JPH04369892A - Molded board - Google Patents
Molded boardInfo
- Publication number
- JPH04369892A JPH04369892A JP14712091A JP14712091A JPH04369892A JP H04369892 A JPH04369892 A JP H04369892A JP 14712091 A JP14712091 A JP 14712091A JP 14712091 A JP14712091 A JP 14712091A JP H04369892 A JPH04369892 A JP H04369892A
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- resin
- soldering
- electronic
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 31
- 239000011347 resin Substances 0.000 claims abstract description 31
- 238000002844 melting Methods 0.000 claims abstract description 22
- 230000008018 melting Effects 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 6
- 239000002861 polymer material Substances 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 235000019589 hardness Nutrition 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 10
- 238000000465 moulding Methods 0.000 abstract description 9
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 239000010409 thin film Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract 2
- 230000007774 longterm Effects 0.000 abstract 1
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は主に制御部を有する電気
製品に適用する。[Industrial Field of Application] The present invention is mainly applied to electrical products having a control section.
【０００２】0002
【従来の技術】従来の構造は、特開昭６３−１５１０９
５公報に記載のように回路パターンを成形樹脂で被覆形
成し、射出成形体形状を任意に成形できかつ電気部品、
電子部品の実装も容易にできる等の利点を有していた。
しかしながら、電気部品、電子部品実装においては、該
電気部品、電子部品との接続をはんだ付けするために、
回路パターンには予め表面にはんだ被膜を形成させるこ
とが必要である。このため、はんだ付け温度より高い融
点の成形材料を必要とし、自ずと樹脂弾性は劣化する。
そこで、電気部品、電子部品の保持を必要とする場合、
当該成形基板の樹脂を射出成形する際に、金型にて保持
部を形成させることになる。同一高融点高分子材料では
、保持する際のたわみ量が少なく破断する可能性が高か
った。[Prior art] The conventional structure is disclosed in Japanese Patent Application Laid-Open No. 63-15109.
As described in Publication No. 5, the circuit pattern is coated with a molding resin, and the shape of the injection molded object can be formed arbitrarily, and the electric component,
It had advantages such as being able to easily mount electronic components. However, in mounting electrical components and electronic components, in order to solder the connection with the electrical components and electronic components,
It is necessary to form a solder film on the surface of the circuit pattern in advance. Therefore, a molding material with a melting point higher than the soldering temperature is required, and the resin elasticity naturally deteriorates. Therefore, if it is necessary to hold electrical or electronic components,
When injection molding the resin of the molded substrate, the holding portion is formed using a mold. With the same high melting point polymer material, the amount of deflection during holding was small and there was a high possibility of breakage.
【０００３】0003
【発明が解決しようとする課題】本発明は、電気部品、
電子部品実装時および、実装後も確実に該電気部品、電
子部品を保持固定することができる基板を提供すること
を目的とする。[Problems to be Solved by the Invention] The present invention provides electrical components,
It is an object of the present invention to provide a board that can reliably hold and fix electrical components and electronic components during and after mounting the electronic components.
【０００４】0004
【課題を解決するための手段】上記目的を達成するため
に、融点の異なる２種類の高分子材料を使用し、先ず高
融点高剛性樹脂で回路パターン周りを被覆し、その後電
気部品、電子部品実装部、つまり該電気部品、電子部品
を固定する部分を、弾性を有する低融点樹脂で形成する
様にしたものである。また、はんだ付け時の高温を考慮
すると熱硬化性樹脂による成形も有効であり、この場合
硬度の低い材料で該電気部品、電子部品を保持固定する
部分を形成させることにより、同様の目的は達成される
ものである。[Means for Solving the Problems] In order to achieve the above object, two types of polymer materials with different melting points are used. First, the circuit pattern is covered with a high melting point and high rigidity resin, and then electrical parts and electronic parts are coated. The mounting portion, that is, the portion for fixing the electrical components and electronic components, is made of an elastic, low-melting resin. In addition, considering the high temperature during soldering, molding with thermosetting resin is also effective. In this case, the same purpose can be achieved by forming the part that holds and fixes the electrical and electronic components with a material with low hardness. It is something that will be done.
