JPH0440589U - - Google Patents
Info
- Publication number
- JPH0440589U JPH0440589U JP8057690U JP8057690U JPH0440589U JP H0440589 U JPH0440589 U JP H0440589U JP 8057690 U JP8057690 U JP 8057690U JP 8057690 U JP8057690 U JP 8057690U JP H0440589 U JPH0440589 U JP H0440589U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- cooling structure
- heat sink
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims 2
- 230000017525 heat dissipation Effects 0.000 claims 1
- 239000011344 liquid material Substances 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案によるプリント基板の冷却構造
の第１の実施例を示す正面図、第２図は第２の実
施例を示す正面図、第３図は第２図の実施例の要
部平面図、第４図は第３の実施例を示す正面図、
第５図は第４の実施例を示す正面図、第６図は従
来例を示す正面図である。
１……プリント基板、２……電子部品、４，６
……放熱板、５……ネジ、７……フイン、８……
中間部材。
Fig. 1 is a front view showing a first embodiment of a cooling structure for a printed circuit board according to the present invention, Fig. 2 is a front view showing a second embodiment, and Fig. 3 is a main part of the embodiment shown in Fig. 2. A plan view, FIG. 4 is a front view showing the third embodiment,
FIG. 5 is a front view showing the fourth embodiment, and FIG. 6 is a front view showing a conventional example. 1... Printed circuit board, 2... Electronic components, 4, 6
...heat sink, 5...screw, 7...fin, 8...
intermediate member.
Claims (1)
ト基板の冷却構造において、 高熱伝導性材料により形成された放熱板をプリ
ント基板との間に電子部品を一括して挟むように
プリント基板に固定すると共に、各電子部品を放
熱板に密着させたことを特徴とするプリント基板
の冷却構造。 (2) 発熱する複数の電子部品を搭載したプリン
ト基板の冷却構造において、 高熱伝導性材料により形成された放熱板をプリ
ント基板との間に電子部品を一括して挟むように
プリント基板に固定すると共に、耐熱性を有する
可塑性の袋内に高熱伝導性液体材料を密封して成
る中間部材を各電子部品と放熱板プリント基板と
の間に配置したことを特徴とするプリント基板の
冷却構造。 (3) 平板状の放熱板を用いたことを特徴とする
請求項(1)または請求項(2)記載のプリント基板の
冷却構造。 (4) 片面側にフインを有する放熱板を用いたこ
とを特徴とする請求項(1)または請求項(2)記載の
プリント基板の冷却構造。[Scope of Claim for Utility Model Registration] (1) In a cooling structure for a printed circuit board equipped with multiple heat-generating electronic components, a heat dissipation plate made of a highly thermally conductive material is placed between the printed circuit board and the electronic components. A cooling structure for a printed circuit board, characterized in that it is fixed to the printed circuit board in a sandwiching manner, and each electronic component is closely attached to a heat sink. (2) In a cooling structure for a printed circuit board equipped with multiple electronic components that generate heat, a heat sink made of a highly thermally conductive material is fixed to the printed circuit board so that the electronic components are all sandwiched between the two. A cooling structure for a printed circuit board, characterized in that an intermediate member made of a heat-resistant plastic bag sealed with a highly thermally conductive liquid material is disposed between each electronic component and a heat sink printed circuit board. (3) The printed circuit board cooling structure according to claim (1) or claim (2), characterized in that a flat heat sink is used. (4) The printed circuit board cooling structure according to claim (1) or claim (2), characterized in that a heat sink having fins on one side is used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8057690U JPH0440589U (en) | 1990-07-31 | 1990-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8057690U JPH0440589U (en) | 1990-07-31 | 1990-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0440589U true JPH0440589U (en) | 1992-04-07 |
Family
ID=31625764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8057690U Pending JPH0440589U (en) | 1990-07-31 | 1990-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0440589U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001284862A (en) * | 2000-03-30 | 2001-10-12 | Tech Res & Dev Inst Of Japan Def Agency | Electronic apparatus cooling device |
| JP2011000884A (en) * | 2009-06-17 | 2011-01-06 | Laird Technologies Inc | Suitable multilayer heat conductive intermediate structure, and memory module equipped with the same |
| JP2015211144A (en) * | 2014-04-28 | 2015-11-24 | 日立オートモティブシステムズ株式会社 | Electronic circuit device and manufacturing method thereof |
| JP2016100512A (en) * | 2014-11-25 | 2016-05-30 | 日本電気株式会社 | Cooling device |
-
1990
- 1990-07-31 JP JP8057690U patent/JPH0440589U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001284862A (en) * | 2000-03-30 | 2001-10-12 | Tech Res & Dev Inst Of Japan Def Agency | Electronic apparatus cooling device |
| JP2011000884A (en) * | 2009-06-17 | 2011-01-06 | Laird Technologies Inc | Suitable multilayer heat conductive intermediate structure, and memory module equipped with the same |
| JP2015211144A (en) * | 2014-04-28 | 2015-11-24 | 日立オートモティブシステムズ株式会社 | Electronic circuit device and manufacturing method thereof |
| JP2016100512A (en) * | 2014-11-25 | 2016-05-30 | 日本電気株式会社 | Cooling device |
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