通過した水の
一部を分流させ第１清水槽８または第２清水槽９
に直接送り込むことによつて、清水槽８，９内の
水の電気伝導率を一定に保つことができる。この
ように上記切換弁２３，２４を適宜に開閉操作す
ることによつて効率良く純水化処理を行わせるこ
とができる。 Further, according to this supply device 1, the first water purification circuit 15 and the second water purification circuit 19 are branched from the front side of the ion exchange resin tank 11, and the first clear water tank 8 and the second clear water tank 9 Bypass passages 25 and 26 are provided which directly communicate with the respective bypass passages, and switching valves 23 and 24 are provided to open and close each bypass passage, so normally these switching valves 23 and 24 are closed and the The water that has passed through the filters 14 and 18 from the first sewage tank 6 or the second sewage tank 7 is passed directly to the ion exchange resin tank 11 without being diverted to the bypass path side, and the electrolyte is removed, thereby rapidly purifying the water. When the treatment can be carried out and the water in the first fresh water tank 8 or the second fresh water tank 9 has a predetermined electrical conductivity, the switching valve is opened and the filters 14 and 18 are opened. A part of the water that has passed through is diverted to the first clear water tank 8 or the second clear water tank 9.
By directly feeding the water into the fresh water tanks 8 and 9, the electrical conductivity of the water in the fresh water tanks 8 and 9 can be kept constant. By appropriately opening and closing the switching valves 23 and 24 in this manner, the water purification process can be carried out efficiently.
更にこの供給装置１は、その全体が一体的に構
成されており、キヤスター３３により移動可能で
あるから、取扱いが容易である。 Furthermore, this supply device 1 is constructed entirely in one piece and is movable on casters 33, making it easy to handle.
なお、上述の実施例において、切換弁として３
方弁または５方弁を組合せて構成することができ
る。切換弁２３，２４に代えて可変しぼり弁を用
いることもできる。このとき、イオン交換樹脂１
１を保護するため、その入力側に開閉操作可能な
切換弁を設けるとよい。センサー２７によつて第
１清水槽８および第２清水槽９内の水の電気伝導
率を制御することも可能である。 In addition, in the above-mentioned embodiment, 3 is used as the switching valve.
It can be constructed by combining a one-way valve or a five-way valve. A variable throttle valve can also be used in place of the switching valves 23 and 24. At this time, ion exchange resin 1
1, it is preferable to provide a switching valve that can be opened and closed on its input side. It is also possible to control the electrical conductivity of the water in the first fresh water tank 8 and the second fresh water tank 9 by means of the sensor 27 .
（考案の効果）
本考案の加工液供給装置によると、電気伝導率
の異なる２種類の加工液を別々に準備することが
でき、これらを切換えて放電加工機に供給するこ
とができるから、ワークの材質や加工精度の変更
に迅速に対応することが可能である。(Effects of the invention) According to the machining fluid supply device of the present invention, two types of machining fluids with different electrical conductivities can be prepared separately, and these can be switched and supplied to the electrical discharge machine. It is possible to quickly respond to changes in material and processing accuracy.
また本考案の加工液供給装置によれば、第１純
水化回路において第１汚水槽内の水を第１清水槽
内に圧送するポンプおよびその水を純粋化するイ
オン交換樹脂槽と、第２純粋化回路において第２
汚水槽内の水を第２清水槽内に圧送するポンプお
よびその水を純粋化するイオン交換樹脂槽とを、
それぞれ１つのポンプおよびイオン交換樹脂槽で
共用させるようにしているため、これらポンプお
よびイオン交換樹脂槽を、第１純水化回路と第２
純水化回路においてそれぞれ別個に設ける場合に
較べると、配管を簡略化できて製作が簡単容易に
なるとともに、装置の小型化および軽量化を図る
ことができ、しかも非常に高価なイオン交換樹脂
槽が１個ですむためコストの大幅な低廉化を図る
ことができる。 Further, according to the processing fluid supply device of the present invention, the first water purification circuit includes a pump that pumps the water in the first sewage tank into the first clean water tank, an ion exchange resin tank that purifies the water, and a first water purification circuit. 2 In the purification circuit, the second
A pump that pumps the water in the sewage tank into the second fresh water tank and an ion exchange resin tank that purifies the water.
Since each pump and ion exchange resin tank are shared, these pumps and ion exchange resin tank are connected to the first water purification circuit and the second water purification circuit.
Compared to installing each separately in the water purification circuit, the piping can be simplified and manufacturing is easier, and the equipment can be made smaller and lighter. Moreover, the ion exchange resin tank is very expensive. Since only one is required, the cost can be significantly reduced.
