JPH0439430B2 - - Google Patents
Info
- Publication number
- JPH0439430B2 JPH0439430B2 JP60212610A JP21261085A JPH0439430B2 JP H0439430 B2 JPH0439430 B2 JP H0439430B2 JP 60212610 A JP60212610 A JP 60212610A JP 21261085 A JP21261085 A JP 21261085A JP H0439430 B2 JPH0439430 B2 JP H0439430B2
- Authority
- JP
- Japan
- Prior art keywords
- guide
- holes
- silicon nitride
- hole
- hard layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 claims description 23
- 239000010410 layer Substances 0.000 claims description 21
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 13
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 13
- 239000002344 surface layer Substances 0.000 claims description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 8
- 239000001301 oxygen Substances 0.000 claims description 8
- 229910052760 oxygen Inorganic materials 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 239000011148 porous material Substances 0.000 claims description 5
- 239000006104 solid solution Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 13
- 239000000843 powder Substances 0.000 description 9
- 238000005245 sintering Methods 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 238000005553 drilling Methods 0.000 description 6
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 5
- 238000010304 firing Methods 0.000 description 5
- 238000000227 grinding Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910018557 Si O Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/22—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of impact or pressure on a printing material or impression-transfer material
- B41J2/23—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of impact or pressure on a printing material or impression-transfer material using print wires
- B41J2/235—Print head assemblies
- B41J2/265—Guides for print wires
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Impact Printers (AREA)
- Ceramic Products (AREA)
Description
【発明の詳細な説明】
［発明の技術分野］
本発明は、窒化ケイ素を主体とするセラミツク
スからなる、孔を有する機械部品に関し、更に詳
しくは、耐摩耗性に優れかつ製造コストの低い
該、孔を有する機械部品に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a mechanical part having holes made of ceramics mainly composed of silicon nitride, and more particularly, to a mechanical part having holes, which has excellent wear resistance and low manufacturing cost. It relates to mechanical parts having holes.
［発明の技術的背景とその問題点］
近年、孔を有する機械部品は多数利用されてい
る。例えば各種ノズル、ドツトプリンター用ガイ
ド等がある。例えば、このうちOA機器などに汎
用されているドツトプリンターとしては種々の形
式のものが知られているが、中でも、第３図に示
したような印字ヘツド１を具備したものが一般的
である。[Technical background of the invention and its problems] In recent years, many mechanical parts having holes have been used. For example, there are various nozzles, guides for dot printers, etc. For example, various types of dot printers are known that are commonly used in office automation equipment, among others, the most common is one equipped with a print head 1 as shown in Figure 3. .
すなわち、第３図において、印字ヘツド１は複
数本、例えば７本の純タングステンよりなるドツ
トピン２が、ガイド３に形成された７個のガイド
孔３ａに貫挿されて縦方向に等間隔で配置される
ことによりい構成されている。ドツトプリンター
にあつては、この印字ヘツド１を文字送り方向に
定速で例えば５ドツト分移動せしめるとともに、
各ドツトピン２を図示しない駆動装置によつて選
択的に高速駆動することにより１文字分のドツト
マトリツクス型（この場合７×５ドツトマトリツ
クス）の文字、数字或は記号等がインクリボンを
介して順次印字用紙（共に図示せず）にインパク
ト印字される。 That is, in FIG. 3, the print head 1 has a plurality of dot pins 2 made of pure tungsten, for example seven dot pins 2, which are inserted into seven guide holes 3a formed in a guide 3 and arranged at equal intervals in the vertical direction. It is constructed by being In the case of a dot printer, the printing head 1 is moved at a constant speed in the character feeding direction by, for example, 5 dots, and
By selectively driving each dot pin 2 at high speed by a drive device (not shown), one character's worth of dot matrix type (7 x 5 dot matrix in this case) letters, numbers, symbols, etc. are printed via the ink ribbon. impact printing is performed sequentially on printing paper (both not shown).
