JPH0438673U - - Google Patents
Info
- Publication number
- JPH0438673U JPH0438673U JP8125890U JP8125890U JPH0438673U JP H0438673 U JPH0438673 U JP H0438673U JP 8125890 U JP8125890 U JP 8125890U JP 8125890 U JP8125890 U JP 8125890U JP H0438673 U JPH0438673 U JP H0438673U
- Authority
- JP
- Japan
- Prior art keywords
- fpc
- mounting member
- view
- plate part
- insulating plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
Description
図面は本考案の一実施例を示すもので、第１図
は第１実施例の展開斜視図、第２図はその組付斜
視図、第３図はその重ね合わせ部分の断面図、第
４図は第２実施例の斜視図、第５図は従来構造の
展開斜視図、第６図はその組付斜視図、第７図は
その重ね合わせ部分の断面図である。
１……ＦＰＣ板、３……取付部材、８……絶縁
板部。
The drawings show one embodiment of the present invention; Fig. 1 is an exploded perspective view of the first embodiment, Fig. 2 is an assembled perspective view thereof, Fig. 3 is a cross-sectional view of the overlapped parts, and Fig. 4 The figure is a perspective view of the second embodiment, FIG. 5 is an exploded perspective view of the conventional structure, FIG. 6 is an assembled perspective view thereof, and FIG. 7 is a cross-sectional view of the overlapping portion thereof. 1... FPC board, 3... Mounting member, 8... Insulating plate part.
Claims (1)
ＦＰＣ板であつて、上記ＦＰＣ板にＦＰＣ板相互
の重ね合わせ間に介在可能な絶縁板部を一体形成
して構成したことを特徴とするＦＰＣ板構造。 An FPC board that is placed in a superimposed manner on a mounting member and is constructed by integrally forming an insulating plate part that can be interposed between the overlapped FPC boards. structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8125890U JPH0438673U (en) | 1990-07-31 | 1990-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8125890U JPH0438673U (en) | 1990-07-31 | 1990-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0438673U true JPH0438673U (en) | 1992-03-31 |
Family
ID=31627041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8125890U Pending JPH0438673U (en) | 1990-07-31 | 1990-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0438673U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55123193A (en) * | 1979-03-16 | 1980-09-22 | Omron Tateisi Electronics Co | Method of connecting substrates |
-
1990
- 1990-07-31 JP JP8125890U patent/JPH0438673U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55123193A (en) * | 1979-03-16 | 1980-09-22 | Omron Tateisi Electronics Co | Method of connecting substrates |