図面は本考案に係る加工液供給装置の実施例を
示し、第１図は回路図、第２図は概略の構造を示
す側面図、第３図は第２図の−矢視断面の平
面図である。
１……供給装置（加工液供給装置）、２……送
出路、３……受入路、４，５……切換弁、６……
第１汚水槽、７……第２汚水槽、８……第１清水
槽、９……第２清水槽、１０……循環ポンプ（ポ
ンプ）、１１……イオン交換樹脂、１２，１３，
１６，１７……切換弁、１４……フイルター、１
５……第１純水化回路、１８……フイルター、１
９……第２純水化回路、２０……圧送ポンプ、２
１，２２……切換弁、２３，２４……切換弁、２
５，２６……バイパス路、２８，２９……センサ
ー、３３……キヤスター。
The drawings show an embodiment of the machining fluid supply device according to the present invention, in which Fig. 1 is a circuit diagram, Fig. 2 is a side view showing a schematic structure, and Fig. 3 is a plan view of a cross section taken in the direction of - arrow in Fig. 2. It is. 1... Supply device (processing liquid supply device), 2... Sending path, 3... Receiving path, 4, 5... Switching valve, 6...
1st sewage tank, 7... 2nd sewage tank, 8... 1st fresh water tank, 9... 2nd fresh water tank, 10... Circulation pump (pump), 11... Ion exchange resin, 12, 13,
16, 17...Switching valve, 14...Filter, 1
5...First water purification circuit, 18...Filter, 1
9...Second water purification circuit, 20...Pressure pump, 2
1, 22...Switching valve, 23, 24...Switching valve, 2
5, 26... Bypass path, 28, 29... Sensor, 33... Caster.
Claims (1)
と、放電加工機からの戻りの加工液を受け入れる
受入路３と、該受入路３に切換手段４，５を介し
て選択的に接続される第１汚水槽６および第２汚
水槽７と、第１汚水槽６または第２汚水槽７に向
けて加工液がそれぞれ溢出可能な第１清水槽８お
よび第２清水槽９と、第１汚水槽６内の水をポン
プ１０によりイオン交換樹脂槽１１を介して第１
清水槽８内へ流入させる第１純水化回路１５と、
第２汚水槽７内の水を第２清水槽９内へ流入させ
る第２純水化回路であつて、前記第１純水化回路
１５のポンプ１０およびイオン交換樹脂槽１１を
共通の回路部分とした第２純水化回路１９と、前
記送出路２から加工液を圧送するための圧送ポン
プ２０と、第１清水槽８または第２清水槽９内の
加工液を前記送出路２に選択的に接続するための
切換手段２１，２２と、を有し、前記第１純水化
回路１５および第２純水化回路１９には両回路１
５，１９を切り換えるための切換手段１２，１３
および１６，１７を設けてなる放電加工機の加工
液供給装置。 Sending path 2 for supplying machining fluid to the electrical discharge machine
a receiving path 3 for receiving machining fluid returned from the electrical discharge machine; a first sewage tank 6 and a second sewage tank 7 selectively connected to the receiving path 3 via switching means 4 and 5; A first clear water tank 8 and a second clear water tank 9 are provided in which processing fluid can overflow toward the first sewage tank 6 or the second sewage tank 7, respectively, and the water in the first sewage tank 6 is pumped into an ion exchange resin tank by a pump 10. 1st through 11
a first water purification circuit 15 that causes water to flow into the fresh water tank 8;
A second water purification circuit that causes the water in the second sewage tank 7 to flow into the second fresh water tank 9, the pump 10 of the first water purification circuit 15 and the ion exchange resin tank 11 being a common circuit part. a second water purification circuit 19, a pressure pump 20 for pumping the machining fluid from the delivery path 2, and a machining fluid in the first fresh water tank 8 or the second fresh water tank 9 selected for the delivery path 2. switching means 21 and 22 for connecting the first water purification circuit 15 and the second water purification circuit 19 to each other.
Switching means 12, 13 for switching 5, 19
and 16 and 17, a machining fluid supply device for an electrical discharge machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985112204U JPH0440823Y2 (en) | 1985-07-22 | 1985-07-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985112204U JPH0440823Y2 (en) | 1985-07-22 | 1985-07-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6222018U JPS6222018U (en) | 1987-02-10 |
| JPH0440823Y2 true JPH0440823Y2 (en) | 1992-09-25 |
Family
ID=30992855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985112204U Expired JPH0440823Y2 (en) | 1985-07-22 | 1985-07-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0440823Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56163844A (en) * | 1980-05-19 | 1981-12-16 | Mitsubishi Electric Corp | Electric discharge machining apparatus |
| JPS57189732A (en) * | 1981-05-15 | 1982-11-22 | Mitsubishi Electric Corp | Method and apparatus for electric processing |
-
1985
- 1985-07-22 JP JP1985112204U patent/JPH0440823Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56163844A (en) * | 1980-05-19 | 1981-12-16 | Mitsubishi Electric Corp | Electric discharge machining apparatus |
| JPS57189732A (en) * | 1981-05-15 | 1982-11-22 | Mitsubishi Electric Corp | Method and apparatus for electric processing |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6222018U (en) | 1987-02-10 |
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