上記した印字ヘツド１の構成要素であるガイド
３は通常、セラミツクス例えばSi3N4系セラミツ
クスから構成されており、次のようにして製造さ
れていた。すなわち、Si3N4粉末を成形して得ら
れたSi3N4成形体を用意する。そしてこの成形体
にガイド孔３ａを形成するため穿孔処理を施す。
次いで、穿孔済のSi3N4成形体を窒素雰囲気中で
焼成して焼結処理を行なう。最後に、ガイド孔３
ａ表面を研削してガイド孔３ａを目的とする寸法
に仕上げるという方法である。 The guide 3, which is a component of the above-mentioned print head 1, is usually made of ceramics, for example, Si 3 N 4 ceramics, and has been manufactured in the following manner. That is, a Si 3 N 4 molded body obtained by molding Si 3 N 4 powder is prepared. This molded body is then subjected to a drilling process to form guide holes 3a.
Next, the perforated Si 3 N 4 molded body is fired in a nitrogen atmosphere to perform a sintering treatment. Finally, guide hole 3
In this method, the guide hole 3a is finished to the desired size by grinding the surface a.
上述のように形成されたSi3N4系セラミツクス
ガイドは、その使用に際しては、上記ガイド孔３
ａに例えばタングステンよりなるドツトピン２が
貫挿されて使用される。そして、印字の際にはダ
ングステンよりなるドツトピン２が上記ガイド孔
３ａ内を高速摺動するためガイド孔３ａ内表面が
摩耗してくる。このように、耐摩耗性に優れた孔
を有する機械部品が求められている。 When using the Si 3 N 4 ceramic guide formed as described above, the guide hole 3 is
A dot pin 2 made of, for example, tungsten is inserted through the dot a. During printing, the dot pin 2 made of dungsten slides inside the guide hole 3a at high speed, so that the inner surface of the guide hole 3a wears out. Thus, there is a need for mechanical parts having holes with excellent wear resistance.
［発明の目的］
本発明は上記した問題点を解消し、耐摩耗性に
優れた、窒化ケイ素を主体とするセラミツクスか
らなる、孔を有する機械部品を提供することを目
的とする。[Object of the Invention] An object of the present invention is to solve the above-mentioned problems and provide a mechanical component having holes, which is made of ceramics mainly composed of silicon nitride and has excellent wear resistance.
［発明の概要］
本発明者らは、上記した目的を達成すべく種々
研究を重ねた結果、次のような事実を見出した。
それは、Si3N4成形体に穿孔処理を施したのち焼
成して得られた焼結体においては、その孔４ａ内
に、第２図に示す如くウイスカー５が発生すると
いう事実である。[Summary of the Invention] The present inventors have conducted various studies to achieve the above-mentioned object, and as a result, have discovered the following fact.
This is the fact that in a sintered body obtained by subjecting a Si 3 N 4 molded body to perforation treatment and firing, whiskers 5 are generated within the holes 4a as shown in FIG.
一般にウイスカー５それ自身は機械的強度にす
ぐれていることが知られているので、本発明者ら
は、そのウイスカー５ならびにそのウイスカー５
が植設されている孔の表面層４ｂを調べたところ
次なる事実を発見した。それは、この表面層４ｂ
が機械部品４全体を構成しているSi3N4系セラミ
ツクスとは異なる組織・組成を形成しているとい
うことである。そして、この表面層４ｂは、
si3N4よりも高硬度のケイ素中に酸素が固溶して
なる成分を含み、更にはSi3N4，Al2O3，Y2O3，
AlNなどを含んでなる層であり、機械部品全体
を構成しているSi3N4系セラミツクスよりも硬質
であつて耐摩耗に優れた硬質層であることが確認
された。 Since it is generally known that the whisker 5 itself has excellent mechanical strength, the present inventors
When we investigated the surface layer 4b of the hole where the hole was planted, we discovered the following fact. It is this surface layer 4b
This means that it has a different structure and composition from the Si 3 N 4 ceramics that make up the entire mechanical component 4. This surface layer 4b is
Contains a component in which oxygen is solidly dissolved in silicon, which has a higher hardness than si 3 N 4 , and further contains Si 3 N 4 , Al 2 O 3 , Y 2 O 3 ,
It was confirmed that this is a layer containing AlN, etc., and is harder than the Si 3 N 4 ceramics that make up the entire mechanical part, and has excellent wear resistance.
従来は、このような表面層4bが優れた耐摩耗
性を有しているにもかかわらず、孔表面研削処理
によりこの表面層４ｂが研削除去されていたので
ある。 Conventionally, although such surface layer 4b has excellent wear resistance, this surface layer 4b has been ground away by hole surface grinding treatment.