【０００５】[0005]
【作用】実装される電気部品、電子部品の形状にあわせ
、保持固定部を弾性樹脂で形成するため、樹脂の破断等
がなく、かつ全体としては、はんだ付け時の高温雰囲気
にも耐える高融点樹脂にて被覆されているため、はんだ
付け時の樹脂の変形、溶融がない。[Function] The holding and fixing part is made of elastic resin to match the shape of the electrical and electronic components to be mounted, so there is no breakage of the resin, and the overall structure has a high melting point that can withstand the high temperature atmosphere during soldering. Since it is coated with resin, there is no deformation or melting of the resin during soldering.
【０００６】[0006]
【実施例】以下、本発明の一実施例を図１により説明す
る。図１は本発明の一部断面であるが、回路パターン４
は銅プレートを回路状に成形加工したものである。当該
回路パターン４には、予めはんだ材料を必要部分に形成
させた薄膜プレコート部５を有し、電気部品、電子部品
実装用の開孔部４ａ、さらに射出成形時、表裏樹脂を回
路パターン４に密着保持するための穴２ａが加工されて
いる。高融点成形樹脂１は、回路パターン４全体を被覆
するように射出成形され、電気部品、電子部品実装用ス
ペース１ｂおよびはんだ付けスペース１ａが形成されて
いる。電気部品、電子部品保持部２、３は高融点成形樹
脂１にて形成された基板と一体となるよう嵌合成形され
、望ましくは回路パターン４の穴２ａを通して反対側２
ｂまで導入することにより、該電気部品、電子部品保持
部２の密着性は向上する。この基板には種々の電気部品
、電子部品６、７が図１のごとく実装されているが、挿
入後はんだ付け工程、例えばはんだディップ槽を通過す
ることにより、はんだ接続部６ａ、７ａのごとくはんだ
で固定され、電気部品、電子部品６、７は基板に固定さ
れる。電気部品、電子部品６、７は、弾性のある低融点
樹脂にて形成された該電気部品、電子部品保持部２、３
により弾性の反力により確実に基板に保持される。一方
、特許請求項２に記述した様に熱硬化性樹脂を使った場
合、高融点樹脂の代わりに、高硬度の樹脂、低融点樹脂
の代わりに、低硬度の樹脂を使用することも充分満足で
きるものである。ここで記した高融点樹脂とは、融点が
２５０℃以上若しくは、ＡＳＴＭ試験のＤ６４８で言え
ば熱変形温度が２６０℃以上のものであり、低融点樹脂
とは融点が２５０℃以下若しくは、同試験で２６０℃以
下のものである。また、これらの樹脂は、単体若しくは
無機質フィラー含有等制限されるものではない。[Embodiment] An embodiment of the present invention will be explained below with reference to FIG. Although FIG. 1 is a partial cross section of the present invention, the circuit pattern 4
is a copper plate molded into a circuit shape. The circuit pattern 4 has a thin film precoat part 5 in which solder material is formed in advance on necessary parts, and openings 4a for mounting electrical components and electronic components, and furthermore, a front and back resin is applied to the circuit pattern 4 during injection molding. Holes 2a are machined to maintain close contact. The high melting point molding resin 1 is injection molded to cover the entire circuit pattern 4, and a space 1b for mounting electrical components and electronic components and a soldering space 1a are formed. The electrical component/electronic component holding parts 2 and 3 are integrally molded with a substrate made of high melting point molded resin 1, and preferably are inserted into the opposite side 2 through the hole 2a of the circuit pattern 4.
By introducing up to b, the adhesion between the electric component and the electronic component holding portion 2 is improved. Various electrical components and electronic components 6 and 7 are mounted on this board as shown in FIG. The electrical components and electronic components 6 and 7 are fixed to the board. The electrical components and electronic components 6 and 7 are made of an elastic low-melting resin.
It is reliably held on the substrate by the elastic reaction force. On the other hand, when a thermosetting resin is used as described in patent claim 2, it is also fully satisfactory to use a high hardness resin instead of a high melting point resin, and a low hardness resin instead of a low melting point resin. It is possible. The high melting point resin mentioned here is one with a melting point of 250°C or higher or the heat distortion temperature of 260°C or higher according to ASTM test D648, and the low melting point resin is one with a melting point of 250°C or lower or a heat distortion temperature according to the same test. The temperature is 260°C or less. Furthermore, these resins are not limited to single substances or those containing inorganic fillers.
