JPH0440573U - - Google Patents

Info

Publication number
JPH0440573U
JPH0440573U JP8146890U JP8146890U JPH0440573U JP H0440573 U JPH0440573 U JP H0440573U JP 8146890 U JP8146890 U JP 8146890U JP 8146890 U JP8146890 U JP 8146890U JP H0440573 U JPH0440573 U JP H0440573U
Authority
JP
Japan
Prior art keywords
casing
board
notch
moisture
harness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8146890U
Other languages
Japanese (ja)
Other versions
JP2519160Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990081468U priority Critical patent/JP2519160Y2/en
Publication of JPH0440573U publication Critical patent/JPH0440573U/ja
Application granted granted Critical
Publication of JP2519160Y2 publication Critical patent/JP2519160Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の実施例を示す構成図、第２図
は従来の防湿型筺体の断面図である。 図中、１は筺体、２は基板、３はハーネス、６
はポツテイング材、７は切欠き、８は突部である
。 FIG. 1 is a configuration diagram showing an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional moisture-proof type housing. In the figure, 1 is the housing, 2 is the board, 3 is the harness, and 6
7 is a potting material, 7 is a notch, and 8 is a protrusion.

Claims (1)

【実用新案登録請求の範囲】 箱型の筺体１の内部にハーネス３を一端に接続
した回路基板２を収容し、更に該筺体内にポツテ
イング材６を充填して該基板の周囲を覆う防湿型
筺体において、 前記基板のハーネス接続端とは逆側に切欠き７
を形成し、 且つ前記筺体の内壁には該切欠きに係合する突
部８を形成してなることを特徴とする防湿型筺体
。[Claims for Utility Model Registration] A moisture-proof type in which a circuit board 2 with a harness 3 connected to one end is housed inside a box-shaped casing 1, and a potting material 6 is filled inside the casing to cover the periphery of the board. In the housing, a notch 7 is provided on the opposite side of the board from the harness connection end.
A moisture-proof casing, characterized in that a protrusion 8 is formed on an inner wall of the casing to engage with the notch.
JP1990081468U 1990-07-31 1990-07-31 Moisture-proof housing Expired - Lifetime JP2519160Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990081468U JP2519160Y2 (en) 1990-07-31 1990-07-31 Moisture-proof housing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990081468U JP2519160Y2 (en) 1990-07-31 1990-07-31 Moisture-proof housing

Publications (2)

Publication Number Publication Date
JPH0440573U true JPH0440573U (en) 1992-04-07
JP2519160Y2 JP2519160Y2 (en) 1996-12-04

Family

ID=31627440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990081468U Expired - Lifetime JP2519160Y2 (en) 1990-07-31 1990-07-31 Moisture-proof housing

Country Status (1)

Country Link
JP (1) JP2519160Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012508374A (en) * 2008-11-10 2012-04-05 イートン コーポレーション Pressure sensing module with integrated seal plate and method of assembling a pressure sensing module

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6318069A (en) * 1986-07-09 1988-01-25 Matsushita Electric Ind Co Ltd Sputtering method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6318069A (en) * 1986-07-09 1988-01-25 Matsushita Electric Ind Co Ltd Sputtering method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012508374A (en) * 2008-11-10 2012-04-05 イートン コーポレーション Pressure sensing module with integrated seal plate and method of assembling a pressure sensing module

Also Published As

Publication number Publication date
JP2519160Y2 (en) 1996-12-04

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term