本発明者らは、上記した事実を踏まえた上で耐
摩耗性に優れた、窒化ケイ素を主体とするセラミ
ツクスからなる、孔を有する機械部品を得るに
は、Si3N4成形体に所定の穿孔処理を施したのに
所定の焼結処理を施し上記した硬質の表面層４ｂ
は研削加工しないでそのままの形で機械部品の完
成品とすればよく、しかも研削加工工程を省くこ
とができて経済的であるとの知見を得て本発明を
完成するに至つた。 Based on the above facts, the present inventors have determined that in order to obtain mechanical parts with holes made of ceramics mainly composed of silicon nitride and having excellent wear resistance, the Si 3 N 4 molded body has a predetermined shape. The above-mentioned hard surface layer 4b is formed by performing a predetermined sintering treatment after the perforation treatment.
The present invention was completed based on the knowledge that the machine parts can be made into finished mechanical parts as they are without being ground, and that the grinding process can be omitted, making it economical.
すなわち、本発明の窒化ケイ素を主体とするセ
ラミツクスからなる、孔を有する機械部品は、単
数又は複数の孔を有する窒化ケイ素を主体とする
セラミツクスからなり、該孔の表面層が、ケイ素
中に酸素が固溶してなる成分を含有する硬質層か
ら形成されていることを特徴とする。 That is, the mechanical component having pores made of ceramics mainly composed of silicon nitride of the present invention is made of ceramics mainly composed of silicon nitride having one or more pores, and the surface layer of the pores contains oxygen in the silicon. It is characterized by being formed from a hard layer containing a component formed by solid solution.
まず、本発明の窒化ケイ素を主体とするセラミ
ツクスからなる、孔を有する機械部品は、その機
械部品を構成している材料構成に特徴を有するも
のであつて、機械部品全体の形状、大きさ及び孔
の形状、大きさ、孔数などは格別限定されるもの
ではない。本発明の機械部品は、第１図に示す如
く、機械部品４本体に孔４ａが穿孔されており、
その材料構成に関しては、機械部品本体のガイド
孔表面層４ｂは硬質層から構成されており、その
他の部分はSi3N4主成分とするセラミツクスから
構成されている。 First, the machine parts with holes made of silicon nitride-based ceramics of the present invention are characterized by the material composition of the machine parts, and are characterized by the overall shape, size, and size of the machine parts. The shape, size, number of holes, etc. of the holes are not particularly limited. As shown in FIG. 1, the mechanical component of the present invention has a hole 4a bored in the main body of the mechanical component 4,
Regarding its material composition, the guide hole surface layer 4b of the main body of the mechanical component is composed of a hard layer, and the other parts are composed of ceramics containing Si 3 N 4 as a main component.
この硬質層は、その硬度がSi3N4よりも大きな
値を示す層である。その硬度値はSi3N4の値と
SiOの値の間にあり、具体的にはビツカース硬度
で1500〜2000、好ましくは1800〜1900である。そ
して、この硬質層はケイ素中に酸素が固溶してい
る成分を必須成分として含み、Si3N4，Y2O3，
Al，AlN，Al2O3などを含有した複数の成分が混
合されている層である。この硬質層中における上
記成分の存在割合は、例えば、穿孔処理の条件
で：ミクロンドリルの径280μｍ，焼結処理の条
件：焼結温度1750℃，焼成時間１時間、雰囲気：
窒素とした場合、ケイ素中に酸素が固溶している
成分0.1〜３重量％，Y2O31〜７重量％，AlN3〜
５重量％、Al2O33〜５重量％，残部Si3N4とな
る。 This hard layer is a layer whose hardness is larger than that of Si 3 N 4 . Its hardness value is the same as that of Si 3 N 4
It is between the value of SiO, specifically 1500 to 2000 in terms of Vickers hardness, preferably 1800 to 1900. This hard layer contains as an essential component a component in which oxygen is dissolved in silicon, and contains Si 3 N 4 , Y 2 O 3 ,
This layer is a mixture of multiple components containing Al, AlN, Al 2 O 3 , etc. The proportion of the above components in this hard layer is determined by, for example, the conditions of the drilling process: micron drill diameter 280 μm, the conditions of the sintering process: sintering temperature 1750°C, firing time 1 hour, atmosphere:
In the case of nitrogen, components in which oxygen is dissolved in silicon 0.1 to 3% by weight, Y 2 O 3 1 to 7% by weight, AlN3 to
5% by weight, 3 to 5% by weight Al 2 O 3 , and the remainder Si 3 N 4 .