【０００７】以上の様に、本発明によれば、電気部品、
電子部品の確実な実装が可能となる。As described above, according to the present invention, electrical components,
This enables reliable mounting of electronic components.
【０００８】[0008]
【発明の効果】本発明によれば、高融点成形樹脂で被覆
されているため、はんだの熱でも変形せず、かつ低融点
成形樹脂の保持部材で固定されているため、実装された
電気部品、電子部品は確実に基板に固定される。[Effects of the Invention] According to the present invention, since it is coated with a high melting point molding resin, it will not be deformed even by the heat of soldering, and since it is fixed with a holding member made of a low melting point molding resin, the electrical components mounted , electronic components are securely fixed to the board.
【図１】本発明の一実施例を示す成形基板のー部断面図
である。FIG. 1 is a partial sectional view of a molded substrate showing an embodiment of the present invention.
１…高融点成形樹脂、２…電気部品、電子部品保持部、
４…回路パターン1...High melting point molding resin, 2...Electric component, electronic component holding part,
4...Circuit pattern
Claims (2)
を適宜成形した回路パターンの周りを、少なくとも融点
の異なる２種類の熱可塑性高分子材料で被覆したことを
特徴とする成形基板。1. A molded substrate characterized in that a circuit pattern formed from copper or a metal plate for conducting electricity is coated around the circuit pattern with at least two types of thermoplastic polymer materials having different melting points.
度の異なる２種類の熱硬化性樹脂であることを特徴とす
る請求項１記載の成形基板。2. The molded substrate according to claim 1, wherein the resins covering the circuit are at least two types of thermosetting resins having different hardnesses.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14712091A JPH04369892A (en) | 1991-06-19 | 1991-06-19 | Molded board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14712091A JPH04369892A (en) | 1991-06-19 | 1991-06-19 | Molded board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04369892A true JPH04369892A (en) | 1992-12-22 |
Family
ID=15422990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14712091A Pending JPH04369892A (en) | 1991-06-19 | 1991-06-19 | Molded board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04369892A (en) |
-
1991
- 1991-06-19 JP JP14712091A patent/JPH04369892A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3501832A (en) | Method of making electrical wiring and wiring connections for electrical components | |
| JP6121019B2 (en) | Electrical connection device | |
| KR970024132A (en) | CIRCUIT DEVICE AND METHOD OF FABRICATING SAME | |
| JPS63240056A (en) | Semiconductor assembly unit | |
| US5692297A (en) | Method of mounting terminal to flexible printed circuit board | |
| US7041906B2 (en) | Flat flex cable | |
| WO2019009148A1 (en) | Circuit device | |
| US7758222B2 (en) | Method for vacuum deposition of circuitry onto a thermoplastic material and a vehicular lamp housing incorporating the same | |
| KR20100009621A (en) | Arrangement having a power semiconductor module, and method for its production | |
| JPH04369892A (en) | Molded board | |
| JPH11204173A (en) | Connector for bga | |
| US10559912B2 (en) | Method for producing and electrical assembly | |
| US5299096A (en) | LED mounting holder and device for mounting LED using it | |
| JPH10321987A (en) | Printed wiring board and manufacture thereof | |
| JP2002368017A (en) | Mounting board | |
| JPH086369Y2 (en) | Terminal structure | |
| JP4651866B2 (en) | Axial fan motor | |
| JP7233067B1 (en) | Mounting component positioning and fixing structure and manufacturing method | |
| KR100604619B1 (en) | Electronic controller | |
| JP2001332847A (en) | Printed wiring board, metallic part, and electric connection structure | |
| JP2781890B2 (en) | Method for manufacturing base of electromagnetic relay | |
| JPS5926619Y2 (en) | Connection structure of electronic components | |
| US3825877A (en) | Printed circuit assembly and method for fabrication thereof | |
| JP2004207725A (en) | Circuit module for vehicles and contact forming device for contact conductor | |
| WO2019009150A1 (en) | Circuit device |