このケイ素中に酸素が固溶してなる成分は、近
似的にSiOとして観察されるが、Si−Ｏ結合を含
む化合物として存在しているのではなく、酸素は
フリーな状態でケイ素中に固溶して存在する。 This component formed by solid solution of oxygen in silicon is observed approximately as SiO, but it does not exist as a compound containing an Si-O bond, but oxygen is solidly dissolved in silicon in a free state. Exists in solution.
この硬質層においては、上記した成分の種類や
存在割合などは明確に定め難い。それはこの硬質
層が穿孔処理と焼結処理とによつて生成されるも
のと推測され、したがつて、これら処理条件によ
つてこの硬質層の諸要素が変化するものと思われ
るからである。 In this hard layer, it is difficult to clearly define the types and proportions of the above-mentioned components. This is because this hard layer is presumed to be produced by a drilling process and a sintering process, and therefore, various elements of this hard layer are thought to change depending on these process conditions.
また、この硬質層の厚さｄは、孔の径の大きさ
等に影響されるものであつて明確に規定できるも
のではないが、穿孔処理条件と焼結処理条件を上
記と同様にした場合、10〜30μｍ程度である。 The thickness d of this hard layer is influenced by the size of the hole diameter and cannot be clearly defined, but if the drilling conditions and sintering conditions are the same as above. , about 10 to 30 μm.
一方、機械部品４本体の硬質層４ｂ以外の部分
はSi3N4を主成分とするセラミツクスで形成され
ている。このセラミツクスは、Y2O3粉末１〜７
重量％、Al2O3粉末１〜５重量％、AlN粉末１〜
５重量％、残部Si3N4粉末を配合して成形体とし
た後焼結してなるSi3N4系セラミツクスである。 On the other hand, the portion of the main body of the mechanical component 4 other than the hard layer 4b is formed of ceramics containing Si 3 N 4 as a main component. This ceramic contains Y 2 O 3 powder 1-7
Weight%, Al2O3 powder 1-5% by weight , AlN powder 1-5% by weight
This is a Si 3 N 4 ceramic made by blending 5% by weight and the balance with Si 3 N 4 powder to form a compact and then sintering it.
次に、本発明の機械部品の製造法について述べ
る。まず、所定形状に成形された上記した如き組
成からなるSi3N4成形体を用意する。そして、上
記したSi3N4成形体に穿孔処理を施す。すなわ
ち、所定寸法の径を有するミクロンドリルを用い
て所定の切削速度で上記成形体に穿孔する。この
とき、使用するミクロンドリルは材質がWCのも
のを用いるとよい。 Next, a method for manufacturing a mechanical component according to the present invention will be described. First, a Si 3 N 4 molded body formed into a predetermined shape and having the composition as described above is prepared. Then, the above-described Si 3 N 4 molded body is subjected to a perforation treatment. That is, the molded body is drilled at a predetermined cutting speed using a micron drill having a predetermined diameter. At this time, it is best to use a micron drill made of WC.
次に、上記孔が形成されたSi3N4成形体をN2雰
囲気中にて焼成する。このときの焼成条件は、焼
成温度：1730〜1780℃、焼成時間：0.5〜１時間
に設定することが好ましい。 Next, the Si 3 N 4 molded body in which the holes have been formed is fired in an N 2 atmosphere. The firing conditions at this time are preferably set to a firing temperature of 1730 to 1780°C and a firing time of 0.5 to 1 hour.
以上の穿孔処理と焼結処理とにより孔表面層が
硬質層に変化するが、それと同時に硬質層上にウ
イスカーも発生するので、孔の寸法精度を高める
ためにもこのウイスカーのみを除去する処理を焼
成後に行なうとよい。 The above-mentioned drilling and sintering processes transform the hole surface layer into a hard layer, but at the same time whiskers are also generated on the hard layer, so in order to improve the dimensional accuracy of the holes, a process to remove only these whiskers is performed. It is best to do this after baking.
［発明の実施例］
機械部品として第３図に示すようなドツトプリ
ンター用ガイドを製造する。まずAl2O3粉末３重
量％、AlN粉末３重量％、Y2O3粉末５重量％、
残部Si3N4粉末を配合し成形処理してなるSi3N4
成形体を用意した。この成形体に、直径280μｍ
のミクロンドリル（材質：WC）を用いて穿孔処
理を行なつた。穿孔処理の後、成形体をN2雰囲
気中にて、1750℃の温度下で１時間焼成した。[Embodiments of the Invention] A guide for a dot printer as shown in FIG. 3 is manufactured as a mechanical part. First, 3% by weight of Al 2 O 3 powder, 3% by weight of AlN powder, 5% by weight of Y 2 O 3 powder,
Si 3 N 4 made by blending and molding the remaining Si 3 N 4 powder
A molded body was prepared. This molded body has a diameter of 280 μm.
The drilling process was performed using a micron drill (material: WC). After the perforation treatment, the molded body was fired at a temperature of 1750° C. for 1 hour in an N 2 atmosphere.
その結果、直径220μｍの孔を有するガイドが
得られた。得られたガイドのガイド孔表面層の組
織を観察したところ、孔表面付近に厚さ30μｍの
硬質層が形成されているのが確認された。この硬
質層の硬度を測定したところ、ビツカース硬さで
1600〜1900であつた。 As a result, a guide having holes with a diameter of 220 μm was obtained. When the structure of the guide hole surface layer of the obtained guide was observed, it was confirmed that a hard layer with a thickness of 30 μm was formed near the hole surface. When the hardness of this hard layer was measured, it was found to be Bitkers hardness.
It was between 1600 and 1900.
さらにこの硬質層の組成を調べたところ、ケイ
素中に酸素が固溶している成分１重量％、
Al2O33重量％、Y2O35重量％、AlN3重量％、残
部Si3N4であつた。 Further investigation of the composition of this hard layer revealed that 1% by weight of oxygen was dissolved in silicon.
The composition was 3% by weight of Al 2 O 3 , 5% by weight of Y 2 O 3 , 3% by weight of AlN, and the balance was Si 3 N 4 .
また、比較のため、本発明で用意したSi3N4系
セラミツクス成形体と同様のものを用意して以下
のようにガイドを製造した。すなわち、上記成形
体に穿孔処理を施したのち、更に孔内表面を研削
加工して、上記実施例と同一寸法の孔を有するガ
イドを得た。このガイドのガイド孔表面の組織を
観察したところ硬質層が存在せずその硬度は1500
〜1700であつた。 In addition, for comparison, a guide was manufactured in the following manner using a Si 3 N 4 ceramic molded body similar to the one prepared in the present invention. That is, after perforating the molded body, the inner surface of the hole was further ground to obtain a guide having a hole of the same size as that of the above example. When we observed the structure of the guide hole surface of this guide, there was no hard layer and its hardness was 1500.
It was ~1700.
次に、ガイド孔表面の耐摩耗性を調べるため、
ガイド孔内にタングステンワイヤを通してワイヤ
の往復運動を２億回行なつた。その結果、本発明
のガイドにおけるガイド孔内表面の摩耗量はほぼ
0.2μｍであつたが、それに対して孔内表面を研削
加工した比較例のガイドにおいては数μｍ摩耗し
ているのが認められた。 Next, to examine the wear resistance of the guide hole surface,
A tungsten wire was passed through the guide hole and the wire was reciprocated 200 million times. As a result, the amount of wear on the inner surface of the guide hole in the guide of the present invention is approximately
It was 0.2 μm, but on the other hand, it was observed that the guide of the comparative example, in which the inner surface of the hole was ground, was worn by several μm.
また、耐摩耗性とガイドの寿命を調べるため、
ガイドをドツトプリンターに装着して印字を行な
つた。その結果、本発明のガイドは３〜10億ドツ
ト印字を行なつても充分使用可能なものであるこ
とが確認された。それに対して、比較例のガイド
は２〜４億ドツトしか印字できないものであるこ
とが確認された。 In addition, to examine wear resistance and guide life,
The guide was attached to a dot printer and printing was performed. As a result, it was confirmed that the guide of the present invention can be used satisfactorily even when printing 300 million to 1 billion dots. In contrast, it was confirmed that the guide of the comparative example could print only 200 million to 400 million dots.
［発明の効果］
以上、説明した如く、本発明の、窒化ケイ素を
主体とするセラミツクスからなる、孔を有する機
械部品は、耐摩耗性に優れた孔を有してその寿命
が長く、しかも、従来の製造工程に比較して孔表
面研削工程が省略されるので製造コストが低くす
み、その工業的価値は大である。[Effects of the Invention] As explained above, the mechanical component having holes made of ceramics mainly composed of silicon nitride of the present invention has holes with excellent wear resistance and has a long life. Compared to conventional manufacturing processes, the hole surface grinding process is omitted, resulting in lower manufacturing costs and great industrial value.
第１図は本発明の機械部品の縦断面組織を模式
的に示した図であり、第２図はウイスカーが形成
されている機械部品の縦断面組織を模式的で示し
た図であり、第３図は印字ヘツド全体を示す図で
ある。
１：印字ヘツド、２：ドツトピン、３：ガイ
ド、３ａ：ガイド孔、４：孔を有する機械部品、
４ａ：孔、４ｂ：表面層（硬質層）、５：ウイス
カー。
FIG. 1 is a diagram schematically showing a vertical cross-sectional structure of a mechanical component of the present invention, and FIG. 2 is a diagram schematically showing a vertical cross-sectional structure of a mechanical component in which whiskers are formed. FIG. 3 shows the entire print head. 1: Print head, 2: Dot pin, 3: Guide, 3a: Guide hole, 4: Machine part with hole,
4a: hole, 4b: surface layer (hard layer), 5: whisker.
Claims (1)
る、単数又は複数の孔を有する機械部品におい
て、該孔の表面層がケイ素中に酸素が固溶してな
る成分を含有する硬質層から形成されていること
を特徴とする窒化ケイ素を主体とするセラミツク
スからなる、孔を有する機械部品。 ２ 窒化ケイ素を主体とするセラミツクスからな
る、孔を有する機械部品はドツトプリンター用ガ
イドである特許請求の範囲第１項記載の窒化ケイ
素を主体とするセラミツクスからなる、孔を有す
る機械部品。 ３ 窒化ケイ素を主体とするセラミツクスからな
る、孔を有する機械部品はノズルである特許請求
の範囲第１項記載の窒化ケイ素を主体とするセラ
ミツスからなる、孔を有する機械部品。[Scope of Claims] 1. A mechanical part made of ceramics mainly composed of silicon nitride and having one or more pores, in which the surface layer of the pores is a hard layer containing a component formed by solid solution of oxygen in silicon. A mechanical part having holes made of ceramics mainly composed of silicon nitride. 2. A mechanical part having holes made of ceramics mainly made of silicon nitride according to claim 1, wherein the mechanical part having holes made of ceramics mainly made of silicon nitride is a guide for a dot printer. 3. A mechanical part having holes made of ceramics mainly made of silicon nitride according to claim 1, wherein the machine part having holes made of ceramics mainly made of silicon nitride is a nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60212610A JPS6273959A (en) | 1985-09-27 | 1985-09-27 | Machine parts with holes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60212610A JPS6273959A (en) | 1985-09-27 | 1985-09-27 | Machine parts with holes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6273959A JPS6273959A (en) | 1987-04-04 |
| JPH0439430B2 true JPH0439430B2 (en) | 1992-06-29 |
Family
ID=16625532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60212610A Granted JPS6273959A (en) | 1985-09-27 | 1985-09-27 | Machine parts with holes |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6273959A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5546337B2 (en) * | 2010-04-30 | 2014-07-09 | パナソニック株式会社 | Method for manufacturing nozzle plate for plasma display panel |
| JP5517730B2 (en) * | 2010-04-30 | 2014-06-11 | パナソニック株式会社 | Method for manufacturing nozzle plate for manufacturing plasma display panel |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61275182A (en) * | 1985-05-29 | 1986-12-05 | イビデン株式会社 | Support member of ceramic composite body |
-
1985
- 1985-09-27 JP JP60212610A patent/JPS6273959A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61275182A (en) * | 1985-05-29 | 1986-12-05 | イビデン株式会社 | Support member of ceramic composite body |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6273959A (en) | 1987-04-04 |
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